CN208655624U

CN208655624U - A kind of pre-packaged frame structure

Info

Publication number: CN208655624U
Application number: CN201821179620.6U
Authority: CN
Inventors: 张凯; 周佳伟; 任姣; 陆晓燕; 王津; 林昀涛
Original assignee: Jiangyin Xinzhilian Electronics Technology Co ltd
Current assignee: Jiangyin Xinzhilian Electronics Technology Co ltd
Priority date: 2018-07-24
Filing date: 2018-07-24
Publication date: 2019-03-26
Anticipated expiration: 2028-07-24

Abstract

The utility model relates to a kind of pre-packaged frame structures, it includes fisrt feature layer (1) and second feature layer (2), the fisrt feature layer (1) and second feature layer (2) are coated with dielectric material (3), the second feature layer (2) and dielectric material (3) surface are coated with one layer of photodissociation glue (4), are covered with one layer of glass (5) on the photodissociation glue (4).The support plate of the utility model is stripped using mechanical system, eliminate the etching work procedure of original support plate, be able to solve conventional etch support plate etch uniformity is poor, product card plate is scrapped, it is bad to etch rear surface situation, rupture and cavity the defects of, improve production efficiency, reduce production cost.

Description

A kind of pre-packaged frame structure

Technical field

The utility model relates to a kind of pre-packaged frame structures, belong to technical field of semiconductor encapsulation.

Background technique

The structure of the pre-packaged frame of conventional etching processes as shown in Figure 1, it includes fisrt feature layer 1 and second feature layer 2, Fisrt feature layer 1 and second feature layer 2 are coated with dielectric material 3.

Its production method the following steps are included:

Step 1: referring to fig. 2, taking a metal plate as bottom plate；

Step 2: covering photoresist layer on bottom plate referring to Fig. 3, exposing and being developed in bottom plate front formation fisrt feature The negativity characteristic pattern of figure needed for layer；

Step 3: referring to fig. 4, plating production fisrt feature layer；

Step 4: applying second layer photoresist layer referring to Fig. 5, exposing and being developed in bottom plate front formation second feature layer The negativity characteristic pattern of required figure；

Step 5: referring to Fig. 6, plating production second feature layer；

Step 6: removing photoresist layer referring to Fig. 7；

Step 7 coats all characteristic layers with dielectric material referring to Fig. 8；

Step 8: grinding dielectric material referring to Fig. 9 to expose outermost layer feature layer pattern；

Step 9: two sides covers photoresist layer referring to Figure 10, exposes and be developed in figure needed for the bottom plate back side forms windowing Pattern, by etching windowing to expose the figure of fisrt feature layer；

Step 10: removing photoresist layer referring to Figure 11；

Step 11: surface treatment, electrodepositable nickel gold, NiPdAu, OSP etc..

The pre-packaged lead frame of above-mentioned conventional etching processes removes bottom plate by etch process, that there are etch uniformities is poor, Product card plate is scrapped, etches the defects of bad rear surface situation, rupture and cavity, so that product rejection rate is brought to rise, cost Increase problem.

Utility model content

Technical problem to be solved in the utility model is to provide a kind of pre-packaged frame structure for the above-mentioned prior art And support plate is stripped using mechanical system, eliminates the etching work procedure of original support plate, and it is equal to be able to solve the etching of conventional etch support plate Even property is poor, product card plate is scrapped, it is bad to etch rear surface situation, rupture and cavity the defects of, improve production efficiency, reduce Production cost.

The technical scheme in the invention for solving the above technical problem are as follows: a kind of pre-packaged frame structure, it includes the One characteristic layer and second feature layer, the fisrt feature layer and second feature layer are coated with dielectric material, the second feature Layer and dielectric material surface are coated with one layer of photodissociation glue, are covered with one layer of glass on the photodissociation glue.

Compared with the prior art, the advantages of the utility model are:

A kind of pre-packaged frame structure of the utility model, it does bottom plate, tearability support plate table using a kind of tearability support plate There is one layer of thin copper layer in face, plays substrate and conducting, and support plate is torn removing by equipment, substitutes original support plate etching work Skill, solve conventional etch support plate etch uniformity is poor, product card plate is scrapped, it is bad to etch rear surface situation, rupture and cavity The defects of, the production cycle is shortened, production cost is reduced.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the pre-packaged frame of conventional etching processes.

Fig. 2~Figure 11 is the process flow chart of the pre-packaged frame manufacture method of conventional etching processes in Fig. 1.

Figure 12 is a kind of schematic diagram of pre-packaged frame structure of the utility model.

Figure 13~Figure 22 is a kind of process flow chart of pre-packaged frame structure production method of the utility model.

Wherein:

Fisrt feature layer 1

Second feature layer 2

Dielectric material 3

Photodissociation glue 4

Glass 5.

Specific embodiment

The utility model is described in further detail below in conjunction with figure embodiment.

Referring to Figure 12, the pre-packaged frame structure of one of the present embodiment, it includes fisrt feature layer 1 and second feature layer 2, the fisrt feature layer 1 and second feature layer 2 are coated with dielectric material 3,3 table of the second feature layer 2 and dielectric material Face is coated with one layer of photodissociation glue 4, is covered with one layer of glass 5 on the photodissociation glue 4.

Its manufacturing method includes the following steps:

Step 1: taking the tearability support plate of a metal as bottom plate referring to Figure 13, tearability support plate surface is provided with one layer thin Layers of copper, the thickness of thin copper layer play substrate and conducting at 1 μm or so, damage characteristic layer when can prevent support plate from stripping；

Step 2: participating in Figure 14, photoresist layer is covered on bottom plate, exposes and is developed in bottom plate front formation fisrt feature The negativity characteristic pattern of figure needed for layer；

Step 3: being electroplated referring to Figure 15 to make fisrt feature layer；

Step 4: continuing to second layer photoresist layer referring to Figure 16, exposing and being developed in bottom plate front formation second and is special The negativity characteristic pattern of figure needed for levying layer；

Step 5: being electroplated referring to Figure 17 to make second feature layer；

Step 6: removing photoresist layer referring to Figure 18；

Step 7: participating in Figure 19, all characteristic layers are coated with dielectric material；

Step 8: referring to fig. 20, dielectric material face is ground to expose outermost layer feature layer pattern；

Step 9: referring to fig. 21, one layer is covered on outermost layer characteristic layer and dielectric material surface scratch brushing dispergation, photodissociation glue Glass, since frame thickness is relatively thin, intensity is intersected, and increasing glass can play a supporting role, production when preventing subsequent support plate from stripping Product deformation；

Step 10: referring to fig. 22, mechanically tearability support plate is once removed；

Pass through cutting tool when removing first to cut thin copper layer and tearability support plate port, then passes through special designing Whole tearability support plate is once torn removing by the port position that equipment is cut from tearability support plate；

Step 11: fast-etching removes thin copper layer, expose fisrt feature layer pattern；

Step 12: surface treatment, electrodepositable nickel gold, NiPdAu, OSP etc.；

Step 13: removing photodissociation glue by photodissociation mode, glass is removed from frame.

In addition to the implementation, the utility model further includes having other embodiments, all to use equivalents or equivalent The technical solution that alternative is formed, should all fall within the protection scope of the utility model claims.

Claims

1. a kind of pre-packaged frame structure, it is characterised in that: it includes fisrt feature layer (1) and second feature layer (2), and described One characteristic layer (1) and second feature layer (2) are coated with dielectric material (3), the second feature layer (2) and dielectric material (3) Surface is coated with one layer of photodissociation glue (4), is covered with one layer of glass (5) on the photodissociation glue (4).