CN208672563U - For detecting the micro-nano sensor of nutrient concentrations in water - Google Patents
For detecting the micro-nano sensor of nutrient concentrations in water Download PDFInfo
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- CN208672563U CN208672563U CN201820998174.5U CN201820998174U CN208672563U CN 208672563 U CN208672563 U CN 208672563U CN 201820998174 U CN201820998174 U CN 201820998174U CN 208672563 U CN208672563 U CN 208672563U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 235000015097 nutrients Nutrition 0.000 title claims abstract description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 270
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 131
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 239000011521 glass Substances 0.000 claims abstract description 89
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 64
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 63
- 239000010703 silicon Substances 0.000 claims abstract description 63
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 229910021607 Silver chloride Inorganic materials 0.000 claims abstract description 33
- 239000000565 sealant Substances 0.000 claims abstract description 32
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims abstract description 32
- 239000004332 silver Substances 0.000 claims abstract description 31
- 239000007924 injection Substances 0.000 claims abstract description 30
- 238000002347 injection Methods 0.000 claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
- 239000000243 solution Substances 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 14
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical class [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims abstract description 13
- 239000002071 nanotube Substances 0.000 claims abstract description 10
- 238000005342 ion exchange Methods 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 27
- 230000005611 electricity Effects 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 6
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 5
- 239000005297 pyrex Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 2
- 241000208340 Araliaceae Species 0.000 claims 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims 1
- 235000003140 Panax quinquefolius Nutrition 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 235000008434 ginseng Nutrition 0.000 claims 1
- JUWSSMXCCAMYGX-UHFFFAOYSA-N gold platinum Chemical compound [Pt].[Au] JUWSSMXCCAMYGX-UHFFFAOYSA-N 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 74
- 238000010586 diagram Methods 0.000 description 30
- 238000004519 manufacturing process Methods 0.000 description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 229910052814 silicon oxide Inorganic materials 0.000 description 14
- 238000002360 preparation method Methods 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 10
- 230000000050 nutritive effect Effects 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 6
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 229940005654 nitrite ion Drugs 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000002848 electrochemical method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 238000005660 chlorination reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000013535 sea water Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000005518 electrochemistry Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002090 nanochannel Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- VEMHQNXVHVAHDN-UHFFFAOYSA-J [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O Chemical compound [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VEMHQNXVHVAHDN-UHFFFAOYSA-J 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229940075397 calomel Drugs 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- GTKRFUAGOKINCA-UHFFFAOYSA-M chlorosilver;silver Chemical compound [Ag].[Ag]Cl GTKRFUAGOKINCA-UHFFFAOYSA-M 0.000 description 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
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- 238000012851 eutrophication Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
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- 230000008520 organization Effects 0.000 description 1
- 239000000575 pesticide Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- BDJXVNRFAQSMAA-UHFFFAOYSA-N quinhydrone Chemical compound OC1=CC=C(O)C=C1.O=C1C=CC(=O)C=C1 BDJXVNRFAQSMAA-UHFFFAOYSA-N 0.000 description 1
- 229940052881 quinhydrone Drugs 0.000 description 1
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Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
It provides a kind of for detecting the micro-nano sensor of nutrient concentrations in water, its glass substrate (1) upper surface is provided with silver/silver chloride reference electrode (3), working electrode (4) and platinum are to electrode (5), working electrode (4) and platinum are to electrode (5) neighbour in reference electrode (3) working end, platinum electrode lead (6) is respectively set to the other end in each electrode, silicon chip (2) back side setting opening (7), it is formed liquid storage chamber (8), silicon chip (2) opens up the notch (9) entered for water to be measured in its working end, notch (9) is adjacent with opening (7), multiple nanometers of ditches (10) are set side by side between opening (7) and notch (9), form nanotubes (11) array;Glass substrate (1) is provided with liquid injection hole (12) and its sealant (13), stores saturated potassium chloride solution in liquid storage chamber (8);Detection sensor is miniaturized, nanotubes (11) array substantially reduces velocity of ion exchange, significantly improves the service life of micro-nano sensor.
Description
Technical field
The micro-nano biography that the utility model relates to a kind of for detecting nutrient concentrations in the water such as ocean, rivers, lake, reservoir
Sensor and preparation method thereof belongs to environmental protection technical field, also belongs to sensor technical field.
Background technique:
With the development of industry, marine environmental pollution is serious, and ecological environment is increasingly severe, a large amount of industrial and agricultural wastewaters and life
Sewage is discharged into ocean, and red tide, oil spilling, virus and harmful influence pollution frequently occur, and economic loss is huge, protects marine ecology ring
Border plays an important role to human social development.Pollution sources mainly include petroleum, heavy metal, nutritive salt and organic matter, radioactive material
Matter, pesticide etc..
Nutritive salt refers to the various inorganic salts of nutrient N, P, Si in seawater, they are in the seawater mainly with acid group shape
Formula exists, and generates salt in conjunction with various metallic elements.The index that predominantly detects of nutrient concentrations is nitrate ion content
With nitrite ion content.Nutritive salt can be excessively seawater eutrophication, cause red tide and green tide.Nutritive salt monitors importance
It is self-evident.The common detection method of nutritive salt includes spectrophotometry, spectra methods, ion-selective electrode, electrochemistry side
Method.Electrochemical method has many advantages, such as that wide detection range, high sensitivity, response time are short at low cost, but also has reference electricity
The problems such as pole service life is short, ion interference is more.Electrochemical method is to the testing principle of nutritive salt: determinand is in working electrode
Redox reaction occurs for surface, in reaction the gain and loss of electronics number be exactly electric current in circuit size, determinand is more, instead
The electronics that should be shifted is more, and electric current is bigger in circuit, and the two is linear.According to electric in collected circuit
The size of stream, so that it may calculate the concentration of determinand.
The three-electrode system of electrochemical method includes working electrode: electrochemical reaction occurs in the electrode surface;To electricity
Pole: current path is formed with working electrode;Reference electrode (Reference Electrode, abbreviation RE) is the various electrodes of measurement
As referring to the electrode compared when potential, the reference electrode of measured electrode and accurately known electrode potential numerical value is constituted into electricity
Pond measures cell emf numerical value, so that it may calculate the electrode potential of tested fixed electrode.Three traditional electrodes are discrete one by one
Electrode, although its parameters is good, already be studied personnel widely use, be not integrated into a sensor chip
On, limit the use occasion of sensor.Particularly, the service life problem of reference electrode annoying always vast research and
User of service is dedicated to the linguistic term of reference electrode in spite of more research institutions, such as develops based on minute manufacturing technology
Miniature Ag/AgCl all-solid-state reference electrode is developed, the form of electrode makes improvement, and the service life also increases, but the problem is still
It does not solve so.So while the service life of reference electrode is not grown, it is not able to satisfy the requirement of sensor long time continuous working.
Reference electrode (Reference Electrode, abbreviation RE) is to compare when measuring various electrode potentials as reference
Electrode, the reference electrode of measured electrode and accurately known electrode potential numerical value is constituted into battery, measures cell emf
Numerical value, so that it may calculate the electrode potential of tested fixed electrode.Usually multi-purpose slightly soluble salt electrode is as reference electrode, common reference
Electrode has calomel electrode and silver-silver chloride electrode, and in addition there are copper-copper sulfate electrode, quinhydrone electrode, solid reference electrodes
Deng.Reference electrode current potential is constant, and main function is measurement cell emf, calculates the benchmark of electrode potential.Common glass
Pipe Ag/AgCl reference electrode has preparation simply, easy to use, is widely used in field of electrochemical detection.But it is led in sensor
Domain can only be used in combination with other electrodes, and cannot limit it with the integrated preparation of other electrodes in a sensor core on piece
Application in terms of sensor.You Duojia research institution is based on minute manufacturing technology and has developed all solid state reference of miniature Ag/AgCl
Electrode, but the saturated potassium chloride solution as needed for electrode is very short in the holding time of electrode surface, so electrode uses the longevity
Life is not grown, and is not able to satisfy the requirement of sensor long time continuous working.
So that there are degree of integration is low for the three-electrode system of existing common electrochemical measurement nutritive salt, service life is short,
The problem of electrode stability difference.
Applicant in this case has submitted entitled " a kind of silver/silver chloride reference electrode and its a system on November 29th, 2017
Make method " application for a patent for invention, application number 201711227160X provides a kind of Ag/AgCl reference electrode and its production side
Method, notable feature are to be integrated with the micro-structure of nanotubes array, can both play the function of ion exchange, also effectively drop
The speed of low ion exchange greatly improves the stability and service life of electrode.The utility model can be regarded as in this technology
On the basis of further developmental achievement.
Summary of the invention:
The micro-nano biography that the technical problem to be solved by the utility model is to provide a kind of for detecting nutrient concentrations in water
The degree of integration of sensor and preparation method thereof, the shortcomings that overcoming existing sensor, sensor is high, long service life, and stability is good.
In order to solve the above-mentioned technical problem, technical solution used by the utility model micro-nano sensor are as follows:
It is a kind of for detecting the micro-nano sensor of nutrient concentrations in water, including can be with 7740 glass of Pyrex of wafer bonding
Glass substrate (1), it is (100) crystal face, twin polishing and oxygen that glass substrate (1), which is covered with surface above in mode bonded thereto,
The silicon chip (2) of change, the two bonds together to form one;It is characterized in that, glass substrate (1) upper surface is provided with silver/chlorination
Silver-colored reference electrode (3), working electrode (4) and platinum are to electrode (5), and wherein silver/silver chloride reference electrode (3) is located at the glass
The middle position of substrate (1), working electrode (4) and platinum to electrode (5) neighbour together with, be located at the glass substrate (1)
Another end position of platinum electrode lead (6) to the glass substrate (1), the silicon is respectively set in a wherein end position, each electrode
The silver/silver chloride reference electrode (3) opening (7), the opening (7) and the glass are at least contained in the setting of substrate (2) back side
Substrate (1) forms the liquid storage chamber (8) for storing saturated potassium chloride solution, and the silicon chip (2) is in working electrode (4) and platinum
The notch (9) entered for water to be measured is opened up to electrode (5) position, the notch (9) is adjacent with the opening (7), described
It is open (7) between notch (9) and multiple nanometers of ditches (10) is set side by side, multiple nanometer of ditch (10) and the glass substrate (1)
Form nanotubes (11) array for being used for ion exchange;The glass substrate (1), which is provided with, to be communicated with the liquid storage chamber (8)
Liquid injection hole (12), and configured with sealant (13) for encapsulating the liquid injection hole (12), stored in the liquid storage chamber (8) through
The saturated potassium chloride solution of liquid injection hole (12) injection.
