CN208767289U - A kind of high leakproofness lead patch sealing structure - Google Patents
A kind of high leakproofness lead patch sealing structure Download PDFInfo
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- CN208767289U CN208767289U CN201821331638.3U CN201821331638U CN208767289U CN 208767289 U CN208767289 U CN 208767289U CN 201821331638 U CN201821331638 U CN 201821331638U CN 208767289 U CN208767289 U CN 208767289U
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- chamfer
- solder
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Abstract
The utility model discloses a kind of high leakproofness lead patch sealing structure, including ceramic insulator, lead, patch, the ceramic insulator center is provided with crunch seal hole, and the lead is nested in crunch seal hole, and the patch is set on lead；The both ends end in the crunch seal hole is provided with inner chamfer and outer chamfer；The lead and ceramic insulator are fixed at inner chamfer and outer chamfer by welding manner；The patch is fixedly connected by welding manner with the end face outside of ceramic insulator, and the diameter of the patch is greater than the diameter of lead.The lead of this sealing-in shell and ceramic joining position weld strength are high, and air-tightness is good, and the risk of product failure is caused due to reduce when lead is repeatedly bent or high temperature brazing shell gas leakage.
Description
Technical field
The utility model belongs to microelectronic packaging technology field, and in particular to a kind of high leakproofness lead patch sealing-in knot
Structure.
Background technique
In the prior art, metal is usually used as housing main body in microelectronic package, and lead passes through ceramic insulation
Son is drawn, and since the coefficient of expansion of material is different, shell is easy to appear gas leak phenomenon after high temperature brazing, influences lead and pottery
The welding of porcelain, and then influence the sealing performance of sealing-in shell；In addition, lead is bent in assembly or use process through multiple stress
Afterwards, the welding position for also resulting in lead and ceramics leaks air phenomenon, influences the sealing performance of package casing, shortens product
Service life even results in product failure.
Utility model content
In order to overcome above-mentioned technical problem existing for prior art, the purpose of the utility model is to provide one kind
High leakproofness lead patch sealing structure, for having the microelectronic package of lead, lead and ceramic joining position are welded
Intensity height is connect, air-tightness is good, reduces because when lead is repeatedly bent or high temperature brazing the phenomenon that shell gas leakage, to reduce product
The risk of failure.
A kind of high leakproofness lead patch sealing structure provided by the utility model, is installed on outside the microelectronics with lead
On shell, including ceramic insulator, lead, patch A, the ceramic insulator center is provided with crunch seal hole, described to draw
Line is nested in crunch seal hole, and the patch A is set on lead；It is fallen in being provided with the both ends end in the crunch seal hole
Angle and outer chamfer, the lead and ceramic insulator are fixed at inner chamfer and outer chamfer by welding manner, the inner chamfer
Having a size of 0.05 × 45 ° ~ 1.0 × 45 °, the size of the outer chamfer is 0.05 × 45 ° ~ 1.0 × 45 °；The patch A passes through weldering
It connects mode to be fixedly connected with the end face outside of ceramic insulator, the diameter of the patch A is greater than the diameter of lead.
Preferably, the inner chamfer is having a size of 0.2 × 45 ° ~ 0.5 × 45 °, and the size of the outer chamfer is 0.2 × 45 ° ~
0.5×45°。
Preferably, when the end face outside of ceramic insulator is only welded with patch A, the inner chamfer weld solder is filled out
Charge is the 1/10 ~ 9/10 of inner chamfer volume, is filled with solder at the outer chamfer.
Preferably, when the end face outside of ceramic insulator is only welded with patch A, the inner chamfer weld solder is filled out
Charge is the 1/3 ~ 1/2 of inner chamfer volume, and filling is fully welded material at outer chamfer, and the effect of dispersive stress is preferable in this case, and
Lead, ceramic insulator and patch A can be made closely to weld, it is seamless, the risk of crackle generation can be reduced.
Preferably, the inner side end of the ceramic insulator is welded with patch B, and the diameter of the patch B is greater than lead
Diameter.
Preferably, described interior when the end face outside of ceramic insulator is welded with patch A, and inner side end is welded with patch B
Solder is filled at chamfering and outer chamfer, and when the solder of the inner chamfer and outer chamfer weld fills full inside and outside chamfering
When, weld lead, ceramic insulator and patch A closely, it is seamless, further decrease the risk of crackle generation.
