CN208654455U - Photoelectricity mould group, depth acquisition device and terminal - Google Patents
Photoelectricity mould group, depth acquisition device and terminal Download PDFInfo
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- CN208654455U CN208654455U CN201821563256.3U CN201821563256U CN208654455U CN 208654455 U CN208654455 U CN 208654455U CN 201821563256 U CN201821563256 U CN 201821563256U CN 208654455 U CN208654455 U CN 208654455U
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Abstract
The utility model discloses a kind of photoelectricity mould group, depth acquisition device and terminals.Photoelectricity mould group includes substrate, light source, optical element and detecting element.Substrate includes main part and extension, and main part includes opposite the first face and the second face, and the direction that extension faces away from main part from first extends.Light source is arranged on main part and for emitting laser.Optical element is arranged in the optical path of light source and for expanding or spread laser.Detecting element is disposed on the substrate and is used to receive and detect by the laser of optical element reflection and exports electric signal.In the photoelectricity mould group of the utility model, it is provided with detecting element on substrate, received using detecting element and detects by laser that optical element reflect and exports electric signal, may determine that optical element whether extremely further according to electric signal.When judging optical element exception, light source can be closed in time, and the laser to prevent light source transmitting is just launched without intact optical element, and burn user.
Description
Technical field
The utility model relates to consumer electronics fields, more specifically, are related to a kind of photoelectricity mould group, depth acquisition device
And terminal.
Background technique
Currently, 3D projective module group can be used for the scenes such as recognition of face, face unlock.And 3D projective module group generally use it is sharp
Optical element is arranged as light source, and in the optical path of light source in optical generator, so that the laser of 3D projective module group projection is realized more
Good optical effect.However the energy of laser is higher, when optical element exception, such as optical element rupture, fall or occur
When displacement, the laser of light source transmitting is just directly launched without optical element, is easy the user that burns.Therefore, how
The problem of whether optical element in 3D projective module group becomes those skilled in the art's urgent need to resolve extremely judged.
Utility model content
The utility model embodiment provides a kind of photoelectricity mould group, depth acquisition device and terminal.
The photoelectricity mould group of the utility model embodiment includes substrate, light source, optical element and detecting element.The substrate
Including main part and extension, the main part includes opposite the first face and the second face, and the extension is from first face
Extend towards the direction far from the main part；The light source is arranged on the main part and for emitting laser；The optics
Element is arranged in the optical path of the light source and for expanding or spreading the laser；The detecting element is arranged in the substrate
It goes up and is used to receive and detect by laser that the optical element reflects and exports electric signal to judge whether optical element is abnormal.
In the photoelectricity mould group of the utility model, it is provided with detecting element on substrate, quilt is received and detected using detecting element
The laser of optical element reflection simultaneously exports electric signal, may determine that whether optical element is abnormal further according to electric signal.When judging light
When learning element exception, light source can be closed in time, the laser to prevent light source transmitting is just launched without intact optical element,
Burn user.
In some embodiments, the optical element is arranged on the extension, and the detecting element is arranged in institute
It states on main part.
Optical element is arranged on extension, and other support construction (such as lens barrel) that no setting is required fixes optics member
Part.Detecting element is set up directly on main part, and mounting means is simple.
In some embodiments, the optical element is arranged on the extension, and the detecting element is arranged in institute
It states on extension.
Optical element is arranged on extension, and other support construction (such as lens barrel) that no setting is required fixes optics member
Part.When photoelectricity mould group further includes collimation lens, detecting element be arranged on extension, can be received to avoid detecting element through
The laser of collimation lens reflection, that is to say, that the testing result for avoiding the laser effect detecting element reflected by collimation lens mentions
High measurement accuracy.
In some embodiments, the optical element includes the opposite plane of incidence and exit facet, and the plane of incidence is compared with institute
Exit facet is stated closer to the light source, the detecting element includes light receiving surface, and the light receiving surface is opposite with the plane of incidence.
Since light receiving surface is opposite with the plane of incidence, the laser of light source transmitting after optical element reflects, is having more
Laser enter light receiving surface, the electric signal of detecting element output is stronger, detects more acurrate.
In some embodiments, the light source is vertical cavity surface emitting laser, and the light source includes light-emitting surface, described
Light-emitting surface is towards the plane of incidence.
