CN208753262U - A kind of sputter ion pump - Google Patents
A kind of sputter ion pump Download PDFInfo
- Publication number
- CN208753262U CN208753262U CN201821200911.9U CN201821200911U CN208753262U CN 208753262 U CN208753262 U CN 208753262U CN 201821200911 U CN201821200911 U CN 201821200911U CN 208753262 U CN208753262 U CN 208753262U
- Authority
- CN
- China
- Prior art keywords
- pump
- pumping
- sputter ion
- pumping cells
- pump housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 108010083687 Ion Pumps Proteins 0.000 title claims abstract description 41
- 238000005086 pumping Methods 0.000 claims abstract description 71
- 230000005684 electric field Effects 0.000 claims abstract description 12
- 102000006391 Ion Pumps Human genes 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 8
- 230000000740 bleeding effect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910000986 non-evaporable getter Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 241000233855 Orchidaceae Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electron Tubes For Measurement (AREA)
Abstract
The utility model proposes a kind of sputter ion pumps, comprising: the pump housing, the pump housing include the cover board that canister portion and two are mounted on canister portion both ends, and cartridge and cover board surround cavity, and the pump housing is set there are two air inlet, and the air inlet is connected to the cavity；At least one pumping cells sets up the cathode plate at anode canister both ends separately including anode canister and two；Permanent magnet setting forms magnetic field on the outside of pumping cells, and in two cathode plates and anode canister region, for providing magnetic field environment to the pumping cells；And the high-head being electrically connected with pumping cells, for providing electric field to pumping cells.According to a kind of sputter ion pump of above-described embodiment, have two bleeding points, can be attached simultaneously with pump-line, eliminate influence of the pumping hole section to pumping speed, thus has bigger pumping speed；Compare with classical ionic pump, the sputter ion pump of the utility model can concatenate in beam current tube, save installation space, and the scale on beam current tube is suitble to use.
Description
Technical field
The utility model relates to a kind of sputter ion pumps, and in particular to a kind of sputter ion pump of two air inlets.
Background technique
In the prior art, sputter ion pump be mainly anode by two pieces of cathode plates, one with honeycomb structure, it is permanent
The vacuum pump of magnet and pump housing composition.Wherein, two pieces of cathode plates are located at the two sides of anode, form the electrode structure of pump.Forever
Long magnet is located at cathode outer side, and magnetic direction is parallel with direction of an electric field.Under the magnetic induction intensity of 1000~2000 Gausses,
It discharges between cathode and anode plus after 3~7 Kilovolt Direct Current pressures, it can be 1.0 × 10 under the magnetic confinement of electromagnetic field-2The pressure of pa
Electric discharge is maintained below, and this electric discharge claims Penning discharge.When electric discharge, electronics is made wheel rolling in anode canister and is moved back and forth, and greatly increases
Electron motion distance can guarantee very high ionizing efficiency.The ion that gas molecule generates after being ionized accelerates to Ti cathode.Ion
Energy it is very big, impact cathode when can cause strong sputtering.The titanium atom sputtered out is deposited on anode canister inner wall and cathode
By the less position of ion bombardment, the freezing Tifilm of formation absorbed reactive gas and metastable inertia on anode canister inner wall
Gas buries inert gas at the inviolent position of cathodic sputtering, this is answered to obtain high vacuum environment.Sputter ion pump is one
The free of contamination ultrahigh vacuum pump of kind, limiting pressure is up to 10-7~10-9Pa.Sputter ion pump in the prior art is mostly rectangle knot
Structure is generally made of a pumping cells an anode canister and 2 pieces of cathode plates, and magnet is located at the two sides of pumping cells, and ion is logical
It crosses inlet flange to be connected with by pumping container, to obtain high vacuum environment.
With the emergence and development of nonevaporable getter (NEG), occur NEG component being added to the plasma sputter pump housing
The compound sputter ion pump of interior composition.Compound ion sputter ion pump can improve pumping speed, and ultimate vacuum can improve to 1~
2 orders of magnitude.
