CN207352585U - Touch-screen and touch screen terminal - Google Patents
Touch-screen and touch screen terminal Download PDFInfo
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- CN207352585U CN207352585U CN201721271777.7U CN201721271777U CN207352585U CN 207352585 U CN207352585 U CN 207352585U CN 201721271777 U CN201721271777 U CN 201721271777U CN 207352585 U CN207352585 U CN 207352585U
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Abstract
The utility model provides a kind of touch-screen and touch screen terminal.In the touch screen structure, first electrode layer and the second electrode lay, are separately positioned on the opposite both sides of substrate；First electrode lead includes the first sub- lead and the second sub- lead, and the first sub- lead is connected with first electrode layer；Second electrode lead is connected with the second electrode lay；Touch-screen is equipped with the through hole through substrate, first electrode layer, the second electrode lay, the second sub- lead and second electrode lead, conductive material is filled with through hole, conductive material forms conductive structure, and the both ends of conductive structure, respectively with the second sub- lead and second electrode wire contacts and turning on, the first sub- lead and the second sub- lead are connected with flexible PCB.Touch-screen provided by the utility model, respectively the second sub- lead and second electrode lead positioned at substrate two sides realize electrical connection, so as to pass through a first sub- lead of FPC connections and the second sub- lead.
Description
Technical field
Touch-screen field is the utility model is related to, more specifically, is related to a kind of touch-screen and touching including the touch-screen
Touch screen terminal.
Background technology
Common film touch screen includes following several classes：GFF, GF1, GF2, GG, OGS etc., and built in the touch-control in later stage
To On-cell the and In-cell schemes of LCM.Actually above-described touch scheme structure is similar, the reality of touch controllable function
Now it is divided into two big mac functions, AA areas and line areas.AA areas are mainly responsible for perception (as shown in A in Fig. 1) and touch, and are really to anticipate
The input block of mobile phone or Pad in justice.Conduction is responsible in line areas (as shown in B in Fig. 1), and the signal transduction of perception is gone out
Analyzed for calculating.
For GF2 (DITO) scheme, in Fig. 2, touch-screen includes first electrode layer 10 ', the second electrode lay 20 ', substrate
30 ', first electrode lead 40 ', second electrode lead 50 ', flexible PCB 60 ', due to being the system of one layer of base material Double-side line
Journey, most at last circuit exported from touch-control Sensor go also will point two sides carry out.Or using two flexible PCBs (FPC) into
Row carries out hot pressing to realize using a FPC two sides.DITO divides two sides to carry out hot pressing connects, and trivial operations are, it is necessary to respectively
Carry out carrying out 2-3 hot pressing binding again after the ACF attachings of 2-3 times.Hot pressing binding technics comparing is complicated, and repeatedly binding is so that life
Producing efficiency reduces, and reduces product yield.
Utility model content
The utility model is intended at least solve one of technical problem existing in the prior art.
For this reason, the purpose of the first aspect of the utility model is to provide a kind of touch-screen.
The purpose of second aspect of the utility model is to provide a kind of touch screen terminal for including above-mentioned touch-screen.
To achieve the above object, the embodiment of the first aspect of the utility model provides a kind of touch-screen, including：Base
Plate；First electrode layer and the second electrode lay, are separately positioned on the opposite both sides of the substrate；First electrode lead, positioned at described
Side of the first electrode layer away from the substrate, including the first sub- lead and the second sub- lead, the first sub- lead with it is described
First electrode layer is connected；Second electrode lead, positioned at side of the second electrode lay away from the substrate and with described
Two electrode layers connect；And flexible PCB；Wherein, the touch-screen is equipped with through the substrate, the first electrode layer, institute
The through hole of the second electrode lay, the second sub- lead and second electrode lead is stated, conductive layer conductive material, institute are filled with the through hole
State conductive material formed conductive structure, and the both ends of the conductive structure respectively with the described second sub- lead and the second electrode
Wire contacts simultaneously turn on, and the first sub- lead and the second sub- lead are connected with the flexible PCB.
The touch-screen that the utility model above-described embodiment provides, only avoids including a FPC hot pressing connects on the same face
Need to carry out hot pressing using two FPC or on the two sides of a FPC in the prior art, so as to improve the production effect of touch-screen
Rate.In addition the first sub- lead and the second sub- lead are made in the same face of base material, are conducive to improve the precision aligned during binding.
