CN208743176U - Semiconductor packages cleaning equipment waves spray equipment - Google Patents
Semiconductor packages cleaning equipment waves spray equipment Download PDFInfo
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- CN208743176U CN208743176U CN201821219774.3U CN201821219774U CN208743176U CN 208743176 U CN208743176 U CN 208743176U CN 201821219774 U CN201821219774 U CN 201821219774U CN 208743176 U CN208743176 U CN 208743176U
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- spray
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- inlet tube
- waves
- frame
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Abstract
The utility model discloses a kind of semiconductor packages cleaning equipments to wave spray equipment, including spray chamber, and the first spray boom equipped with spray orifice is used to support the first swinging frame of the first spray boom, motor, the first eccentric wheel and the first inlet tube；First inlet tube is connected to the first spray boom respectively, and the first eccentric wheel is fixedly connected with electric machine main shaft, and the first eccentric shaft of the first eccentric wheel is fixedly connected with the first swinging frame, and motor drives the first swinging frame to swing by the first eccentric shaft.Its advantages are that the first spray boom and the second spray boom are swung in spray chamber, therefore can be cleaned comprehensively to indoor component to be cleaned is sprayed, and cleaning effect is good, and cleaning efficiency is high.
Description
Technical field
The utility model relates to cleaning device, especially a kind of semiconductor packages cleaning equipment waves spray equipment.
Background technique
It after component processing, needs to be used in purge chamber and clean, the existing indoor nozzle of cleaning is fixed, and is sprayed
Mouth can only clean a certain position of component to be cleaned, and other positions are difficult to clean, therefore cleaning effect is bad.
Utility model content
The purpose of this utility model is to solve the deficiencies in the prior art, provides a kind of semiconductor packages cleaning equipment and waves spray
Shower device.
A kind of technical solution of the utility model:
A kind of semiconductor packages cleaning equipment waves spray equipment, including spray chamber, and the first spray boom equipped with spray orifice is used for
Support the first swinging frame of the first spray boom, motor, the first eccentric wheel and the first inlet tube；First inlet tube respectively with the first spray boom
Connection, the first eccentric wheel are fixedly connected with electric machine main shaft, and the first eccentric shaft of the first eccentric wheel is fixedly connected with the first swinging frame,
Motor drives the first swinging frame to swing by the first eccentric shaft.
A kind of preferred embodiment is that spray chamber side wall is equipped with sliding rail, and the first swinging frame side is fixed with swinging block, swinging block with
Sliding rail is slidably connected, and swinging block is equipped with swinging chute, and the first eccentric shaft is set in swinging chute and is flexibly connected with swinging chute.
A kind of preferred embodiment is that the first swinging frame is frame structure, is fixed with several first spray booms, framework in frame structure
A side of structure is hollow structure, and the first inlet tube is connected to several first spray booms respectively by hollow structure.
A kind of preferred embodiment is that wave spray equipment further include the second spray boom equipped with spray orifice to semiconductor packages cleaning equipment,
It is used to support the second swinging frame of the second spray boom, the second inlet tube, the second eccentric wheel and chain；Second inlet tube and the second spray boom
Connection, the first eccentric wheel and the second eccentric wheel are connected by chain, and the second eccentric shaft and the second swinging frame of the second eccentric wheel are solid
Fixed connection.
A kind of preferred embodiment is that the second swinging frame is frame structure, is fixed with several second spray booms, framework in frame structure
A side of structure is hollow structure, and the second inlet tube is connected to several second spray booms respectively by hollow structure.
A kind of preferred embodiment is that wave spray equipment further include the transmission for being used for transmission substrate to semiconductor packages cleaning equipment
Band, transmission belt are set in spray chamber and are arranged along its length.
A kind of preferred embodiment is that wave spray equipment further include hothouse to semiconductor packages cleaning equipment, and hothouse is close to spray
The outlet side of room is drenched, hothouse is inner to be equipped with Gas inlet tube and air knife, and Gas inlet tube is close to spray chamber side, and air knife is far from spray chamber one
Side.
In summary technical solution, the utility model has the beneficial effects that the first spray boom and the second spray boom are put in spray chamber
It is dynamic, therefore can be cleaned comprehensively to indoor component to be cleaned is sprayed, cleaning effect is good, and cleaning efficiency is high.
The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model
Art means, and being implemented in accordance with the contents of the specification, and in order to allow the above and other purpose, feature of the utility model
It can be more clearly understood with advantage, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the perspective view of the utility model；
Fig. 2 is the utility model schematic internal view one；
Fig. 3 is the utility model schematic internal view two；
Fig. 4 is the cross-sectional view of the utility model；
Fig. 5 is the schematic diagram of the first eccentric wheel and the connection of the first eccentric wheel in the utility model.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The utility model is described further with reference to the accompanying drawing.
First embodiment, as shown in Figures 1 to 5, a kind of semiconductor packages cleaning equipment wave spray equipment, including spray
Room 10, the first spray boom 11 equipped with spray orifice are used to support the first swinging frame 12 of the first spray boom 11, motor 13, the first eccentric wheel
14 and first inlet tube 15；First inlet tube 15 is connected to the first spray boom 11 respectively, and the first eccentric wheel 14 and 13 main shaft of motor are solid
Fixed connection, the first eccentric shaft 141 of the first eccentric wheel 14 are fixedly connected with the first swinging frame 12, and motor 13 passes through the first eccentric shaft
141 the first swinging frames 12 of driving are swung.
As shown in Figures 1 to 5, the first swinging frame 12 can be divided into upper layer and lower layer, and the structure of the first swinging frame 12 is the same
, the first swinging frame of upper layer and lower layer 12 is fixedly connected with the first eccentric shaft 141 of the first eccentric wheel 14 respectively, and motor 13 passes through the
One eccentric shaft 141 drives the first swinging frame of upper layer and lower layer 12 to swing.First spray boom 11 of the first swinging frame of upper layer and lower layer 12 can be with
It is connected to, can also be connected to from the first different inlet tubes 15 respectively with same first inlet tube 15.
As shown in Figures 1 to 5, cleaning solution flows to the first spray boom 11 from the first inlet tube 15, and motor 13 is eccentric by first
Axis 141 drives the first swinging frame 12 to swing, and the cleaning solution in the first spray boom 11 sprays to the portion to be cleaned in spray chamber 10 from spray orifice
Part can be to the portion to be cleaned in spray chamber 10 since the first spray boom 11 is swung with the swing of the first swinging frame 12
Part cleans comprehensively, and cleaning effect is good.
Second embodiment, as shown in Figures 1 to 5,10 side wall of spray chamber are equipped with sliding rail 101, and 12 side of the first swinging frame is solid
Surely there is swinging block 121, swinging block 121 is slidably connected with sliding rail 101, and swinging block 121 can also be by being arranged sliding block 123, sliding block
123 are slidably connected with sliding rail 101, swinging block 121 be equipped with swinging chute 122, the first eccentric shaft 141 be set to swinging chute 122 in and with
Swinging chute 122 is flexibly connected.
As shown in Figures 1 to 5, swinging block 121 is fixedly connected with the first swinging frame of upper layer and lower layer 12 respectively, the first eccentric shaft
141 drive the first swinging frame of upper layer and lower layer 12 to swing by swinging block 121.
Specifically, as shown in Figures 1 to 5, the first swinging frame 12 is frame structure, several first are fixed in frame structure
The quantity of spray boom 11, the first spray boom 11 can according to need setting, can for one, two or mostly with.The one of frame structure
Side is hollow structure, and the first inlet tube 15 is connected to several first spray booms 11 respectively by hollow structure.
3rd embodiment, as shown in Figures 1 to 5, it further includes being equipped with spray that semiconductor packages cleaning equipment, which waves spray equipment,
Second spray boom 16 in hole is used to support the second swinging frame 17 of the second spray boom 16, the second inlet tube 18, the second eccentric wheel 19 and chain
Item 20；Second inlet tube 18 is connected to the second spray boom 16, and the first eccentric wheel 14 and the second eccentric wheel 19 are connected by chain 20, the
Second eccentric shaft 191 of two eccentric wheels 19 is fixedly connected with the second swinging frame 17.
As shown in Figures 1 to 5, the second swinging frame 17 can be identical with the structure of the first swinging frame 12, the second swinging frame 17
For frame structure, several second spray booms 16 are fixed in frame structure, a side of frame structure is hollow structure, the second feed liquor
Pipe 18 is connected to several second spray booms 16 respectively by hollow structure.
Second swinging frame 17 can be divided into upper layer and lower layer, the structure of the second swinging frame of upper layer and lower layer 17 be it is the same, up and down
Two layers of second swinging frames 17 are fixedly connected with the second eccentric shaft 191 of the second eccentric wheel 19 respectively, and motor 13 passes through 20 band of chain
Dynamic second eccentric wheel 19 rotation, the second eccentric shaft 191 drive the second swinging frame of upper layer and lower layer 17 to swing.Upper layer and lower layer second are swung
Second spray boom 16 of frame 17 can be connected to same second inlet tube 18, can also be connected respectively from the second different inlet tubes 18
It is logical.
Cleaning solution flows to the second spray boom 16 from the second inlet tube 18, and motor 13 drives the rotation of the second eccentric wheel 19 by chain 20
Turn, the second eccentric shaft 191 drives the second swinging frame 17 to swing, and the cleaning solution in the second spray boom 16 sprays in spray chamber 10 from spray orifice
Component to be cleaned can be in spray chamber 10 since the second spray boom 16 is swung with the swing of the second swinging frame 17
Component to be cleaned clean comprehensively, cleaning effect is good.
Fourth embodiment, as shown in Figures 1 to 5, it further includes for passing that semiconductor packages cleaning equipment, which waves spray equipment,
The transmission belt (unmarked in figure) of defeated substrate, transmission belt are set in spray chamber 10 and are arranged along its length.Substrate is placed on
In transmission belt and as transmission belt enters spray chamber 10, the first spray boom 11 and/or the second spray boom 16 in spray chamber 10 are to substrate
It is cleaned, as defeated band exports spray chamber 10 after having cleaned.
5th embodiment, as shown in Figures 1 to 5, it further includes hothouse that semiconductor packages cleaning equipment, which waves spray equipment,
21, hothouse 21 is close to the outlet side of spray chamber 10, and hothouse 21 is inner to be equipped with Gas inlet tube 23 and air knife 22, and Gas inlet tube 23 is close
10 side of spray chamber, air knife 22 is far from 10 side of spray chamber.Gas inlet tube 23 is connect with external high pressure wind, and high-pressure blast is to from spray chamber
10 output substrates drying, while air knife 22 vapor of substrate surface is scraped it is dry.
It is specific embodiment of the present utility model above, it is noted that for those skilled in the art
For, without departing from the principle of this utility model, several improvements and modifications can also be made, these improvements and modifications
It is considered as the protection scope of the utility model.
Claims (7)
1. a kind of semiconductor packages cleaning equipment waves spray equipment, which is characterized in that including spray chamber, equipped with spray orifice first
Spray boom is used to support the first swinging frame of the first spray boom, motor, the first eccentric wheel and the first inlet tube；First inlet tube
Be connected to respectively with the first spray boom, first eccentric wheel is fixedly connected with electric machine main shaft, the first eccentric shaft of the first eccentric wheel with
First swinging frame is fixedly connected, and motor drives the first swinging frame to swing by the first eccentric shaft.
2. semiconductor packages cleaning equipment according to claim 1 waves spray equipment, which is characterized in that the spray chamber
Side wall is equipped with sliding rail, and first swinging frame side is fixed with swinging block, and swinging block is slidably connected with sliding rail, and the swinging block is set
There is swinging chute, first eccentric shaft is set in swinging chute and is flexibly connected with swinging chute.
3. semiconductor packages cleaning equipment according to claim 1 waves spray equipment, which is characterized in that first pendulum
Moving frame is frame structure, and several first spray booms are fixed in frame structure, and a side of the frame structure is hollow structure, institute
The first inlet tube is stated to be connected to several first spray booms respectively by hollow structure.
4. semiconductor packages cleaning equipment according to claim 2 or 3 waves spray equipment, which is characterized in that described half
It further includes the second spray boom equipped with spray orifice that conductor encapsulation cleaning equipment, which waves spray equipment, is used to support the second pendulum of the second spray boom
Moving frame, the second inlet tube, the second eccentric wheel and chain；Second inlet tube is connected to the second spray boom, first eccentric wheel
It is connected with the second eccentric wheel by chain, the second eccentric shaft of second eccentric wheel is fixedly connected with the second swinging frame.
5. semiconductor packages cleaning equipment according to claim 4 waves spray equipment, which is characterized in that second pendulum
Moving frame is frame structure, and several second spray booms are fixed in frame structure, and a side of the frame structure is hollow structure, institute
The second inlet tube is stated to be connected to several second spray booms respectively by hollow structure.
6. semiconductor packages cleaning equipment according to claim 1 waves spray equipment, which is characterized in that the semiconductor
It further includes the transmission belt for being used for transmission substrate that encapsulation cleaning equipment, which waves spray equipment, and transmission belt is set in spray chamber and along its length
Spend direction setting.
7. semiconductor packages cleaning equipment according to claim 6 waves spray equipment, which is characterized in that the semiconductor
It further includes hothouse that encapsulation cleaning equipment, which waves spray equipment, outlet side of the hothouse close to spray chamber, the hothouse
Inner to be equipped with Gas inlet tube and air knife, the Gas inlet tube is close to spray chamber side, and the air knife is far from spray chamber side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821219774.3U CN208743176U (en) | 2018-07-27 | 2018-07-27 | Semiconductor packages cleaning equipment waves spray equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821219774.3U CN208743176U (en) | 2018-07-27 | 2018-07-27 | Semiconductor packages cleaning equipment waves spray equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208743176U true CN208743176U (en) | 2019-04-16 |
Family
ID=66059503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821219774.3U Active CN208743176U (en) | 2018-07-27 | 2018-07-27 | Semiconductor packages cleaning equipment waves spray equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208743176U (en) |
-
2018
- 2018-07-27 CN CN201821219774.3U patent/CN208743176U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200409 Address after: 523000 1st floor, building a, No. 16, huangjinhu Industrial Zone, songmushan village, Dalang Town, Dongguan City, Guangdong Province Patentee after: Guangdong keldi Cleaning Technology Co., Ltd. Address before: 518000 Guangdong province Shenzhen Guangming New District Office of Gongming Tian Liao community of guangqiao road hi tech park first (Guangming hi tech Park West Area) third floor No. 1 Patentee before: SHENZHEN KED OPTICAL ELECTRIC TECHNOLOGY Co.,Ltd. |