Existing classics sputter ion pump, is usually vertically mounted on beam current tube, installation needs larger space, simultaneously
The pumping speed of ionic pump is limited by single mouth conductance of taking out, and effective pumping speed is limited.
Utility model content
The utility model is mainly solving the technical problems that the sputter ion pump installation of the prior art needs larger space, together
When pumping speed limit by single mouth conductance of taking out, effective pumping speed is limited.
The utility model proposes a kind of sputter ion pumps, comprising: the pump housing, the pump housing include that canister portion and two are mounted on cylinder
The cover board at portion both ends, cartridge and cover board surround cavity, and the pump housing sets that there are two air inlet, the air inlet and the chambers
Body connection；At least one pumping cells, the pumping cells include anode canister and two cathode plates set up separately at anode canister both ends,
The pumping cells are fixed on pump body；Permanent magnet, the permanent magnet are arranged on the outside of pumping cells, and in two cathode plates
Magnetic field is formed in anode canister region, for providing magnetic field environment to the pumping cells；And high-head, the high-head with
Pumping cells electrical connection, for providing electric field to pumping cells.
A kind of specific embodiment according to the present utility model, further includes magnetizer, and the permanent magnet is arranged in pump housing canister portion
It is external；It is arranged with the magnetizer outside two cover boards of the pump housing, for being together the pumping cells with the permanent magnet
Closed magnetic field environment is provided.
A kind of specific embodiment according to the present utility model, the permanent magnet are made of the strong magnetic high temperature resistant magnet of SmCo,
The magnetizer is made of pure iron.
A kind of specific embodiment according to the present utility model, cartridge be cylindrical shape, the cover board be circle, it is described into
Port opens up on the cover board.
A kind of specific embodiment according to the present utility model, is respectively arranged with an air inlet on two cover boards, and two
A air inlet is located on the center line of canister portion.
A kind of specific embodiment according to the present utility model, the air inlet are provided with flange, the high-head and cover board
Connection.
A kind of specific embodiment according to the present utility model, the magnetic direction and direction of an electric field in the pumping cells are flat
Row.
A kind of specific embodiment according to the present utility model, the pump housing inner wall are coated with the Fe Getter Films Prepared of 1m.
A kind of specific embodiment according to the present utility model, the anode canister are made of stainless steel, and the cathode plate is adopted
It is made of titanium.
A kind of specific embodiment according to the present utility model, the anode canister ground connection, the cathode plate are applied by high-head
Add back bias voltage, the DC voltage range between the anode and cathode is 3~7 kilovolts.
According to a kind of sputter ion pump of above-described embodiment, have two bleeding points, bleeding point can simultaneously and pump-line
It is attached, eliminates influence of the pumping hole section to pumping speed, thus have bigger pumping speed；Compare with classical ionic pump, this is practical
Novel sputter ion pump can concatenate in beam current tube, save installation space, and the scale on beam current tube is suitble to use.
Detailed description of the invention
Fig. 1 is a kind of sputter ion pump configurations schematic diagram of embodiment；
Fig. 2 is a kind of sputter ion pump configurations schematic top plan view of embodiment；
Fig. 3 is a kind of sputter ion pump Distribution of Magnetic Field schematic diagram of embodiment.
Specific embodiment
The utility model is described in further detail below by specific embodiment combination attached drawing.It is wherein different to implement
Similar component uses associated similar element numbers in mode.In the following embodiments, many datail descriptions are
In order to enable the application can be better understood.However, those skilled in the art can recognize without lifting an eyebrow, it is part of
Feature is dispensed in varied situations, or can be substituted by other elements, material, method.In some cases,
The relevant some operations of the application are there is no display in the description or describe, this is the core in order to avoid the application
It is flooded by excessive description, and to those skilled in the art, these relevant operations, which are described in detail, not to be necessary,
They can completely understand relevant operation according to the general technology knowledge of description and this field in specification.
It is formed respectively in addition, feature described in this description, operation or feature can combine in any suitable way
Kind embodiment.Meanwhile each step in method description or movement can also can be aobvious and easy according to those skilled in the art institute
The mode carry out sequence exchange or adjustment seen.Therefore, the various sequences in the description and the appended drawings are intended merely to clearly describe a certain
A embodiment is not meant to be necessary sequence, and wherein some sequentially must comply with unless otherwise indicated.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).
