CN208720088U - LED flame lamp - Google Patents
LED flame lamp Download PDFInfo
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- CN208720088U CN208720088U CN201821709688.0U CN201821709688U CN208720088U CN 208720088 U CN208720088 U CN 208720088U CN 201821709688 U CN201821709688 U CN 201821709688U CN 208720088 U CN208720088 U CN 208720088U
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- substrate
- led chip
- led
- light
- flame
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- 239000000758 substrate Substances 0.000 claims abstract description 84
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 230000000694 effects Effects 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 3
- 239000007924 injection Substances 0.000 claims abstract description 3
- 239000012780 transparent material Substances 0.000 claims description 11
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005284 excitation Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 241001465382 Physalis alkekengi Species 0.000 description 2
- 239000011222 crystalline ceramic Substances 0.000 description 2
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 2
- 239000002241 glass-ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses LED flame lamps, the LED chip that is arranged including substrate, on substrate and for controlling LED chip light on and off and flashing to form the control circuit board of flame effect, in the form of sheets, and substrate is arranged such that two surfaces and can project the light of LED chip injection to the substrate；It further include fluorescence coating, the light that the LED chip projects after the fluorescence coating with the color close with flame by being shown.The utility model replaces the substrate of traditional cylindricality or polyhedron shape by using the substrate of sheet, so that the volume of substrate is substantially reduced, cost is reduced.
Description
Technical field
The present invention relates to the manufacturing technology field of semiconductor luminaire more particularly to Simulated flame lamps.
Background technique
With the development of technology, lamps and lanterns in addition to common illumination functions, also imitate simultaneously with decoration by some lamps and lanterns
Fruit, such as the flame lamp of the jump flickering effect of most popular simulation flame combustion is exactly one of at present.
Being achieved in that while being lighted using quartz bulb for traditional flame lamp blows afloat red silk band, stone with blower
The red silk band that the light of English light bulb is radiated at shaking looks like burned flame, however, in above structure, blower
Operation not only causes the waste on the energy and at the same time noise can be brought, and silk band is easy to happen the event such as tangled up and knotted, breakage
Barrier.
Of the existing technology in order to solve the problems, such as, people have carried out long-term exploration, with the development of LED technology, people
Try through LED technology come Simulated flame effect.Such as: Chinese patent literature discloses a kind of 360 degree of LED luminous flame lamps
(application number: CN201510152837.2), the light source including a lampshade and in lampshade, light source is including a lamp housing and is set to lamp
The pedestal of shell one end, pedestal are equipped with lamp cap, are equipped with a lamp panel support in lamp housing, are coated with one in the outer surface of lamp panel support
The LED circuit board of cylindricality or polyhedron shape is laid with LED chip in LED circuit board, successively electric between LED circuit board and lamp cap
One is connected with according to the light on and off of certain sequential export pwm signal control LED chip and flashing control circuitry plate and driving
The driving power of control circuit board and LED circuit board work.
Above-mentioned scheme improves the subproblem of the prior art to a certain extent, still, the program still exist with
Lower defect: since a large amount of LED chip being distributed in LED circuit board, and LED chip is by LED chip and to apply set on its appearance
What the fluorescence coating on face formed, since light-emitting area is small, glare can be led to the problem of, simultaneously because fluorescent powder directly connects with chip
Touching generates light decay, reduces the service life；In addition, above-mentioned flame lamp is needed in the circuit board using cylindricality or the LED circuit board of polyhedron shape
It is distributed very more LED chips, this causes the volume of entire flame lamp very big, and complicated integral structure, is unfavorable for entire
The reduction of flame lamp processing cost.
Summary of the invention
It is of the invention aiming at the shortcomings in the prior art, provide LED flame lamp.
The application is achieved by the following technical solution: LED flame lamp, the LED being arranged including substrate, on substrate
Chip and for controlling LED chip light on and off and flashing to form the control circuit board of flame effect, the substrate in the form of sheets, and base
Plate, which is arranged such that two surfaces, can project the light of LED chip injection；It further include fluorescence coating, the LED chip projects
Light by being shown after the fluorescence coating with the color close with flame.
In above-mentioned technical proposal, the substrate selects transparent material, is provided on a surface of the substrate described
LED chip.
In above-mentioned technical proposal, the substrate uses transparent materials, offers several through-holes on the substrate, described
Be provided with the LED chip on one surface of substrate, the LED chip is distributed on the path that the through-hole is formed, with
It is projected by the through-hole to another surface of substrate in the light for projecting LED chip.
In above-mentioned technical proposal, the substrate uses transparent materials, is respectively provided on two surfaces of the substrate
There is LED chip.
In above-mentioned technical proposal, two surfaces of the substrate are arranged in the fluorescence coating.
In above-mentioned technical proposal, the fluorescence coating is formed on a fluorescence cover, and the substrate is located at fluorescence cover encirclement
Space in and two surfaces of substrate, do not contacted with fluorescence cover.It is separated using remote excitation, reduces light decay, extend the service life.
In above-mentioned technical proposal, the transparent material is sapphire, glass or crystalline ceramics.
The invention has the following beneficial effects: the present invention to replace traditional cylindricality or polyhedron by using the substrate of sheet
The substrate of shape, so that the volume of substrate is substantially reduced, cost is reduced.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention 1.
Fig. 2 is the part-structure schematic cross-sectional view of the embodiment of the present invention 1.
Fig. 3 is the structural schematic diagram of the embodiment of the present invention 2.
Fig. 4 is the part-structure schematic cross-sectional view of the embodiment of the present invention 2.
Fig. 5 is the structural schematic diagram of the embodiment of the present invention 3.
Fig. 6 is the part-structure schematic cross-sectional view in the embodiment of the present invention 3.
Fig. 7 is the structural schematic diagram of the embodiment of the present invention 4.
Fig. 8 is the part-structure schematic cross-sectional view in the embodiment of the present invention 4.
Fig. 9 is the structural schematic diagram of the embodiment of the present invention 5.
Specific embodiment
Present invention is further described in detail with specific embodiment with reference to the accompanying drawing:
Embodiment 1: referring to Fig. 1 to Fig. 2, LED flame lamp, including flaky substrate 1, if being offered on the substrate 1
Dry through-hole 5, is provided with the LED chip 2 on a surface 10 of the substrate 1, and the LED chip 2 be distributed in it is described
On the path that through-hole 5 is formed, projected by the through-hole to another surface 11 of substrate with the light for projecting LED chip.
It is provided on substrate 1 for controlling 2 light on and off of LED chip and flashing to form the control circuit board 3 of flame effect,
It further include fluorescence coating 4, the fluorescence coating 4 applies two surfaces 10,11 for being located at the substrate 1, the light that the LED chip 2 projects
By being shown after the fluorescence coating 4 with the color close with flame.
In the embodiment, the substrate due to using sheet replaces the substrate of traditional cylindricality or polyhedron shape, makes
The volume for obtaining substrate is substantially reduced, and cost reduces；Additionally due to LED chip is provided only on a surface of substrate, lead to
It crosses the light that through-hole projects LED chip to project to another surface of substrate, this subtracts the setting quantity of LED chip significantly
It is few, finally cost is further reduced；Further, above structure LED on two surfaces of plate shape substrates is projected
Light is uniformly projected, and LED point light source is converted into area source, solves the problems, such as dazzle, while increasing the luminous uniformity,
So that the simulated effect of flame is greatly improved.
Embodiment 2: referring to Fig. 3 to Fig. 4, the fluorescence coating 4 is formed on a fluorescence cover 6, and the substrate 1 is located at described glimmering
In the space that light shield 6 surrounds and two surfaces 10,11 of substrate 1 do not contact with fluorescence cover.Embodiment 2 remaining with embodiment 1.
Embodiment 2 compare with embodiment 1, since fluorescence coating and LED chip is separately positioned, i.e., in LED chip
Fluorescent powder is no longer equipped on the light-emitting surface of LED chip, the light projected in LED chip be mapped to on its discontiguous fluorescence cover,
The light projection after change is gone out by fluorescence cover, that is, being converted LED point light source by way of remote excitation LED light source
At area source.Due to realize by fluorescent powder issue heat with LED chip sending heat be effectively isolated, can reduce LED chip,
The temperature of fluorescent powder, is improved light efficiency, to reduce the light decay phenomenon Probability of flame lamp, extends using the longevity
Life.
Embodiment 3:LED flame lamp, including flaky substrate 1, the substrate uses transparent material, for example, blue precious
Stone, glass or crystalline ceramics.The LED chip 2,1 one tables of the substrate are provided on one surface 10 of the substrate 1
The light that the LED chip 2 in face 10 projects is projected by substrate and to another surface 11 of substrate.
It is provided on substrate 1 for controlling LED chip light on and off and flashing to form the control circuit board 3 of flame effect,
It further include fluorescence coating 4, the fluorescence coating applies two surfaces 10,11 for being located at the substrate, and the light that the LED chip 2 projects is logical
It is shown after crossing the fluorescence coating 4 with the color close with flame.
Embodiment 3 compare with embodiment 1, the material of substrate is defined, so that being arranged on a surface on substrate
LED chip project light can by substrate and to another surface of substrate project.Therefore, the punching work to substrate is eliminated
Sequence, this is conducive to the convenience for promoting substrate processing.
In addition, although " transparent " word is shown in embodiment, however, those skilled in the art know, in this implementation
The transparent light for only needing satisfaction that the LED chip being arranged on a surface on substrate is enabled to project can be by substrate simultaneously in example
To the projection of another surface of substrate can (and be projected to another surface time remain unchanged keep with it is initial when close intensity, this Shen
Please in keep substrate to have 50% or more light transmittance), other transparent materials, such as light transmittance can be selected to exist in the present embodiment
The white translucent material of 60%-70%.
Embodiment 4: the fluorescence coating 4 is formed on a fluorescence cover 6, and the substrate 1 is located at the sky of the fluorescence cover 6 encirclement
Interior and substrate two surfaces 10,11 do not contact with fluorescence cover.Embodiment 4 remaining with embodiment 3.
4 comparing embodiment 3 of embodiment, the LED core since fluorescence coating and LED chip is separately positioned, i.e., in LED chip
Fluorescent powder is no longer equipped on the light-emitting surface of piece, the light projected in LED chip be mapped to on its discontiguous fluorescence cover, by glimmering
Light shield goes out the light projection after change, that is, LED point light source is converted into face light by way of remote excitation LED light source
Source.It is effectively isolated due to realizing the heat that the heat for issuing fluorescent powder is issued with LED chip, can reduce LED chip, fluorescent powder
Temperature, be improved light efficiency, to reduce the light decay phenomenon Probability of flame lamp, extend service life.
Embodiment 5:LED flame lamp, including flaky substrate 1, the substrate 1 uses transparent materials, in the base
LED chip 2 is provided on two surfaces 10,11 of plate 1.It is provided on substrate 1 for controlling LED chip light on and off and sudden strain of a muscle
The bright control circuit board 3 to form flame effect, further includes fluorescence coating 4, and the painting of fluorescence coating 4 is located at two of the substrate 1
Surface 10,11, the light that the LED chip 2 projects after the fluorescence coating 4 with the color close with flame by being shown.
In the embodiment, the substrate due to using sheet replaces the substrate of traditional cylindricality or polyhedron shape, makes
The volume for obtaining substrate is substantially reduced, additionally due to LED chip is provided on two surfaces of substrate, in plate shape substrates
The light that LED is projected on two surfaces is uniformly projected, and LED point light source is converted into area source, solves the problems, such as dazzle, simultaneously
The luminous uniformity is increased, so that the simulated effect of flame is greatly improved.
Embodiment 6: the fluorescence coating 4 is formed on a fluorescence cover 6, and the substrate 1 is located at the sky of the fluorescence cover 6 encirclement
Interior and substrate two surfaces 10,11 do not contact with fluorescence cover 6.Embodiment 6 remaining with embodiment 5.
6 comparing embodiment 5 of embodiment, the LED core since fluorescence coating and LED chip is separately positioned, i.e., in LED chip
Fluorescent powder is no longer equipped on the light-emitting surface of piece, the light projected in LED chip be mapped to on its discontiguous fluorescence cover, by glimmering
Light shield goes out the light projection after change, that is, LED point light source is converted into face light by way of remote excitation LED light source
Source.It is effectively isolated due to realizing the heat that the heat for issuing fluorescent powder is issued with LED chip, can reduce LED chip, fluorescent powder
Temperature, be improved light efficiency, to reduce the light decay phenomenon Probability of flame lamp, extend service life.
Embodiment 1 is into embodiment 6, and the LED chip on 1 surface of substrate is packaged by forms such as COB CSP, this Shen
Please in specific packaging technology without repeating.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments.Described in the above embodiment and specification in the application
It is the principle of the present invention, various changes and improvements may be made to the invention without departing from the spirit and scope of the present invention.On
Changes and improvements are stated to both fall in the range of claimed invention.
Claims (7)
1.LED flame lamp, it is bright including substrate (1), the LED chip (2) being arranged on substrate (1) and for controlling LED chip (2)
Go out and flash to form the control circuit board of flame effect (3), it is characterised in that: the substrate (1) in the form of sheets, and substrate (1)
It is arranged such that two surfaces (10,11) can project the light of LED chip (2) injection；It further include fluorescence coating (4), it is described
The light that LED chip (2) projects after the fluorescence coating (4) with the color close with flame by being shown.
2. LED flame lamp as described in claim 1, it is characterised in that: the substrate (1) selects transparent material, in the base
The LED chip (2) are provided on one surface (10) of plate.
3. LED flame lamp as described in claim 1, it is characterised in that: the substrate (1) uses transparent materials, described
It is offered on substrate (1) several through-holes (5), is provided with the LED chip (2), institute on a surface (10) of the substrate (1)
It states LED chip (2) to be distributed on the path of the through-hole (5) formation, be passed through with the light for projecting LED chip (2) described
Through-hole (5) is projected to another surface (11) of substrate.
4. LED flame lamp as described in claim 1, it is characterised in that: the substrate (1) uses transparent materials, described
LED chip (2) are provided on two surfaces (10,11) of substrate (1).
5. the LED flame lamp as described in Claims 1-4 any one, it is characterised in that: the fluorescence coating (4) is arranged in institute
State two surfaces (10,11) of substrate (1).
6. the LED flame lamp as described in any one of Claims 1-4, it is characterised in that: the fluorescence coating (4) is formed in
On one fluorescence cover (6), the substrate (1) is located in the space of the fluorescence cover (6) encirclement and two surfaces (10,11) of substrate
It is not contacted with fluorescence cover (6).
7. LED flame lamp as claimed in claim 2, it is characterised in that: the transparent material is sapphire, glass or transparent
Ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821709688.0U CN208720088U (en) | 2018-10-22 | 2018-10-22 | LED flame lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821709688.0U CN208720088U (en) | 2018-10-22 | 2018-10-22 | LED flame lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208720088U true CN208720088U (en) | 2019-04-09 |
Family
ID=65983384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821709688.0U Active CN208720088U (en) | 2018-10-22 | 2018-10-22 | LED flame lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208720088U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109210481A (en) * | 2018-10-22 | 2019-01-15 | 宁波阳铭星光电子科技有限公司 | LED flame lamp |
| CN113587036A (en) * | 2021-08-12 | 2021-11-02 | 苏州乔远激光科技有限公司 | Transparent piezoelectricity polychrome LD atmosphere lamp module |
-
2018
- 2018-10-22 CN CN201821709688.0U patent/CN208720088U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109210481A (en) * | 2018-10-22 | 2019-01-15 | 宁波阳铭星光电子科技有限公司 | LED flame lamp |
| CN113587036A (en) * | 2021-08-12 | 2021-11-02 | 苏州乔远激光科技有限公司 | Transparent piezoelectricity polychrome LD atmosphere lamp module |
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