Preferably, the patch A and patch B is metal patch or solder patch, and the diameter of the patch A and patch B
It is 1.1 ~ 2.0 times of diameter wire, the metal patch is alloy materials or copper, nickel, the Tie Dengchun such as kovar alloy, iron-nickel alloy
Metal material, the solder patch are silver-based solder, copper-based solder or other high-temperature solders or solder.
Preferably, the ceramic insulator is aluminium oxide ceramics, Al2O3Content is 70% ~ 99.6%.
A kind of high leakproofness lead patch sealing structure provided by the utility model, it has the advantage that: (1) sealing-in shell
Components contain multiple material, at high temperature, linear expansion coefficient is not quite similar, cause shell in high temperature brazing lead and pottery
Leak air phenomenon between porcelain insulator, influences the weld strength of lead and ceramic insulator, to influence the leakproofness of shell
Can, by the outside of ceramic insulator with lead sealing-in position it is soldering surface mounted, and the diameter of patch greater than lead diameter, may be used also
Enhance the weld strength of lead and ceramic insulator, even if lead will not cause ceramic insulator to produce from 90 ° of root bending
Raw crackle, not will lead to shell gas leakage, improves the leakproofness of shell；(2) the both ends end of lead and crunch seal hole junction
It is provided with inner chamfer and outer chamfer, and the loading of solder is the 1/3 ~ 1/2 of inner chamfer volume at inner chamfer, not only increases pottery
Porcelain and lead sealing strength, and so that ceramic insulator is born pulling force rather than peeling force, while dispersive stress can also be played
Effect, reduce ceramic insulator by the risk of drawing crack；(3) when the inner side end of ceramic insulator and end face outside are provided with
When patch, it need to be filled at inner chamfer and outer chamfer and be fully welded material, it is ensured that patch and ceramic insulator and lead junction are seamless,
The generation of crackle can also be reduced.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment 1；
Fig. 2 is schematic enlarged-scale view at the I of Fig. 1；
Fig. 3 is the structural schematic diagram of ceramic insulator；
Fig. 4 is that embodiment 2(removes sealing-in cover board) overall structure diagram；
Fig. 5 is cross-sectional view at the A-A of Fig. 4；
Fig. 6 is schematic enlarged-scale view at the II of Fig. 5；
Fig. 7 is that embodiment 2(removes sealing-in cover board) overall structure diagram；
Fig. 8 is cross-sectional view at the B-B of Fig. 7；
Fig. 9 is schematic enlarged-scale view at the III of Fig. 8.
It is marked in figure:
1. lead；2. ceramic insulator；3. patch A；4. solder；5. inner chamfer；6. outer chamfer；7. crunch seal hole；8.
Metal base plate；9. metal edge frame；10. patch B.
Specific embodiment
With reference to the accompanying drawings, in conjunction with the embodiments, to a kind of high leakproofness lead patch sealing-in knot provided by the utility model
Structure is described in detail.
In the description of the present invention, it should be understood that term " thickness ", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Embodiment 1
Referring to Fig.1-3, a kind of high leakproofness lead patch sealing structure provided by the present embodiment 1, including ceramic insulation
Sub 2, lead 1, patch A3, the ceramic insulator are aluminium oxide ceramics, Al2O3Content is 95%, 2 center of ceramic insulator
Position is provided with crunch seal hole 7, and the lead 1 is nested in crunch seal hole 7, and the patch A3 is set on lead 1.
For the sealing strength for enhancing lead 1 and ceramic insulator 2, inner chamfer 5 is set in the both ends end in crunch seal hole 7
And outer chamfer 6, the inner chamfer 5 is having a size of 0.4 × 45 °, and the size of the outer chamfer 6 is 0.15 × 45 °, while inner chamfer 5
And the setting of outer chamfer 6 also can avoid ceramic insulator 2 by drawing crack.
Since the pulling force that ceramic insulator 2 can bear is bigger than peeling force, for make ceramic insulator 2 bear pulling force rather than
Peeling force fixes lead 1 with ceramic insulator 2 at inner chamfer 5 and outer chamfer 6 by welding manner, and the inner chamfer 5
The loading of weld solder is the 1/2 of 5 volume of inner chamfer, and the 6 weld fill solder of outer chamfer expire outer chamfer 6, it is interior
Solder, which is not filled by, at angle 5 can completely play the role of dispersive stress, and fill solder completely can guarantee that patch A3 and ceramics are exhausted at outer chamfer 6
Edge 2 and 1 junction of lead are seamless, to reduce the generation of crackle.
For the weld strength for enhancing lead 1 and ceramic insulator 2, patch A3 is passed through into welding manner and ceramic insulator 2
End face outside be fixedly connected, and the diameter of patch A3 is greater than the diameter of lead 1, and the diameter of lead 1 is 1mm in the present embodiment,
The diameter of patch A is 2mm, and the patch A is metal patch, and the material of the metal patch is kovar alloy, and the metal
The medial surface of patch is fixedly connected by welding manner with the end face outside of ceramic insulator 2, and the circular hole of the metal patch
Part is fixedly connected with 1 circumferential surface of lead by melting welding.
Embodiment 2
Referring to Fig. 4-6, the present embodiment 2 is a kind of high leakproofness lead patch sealing structure answering in TO class wrapper shell
With.The structure of embodiment 2 includes sealing-in cover board, metal edge frame 9, metal base plate 8, lead 1, ceramic insulator 2, patch A3, institute
Stating ceramic insulator is aluminium oxide ceramics, Al2O3Content is 99%, and the metal edge frame 9 is by Welding in metal base plate 8
On, the metal edge frame 9 is the ring structure comprising four side walls, and the right side wall of the metal edge frame 9 is provided with through-hole, institute
It is cylindrical to state ceramic insulator 2,2 center of ceramic insulator is provided with crunch seal hole 7, the ceramic insulator
2 are nested in through-hole, and the lead 1 is inserted in crunch seal hole 7, and the patch A3 is set on lead 1.
The both ends end of the lead 1 and 7 junction of crunch seal hole is provided with inner chamfer 5 and outer chamfer 6, it is described in fall
Angle 5 is 45 ° of 0.15 ﹡ having a size of 45 ° of 0.4 ﹡, the size of the outer chamfer 6.
The lead 1 is fixed at inner chamfer 5 and outer chamfer 6 by welding manner with ceramic insulator 2, and it is described in fall
The loading of 5 weld solder of angle is the 1/3 of 5 volume of inner chamfer, and the 6 weld fill solder of outer chamfer expires outer chamfer 6.
The right end face of the ceramic insulator 2 exceeds the right side wall of metal edge frame 9, and the patch A3 passes through welding manner
It being fixedly connected with the right end face of ceramic insulator 2, the diameter of the lead 1 is 1.5mm, the diameter 2.8mm of the patch A3,
The diameter of patch A3 is greater than the diameter of lead 1.
The lead 1 is arranged 3, and the quantity of the ceramic insulator 2 is consistent with 1 quantity of lead.
The sealing-in cover board is fixed on the upper surface opening of the metal edge frame 9 by parallel seam welding sealing.
The patch A3 is metal patch, and the metal patch is iron-nickel alloy, and the medial surface of the metal patch is logical
It crosses welding manner to be fixedly connected with the end face outside of ceramic insulator 2, and the circular hole portion of the metal patch and lead 1 are circumferential
Face is fixedly connected by melting welding.
Embodiment 3
Referring to Fig. 7-9, the present embodiment 3 is a kind of high leakproofness lead patch sealing structure in thick film class wrapper shell
Using.The structure of embodiment 3 include sealing-in cover board, metal edge frame 9, metal base plate 8, lead 1, ceramic insulator 2, patch A3,
Patch B10, the ceramic insulator are aluminium oxide ceramics, Al2O3Content is 92%, and the metal edge frame 9 is existed by Welding
On metal base plate 8, the metal edge frame 9 is the ring structure comprising four side walls, and the right side wall of the metal edge frame 9 is arranged
There is through-hole, the ceramic insulator 2 is cylindrical, and 2 center of ceramic insulator is provided with crunch seal hole 7, described
Ceramic insulator 2 is nested in through-hole, and the lead 1 is inserted in crunch seal hole 7, and the patch A3 and patch B10 are set in
On lead 1, and it is located at the both ends of ceramic insulator 2.
The both ends end of the lead 1 and 7 junction of crunch seal hole is provided with inner chamfer 5 and outer chamfer 6, it is described in fall
Angle 5 is 45 ° of 0.2 ﹡ having a size of 45 ° of 0.35 ﹡, the size of the outer chamfer 6.
The lead 1 is fixed at inner chamfer 5 and outer chamfer 6 by welding manner with ceramic insulator 2, and it is described in fall
Angle 5 and 6 weld of outer chamfer fill and are fully welded material.
The right end face of the ceramic insulator 2 without departing from metal edge frame 9 right side wall, the patch A3 pass through welding side
Formula is fixedly connected with the end face outside of ceramic insulator 2, and the patch B10 passes through the inside of welding manner and ceramic insulator 2
End face is fixedly connected, and the diameter of the lead 1 is that the diameter of 1.0mm, the patch A3 and patch B10 are 1.9mm.
The lead 1 is arranged 2, and the quantity of ceramic insulator 2 is consistent with 1 quantity of lead.
The sealing-in cover board is fixed on 2 upper surface openings of the metal edge frame by parallel seam welding sealing.
The patch A3 and patch B10 is solder patch, and the solder patch is silver-based solder, by lead 1 and pottery
Direct solder in the end face outside and inner side end of porcelain insulator 2 forms solder patch.
For above-described embodiment simply to illustrate that the technical ideas and features of the present invention, its purpose is allows this field
Interior those of ordinary skill can understand the content of the utility model and implement accordingly, can not limit the utility model with this
Protection scope.The equivalent changes or modifications that all essence according to the content of the present invention is made, should all cover in this reality
With in novel protection scope.
Claims (6)
1. a kind of high leakproofness lead patch sealing structure, is installed on the microelectronic case with lead, it is characterised in that: packet
Ceramic insulator, lead, patch A are included, the ceramic insulator center is provided with crunch seal hole, and the lead is nested in
In crunch seal hole, the patch A is set on lead；
The both ends end in the crunch seal hole is provided with inner chamfer and outer chamfer, and the lead and ceramic insulator are in inner chamfer
And fixed at outer chamfer by welding manner, the inner chamfer is having a size of 0.05 × 45 ° ~ 1.0 × 45 °, the ruler of the outer chamfer
Very little is 0.05 × 45 ° ~ 1.0 × 45 °；
The patch A is fixedly connected by welding manner with the end face outside of ceramic insulator, and the diameter of the patch A, which is greater than, to be drawn
The diameter of line.
2. a kind of high leakproofness lead patch sealing structure according to claim 1, it is characterised in that: the ceramic insulation
The inner side end of son is welded with patch B, and the patch B is set on lead, and the diameter of the patch B is greater than the diameter of lead.
3. a kind of high leakproofness lead patch sealing structure according to claim 1, it is characterised in that: the inner chamfer weldering
The loading for connecing place's solder is the 1/10 ~ 9/10 of inner chamfer volume, is filled with solder at the outer chamfer.
4. a kind of high leakproofness lead patch sealing structure according to claim 2, it is characterised in that: the inner chamfer and
Solder is filled at outer chamfer.
5. a kind of high leakproofness lead patch sealing structure according to claim 2, it is characterised in that: the patch A is
Metal patch or solder patch, the patch B are metal patch or solder patch.
6. a kind of high leakproofness lead patch sealing structure according to claim 1, it is characterised in that: the ceramic insulation
Son is aluminium oxide ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821331638.3U CN208767289U (en) | 2018-08-17 | 2018-08-17 | A kind of high leakproofness lead patch sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821331638.3U CN208767289U (en) | 2018-08-17 | 2018-08-17 | A kind of high leakproofness lead patch sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208767289U true CN208767289U (en) | 2019-04-19 |
Family
ID=66132180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821331638.3U Active CN208767289U (en) | 2018-08-17 | 2018-08-17 | A kind of high leakproofness lead patch sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208767289U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785570A (en) * | 2020-07-10 | 2020-10-16 | 青岛凯瑞电子有限公司 | Sealed electromagnetic relay casing with high current and low lead resistance |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
-
2018
- 2018-08-17 CN CN201821331638.3U patent/CN208767289U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785570A (en) * | 2020-07-10 | 2020-10-16 | 青岛凯瑞电子有限公司 | Sealed electromagnetic relay casing with high current and low lead resistance |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
| CN111928954B (en) * | 2020-07-27 | 2024-06-14 | 青岛凯瑞电子有限公司 | Miniature Dewar of infrared detector |
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