In addition, the touch-screen that the utility model above-described embodiment provides also has following additional technical feature：
In above-mentioned technical proposal, it is preferable that the quantity of the flexible PCB is one；And/or the first sub- lead
It is connected with the described second sub- lead with the same face of the flexible PCB.
The second electrode lead of second surface is connected to first surface by the conductive structure in through hole, the
One sub- lead and the second sub- lead are electrically connected in first surface with FPC.And using a FPC can also reduce touch-screen into
This, while lifting the preparation efficiency of touch-screen, improves the precision of touch-screen.
In above-mentioned technical proposal, it is preferable that the conductive structure is at least partially disposed at the described second sub- lead away from institute
The side of substrate is stated, and at least part of cross-sectional area of the conductive structure is more than the cross-sectional area of the through hole.
Preferably, conductive material is filled in through hole using typography, and further the hole on printing screen plate is more than logical
Hole, even if being so printed with deviation, it is also possible that conductive material can completely be stuffed entirely with through hole.
In above-mentioned technical proposal, it is preferable that the conductive material is filled in described logical by typography or gluing process
In hole.
Further, conductive material can be used and is printed on one side or double face printing process is filled in through hole.
In above-mentioned technical proposal, it is preferable that the conductive material includes silver paste, graphite or carbon.
Preferably, conductive structure is silver slurry layer, graphite linings or carbon-coating.Certainly, conductive material can also be that by
Other conductive materials that two sub- leads and second electrode lead are electrically connected.
In above-mentioned technical proposal, it is preferable that the quantity of the through hole is not less than the quantity of the second electrode lead, so that
The one second electrode lead is connected by least one through hole with a second sub- lead.
The quantity of through hole can be equal with the quantity of the second sub- lead or second electrode lead, i.e. through hole and the second sub- lead
Or second electrode lead corresponds.Can also be that the quantity of through hole is more than the quantity of the second sub- lead or second electrode lead,
In this way, a second electrode lead is connected by least one through hole with one second sub- lead, at this point it is possible to increase contact surface
Product, reduce resistance, and can prevent caused touch-screen failure after a through hole failure.
In above-mentioned technical proposal, it is preferable that the substrate includes viewing area (i.e. functional areas) and rim area, the through hole position
In the rim area.
In above-mentioned technical proposal, it is preferable that the flexible PCB passes through anisotropic conductive adhesive paste and the first sub- lead
It is connected with the described second sub- lead.
Flexible PCB is by the sub- leads of ACF and first or the second sub- lead hot pressing connects, so that when the quantity of FPC is one
When a, one of hot pressing process can be saved, lifts the manufacture efficiency of touch-screen.
In above-mentioned technical proposal, it is preferable that the first electrode layer includes ITO electrode；And/or the second electrode lay
Including ITO electrode；And/or the substrate includes pet substrate, PC substrates or glass substrate.
First electrode layer or the second electrode lay can also be Metal Mesh (metal grill) conducting film.
The utility model also provides a kind of preparation method, is used to prepare the touch-screen described in any of the above-described embodiment, described
Preparation method includes：Step S10, the first conducting film and the second conducting film are made in the both sides of substrate respectively；Step S20, in institute
State and the first metal film and the second metal film are set respectively on the first conducting film and second conducting film；Step S30, setting run through
First conducting film, second conducting film, the substrate, the through hole of first metal film and second metal film；
Step S40, fills conductive material in the through hole, and the conductive material forms conductive structure；Step S50, using etching work
First conducting film, second conducting film, first metal film, second metal film etching are respectively first by skill
Electrode layer, the second electrode lay, first electrode lead, second electrode lead, the first electrode lead include the first sub- lead and
Second sub- lead, and the both ends of the conductive structure are respectively with the described second sub- lead and the second electrode wire contacts and leading
It is logical, wherein, step S40 is located at after the step S30；Alternatively, step S10, it is conductive that first is made in the both sides of substrate respectively
Film and the second conducting film；Step S20, set respectively on first conducting film and second conducting film the first metal film and
Second metal film；Step S30, using etching technics respectively by first conducting film, second conducting film, first gold medal
Category film, second metal film etching are first electrode layer, the second electrode lay, first electrode lead, second electrode lead, its
In, the first electrode lead includes the first sub- lead and the second sub- lead；Step S40, sets the through hole through the substrate,
Wherein, step S40 is located at after step S30；Step S50, fills conductive material in the through hole, and the conductive material is formed
Conductive structure, and the both ends of the conductive structure are respectively with the described second sub- lead and the second electrode wire contacts and leading
It is logical.
The embodiment of second aspect of the utility model provides a kind of preparation method, including：Splashed respectively in the both sides of substrate
One layer of first conducting film and the second conducting film are penetrated, the first metal film and second are plated respectively on the first conducting film and the second conducting film
Metal film, after having plated the first metal film and the second metal film, punching press (Punching) through hole, through hole is through the first conducting film, the
Two conducting films, substrate, the first metal film and the second metal film, after the complete through hole of punching press, using typography or gluing process logical
Conductive material is filled in hole, the conductive material forms conductive structure, after the filling for completing conductive material, using wet etching
First conducting film etching is first electrode layer by technique, is the second electrode lay by the second conducting film etching, the first metal film is carved
To lose for first electrode lead, the second metal film etching is second electrode lead, wherein, the first metal film etches the first sub- lead
With the second sub- lead, through hole corresponds to the second sub- lead and second electrode lead and sets, through the second sub- lead, first electrode layer,
Substrate, the second electrode lay, second electrode lead so that conductive structure can be with the second sub- lead and second electrode wire contacts simultaneously
Conducting.
Alternatively, the preparation method includes：Sputter one layer of first conducting film and the second conducting film respectively in the both sides of substrate,
The first metal film and the second metal film are plated respectively on first conducting film and the second conducting film, have plated the first metal film and the second metal
After film, use the technique of wet etching to etch the first conducting film for first electrode layer, be the second electricity by the second conducting film etching
Pole layer, is the first sub- lead and the second sub- lead by the first metal film etching, the second metal film etching is second electrode lead, is carved
After etching technique, the through hole through substrate is set on substrate by the way of punching press (Punching), it is preferable that through hole corresponds to the
Two sub- leads and second electrode lead are set, through the second sub- lead, first electrode layer, substrate, the second electrode lay, second electrode
Lead.After the complete through hole of punching press, conductive material is filled in through hole using typography or gluing process, completes conduction material in through hole
The filling of material, to form conductive structure, and conductive structure can be with the second sub- lead and second electrode wire contacts and turning on.
The purpose of the 3rd aspect of the utility model is to provide a kind of touch screen terminal, including any of the above-described embodiment institute
The touch-screen stated.
The touch screen terminal that the embodiment of the 3rd aspect of the utility model provides, because including described in any of the above-described embodiment
Touch-screen, thus with all beneficial effects of the touch-screen described in any of the above-described embodiment, details are not described herein.
The additional aspect and advantage of the utility model will become obvious in following description section, or new by this practicality
The practice of type is recognized.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the utility model will in the description from combination accompanying drawings below to embodiment
Become obvious and be readily appreciated that, wherein：
Fig. 1 is the structure diagram of touch-screen in correlation technique；
Fig. 2 is the structure diagram of touch-screen in correlation technique.
Wherein, the correspondence in Fig. 1 and Fig. 2 between reference numeral and component names is：
10 ' first electrode layers, 20 ' the second electrode lays, 30 ' substrates, 40 ' first electrode leads, 50 ' second electrode leads,
60 ' flexible PCBs.
Fig. 3 is the structure diagram of the touch-screen described in one embodiment of the utility model；
Fig. 4 is the enlarged structure schematic diagram in C portions in Fig. 3；
Fig. 5 is the structure after punch forming through hole in touch-screen preparation process described in one embodiment of the utility model
Schematic diagram；
Fig. 6 is to fill conductive structure in through-holes in the touch-screen preparation process described in one embodiment of the utility model
Structure diagram afterwards；
Fig. 7 is the structure diagram after being etched in the touch-screen preparation process described in one embodiment of the utility model；
Fig. 8 is the flow chart of the touch-screen preparation method described in one embodiment of the utility model；
Fig. 9 is the flow chart of the touch-screen preparation method described in another embodiment of the utility model.
Wherein, correspondences of the Fig. 3 into Fig. 7 between reference numeral and component names is：
10 substrates, 20 first electrode layers, 30 first electrode leads, 301 first sub- leads, 302 second sub- leads, 40 second
Electrode layer, 50 second electrode leads, 60 through holes, 70FPC, 80 conductive structures.
Embodiment
In order to be more clearly understood that the above-mentioned purpose of the utility model, feature and advantage, below in conjunction with the accompanying drawings and have
The utility model is further described in detail in body embodiment.It should be noted that in the case where there is no conflict, this Shen
The feature in embodiment and embodiment please can be mutually combined.
Many details are elaborated in the following description in order to fully understand the utility model, still, this practicality
It is new to be implemented using other different from mode described here, therefore, the scope of protection of the utility model and from
The limitation of following public specific embodiment.
Describe with reference to the accompanying drawings according to touch-screen of the utility model some embodiments and preparation method thereof and touch-screen
Terminal.
As shown in Fig. 3, Fig. 4 and Fig. 7, according to a kind of touch-screen of the utility model some embodiments offer, including：Substrate
10th, first electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50 and flexible PCB 70.First
Electrode layer 20 and the second electrode lay 40 are separately positioned on the opposite both sides of substrate 10；First electrode lead 30 is located at first electrode layer
Side away from the substrate, including the first sub- 301 and second sub- lead 302 of lead, the first sub- lead 301 and first electrode layer
20 are connected；Second electrode lead 50 is located at side of the second electrode lay away from substrate and is connected with the second electrode lay 40；Wherein,
Substrate 10 is equipped with the through hole 60 through substrate 10, and conductive material is filled with through hole 60, and conductive material forms conductive structure 80,
And the both ends of conductive structure 80 contact and turn on the second sub- lead 302 and second electrode lead 50 respectively；Flexible PCB 70
It is connected with the first sub- 301 and second sub- lead 302 of lead.
The touch-screen that the utility model above-described embodiment provides, substrate 10 include first surface and opposite with first surface set
The second surface put, first electrode layer 20 are set on the first surface, and the second electrode lay 40 is set on a second surface, preferably
Ground, first electrode layer 20 and the second electrode lay 40 are capacitance electrode, i.e., touch-screen includes substrate 10 and is arranged on 10 liang of substrate
The capacitance electrode of side, first electrode layer 20 and the second electrode lay 40 include electrode pattern, and form the sensor of touch-screen, pass through
Capacitance is produced positioned at the first electrode layer 20 on substrate two sides and 40 mutual induction of the second electrode lay, finger, which touches, can change capacitance
Value, by detect knots modification can detected touch point position, and first electrode layer and the second electrode lay draw with first electrode respectively
Line 30 is connected with second electrode lead 50, and first electrode lead 30 includes the first sub- 301 and second sub- lead 302 of lead, the
One sub- lead 301 is connected with first electrode layer, and the second sub- lead 302 is connected by conductive structure 80 with second electrode lead 50
Connect, since the first sub- 301 and second sub- lead 302 of lead of first electrode lead 30 is by made from first procedure second
Contact conductor 50 is worked it out at twice by first procedure, i.e. first electrode lead 30 and second electrode lead 50,
Cannot once it make at the same time, so the site error between first electrode lead 30 and second electrode lead 50 is very big, and first
Sub- 301 and second sub- lead 302 of lead is worked it out by first procedure, so the first sub- 301 and second sub- lead of lead
302 positional precision is high.Substrate 10, which is equipped with along the direction of first electrode layer 20, substrate 10, the second electrode lay 40, runs through substrate
10 through hole 60 (in such as Fig. 7, through hole runs through substrate along the vertical direction), filling conductive material in through hole, conductive material formed to
Small part is located at the conductive structure in through hole, and the second sub- lead 302 is connected with second electrode lead 50 by conductive structure 80
Connect, then the second sub- lead 302 is connected on flexible PCB 70 (FPC 70), realize second electrode lead 50 and FPC 70
Connection, and then realize the connection of the second electrode lay 40 and FPC 70, wherein, first electrode layer 20 passes through the first sub- lead
301 are connected with FPC 70, so as to improve the precision that first electrode lead 30 and second electrode lead 50 are connected with FPC 70.
Wherein, the first sub- 301 and second sub- lead 302 of lead passes through the connections of FPC 70 IC.
In addition it should be noted that the contact conductor of the utility model is the electrode layer material and metal layer by electrically conducting transparent
It is partly to make that the double-decker that material etches form, i.e. electrode layer also have in addition to including the touch control electrode layer as touch controllable function
For lead, it is positioned at first electrode lead 30, second electrode that specific first electrode layer 20, the second electrode lay 40, which have part,
The lower floor of lead 50.
As shown in figure 3, AA areas be mainly responsible for (as shown in E in Fig. 3) perception touch, be truly mobile phone or
The input block of Pad.Conduction is responsible in line areas (as shown in D in Fig. 3), and the signal transduction of perception is gone out for calculating analysis.
First electrode lead and second electrode lead can be copper lead or silver paste lead etc..
Preferably, as shown in Figure 3 and Figure 4, the quantity of flexible PCB 70 is one.
Preferably, the first sub- 301 and second sub- lead 302 of lead is connected with the same face of flexible PCB 70.
Since the second sub- lead 302 is connected with second electrode lead 50 by the conductive structure 80 in through hole 60 so that
Touch-screen can include a FPC 70, and first electrode lead 30 and 50 hot pressing connects of second electrode lead are in flexible PCB
On 70 the same face, avoiding needs to carry out hot pressing on 70 two sides of flexible PCB in the prior art, so as to improve touch-screen
Production efficiency.
The second electrode lead 50 of second surface is connected to first surface, the first son by the conductive structure in through hole 60
301 and second sub- lead 302 of lead is electrically connected in first surface with FPC 70.And touch can also be reduced using a FPC 70
The cost of screen, while lifting the preparation efficiency of touch-screen, improves the precision of touch-screen.
Preferably, conductive structure 80 is at least partially disposed at the second sub- side of the lead 302 away from substrate 10, and conductive knot
At least part of cross-sectional area of structure 80 is more than the cross-sectional area of through hole 60, as shown in fig. 7, the upper end of conductive structure is higher than second
Sub- lead, and the cross-sectional area of the upper end of conductive structure is more than the cross-sectional area of through hole.
Preferably, conductive material is filled in through hole 60 using typography, and further the hole on printing screen plate is more than
Through hole 60, even if being so printed with deviation, it is also possible that conductive material can completely be stuffed entirely with through hole 60.
Preferably, conductive material is filled in through hole 60 by typography or gluing process.
Further, conductive material can be used and is printed on one side or double face printing process is filled in through hole 60.
Preferably, conductive material includes silver paste, graphite or carbon.
Preferably, conductive structure is silver slurry layer, graphite linings or carbon-coating, and when conductive structure is silver slurry layer, conductive structure exists
Filling in through hole forms silver paste grouting.Certainly, conductive material can also be that by the second sub- lead 302 and second electrode
Other conductive materials that lead 50 is electrically connected.
Preferably, the quantity of through hole 60 is not less than the quantity of second electrode lead 50, so that a second electrode lead 50 is logical
At least one through hole 60 is crossed with one second sub- lead 302 to be connected.
The quantity of through hole 60 can be equal with the quantity of the second sub- lead 302 or second electrode lead 50, i.e., through hole 60 with
Second sub- lead 302 or second electrode lead 50 corresponds.Can also be through hole 60 quantity be more than the second sub- lead 302 or
The quantity of second electrode lead 50, in this way, a second electrode lead 50 passes through at least one 60 and 1 second sub- lead of through hole
302 are connected, at this point it is possible to increase contact area, reduce resistance, and can prevent caused touch after a failure of through hole 60
Screen failure.As shown in figure 4, touch-screen includes the multiple second sub- metal lead wires and second electrode lead, and the number of the second sub- lead
Amount is equal with the quantity of second electrode lead.
Preferably, substrate 10 includes viewing area (i.e. functional areas) and rim area, and through hole 60 is located at rim area.
Preferably, flexible PCB 70 passes through anisotropic conductive adhesive paste (ACF) and the first sub- 301 and second sub- lead of lead
302 are connected.
FPC is by sub- 302 hot pressing connects of lead of the sub- leads 301 and second of ACF and first, so that when the quantity of FPC 70 is
At one, one of hot pressing process can be saved, lifts the manufacture efficiency of touch-screen.
Preferably, first electrode layer 20 includes ITO electrode；And/or the second electrode lay 40 includes ITO electrode；And/or base
Plate 10 includes pet substrate 10, PC substrates 10 or glass substrate 10.
First electrode layer 20 or the second electrode lay 40 can also be Metal Mesh (metal grill) conducting film.
The purpose of the aspect of the utility model second is to provide a kind of preparation method, is used to prepare any of the above-described embodiment
Touch-screen.
As shown in figure 8, in a specific embodiment, which includes：
Step S10, the first conducting film and the second conducting film are made in the both sides of substrate 10 respectively；
Step S20, the first metal film and the second metal film are set on the first conducting film and the second conducting film respectively；
Step S30, is set through the first conducting film, the second conducting film, substrate 10, the first metal film and the second metal film
Through hole 60, as shown in Figure 5；
Step S40, the filling conductive material in through hole 60, the conductive material form conductive structure 80, as shown in Figure 6；
Step S50, using etching technics respectively by the first conducting film, the second conducting film, the first metal film, the second metal film
Etch as first electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50, first electrode lead 30
Including the first sub- 301 and second sub- lead 302 of lead, and the both ends of conductive structure 80 respectively with the second sub- lead 302 and second
Contact conductor 50 is contacted and turned on, wherein, step S50 is located at after step S340.
The embodiment of second aspect of the utility model provides a kind of preparation method, including：Distinguish in the both sides of substrate 10
One layer of first conducting film and the second conducting film are sputtered, plates the first metal film and the respectively on the first conducting film and the second conducting film
Two metal films, after having plated the first metal film and the second metal film, punching press (Punching) through hole 60, through hole 60 is through the first conduction
Film, the second conducting film, substrate 10, the first metal film and the second metal film, after the complete through hole 60 of punching press, using typography or dispensing
Technique filling conductive material in through hole 60, conductive material form conductive structure 80, and after the filling for completing conductive material, use is wet
First conducting film etching is first electrode layer 20 by the technique of method etching, is the second electrode lay 40 by the second conducting film etching, will
First metal film etching is first electrode lead 30, and the second metal film etching is second electrode lead 50, wherein, the first metal film
The first sub- 301 and second sub- lead 302 of lead is etched, through hole 60 corresponds to the second sub- lead 302 and second electrode lead 50 and sets
Put, through the second sub- lead 302, first electrode layer 20, substrate 10, the second electrode lay 40, second electrode lead 50 so that conductive
Structure 80 can contact and turn on the second sub- lead 302 and second electrode lead 50.
As shown in figure 9, in second specifically embodiment, which includes：
Step S10, the first conducting film and the second conducting film are made in the both sides of substrate 10 respectively；
Step S20, the first metal film and the second metal film are set on the first conducting film and the second conducting film respectively；
Step S30, using etching technics respectively by the first conducting film, the second conducting film, the first metal film, the second metal film
Etch as first electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50, wherein, first electrode is drawn
Line 30 includes the first sub- 301 and second sub- lead 302 of lead；
Step S40, sets the through hole 60 through substrate 10, wherein, step S40 is located at after step S30；
Step S50, the filling conductive material in through hole 60, conductive material formation conductive structure 80, and conductive structure 80
Both ends contact and turn on the second sub- lead 302 and second electrode lead 50 respectively.
The preparation method includes：One layer of first conducting film and the second conducting film are sputtered respectively in the both sides of substrate 10,
The first metal film and the second metal film are plated respectively on one conducting film and the second conducting film, have plated the first metal film and the second metal film
Afterwards, use the technique of wet etching to etch the first conducting film for first electrode layer 20, be the second electricity by the second conducting film etching
Pole layer 40, is the first sub- 301 and second sub- lead 302 of lead by the first metal film etching, and the second metal film etching is the second electricity
Pole lead 50, after etching technics, sets the through hole 60 through substrate 10 on the substrate 10 by the way of punching press (Punching),
Preferably, through hole 60 corresponds to the second sub- lead 302 and second electrode lead 50 and sets, through the second sub- lead 302, first electrode
Layer 20, substrate 10, the second electrode lay 40, second electrode lead 50.After the complete through hole 60 of punching press, using typography or gluing process
The filling conductive material in through hole 60, completes the filling of conductive material in through hole 60, to form conductive structure, and conductive structure 80
It can contact and turn on the second sub- lead 302 and second electrode lead 50.
In addition it should be noted that first, second contact conductor of the utility model be by conducting film and metal film etching and
Into double-decker.
The purpose of the aspect of the utility model the 3rd is to provide a kind of touch screen terminal, including any of the above-described embodiment
Touch-screen.
The touch screen terminal that the embodiment of the 3rd aspect of the utility model provides, because of touching including any of the above-described embodiment
Screen, thus all beneficial effects of the touch-screen with any of the above-described embodiment are touched, details are not described herein.
In conclusion the touch-screen that the utility model embodiment provides, respectively positioned at the second sub- lead on 10 two sides of substrate
302 and second electrode lead 50 realize electrical connection, so as to pass through the connection first electrodes of FPC 70 lead 30 and
Two contact conductors 50.
In the description of the utility model, unless otherwise clearly defined and limited, term " multiple " refers to two or two
More than a；Unless otherwise prescribed or illustrate, term " connection ", " fixation " etc. should all be interpreted broadly, for example, " connection " can be
It is fixedly connected or is detachably connected, or be integrally connected, or is electrically connected；It can be directly connected, can also be in
Between medium be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood at this as the case may be
Concrete meaning in utility model.
In the description of this specification, it is to be understood that the instruction such as term " on ", " under ", "front", "rear", "left", "right"
Orientation or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description the utility model and letter
Change description, rather than instruction or imply signified device or unit must have specific direction, with specific azimuth configuration and
Operation, it is thus impossible to be interpreted as the limitation to the utility model.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that combining the particular features, structures, materials, or characteristics that the embodiment or example describe is contained at least the one of the utility model
In a embodiment or example.In the present specification, schematic expression of the above terms is not necessarily referring to identical embodiment
Or example.Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more embodiments or example
In combine in an appropriate manner.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the present invention, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on, should be included within the scope of protection of this utility model.
Claims (9)
- A kind of 1. touch-screen, it is characterised in that including：Substrate；First electrode layer and the second electrode lay, are separately positioned on the opposite both sides of the substrate；First electrode lead, positioned at side of the first electrode layer away from the substrate, including the first sub- lead and the second son Lead, the first sub- lead are connected with the first electrode layer；Second electrode lead, is connected positioned at side of the second electrode lay away from the substrate and with the second electrode lay； WithFlexible PCB；Wherein, the touch-screen is equipped with through the substrate, the first electrode layer, the second electrode lay, described second The through hole of sub- lead and the second electrode lead, the through hole is interior to be filled with conductive material, and the conductive material forms conduction Structure, and the both ends of the conductive structure are respectively with the described second sub- lead and the second electrode wire contacts and turning on, institute State the first sub- lead and the second sub- lead is connected with the flexible PCB.
- 2. touch-screen according to claim 1, it is characterised in thatThe quantity of the flexible PCB is one；And/orThe first sub- lead and the second sub- lead are connected with the same face of the flexible PCB.
- 3. touch-screen according to claim 1, it is characterised in thatThe conductive structure is at least partially disposed at the described second side of the sub- lead away from the substrate, and the conductive structure At least part of cross-sectional area be more than the through hole cross-sectional area.
- 4. touch-screen according to claim 1, it is characterised in thatThe conductive material is filled in the through hole by typography or gluing process.
- 5. touch-screen according to claim 1, it is characterised in thatThe conductive material includes silver paste, graphite or carbon.
- 6. touch-screen according to any one of claim 1 to 5, it is characterised in thatThe quantity of the through hole is not less than the quantity of the second electrode lead, so that a second electrode lead passes through at least One through hole is connected with a second sub- lead.
- 7. touch-screen according to any one of claim 1 to 5, it is characterised in thatThe substrate includes viewing area and rim area, and the through hole is located at the rim area.
- 8. touch-screen according to any one of claim 1 to 5, it is characterised in thatThe flexible PCB is connected by anisotropic conductive adhesive paste with the described first sub- lead with the described second sub- lead.
- 9. a kind of touch screen terminal, it is characterised in that including touch-screen such as described in any item of the claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721271777.7U CN207352585U (en) | 2017-09-29 | 2017-09-29 | Touch-screen and touch screen terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721271777.7U CN207352585U (en) | 2017-09-29 | 2017-09-29 | Touch-screen and touch screen terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207352585U true CN207352585U (en) | 2018-05-11 |
Family
ID=62357963
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721271777.7U Expired - Fee Related CN207352585U (en) | 2017-09-29 | 2017-09-29 | Touch-screen and touch screen terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207352585U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343748A (en) * | 2018-12-20 | 2019-02-15 | 盈天实业(深圳)有限公司 | Flexible touch sensor and preparation method thereof |
-
2017
- 2017-09-29 CN CN201721271777.7U patent/CN207352585U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343748A (en) * | 2018-12-20 | 2019-02-15 | 盈天实业(深圳)有限公司 | Flexible touch sensor and preparation method thereof |
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Granted publication date: 20180511 |