Using vertical cavity surface emitting laser as light source, then the irrelevance of laser pattern can be higher, is conducive to obtain
High accuracy depth image.
In some embodiments, the light source is edge-emitting lasers, and the light source includes light-emitting surface, the photoelectricity
Mould group further includes prism, and the laser in the optical path of the light source and for reflecting the light source transmitting, institute is arranged in the prism
Stating prism includes entering light face, light-emitting surface and reflecting surface, and the entering light enters described in facing towards the light-emitting surface, the light-emitting surface
Face is penetrated, the reflecting surface connects the entering light face and the light-emitting surface, and the laser issued from the light-emitting surface is by the entering light face
It is emitted to the optical element into the prism and from the light-emitting surface after the reflective surface, it is described used for optical elements
In the laser that adjusting is emitted from the light-emitting surface.
Since edge-emitting lasers are single-point light emitting structure, use edge-emitting lasers as light source, be not necessarily to
Array of designs structure, production is simple, and the cost of light source of photoelectricity mould group is lower, and compared with vertical cavity surface emitting laser for, side
The temperature drift of emission type laser is smaller.In addition, prism can change the luminous optical path of light source, so as to by the light of photoelectricity mould group
Road is designed to the optical path of periscopic, reduces optical path of the photoelectricity mould group on light direction, shortens photoelectricity mould group and is going out
Height on light direction is conducive to the miniaturization of photoelectricity mould group.
In some embodiments, the optical element is diffraction optical element, and the diffraction optical element includes diffraction
Ontology and diffraction micro structural, the diffraction ontology include the plane of incidence and the exit facet, and the diffraction micro structural is for expanding
To form laser pattern, the diffraction micro structural can be set on the plane of incidence Shu Suoshu laser, also can be set in institute
It states on exit facet, can also be arranged on the plane of incidence and the exit facet.
The laser that diffraction optical element can be issued with reflection source, detecting element, which receives, is diffracted swashing for optical element reflection
Light simultaneously exports electric signal.In this way, the electric signal judgement that the photoelectricity mould group of structure light depth camera can be exported according to detecting element is spread out
Whether abnormal penetrate optical element.When judging diffraction optical element exception, light source can be closed in time, to prevent swashing for light source transmitting
Light is just launched without intact diffraction optical element, and burn user.
In some embodiments, the optical element is diffuser, and the diffuser is for spreading the laser.
A part of laser that light source issues is reflected by diffuser, and is received by detecting element.In this way, TOF depth camera
Photoelectricity mould group can also judge whether diffuser is abnormal according to the electric signal that detecting element exports.It, can when judging diffuser exception
To close light source in time, the laser to prevent light source transmitting is just launched without intact diffuser, and burn user.
In some embodiments, the main part further includes the through-hole for penetrating through first face and second face, institute
Stating photoelectricity mould group further includes heat-conducting piece, and the heat-conducting piece is filled in the through-hole, and the light source loading is on the heat-conducting piece
So that the heat-conducting piece radiates to the light source.
Heat-conducting piece radiates to light source, on the one hand, the temperature of light source is not too high, the laser power for avoiding light source from emitting
Decay or the phenomenon that light source is burnt occur, on the other hand, avoid the temperature of photoelectricity module internal excessively high, optical element is made to generate temperature
Drift, influences the optical effect of optical element.
The depth acquisition device of the utility model embodiment include photoelectricity mould group described in any of the above-described embodiment and
Camera mould group.The photoelectricity mould group is used to emit laser towards target object；The camera mould group is for receiving through the object
Laser after body reflection.
In the depth acquisition device of the utility model, it is provided with detecting element on the substrate of photoelectricity mould group, utilizes detection member
Part receives and detects by laser that optical element reflects and export electric signal, whether may determine that optical element further according to electric signal
It is abnormal.When judging optical element exception, light source can be closed in time, it is first without intact optics to prevent the laser of light source transmitting
Part is just launched, and burn user.
The terminal of the utility model embodiment includes depth acquisition device described in shell and above embodiment, described
Depth acquisition device is arranged on the housing.
