CN208673040U - Mask cleaning device - Google Patents
Mask cleaning device Download PDFInfo
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- CN208673040U CN208673040U CN201821285955.6U CN201821285955U CN208673040U CN 208673040 U CN208673040 U CN 208673040U CN 201821285955 U CN201821285955 U CN 201821285955U CN 208673040 U CN208673040 U CN 208673040U
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- mask
- nitrogen
- cleaning device
- particulate matter
- airtight chamber
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Abstract
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of mask cleaning devices.The mask cleaning device further includes airtight chamber for accommodating the mask and is located at the indoor sweep module of the closed chamber including the exposure machine for detecting particle article coordinate on mask；The sweep module connects the exposure machine, and for obtaining the coordinate of particulate matter on the mask, and the mask plate according to the coordinate pair is purged, to remove the particulate matter on the mask.The utility model realizes the automated cleaning to mask, avoids the troublesome operation of artificial cleaning mode.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of mask cleaning devices.
Background technique
In ic manufacturing process, photoetching process defines integrated circuit according to circuit design drawing on a semiconductor wafer
Pattern.In general, making mask according to circuit design drawing first, i.e., is inscribed on original mask copy (Blank) and form circuit
Then pattern covers photoresist layer in semiconductor wafer surface, then under the blocking of the mask with circuit pattern half-and-half
Semiconductor wafer is exposed, and using development, the circuit pattern in mask is transferred to photoresist layer, then, semiconductor die
The region that circular surfaces form exposed region and are covered by photoresist.After the completion of above-mentioned photoetching process, semiconductor crystal wafer is passed
Later process stages are sent to, subsequent processing, such as etching, oxidation, diffusion etc. are carried out.
Since all circuit components eventually formed are made according to mask pattern, photoetching process is
Committed step in ic manufacturing process, wherein mask for forming circuit pattern on a semiconductor wafer, if covered
The second-rate quality that can directly result in photoetching process of template is undesirable, such as the presence of reticle surface particulate matter,
It will lead to photoetching quality decline, to seriously affect the yield of semiconductor crystal wafer processing.
In order to avoid this problem, mask used in existing photoetching process is before exposure and after exposure, staff
Exposure machine progress will be put it into the inspection of line defect.Detection system in exposure machine distinguishes the square two sides of mask
It is scanned, once discovery particulate matter, will record lower particulate matter in the position coordinates of reticle surface and sounds an alarm.Work people
Mask can be exited exposure machine after seeing alarm by member, and be transferred them on mask transfer machine, according to the particulate matter of record
Coordinate position finds particulate matter on mask by the way of artificial eye searching and removes, and then again puts back to mask
Exposure machine carries out particle analyte detection again, and so on, until particulate matter is all removed on mask.This removing mask
The mode of upper particulate matter due to needing mask to be repeatedly loaded into, setting out exposure machine, and needs manually to find, removes particle
Object, operation is quite cumbersome, seriously reduces the cleaning efficiency of mask；Moreover, mask is repeatedly loaded into, sets out the mistake of exposure machine
Particulate matter inside Cheng Zhong, external environment or exposure machine is also easy to fall to reticle surface, causes secondary pollution.
Therefore, the particulate matter on mask how efficiently, is efficiently removed, is a technical problem to be solved urgently.
Utility model content
The utility model provides a kind of mask cleaning device, for solving particulate matter elimination efficiency on existing mask
Low, cumbersome problem, to improve the efficiency of photoetching process.
To solve the above-mentioned problems, the utility model provides a kind of mask cleaning device, including for detecting mask
The exposure machine of particle article coordinate in version further includes airtight chamber for accommodating the mask and is located at the closed chamber
Indoor sweep module；The sweep module connects the exposure machine, for obtaining the coordinate of particulate matter on the mask, and
It is purged according to mask plate described in the coordinate pair, to remove the particulate matter on the mask.
Preferably, the sweep module includes controller and an at least nitrogen gun；The controller connects the exposure machine
With the nitrogen gun, for obtaining the coordinate of particulate matter on the mask plate, and the nitrogen gun is controlled towards at the coordinate
Spray nitrogen.
Preferably, the angle of the direction of the nitrogen gun injection nitrogen and mask place plane is 45 degree.
Preferably, in the airtight chamber further include plummer for carrying the mask；An at least nitrogen gun packet
Include multiple nitrogen guns, and axially symmetric setting of multiple nitrogen guns about the plummer.
Preferably, the exposure machine is also used to detect the partial size of the particulate matter；The controller is for obtaining described
The partial size of grain object, and the flow velocity that the nitrogen gun sprays nitrogen is adjusted according to the partial size.
Preferably, the opposite end of the airtight chamber is respectively provided with the first opening and the second opening, and first gas is through institute
The first opening is stated into the airtight chamber, the indoor particulate matter of the closed chamber is discharged from second opening.
Preferably, the first gas is nitrogen.
Preferably, the end of the airtight chamber is open with a third, and the mask is open through the third and passes in and out
The airtight chamber.
It preferably, further include the sensor and baffle for being located at the third opening；The sensor is described for detecting
Whether mask enters the airtight chamber, if so, the baffle is driven to close the third opening.
Mask cleaning device provided by the utility model, by setting airtight chamber and sweep module, and according to exposure
The particle article coordinate that machine examination measures, automatically cleans mask, avoids the troublesome operation of artificial cleaning mode, improves
The cleaning efficiency of mask；And due to entirely cleaning process carried out in airtight chamber, external environment is avoided to mask
The secondary pollution of version, to further improve the cleaning effect of mask.
Detailed description of the invention
Attached drawing 1 is the structural schematic diagram of mask cleaning device in specific embodiment of the present invention；
Attached drawing 2 is the structural block diagram of mask cleaning device in specific embodiment of the present invention.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of mask cleaning device provided by the utility model.
Present embodiment provides a kind of mask cleaning device, and attached drawing 1 is specific embodiment of the present invention
The structural schematic diagram of middle mask cleaning device, attached drawing 2 are mask cleaning devices in specific embodiment of the present invention
Structural block diagram.
As shown in Figure 1 and Figure 2, the mask cleaning device that present embodiment provides, including for detecting mask 13
The exposure machine 23 of upper particle article coordinate further includes airtight chamber 11 for accommodating the mask 13 and is located at described close
Sweep module 21 in closed chamber room 11；The sweep module 21 connects the exposure machine 23, for obtaining the mask 13
The coordinate of particulate matter, and the mask plate 13 according to the coordinate pair is purged, to remove the particle on the mask 13
Object.Wherein, the exposure machine 23 obtains the concrete mode of particle article coordinate on the mask 13, examines with existing in line defect
Survey method is identical, such as the mode of optical scanner, and details are not described herein.
Specifically, when the mask 13 is in carrying out defect inspection in the exposure machine 23, and the mask is determined
On 13 after the coordinate of particulate matter, the mask 13 is transferred in the airtight chamber 11, the sweep module 21 is according to institute
The purging direction of the sweep module 21 can be adjusted in the particle article coordinate for stating the offer of exposure machine 13, and then targetedly
Gas purging is carried out to the mask 13, realize automation, the intelligentized particulate matter removed on the mask 13.
Preferably, the airtight chamber 11 is connected to the end of the exposure machine 23.So that the mask 13 is described
After completing defect inspection in exposure machine 23, it can be transferred directly to the airtight chamber 11, to reduce intermediate transfer link pair
The secondary pollution of the mask 13, and further increase the efficiency that particulate matter is removed on the mask 13.Wherein, described to cover
Template 13 can pass through mechanical arm or track transmission to the airtight chamber 11.
In order to simplify the overall structure of the mask cleaning device, it is preferred that the sweep module 21 includes controller
22 and at least one nitrogen gun 12；The controller 22 connects the exposure machine 23 and the nitrogen gun 12, for obtaining described cover
The coordinate of particulate matter in film version 13, and the nitrogen gun 12 is controlled towards injection nitrogen at the coordinate.
For example, the controller 22 obtains seat of the particulate matter on the mask 13 from the exposure machine 23
After mark, the nitrogen gun 12 is driven to be moved to oblique upper corresponding with the coordinate position or adjustment 12 spray head of nitrogen gun
Direction so that the nitrogen gun 12 sprays nitrogen towards the coordinate position, by the particulate matter from the mask 13
It removes on surface.
In order to further increase the efficiency that the 13 surface particles object of mask is removed, it is preferred that the nitrogen gun 12 is sprayed
The angle of the direction of radio-nitrogen gas and the 13 place plane of mask is 30 degree of -60 degree, more preferably 45 degree.
In order to further increase the efficiency that the 13 surface particles object of mask is removed, it is preferred that the airtight chamber 11
It inside further include the plummer 19 for carrying the mask 13；An at least nitrogen gun 12 includes multiple nitrogen guns 12, and multiple
Axially symmetric setting of the nitrogen gun 12 about the plummer 19.By the way that multiple nitrogen guns 12 are arranged, can be covered simultaneously to described
Multiple particulate matters on template 13 are purged, to further improve the cleaning efficiency of mask 13.
Preferably, the exposure machine 23 is also used to detect the partial size of the particulate matter；The controller 22, for obtaining
The partial size of particulate matter is stated, and the flow velocity that the nitrogen gun 12 sprays nitrogen is adjusted according to the partial size.Specifically, when described
When the partial size of grain object is greater than the first preset value, then nitrogen is sprayed using the first flow velocity；When the partial size of the particulate matter is greater than second
Preset value and when less than the first preset value, then spray nitrogen using second flow speed, the second flow speed is less than the first flow velocity；Work as institute
When stating the partial size of particulate matter less than the second preset value, then nitrogen is sprayed using third flow velocity, the third flow velocity is less than second
Speed.In this way, can further save energy consumption while effective eliminating particle object.
Preferably, the opposite end of the airtight chamber 11 is respectively provided with the first opening 14 and the second opening 15, the first gas
Body enters the airtight chamber 11 through first opening 14, by the particulate matter in the airtight chamber 11 from described the
Two openings, 15 discharge.It is furthermore preferred that the first gas is nitrogen.
Specifically, by continuing to transmit the first gas to the airtight chamber 11 from first opening 14, one
Aspect can remove the particulate matter in 11 internal environment of airtight chamber, avoid causing secondary pollution to the mask 13；
It on the other hand, can also be by the particulate matter purged out from 13 surface of mask directly from described in 15 discharge of the second opening
Airtight chamber 11 avoids remaining on the airtight chamber 11.
Preferably, the end of the airtight chamber 11 has third opening 16, and the mask 13 is opened through the third
The 16 disengaging airtight chamber of mouth.It is furthermore preferred that the mask cleaning device further includes being located at third opening 16
Sensor 17 and baffle 18；The sensor 17, for detecting whether the mask 13 enters the airtight chamber 11, if
It is that the baffle 18 is then driven to close the third opening 16.
Specifically, the sensor 17 is after detecting that the mask 13 is transferred to 11 inside of airtight chamber,
It can control the baffle 18 to close the third opening 16, enter the airtight chamber to avoid the particulate matter in external environment
11, the mask 13 is polluted.
The mask cleaning device that present embodiment provides, by setting airtight chamber and sweep module, and according to
The particle article coordinate that exposure machine detects, automatically cleans mask, avoids the troublesome operation of artificial cleaning mode, mentions
The high cleaning efficiency of mask；And due to entirely cleaning process carried out in airtight chamber, avoid external environment pair
The secondary pollution of mask, to further improve the cleaning effect of mask.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (9)
1. a kind of mask cleaning device, including the exposure machine for detecting particle article coordinate on mask, which is characterized in that also
Including the airtight chamber for accommodating the mask and it is located at the indoor sweep module of the closed chamber；The purging group
Part connects the exposure machine, for obtaining the coordinate of particulate matter on the mask, and the mask according to the coordinate pair
It is purged, to remove the particulate matter on the mask.
2. mask cleaning device according to claim 1, which is characterized in that the sweep module includes controller and extremely
A few nitrogen gun；The controller connects the exposure machine and the nitrogen gun, for obtaining particulate matter on the mask
Coordinate, and the nitrogen gun is controlled towards injection nitrogen at the coordinate.
3. mask cleaning device according to claim 2, which is characterized in that the direction of nitrogen gun injection nitrogen with
The angle of plane is 45 degree where the mask.
4. mask cleaning device according to claim 2, which is characterized in that further include for holding in the airtight chamber
Carry the plummer of the mask；An at least nitrogen gun includes multiple nitrogen guns, and multiple nitrogen guns are about the plummer
Axially and symmetrically setting.
5. mask cleaning device according to claim 2, which is characterized in that the exposure machine is also used to detect described
The partial size of grain object；The controller is used to obtain the partial size of the particulate matter, and adjusts the nitrogen gun according to the partial size and spray
The flow velocity of radio-nitrogen gas.
6. mask cleaning device according to claim 1, which is characterized in that the opposite end of the airtight chamber is distinguished
With the first opening and the second opening, first gas enters the airtight chamber through first opening, by the closed chamber
The indoor particulate matter is discharged from second opening.
7. mask cleaning device according to claim 6, which is characterized in that the first gas is nitrogen.
8. mask cleaning device according to claim 6, which is characterized in that the end of the airtight chamber has one the
Three openings, the mask pass in and out the airtight chamber through third opening.
9. mask cleaning device according to claim 8, which is characterized in that further include being located at the third opening
Sensor and baffle；The sensor is for detecting whether the mask enters the airtight chamber, if so, described in driving
Baffle closes the third opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821285955.6U CN208673040U (en) | 2018-08-09 | 2018-08-09 | Mask cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821285955.6U CN208673040U (en) | 2018-08-09 | 2018-08-09 | Mask cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208673040U true CN208673040U (en) | 2019-03-29 |
Family
ID=65837410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821285955.6U Active CN208673040U (en) | 2018-08-09 | 2018-08-09 | Mask cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208673040U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112051273A (en) * | 2020-07-31 | 2020-12-08 | 中国科学院微电子研究所 | Device and method for detecting and cleaning micro-dust on glass surface and film surface of photomask |
| CN112387707A (en) * | 2021-01-14 | 2021-02-23 | 成都路维光电有限公司 | Mask surface particle removing device and method |
| CN113391521A (en) * | 2020-03-13 | 2021-09-14 | 长鑫存储技术有限公司 | Exposure machine and exposure method |
| WO2022134500A1 (en) * | 2020-12-23 | 2022-06-30 | 长鑫存储技术有限公司 | Exposure machine |
-
2018
- 2018-08-09 CN CN201821285955.6U patent/CN208673040U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113391521A (en) * | 2020-03-13 | 2021-09-14 | 长鑫存储技术有限公司 | Exposure machine and exposure method |
| WO2021180140A1 (en) * | 2020-03-13 | 2021-09-16 | 长鑫存储技术有限公司 | Exposure machine and exposure method |
| US11852976B2 (en) | 2020-03-13 | 2023-12-26 | Changxin Memory Technologies, Inc. | Exposure machine and exposure method |
| CN112051273A (en) * | 2020-07-31 | 2020-12-08 | 中国科学院微电子研究所 | Device and method for detecting and cleaning micro-dust on glass surface and film surface of photomask |
| WO2022134500A1 (en) * | 2020-12-23 | 2022-06-30 | 长鑫存储技术有限公司 | Exposure machine |
| US11662667B2 (en) | 2020-12-23 | 2023-05-30 | Changxin Memory Technologies, Inc. | Exposure machine |
| CN112387707A (en) * | 2021-01-14 | 2021-02-23 | 成都路维光电有限公司 | Mask surface particle removing device and method |
| CN112387707B (en) * | 2021-01-14 | 2022-03-01 | 成都路维光电有限公司 | Mask surface particle removing device and method |
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