The following are the utility model micro-nano sensor further embodiments:
The multiple multiple nanometers of ditches (10) are the tapered nanometer in multiple sections for being etched using wet-etching technology
Slot, nanometer groove depth are less than 1um;Silicon chip (2) back side opens up the groove being embedded in for the platinum electrode lead (6) of each electrode
(15)。
The silver/silver chloride reference electrode (3), working electrode (4), platinum are to adopt to electrode (5) and platinum electrode lead (6)
The one layer of platinum layer prepared with lift-off technique in the surface area that the glass substrate (1) upper surface is respectively set,
In, the silver/silver chloride reference electrode (3) successively includes that platinum layer, metallic silver layer and metallic silver layer are adopted from bottom to surface
With the Ag/AgCl layer formed after HCl treatment;The working electrode (4) is in one layer of graphite of platinum layer surface modification or carbon nanotube
Material;The platinum is its platinum layer itself to electrode (5).
The glass substrate (1) opens up through-hole, and each self-configuring in platinum electrode lead (6) terminal (16) of each electrode
Conductive sealant (14), the outer end of each Conductive sealant (14) is as external electric connecting terminal;Each wire lead termination (16) is embedded in respectively
From Conductive sealant (14) in;Wherein at least 1 through-hole is as liquid injection hole (12).
The platinum electrode lead (6) of each electrode leads to the wire lead termination of another end position of the glass substrate (1)
(16) arrangement is formed;The silicon chip (2) opens up shape corresponding with each wire lead termination (16) in each wire lead termination (16) position
At the wiring through-hole (17) of arrangement, and each self-configuring Conductive sealant (14), the outer end of each Conductive sealant (14) are used as external
Electric connecting terminal;Each wire lead termination (16) is embedded in respective Conductive sealant (14).
Working electrode (4) rectangular-blocklike, the platinum is u-shaped to electrode (5), and surface area numerical digit is in described
The surface area of working electrode (4), the working electrode (4) are located at the platinum in electrode (5) u-shaped ring of encirclement.
The silver/silver chloride reference electrode (3), working electrode (4), platinum are respectively 1 to electrode (5);The work electricity
Pole (4), platinum are located at the middle position of another end position of the glass substrate (1), the platinum of working electrode (4) to electrode (5)
Contact conductor (6) is drawn from its outer end, and the platinum is to the platinum electrode lead (6) of electrode (5) from the back of its U-shaped opening (7)
End is drawn, and the platinum electrode lead (6) and platinum of working electrode (4) are to the platinum electrode lead (6) of electrode (5) in the glass substrate
(1) it is symmetric on;Alternatively, the working electrode (4), platinum are located at the other end of the glass substrate (1) to electrode (5)
The platinum electrode lead (6) of unilateral position, working electrode (4) is drawn from its outer end, and the platinum draws the platinum electrode of electrode (5)
Wherein 1 foot that line (6) is held from its U-shaped opening (7) is drawn, the platinum electrode lead (6) and platinum pair of working electrode (4)
The platinum electrode lead (6) of electrode (5) is on the glass substrate (1) in unilateral distribution.
The silver/silver chloride reference electrode (3) is 1 shared, and the working electrode (4), platinum are respectively to electrode (5)
2 be distributed in the other end positional symmetry of the glass substrate (1);The platinum is respective to electrode (5) U-shaped opening (7)
Outwardly;The platinum electrode lead (6) of working electrode (4) is drawn from its outer end, platinum electrode lead (6) of the platinum to electrode (5)
Wherein 1 foot held from its U-shaped opening (7) is drawn, and the platinum electrode lead (6) and platinum of working electrode (4) are to electrode (5)
Platinum electrode lead (6) be symmetric on the glass substrate (1).
The back side of the glass substrate (1) is coated with one layer of epoxy and is protected from light layer.
The micro-nano sensor includes outer package, and the outer package is in the working electrode (4), platinum to electrode (5) institute
In region openings (7), other positions are all encapsulated, and draw the lead-out wire of each electrode.
In order to solve the above-mentioned technical problem, technical solution used by the production method of the utility model micro-nano sensor
Are as follows:
The production method of micro-nano sensor as described above respectively includes the production of the silicon chip (2), the glass base
The envelope of liquid injection hole (12) in the production of piece (1) and the bonding of the two, the injection of saturated potassium chloride solution and glass substrate (1)
Glue, which is characterized in that further include the generation of Conductive sealant (14);The production of the silicon chip (2) the following steps are included:
Step 1: selecting surface is the single-sided polishing silicon wafer of (100) crystal face as silicon chip (2) material, silicon chip surface is flat
Whole degree is less than 1um, carries out oxidation processes to its surface, is formed silicon oxide layer (18);
Step 2: spinning coating photoresist layer (19) in substrate front, photoetching development prepares silicon oxide layer (18) window, then
With BOE corrosive liquid wet etching silicon oxide layer (18), the corrosion window of opening (7) and notch (9) is prepared;
Step 3: using 30%KOH corrosive liquid, anisotropic wet etch silicon chip (2) ontology under the conditions of set temperature,
Prepare the opening (7) and notch (9);
Step 4: spin coating photoresist layer (19), photoetching development are prepared more with BOE corrosive liquid etching oxidation silicon layer (18)
The corrosion window of a nanometer of ditch (10), then 30%KOH corrosive liquid is used, anisotropic wet etch silicon under the conditions of set temperature
Layer makes the deep-controlled in < 1um of nanotubes (11) by control corrosion rate rate and etching time, forms multiple nanometers of ditches
(10);
Step 5: removing photomask surface glue-line (19) using the concentrated sulfuric acid, surface oxidized silicon layer (18) are removed using BOE, system
It is standby to go out to have the silicon base chip of opening (7), notch (9) and multiple nanometers of ditch (10) micro-nano structures;
The production of the glass substrate (1) includes that selection can be used with 7740 glass substrate of Pyrex (1) of wafer bonding
Laser boring method or ultrasonic drilling method get the liquid injection hole (12) that a diameter is 1mm to 2mm in setting position, and configure with
The sealant (13) that liquid injection hole (12) shape matches;It is set as each electrode in glass substrate (1) upper surface to draw with platinum electrode
At line (6), the Pt layer of one layer of setting thickness is prepared using Lift-Off technique;It is being set as at silver/silver chloride reference electrode (3)
Pt layer one layer of setting thickness prepared above Ag layer, then use electrolysis process that surface layer Ag is transformed into AgCl;Using screen printing
Dataller's skill applies one layer of graphite or carbon nano-tube material on the Pt layer being set as at working electrode (4);It is set as platinum to electricity
Pt layer at pole (5) is directly as platinum to electrode (5);
The silicon chip (2) is bonded the silicon chip (2) including completing above-mentioned preparation with both glass substrates (1)
It is aligned with glass substrate (1), one is formed using silicon-glass anodic bonding mode;Through liquid injection hole (12) Xiang Suoshu liquid storage chamber (8)
Middle injection saturated potassium chloride solution;Two-in-one epoxy glue, shape after air-setting are injected to the liquid injection hole (12) after completion liquid feeding
At sealant (13).The micro-nano sensor is placed in Conductive sealant (14) baking and curing in baking oven afterwards.
Production method further embodiment:
It further include using same method above and below silicon chip (2) when the production of the silicon chip (2), in step 2
Prepare the corrosion window to form the wiring through-hole (17) of arrangement in two sides;It further include using same method in its step 3 in silicon
Two face up and down of substrate (2), it is two-way to use anisotropic wet etch silicon layer, prepare the wiring through-hole for forming arrangement
(17)。
The production of the glass substrate (1) further includes spinning coating one layer of epoxy at the back side of glass substrate (1) to be protected from light layer.
It further include finally being packaged as required.
Described in the utility model a kind of for detecting the micro-nano sensor of nutrient concentrations in water, notable feature is to collect
At the micro-structure of nanotubes array, the stability and service life of electrode are improved, and is integrated into working electrode, to electrode
Three-electrode system is integrated complete, the flexible and convenience of enhancing electrochemistry nutritive salt detection by one.
Compared with prior art, the nanotubes array based on miromaching preparation for ion exchange, chlorination
Potassium saturated solution liquid storage tank, Ag/AgCl reference electrode.Since nanohole array not only has the function of ion exchange, more due to
Nanoscale aperture, velocity of ion exchange substantially reduce, and can effectively improve saturated potassium chloride solution uses the time, significantly improve
The service life of its reference electrode, and then significantly improve the service life of micro-nano sensor.The utility model integrates each electrode
Manufacture, realizes the micromation of entire detection sensor, while having longer service life, forms a kind of micro- core of novel sensor
Piece, have can mass preparation, reduce the remarkable advantages such as cost, consistency be good, be micro-nano sensor in water quality monitoring field
Using support is provided, there is important practical application value.
Detailed description of the invention
Fig. 1 is the utility model micro-nano three-dimensional sensor schematic diagram;
Fig. 2 is the utility model micro-nano sensor bottom surface stereo schematic diagram;
Fig. 3 is glass substrate working face stereoscopic schematic diagram;
Fig. 4 is glass substrate elevated bottom perspective schematic diagram;
Fig. 5 is silicon chip upper surface stereoscopic schematic diagram;
Fig. 6 is silicon chip working face stereoscopic schematic diagram;
Fig. 7 is one micro-nano sensor the schematic diagram of the section structure of the utility model embodiment;
Fig. 8 is two micro-nano sensor the schematic diagram of the section structure of the utility model embodiment;
Fig. 9 is that each electrode sole disposition platinum electrode lead is symmetric status diagram in glass substrate;
Figure 10 is that each electrode sole disposition platinum electrode lead is in unilateral distribution schematic diagram in glass substrate;
Figure 11 is that each step shape changes schematic diagram in one silicon chip manufacturing process of the utility model embodiment;Wherein,
Figure 11-1 is that one silicon chip of embodiment makes original state schematic diagram;
Figure 11-2 is that silicon chip forms silicon oxide layer status diagram;
Figure 11-3 is to spin coating photoresist layer status diagram in substrate front;
Figure 11-4 is to prepare silicon oxide layer Window state schematic diagram in substrate;
Figure 11-5 is the silicon oxide layer status diagram removed at substrate window;
Figure 11-6 is to remove the remaining photoresist layer status diagram of substrate surface;
Figure 11-7 is to carry out KOH corrosion to substrate, prepares reference liquid reservoir, liquid bath to be measured, lead and picks out through-hole
Status diagram;
Figure 11-8 is to repeat Figure 11 .1 to Figure 11 .7 process, and nanochannel arrays are prepared on substrate and are shown with wire lead slot state
It is intended to;
Figure 11-9 is to remove substrate residual silicon oxide layer state schematic diagram;
Figure 11-10 is that by silicon chip, there are three the alignments of the sheet glass of electrode to be bonded with preparation, and completes the assembling shape of chip
State schematic diagram;
Figure 12 is that each step shape changes schematic diagram in two silicon chip manufacturing process of the utility model embodiment;Wherein,
Figure 12-1 is that one silicon chip of embodiment makes original state schematic diagram;
Figure 12-2 is that silicon chip forms silicon oxide layer status diagram;
Figure 12-3 is to spin coating photoresist layer status diagram in substrate front;
Figure 12-4 is to prepare silicon oxide layer Window state schematic diagram in substrate (to be to save glass with one difference of embodiment
The quantity of glass punching, cost is relatively low for this preparation method);
Figure 12-5 is the silicon oxide layer status diagram removed at substrate window;
Figure 12-6 is to remove the remaining photoresist layer status diagram of substrate surface;
Figure 12-7 is to carry out KOH corrosion to substrate, prepares the shape that reference liquid reservoir, liquid bath to be measured, lead pick out slot
State schematic diagram;
Figure 12-8 is to repeat Figure 12 .1- Figure 12 .7 process, and nanochannel arrays are prepared on substrate and are shown with wire lead slot state
It is intended to;
Figure 12-9 is to remove substrate residual silicon oxide layer state schematic diagram;
Figure 12-10 is that by silicon chip, there are three the alignments of the sheet glass of electrode to be bonded with preparation, and completes the assembling shape of chip
State schematic diagram.
Specific embodiment
The utility model is described in further detail below in conjunction with figure embodiment.
Embodiment one
The utility model is used to detect the micro-nano sensor of nutrient concentrations in water, as shown in Figure 1, Figure 7 shows, including can be with silicon
7740 glass substrate 1 of Pyrex of piece bonding, it is that (100) are brilliant that glass substrate 1, which is covered with surface above in mode bonded thereto,
Face, twin polishing and the silicon chip 2 aoxidized, the two bonds together to form one.
As shown in figure 3,1 upper surface of glass substrate is provided with silver/silver chloride reference electrode 3, working electrode 4 and platinum to electricity
Pole 5, wherein silver/silver chloride reference electrode 3 is located at the middle position of glass substrate 1, working electrode 4 and platinum to 5 neighbour of electrode
Together, positioned at a wherein end position for glass substrate 1, it is another to glass substrate 1 that platinum electrode lead 6 is respectively set in each electrode
End position.
As shown in figure 3,2 back side of silicon chip setting at least contain silver/silver chloride reference electrode 3 opening 7, the opening 7 with
Glass substrate 1 forms the liquid storage chamber 8 for storing saturated potassium chloride solution, and silicon chip 2 is in working electrode 4 and platinum to electrode 5
Position opens up the notch 9 entered for water to be measured, and notch 9 is adjacent with opening 7, is set side by side between opening 7 and notch 9 multiple
Nanometer ditch 10, multiple nanometer of ditch 10 and glass substrate 1 form 11 array of nanotubes for being used for ion exchange.Such as Fig. 3, Fig. 4
Shown, glass substrate 1 is provided with the liquid injection hole 12 communicated with liquid storage chamber 8, and as shown in Figure 7 configured with for encapsulating liquid injection hole 12
Sealant 13, store the saturated potassium chloride solution injected through liquid injection hole 12 in liquid storage chamber 8.As shown in fig. 6, multiple nanometers of ditches
The 10 nanometer slots tapered for the multiple sections etched using wet-etching technology, nanometer groove depth are less than 1um;Silicon chip 2
The back side opens up the groove 15 being embedded in for the platinum electrode lead 6 of each electrode.Sealant 13 is to be commercially available by two kinds of components
The two-in-one adhesive of composition, when use, are concocted with setting ratio, fast curing-formed under room temperature.
As shown in figure 3, silver/silver chloride reference electrode 3, working electrode 4, platinum are to use to electrode 5 and platinum electrode lead 6
One layer of platinum layer of the surface area preparation that lift-off technique is respectively set in 1 upper surface of glass substrate, wherein silver/chlorination
Silver-colored reference electrode 3 successively includes being formed after platinum layer, metallic silver layer and metallic silver layer use HCl treatment from bottom to surface
Ag/AgCl layer;Working electrode 4 is in one layer of graphite of platinum layer surface modification or carbon nano-tube material;Platinum is its platinum to electrode 5
Layer gold itself.
As shown in figure 3, the platinum electrode lead 6 of each electrode leads to 16 shape of wire lead termination of another end position of glass substrate 1
At arrangement.As shown in fig. 6, silicon chip 2 opens up formation arrangement corresponding with each wire lead termination 16 in each 16 position of wire lead termination
Wiring through-hole 17, and each self-configuring Conductive sealant 14 as shown in Figure 7, the outer end of each Conductive sealant 14 is as being externally electrically connected
Connect end;Each wire lead termination 16 is embedded in respective Conductive sealant 14.Conductive sealant 8 is by the metal powder that conducts electricity very well
Pulp is mixed with adhesive, metal powder is preferred with silver powder, and curing molding is that electric conductivity is good after heating, drying
Sealing element.
As shown in Figure 1, Figure 3,4 rectangular-blocklike of working electrode, platinum are u-shaped to electrode 5, and surface area numerical digit is in work
Make the surface area of electrode 4, working electrode 4 is located at platinum in the u-shaped ring of encirclement of electrode 5.Silver/silver chloride reference electrode 3 is
Shared 1, working electrode 4, platinum to electrode 5 respectively for glass substrate 1 other end positional symmetry be distributed 2;Platinum
To electrode 5U font opening 7 respectively outwardly;The platinum electrode lead 6 of working electrode 4 is drawn from its outer end, platinum of the platinum to electrode 5
Contact conductor 6 is drawn from wherein 1 foot at 7 ends of its U-shaped opening, and the platinum electrode lead 6 and platinum of working electrode 4 are to electrode
5 platinum electrode lead 6 is symmetric in glass substrate 1.The back side of glass substrate 1 is coated with one layer of epoxy and is protected from light layer.
The utility model micro-nano sensor further includes outer package, and outer package is in working electrode 4, platinum to 5 location of electrode
Domain opening 7, other positions all encapsulate, and draw the lead-out wire of each electrode.
The production method of micro-nano sensor as above, respectively include the production of silicon chip 2, the production of glass substrate 1 and its
The bonding of the two, the sealing of liquid injection hole 12 in the injection and glass substrate 1 of saturated potassium chloride solution, which is characterized in that further include
The generation of Conductive sealant 14.As shown in figure 11, silicon chip 2 production the following steps are included:
Step 1: selecting surface is the single-sided polishing silicon wafer of 100 crystal faces as 2 material of silicon chip, silicon chip surface flatness
Less than 1um, as shown in Figure 11-1;Oxidation processes are carried out to its surface, silicon oxide layer 18 are formed, as shown in Figure 11-2;
Step 2: photoresist layer 19 is spun coating in substrate front, as shown in Figure 11-3;Photoetching development prepares silicon oxide layer
18 windows, as shown in Figure 11-4;BOE corrosive liquid wet etching silicon oxide layer 18 is used again, prepares the corrosion of opening 7 and notch 9
Window, as shown in Figure 11-5, institute Figure 11-6.
Step 3: using 30%KOH corrosive liquid, 2 ontology of anisotropic wet etch silicon chip under the conditions of set temperature, system
Standby opening 7 and notch 9 out, as shown in Figure 11-7.
Step 4: spin coating photoresist layer 19, photoetching development prepare multiple receive with BOE corrosive liquid etching oxidation silicon layer 18
The corrosion window of rice ditch 10, then 30%KOH corrosive liquid is used, anisotropic wet etch silicon layer under the conditions of set temperature passes through
Control corrosion rate rate and etching time make the deep-controlled in < 1um of nanotubes 11, form multiple nanometers of ditches 10;Such as Figure 11-8
It is shown.
Step 5: removing photomask surface glue-line 19 using the concentrated sulfuric acid, surface oxidized silicon layer 18 is removed using BOE, is prepared
There is the silicon base chip of opening 7, notch 9 and multiple nanometers of 10 micro-nano structures of ditch;As shown in Figure 11-9.
Glass substrate 1 production include selection can with 7740 glass substrate 1 of Pyrex of wafer bonding, using laser boring
Method or ultrasonic drilling method get the liquid injection hole 12 that a diameter is 1mm to 2mm in setting position, and configure and 12 shape of liquid injection hole
The sealant 13 that shape matches;It is set as at each electrode and platinum electrode lead 6 in 1 upper surface of glass substrate, using Lift-Off work
Skill prepares the Pt layer of one layer of setting thickness;It is thick in the Pt layer being set as at silver/silver chloride reference electrode 3 one layer of setting prepared above
The Ag layer of degree, then surface layer Ag is transformed by AgCl using electrolysis process;Working electrode 4 is being set as using silk-screen printing technique
The Pt layer at place applies one layer of graphite or carbon nano-tube material above;It is set as platinum to the Pt layer at electrode 5 directly as platinum pair
Electrode 5.
Silicon chip 2 and the silicon chip 2 of both glass substrates 1 being bonded including completing above-mentioned preparation and glass substrate 1 are right
Standard forms one using silicon-glass anodic bonding mode;Saturated potassium chloride solution is injected into liquid storage chamber 8 through liquid injection hole 12;It is complete
Two-in-one epoxy glue is injected to liquid injection hole 12 at after liquid feeding, forms sealant 13 after air-setting.Micro-nano sensor is placed in afterwards
By 14 baking and curing of Conductive sealant in baking oven.As shown in Figure 11-10 or Fig. 7.
It further include the upper and lower surface preparation using same method in silicon chip 2 when the production of silicon chip 2, in step 2
The corrosion window of each wiring through-hole 17 of arrangement is formed out;It further include using same method in its step 3 in silicon chip 2
Upper and lower two face, it is two-way to use anisotropic wet etch silicon layer, prepare each wiring through-hole 17 to form arrangement.Glass substrate 1
Production further include glass substrate 1 the back side spin coating one layer of epoxy be protected from light layer.It further include finally being packaged as required, and connect
Upper each contact conductor.
The index that predominantly detects of nutrient concentrations is nitrate ion content and nitrite ion content.Due to work electricity
Pole 4, platinum to electrode 5 respectively for glass substrate 1 other end positional symmetry be distributed 2, so, it is micro- using the present embodiment one
Sensor of receiving can detect nitrate ion content and nitrite ion content simultaneously;Also, 1 need to be only made a call in glass substrate 1
A liquid injection hole 12 is preferred embodiments of the present invention convenient for production.
Embodiment two
The difference of the present embodiment two and embodiment one is only that the layout of each electrode: silver/silver chloride reference electrode 3, work
Electrode 4, platinum are respectively 1 to electrode 5.There are two types of embodiment it is available: mode one, as shown in figure 9, working electrode 4,
Platinum is located at the middle position of another end position of glass substrate 1 to electrode 5, and the platinum electrode lead 6 of working electrode 4 is from its outer end
It draws, platinum draws the platinum electrode lead 6 of electrode 5 from the backside of its U-shaped opening 7, the platinum electrode lead 6 of working electrode 4
It is symmetric in glass substrate 1 with platinum electrode lead 6 of the platinum to electrode 5.Alternatively, selection mode two: as shown in Figure 10,
Working electrode 4, platinum are located at the other end unilateral side position of glass substrate 1, the platinum electrode lead 6 from its of working electrode 4 to electrode 5
Outer end is drawn, and platinum draws the platinum electrode lead 6 of electrode 5 from wherein 1 foot at 7 ends of its U-shaped opening, working electrode 4
Platinum electrode lead 6 and platinum to the platinum electrode lead 6 of electrode 5 in glass substrate 1 in unilateral distribution.Other structures scheme with
Production method continues to use embodiment one.By setting detection nitrate ion content or nitrite ion when the present embodiment two uses
Content.
Embodiment three
The difference of the present embodiment three and embodiment one, is only that: platinum electrode lead 6 terminal of the glass substrate 1 in each electrode
16 open up through-hole, and each self-configuring Conductive sealant 14, and silicon chip 2 opens up and each wire lead termination 16 in each 16 position of wire lead termination
The unilateral hole 20 of the injection of part electricity sealant 14 is led in the corresponding confession for forming arrangement, the outer end of each Conductive sealant 14 as pair
Outer electric connecting terminal;Each wire lead termination 16 is embedded in respective Conductive sealant 14;Wherein at least 1 through-hole is as liquid injection hole
12, as shown in Figure 8.It is two-way when production to use anisotropic wet etch silicon layer, it is changed to unidirectionally use anisotropic wet etch
Silicon layer.Other structures scheme and production method continue to use embodiment one.The present embodiment three can also detect nitrate anion when using simultaneously
Ion concentration and nitrite ion content.
Example IV
The difference of the present embodiment four and embodiment three is only that being laid out by the way of embodiment two for each electrode, other
Organization plan and production method continue to use embodiment three.The present embodiment four use when also press setting detection nitrate ion content or
Nitrite ion content.
The utility model micro-nano sensor can be used for inorganic nutrient salt in the water such as ocean, rivers, lake, reservoir and detect,
Application method is identical as conventional three electrode detection System Utilization Procedures.
Claims (10)
1. a kind of for detecting the micro-nano sensor of nutrient concentrations in water, including can be with 7740 glass of Pyrex of wafer bonding
Substrate (1), glass substrate (1) are covered with surface above in mode bonded thereto and are (100) crystal face, twin polishing and aoxidize
Silicon chip (2), the two bonds together to form one;It is characterized in that, glass substrate (1) upper surface is provided with silver/silver chlorate ginseng
Than electrode (3), working electrode (4) and platinum to electrode (5), wherein silver/silver chloride reference electrode (3) is located at the glass substrate
(1) middle position, working electrode (4) and platinum to electrode (5) neighbour together with, be located at the glass substrate (1) wherein
Another end position of platinum electrode lead (6) to the glass substrate (1), the silicon chip is respectively set in one end position, each electrode
(2) silver/silver chloride reference electrode (3) opening (7), the opening (7) and the glass substrate are at least contained in back side setting
(1) liquid storage chamber (8) for storing saturated potassium chloride solution is formed, the silicon chip (2) is in working electrode (4) and platinum to electricity
Pole (5) position opens up the notch (9) entered for water to be measured, and the notch (9) is adjacent with the opening (7), the opening
(7) multiple nanometers of ditches (10) are set side by side between notch (9), multiple nanometer of ditch (10) and the glass substrate (1) are formed
Nanotubes (11) array for ion exchange;The glass substrate (1) is provided with the fluid injection communicated with the liquid storage chamber (8)
Hole (12), and it is configured with the sealant (13) for encapsulating the liquid injection hole (12), it stores in the liquid storage chamber (8) through fluid injection
The saturated potassium chloride solution of hole (12) injection.
2. micro-nano sensor as described in claim 1, which is characterized in that the multiple multiple nanometers of ditches (10) are using wet process
The tapered nanometer slot in multiple sections that etching technics etches, nanometer groove depth are less than 1um;It opens at silicon chip (2) back side
If the groove (15) of platinum electrode lead (6) insertion for each electrode.
3. micro-nano sensor as described in claim 1, which is characterized in that the silver/silver chloride reference electrode (3), work electricity
Pole (4), platinum are each in the glass substrate (1) upper surface using lift-off technique to electrode (5) and platinum electrode lead (6)
The one layer of platinum layer prepared from the surface area of setting, wherein the silver/silver chloride reference electrode (3) from bottom to surface according to
It is secondary to use the Ag/AgCl layer formed after HCl treatment including platinum layer, metallic silver layer and metallic silver layer;The working electrode
(4) in one layer of graphite of platinum layer surface modification or carbon nano-tube material;The platinum is its platinum layer itself to electrode (5).
4. micro-nano sensor as described in claim 1, which is characterized in that platinum of the glass substrate (1) in each electrode
Contact conductor (6) terminal (16) opens up through-hole, and each self-configuring Conductive sealant (14), and the outer end of each Conductive sealant (14) is made
For external electric connecting terminal;Each wire lead termination (16) is embedded in respective Conductive sealant (14);Wherein at least 1 through-hole conduct
Liquid injection hole (12).
5. micro-nano sensor as described in claim 1, which is characterized in that the platinum electrode lead (6) of each electrode leads to institute
The wire lead termination (16) for stating another end position of glass substrate (1) forms arrangement;The silicon chip (2) is in each wire lead termination (16)
Position opens up the wiring through-hole (17) for forming arrangement corresponding with each wire lead termination (16), and each self-configuring Conductive sealant
(14), the outer end of each Conductive sealant (14) is as external electric connecting terminal;It is close that each wire lead termination (16) is embedded in respective conduction
In sealing (14).
6. micro-nano sensor as described in claim 1, which is characterized in that working electrode (4) rectangular-blocklike, the platinum
Gold is u-shaped to electrode (5), and surface area numerical digit is located in the surface area of the working electrode (4), the working electrode (4)
The platinum is in electrode (5) u-shaped ring of encirclement.
7. micro-nano sensor as claimed in claim 6, which is characterized in that the silver/silver chloride reference electrode (3), work electricity
Pole (4), platinum are respectively 1 to electrode (5);The working electrode (4), platinum are located at the glass substrate (1) to electrode (5)
The platinum electrode lead (6) of the middle position of another end position, working electrode (4) is drawn from its outer end, and the platinum is to electrode (5)
Platinum electrode lead (6) drawn from the backside of its U-shaped opening (7), the platinum electrode lead (6) of working electrode (4) and platinum pair
The platinum electrode lead (6) of electrode (5) is symmetric on the glass substrate (1);Alternatively, the working electrode (4), platinum
Electrode (5) are located at the other end unilateral side position of the glass substrate (1), the platinum electrode lead (6) of working electrode (4) is outside it
End is drawn, and the platinum draws wherein 1 foot that the platinum electrode lead (6) of electrode (5) is held from its U-shaped opening (7), work
The platinum electrode lead (6) and platinum for making electrode (4) are in single on the glass substrate (1) to the platinum electrode lead (6) of electrode (5)
Side distribution.
8. micro-nano sensor as described in claim 1, which is characterized in that the silver/silver chloride reference electrode (3) is to share
1, the working electrode (4), platinum are to electrode (5) respectively for the 2 of the distribution of the other end positional symmetry of the glass substrate (1)
It is a;The platinum is respective to electrode (5) U-shaped opening (7) outwardly;The platinum electrode lead (6) of working electrode (4) draws from its outer end
Out, the platinum draws wherein 1 foot that the platinum electrode lead (6) of electrode (5) is held from its U-shaped opening (7), work electricity
The platinum electrode lead (6) and platinum of pole (4) are to the platinum electrode lead (6) of electrode (5) in symmetrical point on the glass substrate (1)
Cloth.
9. micro-nano sensor as described in claim 1, which is characterized in that the back side of the glass substrate (1) is coated with one layer of ring
Oxygen is protected from light layer.
10. micro-nano sensor as described in claim 1, which is characterized in that including outer package, the outer package is in the work
Electrode (4), platinum are open (7) to electrode (5) region, and other positions all encapsulate, and draw the lead-out wire of each electrode.
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CN108680628B (en) * | 2018-06-27 | 2023-11-21 | 宁波大学 | Micro-nano sensor for detecting nutrient salt content in water and manufacturing method thereof |
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