In the utility model embodiment, a kind of sputter ion pump is proposed, on the basis of ionic pump working principle, by changing
The structure feature for becoming classical ionic pump, can obtain higher pumping speed.
Embodiment one:
Referring to FIG. 1, in the present embodiment, a kind of sputter ion pump includes the pump housing 8, at least one pumping cells, permanent magnetism
Body 7 and high-head 3.Wherein, the pump housing 8 includes the cover board that canister portion and two are mounted on canister portion both ends, and canister portion and cover board surround cavity；
The pump housing 8 is set there are two air inlet 1, and air inlet 1 is connected to the cavity of the pump housing.In the present embodiment, have splashing there are two bleeding point 1
Penetrating ionic pump can be directly installed on the beam current tube of particle accelerator, with pass through in the prior art bleeding point perpendicular to
The sputter ion pump of beam current tube installation is compared, and can provide higher pumping speed and better ultimate vacuum, and save installation
Space.Pumping cells include anode canister 5 and two cathode plates 4 set up separately at anode canister both ends.The pumping cells are fixed on the pump housing 8
Inside.In the present embodiment, two pieces of cathode plates 4 are installed in parallel in the radial both ends of pump body, and are made pottery by high-voltage isulation
Porcelain is connected with anode canister.The setting of permanent magnet 7 forms magnetic on the outside of pumping cells, and in two cathode plates and anode canister region
, for providing magnetic field environment to pumping cells.High-head 3 is electrically connected with pumping cells, is mounted on the outer radial one of the pump housing 8
On end casing, for providing electric field to pumping cells.
In the present embodiment, sputter ion pump further includes magnetizer 2.Permanent magnet 7 is arranged outside 8 canister portion of the pump housing, the pump housing 8
Two cover boards outside be respectively equipped with magnetizer 2, for providing closed magnetic field environment for pumping cells together with permanent magnet 7, this
Structure can reduce the pumping speed that leakage field influences and pumping cells can be improved, shown in magnetic line of force distribution as shown in phantom in Figure 3.
In the present embodiment, the material of magnetizer 2 is pure iron.The material of permanent magnet 7 is the strong magnetic high temperature resistant magnet of SmCo, on
Lower both ends are N and S grades respectively.Magnetic field strength range is 1000~2000 Gausses.The operating temperature range of permanent magnet 7 is 0~
350℃。
In the present embodiment, the canister portion of the pump housing 8 is cylindrical shape, and the cover board at both ends is circle, and air inlet 1 is provided with cover board
On.In such a configuration, permanent magnet 7 can be annular permanent magnet.With classical sputter ion pump comparatively, ring structure more
Pressure resistance, therefore outer wall can be made thinner, mitigate the weight of integral pump.In other examples, the canister portion of the pump housing 8 can also
Think rectangle, square or other shapes, the cover board of opposite ends is rectangle, square or other shapes.
In the present embodiment, air inlet 1 is two, is respectively arranged with an air inlet 1 on two cover boards of the pump housing 8, two
A air inlet is located on the center line of 8 canister portion of the pump housing.
In the present embodiment, air inlet 1 is provided with flange, for connecting with other component.When sputter ion pump passes through method
Orchid is mounted in beam current tube, and air inlet 1 and pumping cells form pump-line.And the pump housing 8 is ring structure, each pumping
Unit is directly connected to pump-line, has more effectively pumping circuit.
As shown in figure 3, the magnetic direction in pumping cells is parallel with direction of an electric field in the present embodiment.
In the present embodiment, the inner wall 6 of the pump housing 8 is coated with 1 μm of Fe Getter Films Prepared.Fe Getter Films Prepared is being heated to 200 DEG C,
And it can be activated under conditions of continuous heating 4 hours or so.Fe Getter Films Prepared after activation can be additionally provided 0.5L/cm2
Pumping speed.When the pump housing 8 is cylinder-shaped, pump housing inner wall 6 is ring structure, and surface is without protrusion, and welding place is few, and plasma sputter
The internal structure of pump is simple, conveniently and efficiently to plating getter (NEG) film of 6 large area of inner wall of the pump housing 8.
