CN208638791U - RF switch - Google Patents

RF switch Download PDF

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Publication number
CN208638791U
CN208638791U CN201820943425.XU CN201820943425U CN208638791U CN 208638791 U CN208638791 U CN 208638791U CN 201820943425 U CN201820943425 U CN 201820943425U CN 208638791 U CN208638791 U CN 208638791U
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CN
China
Prior art keywords
pcb board
switch
pad
shielding case
top layer
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Active
Application number
CN201820943425.XU
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Chinese (zh)
Inventor
李坤
臧嘉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Jia Chen Science And Technology Ltd
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Chengdu Jia Chen Science And Technology Ltd
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Priority to CN201820943425.XU priority Critical patent/CN208638791U/en
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Publication of CN208638791U publication Critical patent/CN208638791U/en
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Abstract

The utility model relates to a kind of RF switches.The utility model includes the first pcb board, the second pcb board and shielding case;First pcb board is Multilayer Structure, and bottom is RF switch, and top layer is driver, and middle layer is ground;Second pcb board is the window frame structure of intermediate hollow out, and surrounding arranges pad;The pad of the pad of second pcb board and the first pcb board corresponds;Second pcb board is welded in the bottom of the first pcb board, and the device of the first pcb board bottom is set in the peripheral frame of the second pcb board, and the element height of the first pcb board bottom is not higher than the height of the second pcb board;Shielding case is welded in the top layer of the first pcb board, and the device of the first pcb board top layer is set in shielding case.The utility model is the RF switch that high isolation is miniaturized in surface-mount type low cost, mainly solves the Surface Mount mode of RF switch;On the other hand meet requirement of the market to RF switch high isolation, low cost.

Description

RF switch
Technical field
The utility model relates to a kind of RF switches, belong to RF switch technical field of electrical components.
Background technique
High isolation RF switch domestic at present mainly uses cavity layered structure, and box body is divided into upper layer and lower layer, and one layer For radio-frequency devices, one layer of drive control does so and needs biggish volume, cannot directly be welded in printing board surface, needs Grooving is handled on structural member, increases the volume of product, the processing charges of structural member is higher, and production technology is more complex.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of radio frequencies of surface-mount type low cost micromation high isolation Switch mainly solves the Surface Mount mode of RF switch;On the other hand meet market to want RF switch high isolation, low cost It asks.
To solve above-mentioned technical problem the technical scheme adopted by the utility model is RF switch, including the first PCB Plate, the second pcb board and shielding case;
First pcb board is Multilayer Structure, and bottom is RF switch, and top layer is driver, and middle layer is ground;
Second pcb board is the window frame structure of intermediate hollow out, and surrounding arranges pad;The pad of second pcb board and the first pcb board Pad correspond;Second pcb board is welded in the bottom of the first pcb board, and the device of the first pcb board bottom is set to the 2nd PCB In the peripheral frame of plate, and the element height of the first pcb board bottom is not higher than the height of the second pcb board;
Shielding case is welded in the top layer of the first pcb board, and the device of the first pcb board top layer is set in shielding case.
Further, the RF switch of the first pcb board bottom uses Surface Mount PIN diode, using a string liang of sides simultaneously Formula arrangement.
Further, two layers of the centre of the first pcb board is ground.
Further, the device on the first pcb board is fixed after being welded with Heraeus.
The beneficial effects of the utility model are: the pad of the pad of the second pcb board and the first pcb board corresponds, it can be compared with Easily interconnected with user's printed board.The intermediate engraved structure of second pcb board will be originally for shielding the bottom surface PCB2 device, shielding case Utility model is isolated with user's other devices, so that the utility model meets the requirement of high isolation on the whole, and the utility model In RF switch Surface Mount mode can be used make, the connection structure between the first pcb board, the second pcb board and shielding case uses Welding processing, so that production technology is more simple, small product size is smaller, and cost is lower.In summary analysis is it is found that this reality With it is novel have many advantages, such as isolation it is high, it is small in size, inexpensive, be easily installed.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is the structural schematic diagram of the first pcb board in the utility model;
Fig. 3 is the structural schematic diagram of the second pcb board in the utility model;
Marked in the figure: the first pcb board of 1-, the second pcb board of 2-, 3- shielding case.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing.
As shown in Figure 1 to Figure 3, the utility model includes the first pcb board 1, the second pcb board 2 and shielding case 3;
First pcb board 1 is Multilayer Structure, and bottom is RF switch, and top layer is driver, and middle layer is ground;
Second pcb board 2 is the window frame structure of intermediate hollow out, and surrounding arranges pad;The pad and the first PCB of second pcb board 2 The pad of plate 1 corresponds;Second pcb board 2 is welded in the bottom of the first pcb board 1, the second pcb board 2 and the first PCB plate 1 it Between can be welded together with 220 DEG C of soldering paste, the device of 1 bottom of the first pcb board is set in the peripheral frame of the second pcb board 2, and first The element height of 1 bottom of pcb board is not higher than the height of the second pcb board 2;
Shielding case 3 is welded in the top layer of the first pcb board 1, and the device of 1 top layer of the first pcb board is set in shielding case 3.
Preferably, the RF switch of 1 bottom of the first pcb board use Surface Mount PIN diode, using a string liang and by the way of cloth It sets, sufficiently increases the isolation of switch.Preferably using the Surface Mount PIN diode of M/A COM Inc.'s production in the utility model.
Sufficiently to separate RF switch and drive control circuit, two layers of the centre of the first pcb board 1 is ground.
Preferably, the device on the first pcb board 1 is fixed after being welded with Heraeus, so as not to client with user's printed board Device shifts when welding.

Claims (4)

1. RF switch, it is characterised in that: including the first pcb board (1), the second pcb board (2) and shielding case (3);
First pcb board (1) is Multilayer Structure, and bottom is RF switch, and top layer is driver, and middle layer is ground;
Second pcb board (2) is the window frame structure of intermediate hollow out, and surrounding arranges pad;The pad and the first PCB of second pcb board (2) The pad of plate (1) corresponds;Second pcb board (2) is welded in the bottom of the first pcb board (1), the device of the first pcb board (1) bottom Part is set in the peripheral frame of the second pcb board (2), and the element height of the first pcb board (1) bottom is not higher than the second pcb board (2) Highly;
Shielding case (3) is welded in the top layer of the first pcb board (1), and the device of the first pcb board (1) top layer is set in shielding case (3).
2. RF switch as described in claim 1, it is characterised in that: the RF switch of the first pcb board (1) bottom uses Surface Mount PIN diode, using a string liang and by the way of arrange.
3. RF switch as described in claim 1, it is characterised in that: two layers of the centre of the first pcb board (1) is ground.
4. the RF switch as described in any one of claims 1 to 3, it is characterised in that: the device on the first pcb board (1) It is fixed after being welded with Heraeus.
CN201820943425.XU 2018-06-19 2018-06-19 RF switch Active CN208638791U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820943425.XU CN208638791U (en) 2018-06-19 2018-06-19 RF switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820943425.XU CN208638791U (en) 2018-06-19 2018-06-19 RF switch

Publications (1)

Publication Number Publication Date
CN208638791U true CN208638791U (en) 2019-03-22

Family

ID=65734158

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820943425.XU Active CN208638791U (en) 2018-06-19 2018-06-19 RF switch

Country Status (1)

Country Link
CN (1) CN208638791U (en)

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