In the terminal of the utility model, it is provided with detecting element on the substrate of photoelectricity mould group, using detecting element in reception
And extremely whether detection by laser that optical element reflect and exports electric signal, may determine that optical element further according to electric signal.
When judging optical element exception, light source can be closed in time, to prevent light source transmitting laser without intact optical element just
Launch, burn user.
The additional aspect and advantage of the embodiments of the present invention will be set forth in part in the description, partially will be from
Become obvious in following description, or is recognized by the practice of the embodiments of the present invention.
Detailed description of the invention
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the terminal of the utility model embodiment；
Fig. 2 is the structural schematic diagram of the depth acquisition device of the utility model embodiment；
Fig. 3 is the structural schematic diagram of the photoelectricity mould group of the utility model embodiment；With
Fig. 4 to Fig. 7 is the structural schematic diagram of the photoelectricity mould group of the utility model other embodiments.
Specific embodiment
The embodiments of the present invention is described further below in conjunction with attached drawing.Same or similar label in attached drawing
Same or similar element or element with the same or similar functions are indicated from beginning to end.
In addition, the embodiments of the present invention described with reference to the accompanying drawing is exemplary, it is only used for explaining this reality
With novel embodiment, and should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Referring to Fig. 1, the terminal 1000 of the utility model embodiment can be the electronic device that can obtain depth, example
Such as mobile phone, computer (including tablet computer, laptop computer), game machine, head show equipment, monitoring device, access control system etc..This reality
It is illustrated so that terminal 1000 is mobile phone as an example with novel.Specifically, terminal 1000 includes shell 200 and depth acquisition device
100.Shell 200 can provide protection to the depth acquisition device 100 being arranged on shell 200, such as can isolate water, ash
Dirt, electromagnetic wave etc., to extend the service life of depth acquisition device 100.In one example, offered on shell 200 with
The corresponding hole of depth acquisition device 100.Light can be pierced by or penetrate shell 200 from hole.
Referring to Fig. 2, the depth acquisition device 100 of the utility model embodiment can be applied to recognition of face, 3D modeling
Equal fields.Depth acquisition device 100 includes photoelectricity mould group 10 and camera mould group 20.Photoelectricity mould group 10 is used to emit towards target object
Laser, such as emit laser pattern towards user.Camera mould group 20 is for receiving the laser after target object reflects.Depth obtains
Device 100 further includes processor 30.Processor 30 is used for according to the received laser of camera mould group 20 so that (depth image) is imaged.Tool
Body, processor 30 is all connected with camera mould group 20 and photoelectricity mould group 10, and processor 30 is for handling above-mentioned laser to obtain depth
Spend image.Can also be formed on depth acquisition device 100 projection window 40 corresponding with photoelectricity mould group 10 and with camera mould group
20 corresponding acquisition windows 50.Photoelectricity mould group 10 can project laser, camera mould group 20 to object space by projection window 40
The laser after target object reflects can be received by acquisition window 50.In one example, depth acquisition device 100 is
The photoelectricity mould group 10 of structure light depth camera, structure light depth camera can project speckle pattern or coding structure light pattern,
Camera mould group 20 is received through the modulated speckle pattern of target object or coding structure light pattern, and processor 30 is according to speckle pattern
Case or coded structured light pattern generation depth image.In another example, depth acquisition device 100 is the flight time
(Time of Flight, TOF) depth camera.The photoelectricity mould group 10 of TOF depth camera can emit laser towards target object, and
Laser after target object reflects is received by camera mould group 20, processor 30 is according to transmitting laser and receives between reflection laser
Time difference calculate the distance between target object and flight time depth camera, to obtain the depth letter of target object
Breath.
Referring to Fig. 3, the photoelectricity mould group 10 of the utility model embodiment includes substrate 11, light source 12, optical element 13
With detecting element 14.Substrate 11 includes main part 111 and extension 112.Main part 111 includes opposite the first face 1111 and the
Two faces 1112.Extension 112 extends from the first face 1111 towards the direction far from main part 111.Light source 12 is arranged in main part 111
It goes up and is used to emit laser.Optical element 13 is arranged in the optical path of light source 12 and for expanding or spread laser.Detecting element
14 settings are on the substrate 11 and for receiving and detecting by laser that optical element 13 reflects and export electric signal to judge optics
Whether element 13 is abnormal.
Wherein, substrate 11 can be used for carrying light source 12 and optical element 13.Specifically, substrate 11 includes main part 111
With extension 112.Main part 111 can be integrally formed with extension 112, can also molding seperated with extension 112.At one
In example, the material of substrate 11 can be plastics, in this way, the lighter weight of substrate 11 and substrate 11 have enough supports strong
Degree.In another example, the material of substrate 11 can be ceramics, in this way, not only main part 111 can preferably exist to setting
Light source 12 on main part 111 radiates, and the heat inside photoelectricity mould group 10 can be also transmitted to photoelectricity mould group by extension 112
10 outside.In the utility model embodiment, substrate 11 is made of ceramics.
Main part 111 is for carrying light source 12.Main part 111 includes opposite the first face 1111 and the second face 1112.Light
Source 12 is carried on the first face 1111.The mode that light source 12 is combined with the first face 1111 includes glued, welding etc..
Extension 112 is for carrying optical element 13.Extension 112 is along the first face 1111 towards the direction of main part 111
Extend.Extension 112 includes two opposite openings, and one of opening is combined with the first face 1111, another opening is
Photoelectricity mould group 10 projects the outlet of laser, and the heat in photoelectricity mould group 10 can also be transmitted to photoelectricity mould group 10 by the opening
It is external.Specifically, extension 112 is hollow tubular structure.Extension 112 further includes the top surface far from the first face 1111
1121, top surface 1121 can be used for being combined with optical element 13.Accommodating space is collectively formed in extension 112 and main part 111
113.Light source 12 is housed in accommodating space 113.
Light source 12 is for emitting laser.Light source 12 can be on setting main part 111.Light source 12 includes light-emitting surface 121, is swashed
Light is projected from light-emitting surface 121.In one example, light source 12 is vertical cavity surface emitting laser (Vertical-Cavity
Surface-Emitting Laser, VCSEL) 122.In another example, light source 12 can also be edge-emitting lasers
(for example, distributed feedback laser (Distributed Feedback Laser, DFB)) 123.As shown in figure 3, light source 12
It can be electrically connected by the base plate line of setting on the substrate 11 with external circuit (mainboard of the terminal 1000 of example as shown in figure 1),
The laser intensity that light source 12 emits can be controlled by external circuit.
Optical element 13 is used to expand or spread the laser of the transmitting of light source 12.Specifically, optical element 13 includes opposite
The plane of incidence 131 and exit facet 132, the plane of incidence 131 is compared with exit facet 132 closer to light source 12.When the setting of optical element 13 is extending
When in portion 112, the light-emitting surface 131 of light source 12 is towards the plane of incidence 131.In one example, the plane of incidence of optical element 13 131
Divide and is combined with the top surface 1121 of extension 112.The mode that the plane of incidence 131 is combined with top surface 1121 includes glued, engaging etc..Optics
Element 13 is arranged on extension 112, and no setting is required, and other support construction (such as lens barrel) carrys out fixing optical element 13.It please join
Fig. 3 is read, in another example, top surface 1121 opens up the mounting groove 1122 of oriented 113 sunken inside of accommodating space, optical element 13
It is at least partially disposed in mounting groove 1122.Under the limitation of the side wall of mounting groove 1122, optical element 13 is steadily housed in
In accommodating space 113, and the height of photoelectricity mould group 10 can be also reduced.
Detecting element 14 is used to receive and detect by laser that optical element 13 reflects and exports electric signal.Electric signal can be with
It is whether abnormal for detecting optical element 13.Specifically, detecting element 14 is arranged on the substrate 11.Detecting element 14 connects including light
Receipts face 141, light receiving surface 141 and the plane of incidence 131 are opposite, therefore the laser that emits of light source 12 is after the reflection of optical element 13,
There are more laser to enter light receiving surface 141, the electric signal that detecting element 14 exports is stronger, detects more acurrate.Detecting element 14
Electric signal is exported according to the laser for receiving reflection.Electric signal is compared with predetermined value, to judge that optical element 13 reflects
Laser it is whether abnormal, and then judge optical element 13 whether extremely.
Predetermined value can be set according to the laser intensity that light source 12 emits, for example, light source 12 emit the 40% of laser to
50%.For example, light source 12 emit laser intensity be 100cd, predetermined value be light source 12 can be 40cd to 60cd any one
Value, such as predetermined value are 40cd, 45cd, 50cd, 55cd, 60cd etc..By predetermined value be 40cd for, when electric signal be greater than or
When person is equal to 40cd, such as 40cd, 45cd, 50cd, 55cd or 60cd etc. then may determine that optical element 13 is intact shape
State.When electric signal is less than 40cd, such as 39cd, 35cd, 20cd, 10cd or 0cd etc. then may determine that optical element 13
There is exception, such as optical element 13 is ruptured, shifts, fallen.Therefore, photoelectricity mould group may determine that according to the size of electric signal
Whether 10 optical element 13 is abnormal, so that photoelectricity mould group 10 takes safety measures in time when optical element 13 is abnormal, such as
Close light source 12.In one example, detecting element 14 can be optical flame detector (Photo Diode).Wherein, detecting element 14
Quantity can be single, or multiple.Multiple detecting elements 14 are evenly spaced on the first face 1111, in this way, multiple inspections
Surveying element 14 can receive multiple laser reflected by different location on optical element 13, improve detection accuracy.
To sum up, in the photoelectricity mould group 10 of the utility model, it is provided with detecting element 14 on substrate 11, utilizes detecting element 14
It receives and detects by laser that optical element 13 reflects and export electric signal, may determine that optical element 13 is further according to electric signal
No exception.When judging that optical element 13 is abnormal, light source 12 can be closed in time, and the laser emitted to prevent light source 12 is without intact
Optical element 13 just launch, burn user.
Referring to Fig. 3, in some embodiments, light source 12 is vertical cavity surface emitting laser 122.Vertical-cavity surface-emitting
Laser 122 includes light-emitting surface 121, and light-emitting surface 121 is towards the plane of incidence 131.Specifically, vertical cavity surface emitting laser 122 by
The light-emitting component composition of semiconductor substrate and setting on substrate.A plurality of light-emitting elements can be in regular distribution on substrate,
It can be in random distribution.The laser of a plurality of light-emitting elements transmitting is issued from light-emitting surface 121, after the reflection of optical element 13, by examining
Element 14 is surveyed to receive.Light source 12 is used as using vertical cavity surface emitting laser 122, the irrelevance of laser pattern can be higher, has
Conducive to acquisition high accuracy depth image.
Referring to Fig. 4, in some embodiments, light source 12 is edge-emitting lasers 123.Edge-emitting lasers
123 include light-emitting surface 121.Photoelectricity mould group 10 further includes prism 15, and prism 15 is arranged in the optical path of light source 12 and for reflecting
The laser that light source 12 emits.Prism 15 includes entering light face 151, light-emitting surface 152 and reflecting surface 153.Entering light face 151 is towards light-emitting surface
121, for light-emitting surface 152 towards the plane of incidence 131 of optical element 13, reflecting surface 153 connects entering light face 151 and light-emitting surface 152.From hair
The laser that smooth surface 121 issues enters prism 15 by entering light face 151 and is emitted to light from light-emitting surface 152 after the reflection of reflecting surface 153
Element 13 is learned, optical element 13 is used to adjust the laser being emitted from light-emitting surface 152.In one example, entering light face 151 and out light
Face 152 is aspherical and all has curvature surface shape, and entering light face 151 and light-emitting surface 152 can be used for the hair of common collimation light source 12
The laser penetrated.Since edge-emitting lasers 123 are single-point light emitting structure, light is used as using edge-emitting lasers 123
Source 12 is not necessarily to array of designs structure, and production is simple, and cost is relatively low for the light source 12 of photoelectricity mould group 10, and compared with vertical-cavity surface-emitting
For laser 122, the temperature drift of edge-emitting lasers 123 is smaller.In addition, prism 15 can change the luminous light of light source 12
Road reduces photoelectricity mould group 10 on light direction so as to the optical path by the light path design of photoelectricity mould group 10 at periscopic
Optical path, shorten height of the photoelectricity mould group 10 on light direction, be conducive to the miniaturization of photoelectricity mould group 10.
Referring again to Fig. 3, in some embodiments, when depth acquisition device 100 is structure light depth camera, optics
Element 13 is diffraction optical element (Diffractive Optical Elements, DOE) 133.Diffraction optical element 133 includes
Diffraction ontology 1331 and diffraction micro structural 1332.Diffraction ontology 1331 includes the plane of incidence 131 and exit facet 132.Diffraction micro structural
1332 stepped ramp types or continuous relief structure (generally optical grating construction) generated for 1331 surface etch of diffraction ontology, can be used in
Laser is expanded to form laser pattern, such as forms speckle pattern or coding structure light pattern.Diffraction optical element 133 can be with
The laser that reflection source 12 issues, detecting element 14 receive the laser for being diffracted the reflection of optical element 133 and export electric signal.Such as
This, the photoelectricity mould group 10 of structure light depth camera can judge diffraction optical element 133 according to the electric signal that detecting element 14 exports
It is whether abnormal.When judging that diffraction optical element 133 is abnormal, light source 12 can be closed in time, the laser emitted to prevent light source 12
Just launch without intact diffraction optical element 133, burn user.Such as Fig. 3, in one example, diffraction micro structural
1332 can be set on the plane of incidence 131, and the laser that light source 12 emits is most of successively by the micro- knot of diffraction on the plane of incidence 131
It is projected after structure 1332, diffraction ontology 1331 from exit facet 132.The inside of photoelectricity mould group 10 is arranged in diffraction micro structural 1332, makes
It obtains diffraction micro structural 1332 and is not readily susceptible to the interference such as extraneous steam, dust.In another example, diffraction micro structural 1332
Also it can be set on exit facet 132, most of laser that light source 12 emits successively passes through diffraction ontology 1331, exit facet 1312
On diffraction micro structural 1332 after project.In another example, the plane of incidence can also be arranged in diffraction micro structural 1332 simultaneously
131 and exit facet 132 on.
Please continue to refer to Fig. 3, in some embodiments, when depth acquisition device 100 is structure light depth camera, light
Electric mould group 10 further includes collimation lens 16.Collimation lens 16 and diffraction optical element 133 are successively set on the optical path of light source 12
On.Collimation lens 16 is used for the laser that collimated light source 12 emits, and diffraction optical element 133 is collimated for the collimated lens 16 of diffraction
Laser afterwards.Collimation lens 16 can be individual lens, which is convex lens or concavees lens；Or be more pieces of lens, it is more
Piece lens can be convex lens or concavees lens, or part is convex lens, is partially concavees lens.
Referring to Fig. 3, in some embodiments, optical element 13 is arranged on extension 112, detecting element 14 is arranged
On main part 111.Specifically, detecting element 14 is combined with the first face 1111 of main part 111, and the mode that the two combines includes
Welding, glued, engaging etc..Detecting element 14 is set up directly on main part 111, and the mounting means of detecting element 14 is simple.Please
Refering to Fig. 5, in other embodiments, optical element 13 is arranged on extension 112, and detecting element 14 is arranged in extension
On 112, such as it is set up directly on the inner sidewall of extension 112, the light receiving surface 141 of detecting element 14 remains to receive warp at this time
The laser that optical element 13 reflects.When photoelectricity mould group 10 further includes collimation lens 16, detecting element 14 is arranged in extension 112
On, the laser that collimated lens 16 reflect can be received to avoid detecting element 14, that is to say, that avoid anti-by collimation lens 16
The testing result for the laser effect detecting element 14 penetrated improves detection accuracy.
Referring to Fig. 6, in some embodiments, when depth acquisition device 100 is TOF depth camera, optical element
13 be diffuser 134, and diffuser 134 is used for spread laser.Specifically, on diffuser 134 can doped with diffusion particle, or
It is provided with diffusion micro-structure (not shown), to be used for spread laser.Diffuser 134 includes the opposite plane of incidence 131 and exit facet
132.A part of laser that light source 12 emits enters to inject diffuser 134 from the plane of incidence 131, and after the diffusion of diffuser 134, by
Exit facet 132 projects；A part of laser is reflected by diffuser 134, and is received by detecting element 14.In this way, TOF depth camera
Photoelectricity mould group 10 can also judge whether diffuser 134 is abnormal according to the electric signal that detecting element 14 exports.When judging diffuser 134
When abnormal, light source 12 can be closed in time, the laser emitted to prevent light source 12 is just launched without intact diffuser 134,
Burn user.In one example, in the photoelectricity mould group 10 of TOF depth camera, detecting element 14 be can be set in main part 11
Upper (such as Fig. 6), also can be set on extension 112 (such as Fig. 7).In addition, the photoelectricity mould group 10 of TOF depth camera can also be
Periscopic structure shown in Fig. 4.
Fig. 3 to Fig. 7 is please referred to, in some embodiments, main part 111 further includes the first face 1111 of perforation and the second face
1112 through-hole 1113.Photoelectricity mould group 10 further includes heat-conducting piece 17, and heat-conducting piece 17 is filled in through-hole 1113, and light source 12 is carried on
So that heat-conducting piece 17 radiates to light source 12 on heat-conducting piece 17.
Specifically, the quantity of through-hole 1113 can be one, or it is multiple, such as two, three, four etc..It is logical
The position in hole 1113 is corresponding with the position of light source 12.Heat-conducting piece 17 is filled in through-hole 1113.The quantity and through-hole of heat-conducting piece 17
1113 quantity is corresponding.It is of course also possible to be in a part of through-hole 1113 filled with heat-conducting piece 17, another part through-hole 1113 is not
Fill heat-conducting piece 17.Light source 12 can be arranged directly on heat-conducting piece 17, embodiment that can also be as shown in Figure 3, and light source 12 is set
It sets in the container 171 of heat-conducting piece 17.Heat-conducting piece 17 radiates to light source 12, on the one hand, the temperature of light source 12 will not mistake
Height, the laser power for avoiding light source 12 from emitting decay or the phenomenon that light source 12 is burnt occur, and on the other hand, avoid photoelectricity mould group 10
Internal temperature is excessively high, so that optical element 13 is generated temperature drift, influences the optical effect of optical element 13.
In some embodiments, the material of heat-conducting piece 17 can be metal, for example, copper, aluminium, copper alloy, aluminium alloy and
At least one of stainless steel.In the present embodiment, heat-conducting piece 17 is made of fine copper, since the heat dissipation performance of fine copper is excellent,
It is more preferable to the heat dissipation performance inside photoelectricity mould group 10.In addition, heat-conducting piece 17 can also be with the common sinter molding of substrate 11.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means in conjunction with the embodiment
Or example particular features, structures, materials, or characteristics described are contained at least one embodiment of the utility model or show
In example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.And
And particular features, structures, materials, or characteristics described can be in any one or more embodiments or example to close
Suitable mode combines.In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one described feature.In the description of the present invention, the meaning of " plurality " is at least two,
Such as two, three, unless otherwise specifically defined.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
It inside can make changes, modifications, alterations, and variations to the above described embodiments, the scope of the utility model is by claim and its is equal
Object limits.
Claims (10)
1. a kind of photoelectricity mould group characterized by comprising
Substrate, the substrate include main part and extension, and the main part includes opposite the first face and the second face, described to prolong
The direction that extending portion faces away from the main part from described first extends；
Light source, the light source are arranged on the main part and for emitting laser；
Optical element, the optical element are arranged in the optical path of the light source and for expanding or spreading the laser；With
Detecting element, detecting element setting are reflected by the optical element on the substrate and for receiving and detecting
Laser simultaneously exports electric signal to judge whether optical element is abnormal.
2. photoelectricity mould group according to claim 1, which is characterized in that the optical element is arranged on the extension,
The detecting element is arranged on the main part；Or, the detecting element is arranged on the extension.
3. photoelectricity mould group according to claim 1, which is characterized in that the optical element includes the opposite plane of incidence and goes out
Face is penetrated, the plane of incidence exit facet is closer to the light source, and the detecting element includes light receiving surface, the light-receiving
Face is opposite with the plane of incidence.
4. photoelectricity mould group according to claim 3, which is characterized in that the light source is vertical cavity surface emitting laser, institute
Stating light source includes light-emitting surface, and the light-emitting surface is towards the plane of incidence.
5. photoelectricity mould group according to claim 3, which is characterized in that the light source is edge-emitting lasers, the light
Source includes light-emitting surface, and the photoelectricity mould group further includes prism, and the prism is arranged in the optical path of the light source and for reflecting
The laser of the light source transmitting, the prism include entering light face, light-emitting surface and reflecting surface, and the entering light shines facing towards described
Face, the light-emitting surface is towards the plane of incidence, and the reflecting surface connects the entering light face and the light-emitting surface, from the light-emitting surface
The laser of sending is emitted to described by the entering light face into the prism and after the reflective surface from the light-emitting surface
Optical element, the optical element are used to adjust the laser being emitted from the light-emitting surface.
6. photoelectricity mould group according to claim 4 or 5, which is characterized in that the optical element is diffraction optical element, institute
Stating diffraction optical element includes diffraction ontology and diffraction micro structural, and the diffraction ontology includes the plane of incidence and the outgoing
Face, the diffraction micro structural are used to expand the laser to form laser pattern,
The diffraction micro structural is arranged on the plane of incidence；And/or
The diffraction micro structural is arranged on the exit facet.
7. photoelectricity mould group according to claim 4 or 5, which is characterized in that the optical element is diffuser, the diffusion
Device is for spreading the laser.
8. photoelectricity mould group according to claim 1, which is characterized in that the main part further include perforation first face and
The through-hole in second face, the photoelectricity mould group further includes heat-conducting piece, and the heat-conducting piece is filled in the through-hole, the light source
It is carried on the heat-conducting piece so that the heat-conducting piece radiates to the light source.
9. a kind of depth acquisition device characterized by comprising
Photoelectricity mould group described in claim 1 to 8 any one, the photoelectricity mould group are used to emit laser towards target object；With
Camera mould group, the camera mould group are used to receive the laser after target object reflection.
10. a kind of terminal characterized by comprising
Shell；With
Depth acquisition device as claimed in claim 9, the depth acquisition device setting is on the housing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821563256.3U CN208654455U (en) | 2018-09-25 | 2018-09-25 | Photoelectricity mould group, depth acquisition device and terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821563256.3U CN208654455U (en) | 2018-09-25 | 2018-09-25 | Photoelectricity mould group, depth acquisition device and terminal |
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| CN208654455U true CN208654455U (en) | 2019-03-26 |
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| CN201821563256.3U Active CN208654455U (en) | 2018-09-25 | 2018-09-25 | Photoelectricity mould group, depth acquisition device and terminal |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110412540A (en) * | 2019-07-30 | 2019-11-05 | Oppo广东移动通信有限公司 | Light emitting module, time-of-flight camera and electronic device |
| WO2020038078A1 (en) * | 2018-08-23 | 2020-02-27 | 南昌欧菲生物识别技术有限公司 | Photovoltaic module, depth extraction device and electronic device |
| CN112824955A (en) * | 2019-11-21 | 2021-05-21 | 南昌欧菲生物识别技术有限公司 | Structured light module, imaging device and electronic equipment |
| WO2024027007A1 (en) * | 2022-08-01 | 2024-02-08 | 奥比中光科技集团股份有限公司 | Contamination monitoring system of transmitting module, contamination detection method, and related device |
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2018
- 2018-09-25 CN CN201821563256.3U patent/CN208654455U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020038078A1 (en) * | 2018-08-23 | 2020-02-27 | 南昌欧菲生物识别技术有限公司 | Photovoltaic module, depth extraction device and electronic device |
| CN110412540A (en) * | 2019-07-30 | 2019-11-05 | Oppo广东移动通信有限公司 | Light emitting module, time-of-flight camera and electronic device |
| CN110412540B (en) * | 2019-07-30 | 2022-05-13 | Oppo广东移动通信有限公司 | Light emitting module, time-of-flight camera and electronic device |
| CN112824955A (en) * | 2019-11-21 | 2021-05-21 | 南昌欧菲生物识别技术有限公司 | Structured light module, imaging device and electronic equipment |
| CN112824955B (en) * | 2019-11-21 | 2022-06-28 | 江西欧迈斯微电子有限公司 | Structured light module, imaging device and electronic equipment |
| WO2024027007A1 (en) * | 2022-08-01 | 2024-02-08 | 奥比中光科技集团股份有限公司 | Contamination monitoring system of transmitting module, contamination detection method, and related device |
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Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |