CN208661623U - A kind of silicon wafer powder sprinkling device - Google Patents
A kind of silicon wafer powder sprinkling device Download PDFInfo
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- CN208661623U CN208661623U CN201820880127.0U CN201820880127U CN208661623U CN 208661623 U CN208661623 U CN 208661623U CN 201820880127 U CN201820880127 U CN 201820880127U CN 208661623 U CN208661623 U CN 208661623U
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- silicon wafer
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Abstract
The utility model proposes a kind of silicon wafer powder sprinkling devices, including funnel, funnel baffle, sieve, silicon wafer fixing seat, carriage, driving device and positioning device, the carriage includes sliding rail and sliding block, the sliding rail is connected together with the sliding block, the sliding block includes the first sliding block and the second sliding block, and first sliding block is equipped with supporting block, and the supporting block is connect with the funnel baffle, second sliding block is connect with the sieve, and the funnel is located on the funnel baffle;The driving device further includes first motor and the second motor, the first motor is connect with the funnel baffle, the first motor drives the funnel baffle to move reciprocatingly along the sliding rail, second motor is connect with the sieve, and second motor drives the sieve to move reciprocatingly along the sliding rail;In the underface of the sieve, the silicon wafer fixing seat is used to limit the position of silicon wafer for placing silicon wafer, the positioning device for the silicon wafer fixed seating.
Description
Technical field
The utility model relates to silicon wafer manufacture field, especially a kind of silicon wafer powder sprinkling device.
Background technique
Solar energy is a kind of very environmentally friendly energy, with the development of science and technology, more and more electrical appliance using solar energies enter into
Usually other.It during with solar energy, needs to apply to solar silicon wafers, it is therefore desirable to which a large amount of silicon wafer is processed.
When silicon wafer is just produced, surface smoother, it is therefore desirable to carry out sprinkling processing.Process of the existing sand blasting unit in sandblasting
In the problems such as that there are sand material particles is uneven, and sprinkling is uneven, and waste paper rate is high.Therefore it is badly in need of a capable of equably spraying sand material
Silicon wafer powder sprinkling device.
Utility model content
To solve the above-mentioned problems, the utility model proposes a kind of silicon wafer powder sprinkling devices of powder uniform and smooth.This is practical
It is novel to be achieved through the following technical solutions:
The utility model proposes a kind of silicon wafer powder sprinkling device, including funnel, funnel baffle, sieve, silicon wafer fixing seat, slidings
Device, driving device and positioning device, the carriage include sliding rail and sliding block, and the sliding rail engages company with the sliding block
It connects, the sliding block includes the first sliding block and the second sliding block, and first sliding block is equipped with supporting block, the supporting block and the leakage
Struggle against baffle connection, and second sliding block is connect with the sieve, and the funnel is located on the funnel baffle;
The driving device further includes first motor and the second motor, and the first motor is connect with the funnel baffle,
The first motor is able to drive the funnel baffle and moves reciprocatingly along the sliding rail, and second motor and the sieve connect
It connects, second motor is able to drive the sieve and moves reciprocatingly along the sliding rail;
In the underface of the sieve, the silicon wafer fixing seat is described fixed for placing silicon wafer for the silicon wafer fixed seating
Position device is used to limit the position of silicon wafer.
Further, the silicon wafer powder sprinkling device further includes cabinet, and the cabinet includes bracket and sealing plate, the bracket with
The sealing plate connection, the sealing plate further includes the first sealing plate, and the cabinet is divided into the first accommodating chamber by first sealing plate
With the second accommodating chamber, the funnel, the carriage and the funnel retaining device are located at first accommodating chamber, the silicon
Piece fixing seat, the positioning device are located at second accommodating chamber.It is equipped with the first opening in the middle part of first sealing plate, described the
The position of one opening is corresponding with the sieve.
Further, the sealing plate further includes funnel cover board, and the funnel cover board includes the first cover board and the second cover board, the
One cover board is connect with the stand hinge, and first cover board is connected with second cover plate hinge, is set on second cover board
There is handle, the handle controls the opening of the funnel cover board and lid closes.
Further, the silicon wafer powder sprinkling device further includes first motor fixing seat and the second motor fixing seat, and described
One motor fixing seat is connect with the first motor, first sealing plate respectively, second motor fixing seat respectively with institute
State the second motor fixing seat, first sealing plate connection.
Further, the silicon wafer powder sprinkling device is additionally provided with enabling baffle, the first twin shaft cylinder and the second twin shaft cylinder, institute
It states enabling baffle to connect with first sealing plate, the enabling baffle is vertically arranged with first sealing plate, the enabling
The middle part of baffle is equipped with the second opening, and the enabling baffle also has the first side wall and second sidewall, the first side wall and institute
It states and is connected separately with sliding slot in second sidewall, the first slide plate and the second slide plate, first slide plate are also equipped on the sliding slot
It is connected with the first fixed plate in the center symmetric setting of second opening, the first slide plate with second slide plate, second is sliding
The second fixed plate is connected on plate, first fixed plate is connect with the first twin shaft cylinder, second fixed plate and institute
The connection of the second twin shaft cylinder is stated, in use, the first twin shaft cylinder drives first slide plate along the sliding slot described in
The sliding of second opening direction, the second twin shaft cylinder drive second slide plate along the sliding slot towards the second opening side
To sliding.
Further, the sealing plate further includes that the second sealing plate, third sealing plate, the 4th sealing plate and two are arranged symmetrically
The 5th sealing plate, the positioning device is mounted on second sealing plate, and the third sealing plate is equipped with and described second
Be open corresponding third opening,
Further, the positioning device includes rotary cylinder, cylinder seal plate, positioning seat and fixing axle, the revolution
Cylinder is connect with the cylinder seal plate, and the cylinder seal plate is for sealing the rotary cylinder, the rotary cylinder and institute
Positioning seat transmission connection is stated, the positioning seat is equipped with a plurality of fixing axle, and the rotary cylinder drives the positioning seat to turn
It is dynamic, to limit position of the silicon wafer in the silicon wafer fixing seat.
Further, the funnel is equipped with first through hole, and the first through hole ranks are arranged, and sets on the funnel baffle
There is the second through-hole corresponding with the first through hole, the sieve is equipped with third through-hole, and the aperture of the third through-hole is small
In the first through hole and second through-hole.
The utility model has the beneficial effects that
The silicon wafer powder sprinkling device of the utility model, including funnel, funnel baffle, sieve, silicon wafer fixing seat, carriage,
Driving device and positioning device, the carriage include sliding rail and sliding block, and the sliding rail is connected together with the sliding block, described
Sliding block includes the first sliding block and the second sliding block, and first sliding block is equipped with supporting block, the supporting block and the funnel baffle
Connection, second sliding block are connect with the sieve, and the funnel is located on the funnel baffle.The driving device further includes
First motor and the second motor, in use, the first motor is connect with the funnel baffle, the first motor is able to drive
The funnel baffle moves reciprocatingly along the sliding rail, and the powder in funnel can be leaked out from funnel baffle, second electricity
Machine is connect with the sieve, and second motor is able to drive the sieve and moves reciprocatingly along the sliding rail;From funnel baffle
The powder of middle leakage falls into sieve and carries out secondary filter, so that powder becomes finer and smoother uniform.
The positioning device is used to limit the position of silicon wafer.The silicon wafer fixed seating is in the underface of the sieve, institute
Silicon wafer fixing seat is stated for placing silicon wafer, the powder fallen from sieve can be equably sprinkled upon on silicon wafer.The silicon of the utility model
The more uniform exquisiteness of piece powder sprinkling device powder, improves the quality of silicon wafer finished product, is conducive to industrialized batch operation.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is a kind of decomposition diagram of the utility model;
Fig. 3 is that the utility model eliminates the structural schematic diagram after the sealing plate;
Fig. 4 is the structural exploded view of the sealing plate of the utility model;
Fig. 5 is the structural schematic diagram of the funnel and the funnel baffle.
Specific embodiment
In order to it is clearer, completely illustrate the technical solution of the utility model, with reference to the accompanying drawing to the utility model
It is described further.
Fig. 1 to Fig. 5 is please referred to, the utility model proposes a kind of silicon wafer powder sprinkling device, including funnel 10, funnel baffle 20,
Sieve 30, silicon wafer fixing seat 40, carriage 50, driving device 60 and positioning device 70, the carriage 50 include sliding rail
51 have two with sliding block 52, the sliding rail 51, and the sliding rail 51 is arranged in parallel.The sliding rail 51 engages with the sliding block 52
Connection, the sliding block 52 include the first sliding block 521 and the second sliding block 522, and there are four the tools of the first sliding block 521, each described
First sliding block 521 is equipped with a supporting block 523, and each supporting block 523 is connected by screw and first sliding block 521
It connects.The supporting block 523 is connected by screw to the funnel baffle 20, and second sliding block 522 passes through with the sieve 30
Screw connection, the funnel 10 are located on the funnel baffle 20.The driving device 60 further includes first motor 61 and second
Motor 62, it is preferred that the first motor 61 and second motor 62 are servo motor.When in use, in the funnel 10
Powder is loaded, the funnel 10 is placed on the funnel baffle 20, and the first motor 61 connects with the funnel baffle 20
It connects, the first motor 61 is able to drive the funnel baffle 20 and moves reciprocatingly along the sliding rail 51, and powder is from the funnel
It leaks out and is fallen on the sieve 30 in baffle 20.Second motor 62 is connect with the sieve 30,62 energy of the second motor
The sieve 30 is enough driven to move reciprocatingly along the sliding rail 51, the sieve 30 is by powder secondary filter, so that powder is more
It is fine and smooth uniform.
The silicon wafer fixing seat 40 is located at the underface of the sieve 30, and the silicon wafer fixing seat 40 is used to place silicon wafer,
The positioning device 70 is used to limit the position of silicon wafer.To which the powder fallen from the sieve 30 can equably be sprinkled upon institute
It states on silicon wafer, avoids that powder particle is uneven, not fine and smooth enough the problem of silty.
Fig. 1 to Fig. 3 is please referred to, the silicon wafer powder sprinkling device further includes cabinet 80, and the cabinet 80 includes bracket 81 and envelope
Plate 82.The bracket 81 is aluminium brackets 81, has light-weight, the high feature of intensity.The bracket 81 connects with the sealing plate 82
Connect, the bracket 81 and the connection type of the sealing plate 82 can be riveting, screw connect, weld, one of hinge connection.
Preferably, the bracket 81 is connect with 82 hinge of sealing plate, and the sealing plate 82 further includes the first sealing plate 821.Described first
Sealing plate 821 divides the cabinet 80 for the first accommodating chamber and the second accommodating chamber, the funnel 10,50 and of the carriage
20 device of funnel baffle is located at first accommodating chamber, and the silicon wafer fixing seat 40, the positioning device 70 are located at described
Second accommodating chamber.The first opening 8211, the position of first opening 8211 and institute are equipped in the middle part of first sealing plate 821
It is corresponding to state sieve 30.When carrying out powder operation, due to the isolation of the first sealing plate 821, spilling the powder come will not enter
First accommodating chamber protects the driving device 60 in the first accommodating chamber.
Fig. 1 to Fig. 3 is please referred to, the sealing plate 82 further includes funnel cover board 822, and the funnel cover board 822 includes the first lid
Plate 8221 and the second cover board 8222, the first cover board 8221 are connect with 81 hinge of bracket, first cover board 8221 and described
Second cover board, 8222 hinge connection, it is preferred that the hinge is butterfly hinge.Second cover board 8222 is equipped with handle
8223, the handle 8223 controls the opening of the funnel cover board 822 and lid closes.When needing to add powder, operator can
Handle 8223 belonging to catching opens the funnel cover board 822, and when not needing addition powder, the lid of funnel cover board 822 is closed,
External impurity is avoided to fall into funnel 10.
Fig. 1 to Fig. 4 is please referred to, the silicon wafer powder sprinkling device further includes that first motor fixing seat 621 and the second motor are fixed
Seat 622, the first motor fixing seat 621 is connect with the first motor 61, first sealing plate 821 respectively, specifically,
The first motor fixing seat 621 is connected by screw to the first motor 61, first sealing plate 821 respectively, described
Second motor fixing seat 622 is connect with second motor fixing seat 622, first sealing plate 821 respectively.Second electricity
Machine fixing seat 622 is connected by screw to second motor fixing seat 622, first sealing plate 821 respectively, and described first
Motor fixing seat 621 can prevent the first motor 61 to be displaced in the process of running, second motor fixing seat 622
Second motor 62 can be prevented to be displaced in the process of running, to extend the use longevity of the silicon wafer powder sprinkling device
Life.
Fig. 1 to Fig. 3 is please referred to, the silicon wafer powder sprinkling device is additionally provided with enabling baffle 90, the first twin shaft cylinder 91 and second
Twin shaft cylinder 92, the enabling baffle 90 are connect with first sealing plate 821, the enabling baffle 90 and first sealing
Plate 821 is vertically arranged, and the middle part of the enabling baffle 90 is equipped with the second opening 93, and the enabling baffle 90 also has the first side wall
And second sidewall, sliding slot 94 is connected separately on the first side wall and the second sidewall, is also equipped on the sliding slot 94
First slide plate 941 and the second slide plate 942, first slide plate 941 and second slide plate 942 are along the center of second opening
It is symmetrical arranged, the first fixed plate 911 is connected on the first slide plate 941, the second fixed plate 921 is connected on the second slide plate 942,
First fixed plate 911 is connect with the first twin shaft cylinder 91, second fixed plate 921 and the second twin shaft cylinder
92 connections, in use, the first twin shaft cylinder 91 drives first slide plate 941 to open along the sliding slot 94 towards described second
Mouthful direction moves reciprocatingly, and the second twin shaft cylinder 92 drives second slide plate 942 along the sliding slot 94 towards described the
Two 93 directions of opening move reciprocatingly.Described in the skateboard control second opening 93 exposing and block.The positioning device 70
Including rotary cylinder 71, air cylinder fixed plate 72, positioning seat 73 and fixing axle 74, there are two the tools of rotary cylinder 71, and described time
Substantially symmetrical about its central axis setting of the rotaring cylinder 71 along the silicon wafer fixing seat 40.The rotary cylinder 71 connects with the air cylinder fixed plate 72
It connects, the air cylinder fixed plate 72 is for sealing the rotary cylinder 71, so that external dust not can enter the rotary cylinder 71
Inside, the rotary cylinder 71 being capable of efficient operation.The rotary cylinder 71 is sequentially connected with the positioning seat 73, described fixed
Position seat 73 is equipped with a plurality of fixing axle 74, and the rotary cylinder 71 drives the positioning seat 73 to rotate, to limit silicon wafer
Position in the silicon wafer fixing seat 40.At work, described two rotary cylinders 71 rotate, and drive positioning seat 73 and fix
Axis 74 rotates, and forms a silicon wafer located space, and the first twin shaft cylinder 91 and the second twin shaft cylinder 92 move back and forth
Drive first slide plate 941 and second slide plate 942 to slide, when first slide plate 941 and second slide plate 942 away from
From it is farthest when, it is described second opening expose, external robot by silicon wafer from it is described second opening 93 in put into parallel, silicon wafer
By the limit of the fixing axle 74, do the movement of falling object along the fixing axle 74, under fall on the silicon wafer fixing seat 40, machine
Device manpower is completed to exit after silicon wafer is delivered from second opening 93, at this time first sliding block 521 and second sliding block 522
It moves toward one another until against each other, second opening 93 is blocked, so that dust during powder be avoided to open from described second
Mouth 93 escapes.The first motor 61 drives funnel baffle 20 to move, and powder falls into sieve 30 from funnel baffle 20, and described second
Motor 62 drives sieve 30 to move, and powder falls from sieve 30, is equably sprinkled upon on silicon wafer, completes the powder behaviour an of silicon wafer
Make, then the first twin shaft cylinder 91 and the second twin shaft cylinder 92 respectively drive first slide plate 941 and described the
The movement of two slide plates 942, second opening are exposed again, and external robot delivers silicon wafer again, and so on.Described
The length of fixing axle 74 is the height of 500 silicon wafers superposition, after the silicon wafer that external robot is delivered reaches 500,
These silicon wafers can be packed into silicon wafer support by external robot, then be taken out from second opening 93.
Referring to FIG. 4, the sealing plate 82 further includes the second sealing plate 823, third sealing plate 824,825 and of the 4th sealing plate
Two symmetrically arranged 5th sealing plates 826, the positioning device 70 are mounted on second sealing plate 823, the third
Sealing plate 824 is equipped with third corresponding with second opening opening 8241, and the sealing plate 82 is same as that the silicon wafer is protected to spill
The internal structure of powder device, meanwhile, when powder falls, the sealing plate 82 completely cuts off powder and external environment, avoids powder
It diffuses, polluting environment or being sucked by operator influences human health.
Referring to FIG. 5, the funnel 10 is equipped with first through hole 11,11 ranks of first through hole are arranged, described first
The quantity of the every a line of through-hole 11 is between 4-11.The funnel baffle 20 is equipped with corresponding with the first through hole 11 the
Two through-holes 21, so that in use, the powder can be leaked out by the first through hole 11 and second through-hole 21.The sieve
Net 30 is equipped with third through-hole, and the aperture of the third through-hole is less than the first through hole 11 and second through-hole 21.Specifically
, the sieve 30 is 60 mesh screens, and the powder leaked out from the first through hole 11 and second through-hole 21 falls into sieve 30
Afterwards by secondary filter, powder becomes finer and smoother uniform, to improve the quality of silicon wafer finished product.
Certainly, the utility model can also have other numerous embodiments, be based on present embodiment, the ordinary skill of this field
Personnel's obtained other embodiments under the premise of not making any creative work, belong to the utility model and are protected
Range.
Claims (8)
1. a kind of silicon wafer powder sprinkling device, including funnel, funnel baffle, sieve, silicon wafer fixing seat, carriage, driving device and
Positioning device, which is characterized in that
The carriage includes sliding rail and sliding block, and the sliding rail is connected together with the sliding block, and the sliding block includes first sliding
Block and the second sliding block, first sliding block are equipped with supporting block, and the supporting block is connect with the funnel baffle, and described second is sliding
Block is connect with the sieve, and the funnel is located on the funnel baffle;
The driving device further includes first motor and the second motor, and the first motor is connect with the funnel baffle, described
First motor is able to drive the funnel baffle and moves reciprocatingly along the sliding rail, and second motor is connect with the sieve,
Second motor is able to drive the sieve and moves reciprocatingly along the sliding rail;
The silicon wafer fixed seating is in the underface of the sieve, and the silicon wafer fixing seat is for placing silicon wafer, the positioning dress
Set the position for limiting silicon wafer.
2. silicon wafer powder sprinkling device according to claim 1, which is characterized in that the silicon wafer powder sprinkling device further includes cabinet,
The cabinet includes bracket and sealing plate, and the bracket is connect with the sealing plate, and the sealing plate further includes the first sealing plate, and described
The cabinet is divided into the first accommodating chamber and the second accommodating chamber, the funnel, the carriage and the funnel by one sealing plate
Retaining device is located at first accommodating chamber, and the silicon wafer fixing seat, the positioning device are located at second accommodating chamber, described
The first opening is equipped in the middle part of first sealing plate, the position of first opening is corresponding with the sieve.
3. silicon wafer powder sprinkling device according to claim 2, which is characterized in that the sealing plate further includes funnel cover board, described
Funnel cover board includes the first cover board and the second cover board, and first cover board connect with the stand hinge, first cover board with
Second cover plate hinge connection, second cover board are equipped with handle, the handle control the funnel cover board opening and
Gai He.
4. silicon wafer powder sprinkling device according to claim 2, which is characterized in that the silicon wafer powder sprinkling device further includes the first electricity
Machine fixing seat and the second motor fixing seat, the first motor fixing seat respectively with the first motor, first sealing plate
Connection, second motor fixing seat are connect with second motor fixing seat, first sealing plate respectively.
5. silicon wafer powder sprinkling device according to claim 2, which is characterized in that the silicon wafer powder sprinkling device is additionally provided with enabling gear
Plate, the first twin shaft cylinder and the second twin shaft cylinder, the enabling baffle are connect with first sealing plate, the enabling baffle with
First sealing plate is vertically arranged, and the middle part of the enabling baffle is equipped with the second opening, and the enabling baffle also has first
It is connected separately with sliding slot in side wall and second sidewall, the first side wall and the second sidewall, is also equipped on the sliding slot
The center symmetric setting of first slide plate and the second slide plate, first slide plate and second slide plate along second opening, institute
State and be connected with the first fixed plate on the first slide plate, be connected with the second fixed plate on second slide plate, first fixed plate with
The first twin shaft cylinder connection, second fixed plate is connect with the second twin shaft cylinder, in use, first twin shaft
Cylinder drives first slide plate to move reciprocatingly along the direction of the sliding slot towards second opening, the second twin shaft gas
Cylinder drives second slide plate to move reciprocatingly along the sliding slot towards second opening direction.
6. silicon wafer powder sprinkling device according to claim 5, which is characterized in that the sealing plate further includes the second sealing plate,
Three sealing plates, the 4th sealing plate and two symmetrically arranged 5th sealing plates, the positioning device are mounted on second sealing
On plate, the third sealing plate is open equipped with third corresponding with second opening.
7. silicon wafer powder sprinkling device according to claim 1, which is characterized in that the positioning device includes rotary cylinder, gas
Cylinder sealing plate, positioning seat and fixing axle, the rotary cylinder are connect with the cylinder seal plate, and the cylinder seal plate is for close
The rotary cylinder is sealed, the rotary cylinder and the positioning seat are sequentially connected, and the positioning seat is equipped with a plurality of fixation
Axis, the rotary cylinder drives the positioning seat rotation, to limit position of the silicon wafer in the silicon wafer fixing seat.
8. silicon wafer powder sprinkling device according to claim 1, which is characterized in that the funnel is equipped with first through hole, described
The arrangement of first through hole ranks, the funnel baffle is equipped with the second through-hole corresponding with the first through hole, on the sieve
Equipped with third through-hole, the aperture of the third through-hole is less than the first through hole and second through-hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201820880127.0U CN208661623U (en) | 2018-06-05 | 2018-06-05 | A kind of silicon wafer powder sprinkling device |
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Application Number | Priority Date | Filing Date | Title |
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CN201820880127.0U CN208661623U (en) | 2018-06-05 | 2018-06-05 | A kind of silicon wafer powder sprinkling device |
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CN208661623U true CN208661623U (en) | 2019-03-29 |
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CN201820880127.0U Active CN208661623U (en) | 2018-06-05 | 2018-06-05 | A kind of silicon wafer powder sprinkling device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110530695A (en) * | 2019-09-11 | 2019-12-03 | 中国人民解放军军事科学院国防工程研究院工程防护研究所 | A kind of mold for the detection test of Radioactive decontamination rate |
-
2018
- 2018-06-05 CN CN201820880127.0U patent/CN208661623U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110530695A (en) * | 2019-09-11 | 2019-12-03 | 中国人民解放军军事科学院国防工程研究院工程防护研究所 | A kind of mold for the detection test of Radioactive decontamination rate |
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Effective date of registration: 20210806 Address after: 518125 2nd floor, building B, 84 Xinyu Road, Xiangshan community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Jiaqiang Laser Technology Co.,Ltd. Address before: 518000 first floor, building C, Fukang community and Hengxing science and Technology Park, Longhua sub district office, Longhua District, Shenzhen, Guangdong Province Patentee before: SHENZHEN SINOCO TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |