CN208706582U - The Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated - Google Patents
The Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated Download PDFInfo
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- CN208706582U CN208706582U CN201821641907.6U CN201821641907U CN208706582U CN 208706582 U CN208706582 U CN 208706582U CN 201821641907 U CN201821641907 U CN 201821641907U CN 208706582 U CN208706582 U CN 208706582U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses the Sip mould groups and its apparatus for coating of a kind of electromagnetic shielding glue to be coated, the SiP mould group of electromagnetic shielding glue to be coated includes substrate, multiple electronic components and plastic packaging layer, substrate includes supporting layer, conductive layer and insulating layer, interval conducting end and edge conductive end are equipped in insulating layer, the lower end surface of two kinds of conducting ends is connect with conductive layer, and upper surface is flushed with the upper surface of substrate；Electronic component is welded on upper surface of base plate, has the electronic component of electromagnetism interference requirement to be individually laid in interval conducting end side；Plastic packaging layer coated electric components；The interval shielding trench and syntype shielding trench for penetrating through plastic packaging layer from top to bottom are offered in plastic packaging layer, filling shields glue into interval shielding trench and syntype shielding trench by vacuum coated mode.Interval shielded layer and syntype shielded layer can be arranged in the SiP mould group production method of the utility model simultaneously, and apparatus for coating is simple, and low manufacture cost, manufacture craft is few, can save sizing material, reduce product cost.
Description
Technical field
The utility model relates to Sip encapsulation (System In a Package system in package) making technologies to improve, espespecially
A kind of the Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated.
Background technique
SIP encapsulation (System In a Package system in package) is including processor, to deposit multiple functions chip
The functional chips such as reservoir are integrated in an encapsulation, to realize a substantially complete function.In order to prevent in electronic product
Portion's signal is disturbed or interfering with each other causes its communication quality to reduce, and generally requires the setting in electronic product and different function are isolated
The middle shield of energy electronic component, and syntype shielded layer, middle shield and syntype shielding is arranged in the outermost layer of electronic product
Layer is electro-magnetic screen layer.Existing middle shield in setting, usually first slot on glue-line, and leads to by covering on substrate
Cross spraying mode insert in slot liquid shield glue shield in this manufacturing method thereof to form the electromagnetic shielding in Sip product
It is big to cover slot size, UPH (Unit Per Hour, output hourly) is low, and glue material waste is bigger, has been unable to satisfy Sip product
Highly integrated, inexpensive demand.And existing syntype shielding is then the single Sip by the way of sputter coating after dicing
Outer surface plates one layer of barrier film layer, and this process apparatus and jig are at high cost.
Therefore, the applicant is dedicated to providing the Sip mould group of the novel electromagnetic shielding glue to be coated of one kind and its applying arranging
It sets.
Utility model content
The purpose of the utility model is to provide the Sip mould group and its apparatus for coating of a kind of electromagnetic shielding glue to be coated, production
Simple process, it is easy to operate, it can effectively improve the producing efficiency of Sip mould group, and the cost of producing device is low, it is convenient to operate.
The technical scheme that the utility model is provided is as follows:
A kind of SiP mould group of electromagnetic shielding glue to be coated, comprising: substrate, the substrate include stacking gradually from bottom to top
The supporting layer of setting, conductive layer and insulating layer are preset with several single SiP mould groups on the substrate and lay area and for separating
The Cutting Road of single SiP mould group, in the insulating layer, single SiP mould group lay area and be laid at least one interval conducting end,
In the insulating layer, edge conductive end is set, under the interval conducting end and the edge conductive end on the Cutting Road
End face is connect with the conductive layer respectively, upper surface and the substrate at the interval conducting end and the edge conductive end it is upper
End face；At least two electronic components, the electronic component are welded on the insulating layer upper surface of the substrate, and will be had anti-
The electronic component that electromagnetic interference requires individually is laid in the interval conducting end side；Plastic packaging layer, the plastic packaging layer setting
In the upper surface of the substrate, and the electronic component is coated；Interval shielding trench and syntype are offered in the plastic packaging layer
Shielding trench, the interval shielding trench and the syntype shielding trench penetrate through the plastic packaging layer, the syntype shielding from top to bottom respectively
Slot is opened in the surface at the edge conductive end, exposes the upper surface at the edge conductive end；The interval shielding trench is opened
Set on the surface of the interval conducting end, expose the upper surface at the edge conductive end.
Preferably, the interval conducting end is a T-type structure, the upper surface of the horizontal part of T-type structure and the substrate
Upper surface flushes, and the lower end surface of vertical portion is connected to the conductive layer.
A kind of electromagnetic shielding gum coating apparatus is coated with for the SiP mould group to any of the above-described kind of electromagnetic shielding glue to be coated
It is electromagnetically shielded glue, comprising: vacuum chamber, the vacuum chamber provide vacuum environment for the SiP mould group of electromagnetic shielding glue to be coated；Dispensing
Head, the Glue dripping head are used to provide shielding glue to the upper surface of the SiP mould group of electromagnetic shielding glue to be coated；Mobile scraper is located at
In the vacuum chamber, in the operating condition, the mobile scraper is located at the upper surface of the SiP mould group, and along the SiP mould
The plastic packaging layer upper surface of group moves back and forth, to complete the coating of shielding glue.
Preferably, described device further includes a baffle, and the baffle is a frame-type structure, for covering electromagnetic screen to be coated
The edge of the plastic packaging layer upper surface of the SiP mould group of glue is covered, and single Sip mould group is exposed.
The Sip mould group and its apparatus for coating of one kind electromagnetic shielding glue to be coated provided by the utility model can be brought following
It is at least one the utility model has the advantages that
1, in the utility model it is to be coated electromagnetic shielding glue Sip mould group production method be by plastic packaging layer simultaneously
Syntype shielding trench and interval shielding trench are set, and placed it in vacuum chamber, makes to be in vacuum state in the slot in Sip mould group,
Then the shielding glue laminated on Sip mould group surface is expired by interval shielding trench and syntype shielding trench in Sip mould group by mobile scraper, and
A shielding glue-line is formed in the mould group upper surface Sip, the shielding glue then cut off in syntype shielding trench can be obtained by multiple be equipped with
The Sip product of intershield glue-line and syntype shielding glue-line, device is simple, the low manufacture cost of device, and making technology is simple,
It is easy to operate, and occupy little space, and Sip production cost can be reduced with effectively save glue material.
2, in the utility model, the SiP mould group of electromagnetic shielding glue to be coated is convenient for while the centre of single Sip product is arranged
The syntype shielded layer of shielded layer and single Sip product surface saves to simplify the technique of post-production electro-magnetic screen layer
Cost of manufacture.
3, in the utility model, in the SiP mould group of electromagnetic shielding glue to be coated, the bottom groove width and edge of syntype shielding trench
The upper surface of ground terminal is of same size, while being spaced the bottom groove width of shielding trench and the upper surface at spaced ground end is of same size,
Setting can be such that the ground terminal in shielded layer and substrate in slot effectively connects in this way, in addition, in the sliver processing procedure in later period, it can
It is connect with the shielding glue being effectively ensured in syntype shielding trench with the edge ground terminal in substrate, so that syntype shielding glue be made to pass through side
Edge ground terminal is connect with the conductive layer in substrate.
4, in the utility model, the method and step that electro-magnetic screen layer is arranged in Sip mould group is few, easy to operate, can be effective
Shielding material is reduced, technique is shortened, saves cost, and yield of the Sip product within the unit time increases substantially.
5, in the utility model, in vacuum filler, a baffle is set in the top surface edge of Sip mould group, it will be extra
Shielding glue scrape on baffle, the extra shielding glue of easy cleaning can also avoid extra shielding glue stain plastic-sealed body surface.
6, in the utility model, electromagnetic shielding gum coating apparatus structure is simple, low cost, and easy to use, is effectively promoted
The producing efficiency of SiP mould group, reduces the production cost.
Detailed description of the invention
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to the above-mentioned spy of the utility model
Property, technical characteristic, advantage and its implementation are further described.
Fig. 1 is a kind of specific embodiment of SiP mould group of the electromagnetic shielding glue to be coated in the utility model in unslotted
Structural schematic diagram；
Fig. 2 be shown in Fig. 1 it is to be coated electromagnetic shielding glue SiP mould group fluting after structural schematic diagram；
Fig. 3 is the SiP of the electromagnetic shielding gum coating apparatus in electromagnetic shielding glue to be coated shown in Fig. 2 of the utility model
The process schematic of setting electromagnetic shielding glue-line in mould group；
Fig. 4 is the structural schematic diagram by treated the Sip mould group of the device in Fig. 3；
Fig. 5 is the structural schematic diagram that the single Sip product after cutting process is carried out to the Sip mould group in Fig. 4.
Drawing reference numeral explanation:
1, substrate, 11, supporting layer, 12, conductive layer, 13, insulating layer, 14, interval conducting end, 15, edge conductive end；21,
Electronic component, 22, electronic component, 23, electronic component；3, plastic packaging layer, 31, syntype shielding trench, 32 interval shielding trenches；4, vacuum
Room；5, mobile scraper；6, baffle；7, glue is shielded；8, glue-line is shielded.
Specific embodiment
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, attached drawing will be compareed below
Illustrate specific embodiment of the present utility model.It should be evident that the accompanying drawings in the following description is only the one of the utility model
A little embodiments for those of ordinary skill in the art without creative efforts, can also be according to these
Attached drawing obtains other attached drawings, and obtains other embodiments.To make simplified form, only schematically showing in each figure
Part relevant to the utility model, they do not represent its practical structures as product.
Specific embodiment one
In conjunction with shown in Fig. 1~5, this specific embodiment discloses a kind of production of SiP mould group with electromagnetic armouring structure
Step:
S1, production substrate 1, as shown in Figure 1, substrate 1 includes supporting layer 11, the conductive layer being cascading from bottom to top
12 and insulating layer 13, several single SiP mould groups, which are preset with, on substrate 1 lays areas and the Cutting Road for separating single SiP mould group,
In insulating layer 13, area is laid in single SiP mould group being equipped with an interval conducting end 14, insulating layer 13 is interior, is arranged on Cutting Road
Edge conductive end 15, the lower end surface for being spaced conducting end 14 and edge conductive end 15 are connect with conductive layer 12 respectively, are spaced conducting end
14 and the upper surface at edge conductive end 15 be exposed to the upper surface of substrate 1 and flushed with the upper surface of substrate 1；
S2, the single SiP mould group in the upper surface of substrate 1, which are laid, is welded with electronic component 21,22 and 23 in area, anti-by having
The electronic component 21 that electromagnetic interference requires individually is laid in interval 14 side of conducting end, and electronic component 22, electronic component 23 are laid
In interval 14 other side of conducting end；
S3, plastic packaging layer 3 is formed in the upper surface of substrate 1, plastic packaging layer 3 coats all electronic components 21,22 and 23, obtains
SiP mould group as shown in Figure 1；
Syntype shielding trench 31 and interval shielding trench 32 are opened up on plastic packaging layer 3 in S4, SiP mould group shown in Fig. 1, altogether
Type shielding trench 31 is opened in the surface at edge conductive end 15, exposes the upper surface at edge conductive end 15, is spaced shielding trench 32
It is opened in the surface of interval conducting end 14, exposes the upper surface for being spaced conducting end 14, obtains electricity to be coated as shown in Figure 2
The SiP mould group of magnetic screen glue；
S5, as shown in figure 3, by SiP mould group made from step S4 be placed in electromagnetic shielding gum coating apparatus vacuum chamber 4 in,
It carries out electromagnetic shielding glue coating process: placing shielding glue 7 on 3 upper surface of plastic packaging layer of SiP mould group, use a mobile scraper 5
It is moved back and forth along 3 upper surface of plastic packaging layer of SiP mould group, so that shielding glue is filled up syntype shielding trench 31 and be spaced shielding trench 32, and
One layer of shielded layer 8 is formed on the upper surface of the plastic packaging layer 3 of SiP mould group, obtains SiP mould group as shown in Figure 4；
S6, along Cutting Road sliver, form the single SiP mould group with electromagnetic armouring structure as shown in Figure 5.
In the present embodiment, the step S5 further comprises step S51: being placed in the SiP mould group made from step S4
One baffle 6, baffle 6 are a frame-type structure, and baffle 6 only covers the edge of 3 upper surface of plastic packaging layer of SiP mould group, makes single SiP mould
Group is exposed, including exposing the interval shielding trench 32 in the single SiP mould group, syntype shielding trench 31 and plastic packaging layer 3
The plastic packaging layer 3 it is possible to prevente effectively from extra shielding glue stain SiP mould group is arranged in upper surface, baffle 6, and it is extra to be also convenient for clearing up
Shielding glue.
In the present embodiment, the conductive layer 12 in substrate 1 is layers of copper, is spaced conducting end 14 and edge conductive end 15 is copper
Block.
The method and process of setting electro-magnetic screen layer in the utility model is simple, easy to operate, can save shielding material,
Cost is saved, and can effectively improve Sip product in the yield in unit time of setting electro-magnetic screen layer.
Certainly, in other specific embodiments of the Sip mould group with electromagnetic armouring structure of the utility model, individually
SiP mould group lays the number of electronic component in area, the row being spaced between the number and interval conducting end and electronic component of conducting end
Cloth relationship can be adjusted according to actual needs；The setting of the step S51 property of can choose；Conductive layer and interval in substrate are led
Electric end and edge conductive end, which can according to need, selects other conductive materials, no longer repeats one by one herein.
Specific embodiment two
In conjunction with shown in Fig. 1,2, this specific embodiment discloses a kind of SiP mould group of electromagnetic shielding glue to be coated, including base
Plate 1, multiple electronic components and plastic packaging layer 3, substrate 1 include supporting layer 11,12 and of conductive layer being cascading from bottom to top
Insulating layer 13 is preset with several single SiP mould groups on substrate 1 and lays areas and the Cutting Road for separating single SiP mould group, exhausted
Edge layer 13 is interior, single SiP mould group laying area is laid with an interval conducting end 14, and side is arranged in insulating layer 13, on Cutting Road
Edge conducting end 15, the lower end surface for being spaced conducting end 14 and edge conductive end 15 are connect with conductive layer 12 respectively, are spaced conducting end 14
It is flushed with the upper surface at edge conductive end 15 with the upper surface of substrate 1, multiple electronic components 21,22 and 23 are welded on substrate 1
It on 13 upper surface of insulating layer, and is laid in area in single SiP mould group, there is the electronic component 21 of electromagnetism interference requirement individually to lay
In interval 14 side of conducting end, electronic component 22, electronic component 23 are laid in interval 14 other side of conducting end.Plastic packaging layer 3 is arranged
On the top surface of the substrate 1, and coated electric components 21,22 and 23.
Syntype shielding trench 31 and interval shielding trench 32, syntype shielding trench 31 and interval shielding trench are offered in plastic packaging layer 3
32 penetrate through plastic packaging layer 3 from top to bottom respectively, and syntype shielding trench 31 and edge conductive end 15 correspond, and syntype shielding trench 31 is opened
Set on the surface at edge conductive end 15, exposes the upper surface at edge conductive end 15, shielding is filled up in syntype shielding trench 31
After glue, the shielding glue in syntype shielding trench 31 is connect with edge ground terminal 15, and the shielding glue in syntype shielding trench 31 passes through
Edge ground terminal 15 is connect with the conductive layer 12 in substrate 1.It is spaced shielding trench 32 and interval conducting end 14 corresponds, spacing screen
The surface that slot 32 is opened in interval conducting end 14 is covered, exposes the upper surface at edge conductive end 15, that is to say, that in spacing screen
It covers after filling up shielding glue in slot 32, the shielding glue being spaced in shielding trench 32 is connect with spaced ground end 14, and is spaced shielding trench
Shielding glue in 32 is connect by spaced ground end 14 with the conductive layer 12 in substrate 1.
In the present embodiment, syntype shielding trench 31 is a rectangular channel, and after shielding glue is filled up in syntype shielding trench 31, edge is cut
When cutting progress cutting splitting, the shielding glue-line in the syntype shielding trench 31 is cut into two parts, and respectively as two phases
The syntype of adjacent Sip product shields glue-line.In the present embodiment, the groove width of syntype shielding trench 31 is kept from port thereon to lower port
It is constant, and the groove width of syntype shielding trench 31 and the upper surface of edge ground terminal 15 is of same size, when being arranged in this way, can make altogether
Shielding glue-line in type shielding trench 31 comes into full contact with edge ground terminal 15.
In the present embodiment, interval conducting end 14 is a T-type structure, upper surface and the substrate 1 of the horizontal part of T-type structure
Upper surface flushes, and the lower end surface of vertical portion is connected to conductive layer 12.The groove width of shielding trench 32 is spaced from port thereon to lower port
Be gradually reduced, and be spaced the lower port of shielding trench 32 groove width and the upper surface at spaced ground end 14 it is of same size, set in this way
When setting, spacing screen can be made to cover the shielding glue-line in slot 32 and come into full contact with edge ground terminal 15, to make to be spaced shielding trench 32
In shielding glue-line can be connect by edge ground terminal 15 with the conductive layer 12 in substrate 1.
Disclosed in the present embodiment it is to be coated electromagnetic shielding glue SiP mould group middle shield and syntype can be set simultaneously
Shielded layer, so as to effectively propose the unit output of the subsequent processing procedure that electro-magnetic screen layer is arranged.
Certainly, in other specific embodiments of the SiP mould group of the electromagnetic shielding glue to be coated of the utility model, syntype screen
The groove body that slot can also be set as polygon annular groove, circular ring-shaped slot or other irregular shapes is covered, but the shape of groove body is not answered
The filling of the shielding glue-line in syntype shielding trench is influenced, while not influencing the formation of the syntype shielding glue-line of Sip product after sliver；
The laying number and mode of electronic component can according to need adjustment；Spaced ground end can be set to the constant knot of upper and lower width
Structure；Edge ground terminal also can be set to T-type structure；The specific structure of spaced ground end and edge ground terminal can be according to reality
It needs to be adjusted, the groove width of syntype shielding trench and interval shielding trench can also adjust according to actual needs, no longer specific herein
It repeats.
Specific embodiment three
As shown in figure 3, this specific embodiment discloses a kind of electromagnetic shielding gum coating apparatus, for implementing specific embodiment
The production method of SiP mould group in one with electromagnetic armouring structure, including vacuum chamber 4, Glue dripping head (not shown) and movement
Scraper plate 5, vacuum chamber 4 provide vacuum environment for the SiP mould group of electromagnetic shielding glue to be coated, make the SiP of electromagnetic shielding glue to be coated
It is in vacuum state in syntype shielding trench 31 and interval shielding trench 32 in mould group, Glue dripping head is used for electromagnetic shielding to be coated
The upper surface of the SiP mould group of glue provides shielding glue 7.Mobile scraper 5 is located in vacuum chamber 4, in the operating condition, mobile scraper 5
It is moved back and forth positioned at the upper surface of SiP mould group, and along 3 upper surface of plastic packaging layer of SiP mould group, to complete the coating of shielding glue.
Specifically, electromagnetic shielding gum coating apparatus further includes a baffle 6, baffle 6 is a frame-type structure, for covering electromagnetic screen to be coated
The edge of 3 upper surface of plastic packaging layer of the SiP mould group of glue is covered, and single Sip mould group is exposed, setting can be to avoid more in this way
Remaining shielding glue stain plastic-sealed body surface, is also convenient for handling extra shielding glue.
In the specific implementation, shape forms an angle mobile scraper 5 between the upper surface of Sip mould group when moving, thus
Shielding glue of the scraper plate 5 easy to remove in Sip mould group applies pressure, and certainly, the bottom of mobile scraper 5 can also be arranged one tiltedly
Face, so that further scraper plate 5 easy to remove applies pressure to shielding glue.
When setting shields glue-line, since the Sip mould group of electromagnetic shielding glue-line to be placed is located in vacuum chamber 4, so Sip
It is in vacuum state in slot in mould group, keeps mobile scraper 5 mobile in the upper horizontal of Sip mould group, makes in moving process
Shielding glue on Sip mould group upper surface gradually fills up syntype shielding trench 31 and interval shielding trench 32, due to being in vacuum shape in slot
State, therefore, the filling for shielding glue are more abundant, and shielding glue is formed on the upper surface of Sip mould group under the action of mobile scraper 5
One shielding glue-line 8.
The apparatus structure of setting electromagnetic shielding glue-line disclosed in the present embodiment is simple, occupies little space, and installation cost is low,
And making technology is simple, and the efficiency of the electromagnetic shielding glue-line processing procedure of Sip mould group can effectively be turned up, be conducive to glue material saving, drop
Low cost of manufacture.
In other specific embodiments of the electromagnetic shielding gum coating apparatus of the utility model, the specific structure of baffle according to
The shape and size of the SiP mould group of electromagnetic shielding glue to be coated are adaptively adjusted, it is, of course, also possible to be not provided with baffle.
It should be noted that above-described embodiment can be freely combined as needed.The above is only the utility model
Preferred embodiment, it is noted that for those skilled in the art, do not departing from the utility model principle
Under the premise of, several improvements and modifications can also be made, these improvements and modifications also should be regarded as the protection scope of the utility model.
Claims (4)
1. a kind of SiP mould group of electromagnetic shielding glue to be coated characterized by comprising
Substrate, the substrate include the supporting layer being cascading from bottom to top, conductive layer and insulating layer, pre- on the substrate
Area is laid equipped with several single SiP mould groups and the Cutting Road for separating single SiP mould group, in the insulating layer, individually
SiP mould group lays area and is laid at least one interval conducting end, and edge conductive is arranged in the insulating layer, on the Cutting Road
The lower end surface at end, the interval conducting end and the edge conductive end is connect with the conductive layer respectively, the interval conducting end
It is flushed with the upper surface at the edge conductive end with the upper surface of the substrate；
At least two electronic components, the electronic component are welded on the insulating layer upper surface of the substrate, and will have anti-electromagnetism
The electronic component of interference requirement is individually laid in the side of the interval conducting end；
Plastic packaging layer, the plastic packaging layer setting in the upper surface of the substrate, and coat the electronic component；In the plastic packaging layer
It inside offers interval shielding trench and syntype shielding trench, the interval shielding trench and the syntype shielding trench penetrates through from top to bottom respectively
The plastic packaging layer, the syntype shielding trench are opened in the surface at the edge conductive end, make the upper end at the edge conductive end
It shows out；The interval shielding trench is opened in the surface of the interval conducting end, shows the upper end at the edge conductive end
Out.
2. the SiP mould group of electromagnetic shielding glue to be coated according to claim 1, it is characterised in that: the interval conducting end
For a T-type structure, the upper surface of the horizontal part of T-type structure is flushed with the upper surface of the substrate, the lower end surface connection of vertical portion
In the conductive layer.
3. a kind of electromagnetic shielding gum coating apparatus, it is characterised in that: for the electricity to be coated as described in claim 1-2 is any
The SiP mould group coating electromagnetic shielding glue of magnetic screen glue, comprising:
Vacuum chamber, the vacuum chamber provide vacuum environment for the SiP mould group of electromagnetic shielding glue to be coated；
Glue dripping head, the Glue dripping head are used to provide shielding glue to the upper surface of the SiP mould group of electromagnetic shielding glue to be coated；
Mobile scraper is located in the vacuum chamber, and in the operating condition, the mobile scraper is located at the upper table of the SiP mould group
Face, and moved back and forth along the plastic packaging layer upper surface of the SiP mould group, to complete the coating of shielding glue.
4. electromagnetic shielding gum coating apparatus as claimed in claim 3, it is characterised in that:
Described device further includes a baffle, and the baffle is a frame-type structure, for covering described in electromagnetic shielding glue to be coated
The edge of the plastic packaging layer upper surface of SiP mould group, and single Sip mould group is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821641907.6U CN208706582U (en) | 2018-10-10 | 2018-10-10 | The Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821641907.6U CN208706582U (en) | 2018-10-10 | 2018-10-10 | The Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated |
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| Publication Number | Publication Date |
|---|---|
| CN208706582U true CN208706582U (en) | 2019-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821641907.6U Active CN208706582U (en) | 2018-10-10 | 2018-10-10 | The Sip mould group and its apparatus for coating of electromagnetic shielding glue to be coated |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300793A (en) * | 2018-10-10 | 2019-02-01 | 环维电子(上海)有限公司 | The production method and device of Sip mould group with electromagnetic armouring structure |
| WO2020238139A1 (en) * | 2019-05-28 | 2020-12-03 | 潍坊歌尔微电子有限公司 | Electromagnetic shielding structure and manufacturing method therefor, and electronic device |
-
2018
- 2018-10-10 CN CN201821641907.6U patent/CN208706582U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300793A (en) * | 2018-10-10 | 2019-02-01 | 环维电子(上海)有限公司 | The production method and device of Sip mould group with electromagnetic armouring structure |
| CN109300793B (en) * | 2018-10-10 | 2024-01-19 | 环维电子(上海)有限公司 | Manufacturing method and device of Sip module with electromagnetic shielding structure |
| WO2020238139A1 (en) * | 2019-05-28 | 2020-12-03 | 潍坊歌尔微电子有限公司 | Electromagnetic shielding structure and manufacturing method therefor, and electronic device |
| US11882681B2 (en) | 2019-05-28 | 2024-01-23 | Weifang Goertek Microelectronics Co. Ltd. | Electromagnetic shielding structure and manufacturing method thereof, and electronic device |
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