In the present embodiment, the material of anode canister 5 is stainless steel, and the material of cathode plate 4 is titanium.For single to pumping
Member provides electric field.When plasma sputter pump work, anode canister 5 is grounded, cathode plate 4 applies back bias voltage, anode 5 by high-head 3
DC voltage range between cathode 4 is 3~7 kilovolts, provides effective electric field for pumping cells.
Embodiment two:
Referring to FIG. 1, in the present embodiment, the pump housing 8 of sputter ion pump is columnar structured, the vertical view from the direction A-A
Figure is as shown in Fig. 2, each pumping cells 9 are by an anode canister 5 and two 4 groups of cathode plate including 12 pumping cells 9
At.Every three pumping cells 9 are fixed together, and constitute a vacuum elements 10, convenient for pumping cells pump it is intracorporal installation and
Disassembly.12 pumping cells 9 constitute 4 vacuum elements, and the center line around the pump housing 8 is symmetrically arranged in sputter ion pump
Inside, the centerline parallel of the center lines of pumping cells 9 and the pump housing 8.Permanent magnet 7 is arranged outside 8 canister portion of the pump housing, the pump housing 8
Two cover boards outside be arranged with magnetizer 2, magnetizer 2 is used for and permanent magnet 7 is formed together magnetic confining field, is mentioned for pumping cells 9
For closed magnetic field environment.There are two air inlet 1 on the pump housing 8 of sputter ion pump, be respectively arranged on two cover boards one into
Port 1, two air inlets 1 are located on the center line of 8 canister portion of the pump housing.High-head 3, high pressure are installed on one cover board of the pump housing 8
First 3 are electrically connected with pumping cells 9, for providing electric field to pumping cells 9.In the present embodiment, anode canister 5 is grounded, cathode plate
4 apply back bias voltage by high-head.In the present embodiment, the direction of an electric field in pumping cells 9 is parallel with magnetic direction, and is evacuated
Unit 9 and two air inlets 1 collectively constitute pump-line, for providing higher pumping speed.
According to a kind of sputter ion pump of above-described embodiment, have two bleeding points, bleeding point can simultaneously and pump-line
It is attached, eliminates influence of the pumping hole section to pumping speed, thus have bigger pumping speed；Compare with classical ionic pump, this is practical
Novel sputter ion pump can concatenate in beam current tube, save installation space, and pressure is uniform in the pump housing, is suitble in line
Scale uses on pipeline.
Use above specific case is illustrated the utility model, is merely used to help understand the utility model, and
Not to limit the utility model.Think of for those skilled in the art of the present invention, according to the utility model
Think, several simple deductions, deformation or replacement can also be made.
Claims (10)
1. a kind of sputter ion pump, characterized by comprising:
The pump housing, the pump housing include the cover board that canister portion and two are mounted on canister portion both ends, and cartridge and cover board surround cavity, institute
It states the pump housing to set there are two air inlet, the air inlet is connected to the cavity；
At least one pumping cells, the pumping cells include anode canister and two cathode plates set up separately at anode canister both ends, institute
It states pumping cells and is fixed on pump body；
Permanent magnet, the permanent magnet setting form magnetic field on the outside of pumping cells, and in two cathode plates and anode canister region,
For providing magnetic field environment to the pumping cells；
And high-head, the high-head are electrically connected with pumping cells, for providing electric field to pumping cells.
2. sputter ion pump as described in claim 1, which is characterized in that further include magnetizer, the permanent magnet setting is pumping
Outside body canister portion；It is arranged with the magnetizer outside two cover boards of the pump housing, for being together the pumping with the permanent magnet
Gas unit provides closed magnetic field environment.
3. sputter ion pump as claimed in claim 2, which is characterized in that the permanent magnet uses the strong magnetic high temperature resistant magnet of SmCo
It is made, the magnetizer is made of pure iron.
4. sputter ion pump as described in claim 1, which is characterized in that cartridge is cylindrical shape, and the cover board is circle,
The air inlet opens up on the cover board.
5. sputter ion pump as claimed in claim 4, which is characterized in that be respectively arranged with an air inlet on two cover boards
Mouthful, two air inlets are located on the center line of canister portion.
6. sputter ion pump as claimed in claim 4, which is characterized in that the air inlet is provided with flange, the high-head
It is connect with cover board.
7. sputter ion pump as described in claim 1, which is characterized in that magnetic direction and electric field side in the pumping cells
To parallel.
8. such as the described in any item sputter ion pumps of claim 1-7, which is characterized in that the pump housing inner wall is coated with 1 μm of suction
Gas agent film.
9. sputter ion pump as claimed in claim 8, which is characterized in that the anode canister is made of stainless steel, the yin
Pole plate is made of titanium.
10. sputter ion pump as claimed in claim 8, which is characterized in that the anode canister ground connection, the cathode plate pass through height
Pressure head applies back bias voltage, and the DC voltage range between the anode and cathode is 3~7 kilovolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821200911.9U CN208753262U (en) | 2018-07-26 | 2018-07-26 | A kind of sputter ion pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821200911.9U CN208753262U (en) | 2018-07-26 | 2018-07-26 | A kind of sputter ion pump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208753262U true CN208753262U (en) | 2019-04-16 |
Family
ID=66058316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821200911.9U Active CN208753262U (en) | 2018-07-26 | 2018-07-26 | A kind of sputter ion pump |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208753262U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491764A (en) * | 2019-09-02 | 2019-11-22 | 北京卫星环境工程研究所 | The yoke assembly of sputter ion pump |
-
2018
- 2018-07-26 CN CN201821200911.9U patent/CN208753262U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491764A (en) * | 2019-09-02 | 2019-11-22 | 北京卫星环境工程研究所 | The yoke assembly of sputter ion pump |
| CN110491764B (en) * | 2019-09-02 | 2022-03-29 | 北京卫星环境工程研究所 | Magnetic yoke assembly of sputtering ion pump |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5372239B2 (en) | Combined pump system including getter pump and ion pump | |
| US8342813B2 (en) | Combined pumping system comprising a getter pump and an ion pump | |
| CN102254775B (en) | Magnetic field reinforced type linear ion source | |
| WO2012035970A1 (en) | Magnetic field generator, magnetron cathode, and sputtering device | |
| CN203411602U (en) | Bell jar-shaped device for coating cylindrical inner walls | |
| US5548183A (en) | Magnetic field immersion type electron gun | |
| CN213203180U (en) | Sputtering coating equipment | |
| CN208753262U (en) | A kind of sputter ion pump | |
| WO2001029874A1 (en) | Planar magnetron sputtering apparatus | |
| JP2001332209A (en) | Sputter ion pump | |
| US3216652A (en) | Ionic vacuum pump | |
| KR101134308B1 (en) | Ion pump with surface treated permanent magnet | |
| CN216738498U (en) | Stable coating device that just ionization rate is high | |
| CN110246746B (en) | Tripolar sputtering ion pump | |
| CN109360780A (en) | A kind of sputter ion pump of Novel anode cylinder array | |
| US6377149B1 (en) | Magnetic field generator for magnetron plasma generation | |
| CN219972438U (en) | Magnetron sputtering coating system for tubular base material | |
| CN109659212A (en) | A kind of array hole hollow cathode discharge ion source | |
| RU2797815C2 (en) | Pumping vacuum device | |
| CN201006892Y (en) | Permanent magnet gun target device of magnetron sputtering coating machine | |
| JP4263806B2 (en) | Ion generation method and ion source | |
| JP4751850B2 (en) | Vacuum deposition equipment | |
| CN113774342A (en) | Sputtering coating equipment, electrode device thereof and coating method | |
| JP2020029577A (en) | Sputtering apparatus | |
| JPH11354071A (en) | Sputter-ion pump |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |