CN208622909U - A kind of structure of the Ceramic Dielectric Filter with pcb board - Google Patents
A kind of structure of the Ceramic Dielectric Filter with pcb board Download PDFInfo
- Publication number
- CN208622909U CN208622909U CN201821560340.XU CN201821560340U CN208622909U CN 208622909 U CN208622909 U CN 208622909U CN 201821560340 U CN201821560340 U CN 201821560340U CN 208622909 U CN208622909 U CN 208622909U
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- China
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- pcb board
- ceramic
- dielectric filter
- ceramic dielectric
- ceramic matrix
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Abstract
The utility model provides a kind of structure of Ceramic Dielectric Filter with pcb board, its is simple and reasonable, can to avoid pcb board in existing assembling mode and ceramics full welding face contact bring stress variation it is excessive caused by ceramics cracking phenomena, enhance reliability, extend the service life of filter, including pcb board and ceramic matrix, the ceramic matrix is arranged on the pcb board, it is connected between the pcb board and the ceramic matrix by soldering, it is characterised in that: be provided with gasket between the pcb board and the ceramic matrix.
Description
Technical field
The utility model relates to Ceramic Dielectric Filter technical field, specially a kind of ceramic dielectric filtering with pcb board
The structure of device.
Background technique
Assembled TEM mould ceramic filter, such as the assembled ceramic dielectric filtering for referring to assembling and having pcb board or screening cover
Device, as shown in Figure 1, ceramic component and pcb board directly use the mode of tin even, ceramic matrix and pcb board spacing are smaller, fitting
Closer, the stress that when temperature change is subject to is larger, and in awful weather, the biggish region service life of the temperature difference is short, ceramic cracking
Phenomena such as always exist and occurrence frequency is higher, since pcb board and ceramic filter are to belong to two kinds of materials, thermal expansion coefficient
Difference, stress intensity is different in temperature change, be easy to cause ceramic cracking, loses performance.
Utility model content
In view of the above-mentioned problems, the utility model provides a kind of structure of Ceramic Dielectric Filter with pcb board, structure
Advantages of simple, can be excessive to avoid the full welding face contact bring stress variation of pcb board in existing assembling mode and ceramics
Caused by ceramics cracking phenomena, enhance reliability, extend the service life of filter.
Its technical solution is such that a kind of structure of Ceramic Dielectric Filter with pcb board, including pcb board and ceramics
Matrix, the ceramic matrix are arranged on the pcb board, are connected between the pcb board and the ceramic matrix by soldering,
It is characterized in that: being provided with gasket between the pcb board and the ceramic matrix.
Further, thermal expansion coefficient of the thermal expansion coefficient of the gasket close to the pcb board.
Further, it is connected between the pcb board and the ceramic matrix by evenly distributed tin welding spot.
Further, the gasket with a thickness of 0.25mm-0.5mm.
Further, the gasket is copper sheet.
Further, the surface of the gasket is silver coated.
Further, the gasket is at least provided with three.
The advantages of structure of the Ceramic Dielectric Filter with pcb board of the utility model, is: by pcb board and ceramic base
Several gaskets are set as transitioning component, the thermal expansion coefficient of gasket uniformly divides close to the thermal expansion coefficient of pcb board between body
The gasket welding of cloth guarantees the balance of ceramic matrix, so that welding contact area welding gap is become larger, reduces fit area, Ke Yibao
The tension intensity between device is demonstrate,proved, the stress that when temperature change is subject to each other substantially reduces, and can satisfy more harsh temperature
Environment excessive can cause to avoid the full welding face contact bring stress variation of pcb board in existing assembling mode and ceramics
Ceramic cracking phenomena, enhance reliability, extend the service life of filter.
Detailed description of the invention
Fig. 1 is the vertical face schematic diagram of existing Ceramic Dielectric Filter；
Fig. 2 is the diagrammatic cross-section of the structure of the Ceramic Dielectric Filter with pcb board of the utility model；
Fig. 3 is the PCB welding region schematic diagram of the structure of the Ceramic Dielectric Filter with pcb board of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
See Fig. 2, Fig. 3, a kind of structure of Ceramic Dielectric Filter with pcb board of the utility model, including 1 He of pcb board
Ceramic matrix 2, ceramic matrix 2 are arranged on pcb board 1, pass through evenly distributed tin welding spot 3 between pcb board 1 and ceramic matrix 2
Connection, is provided with gasket 4 between pcb board 1 and ceramic matrix 2, in the present embodiment, gasket 4 is sheffield plate, the heat of gasket 4
Thermal expansion coefficient of the coefficient of expansion close to pcb board 1, visible 4 gaskets 4 in Fig. 3, in the present embodiment, the gasket of use
With a thickness of 0.3mm.
The advantages of structure of the Ceramic Dielectric Filter with pcb board of the utility model, is: by pcb board and ceramic base
Several gaskets are set as transitioning component, the thermal expansion coefficient of gasket uniformly divides close to the thermal expansion coefficient of pcb board between body
The gasket welding of cloth guarantees the balance of ceramic matrix, so that welding contact area welding gap is become larger, reduces fit area, Ke Yibao
The tension intensity between device is demonstrate,proved, the stress that when temperature change is subject to each other substantially reduces, and can satisfy more harsh temperature
Environment excessive can cause to avoid the full welding face contact bring stress variation of pcb board in existing assembling mode and ceramics
Ceramic cracking phenomena, enhance reliability, extend the service life of filter.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of structure of the Ceramic Dielectric Filter with pcb board, including pcb board and ceramic matrix, the ceramic matrix setting
On the pcb board, between the pcb board and the ceramic matrix pass through soldering connect, it is characterised in that: the pcb board and
Gasket is provided between the ceramic matrix.
2. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 1, it is characterised in that: the pad
Thermal expansion coefficient of the thermal expansion coefficient of piece close to the pcb board.
3. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 1, it is characterised in that: the PCB
It is connected between plate and the ceramic matrix by evenly distributed tin welding spot.
4. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 1, it is characterised in that: the pad
Piece with a thickness of 0.25mm-0.5mm.
5. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 1, it is characterised in that: the pad
Piece is copper sheet.
6. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 5, it is characterised in that: the pad
The surface of piece is silver coated.
7. a kind of structure of Ceramic Dielectric Filter with pcb board according to claim 1, it is characterised in that: the pad
Piece is at least provided with three.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821560340.XU CN208622909U (en) | 2018-09-25 | 2018-09-25 | A kind of structure of the Ceramic Dielectric Filter with pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821560340.XU CN208622909U (en) | 2018-09-25 | 2018-09-25 | A kind of structure of the Ceramic Dielectric Filter with pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208622909U true CN208622909U (en) | 2019-03-19 |
Family
ID=65717505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821560340.XU Active CN208622909U (en) | 2018-09-25 | 2018-09-25 | A kind of structure of the Ceramic Dielectric Filter with pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208622909U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111048874A (en) * | 2019-12-11 | 2020-04-21 | 深圳市华臻科技有限公司 | Dielectric filter and method for manufacturing the same |
| CN111465182A (en) * | 2020-03-26 | 2020-07-28 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
| WO2021190241A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳顺络电子股份有限公司 | Ceramic filter having cte compensation function |
| WO2021244076A1 (en) * | 2020-06-04 | 2021-12-09 | 深圳顺络电子股份有限公司 | Ceramic dielectric filter |
| WO2022036700A1 (en) * | 2020-08-21 | 2022-02-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Filter unit and radio node |
| CN115940875A (en) * | 2022-11-24 | 2023-04-07 | 台晶(重庆)电子有限公司 | Temperature induction type quartz crystal resonator |
-
2018
- 2018-09-25 CN CN201821560340.XU patent/CN208622909U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111048874A (en) * | 2019-12-11 | 2020-04-21 | 深圳市华臻科技有限公司 | Dielectric filter and method for manufacturing the same |
| CN111465182A (en) * | 2020-03-26 | 2020-07-28 | 重庆思睿创瓷电科技有限公司 | Filter assembling method |
| WO2021190241A1 (en) * | 2020-03-27 | 2021-09-30 | 深圳顺络电子股份有限公司 | Ceramic filter having cte compensation function |
| WO2021244076A1 (en) * | 2020-06-04 | 2021-12-09 | 深圳顺络电子股份有限公司 | Ceramic dielectric filter |
| WO2022036700A1 (en) * | 2020-08-21 | 2022-02-24 | Telefonaktiebolaget Lm Ericsson (Publ) | Filter unit and radio node |
| CN115940875A (en) * | 2022-11-24 | 2023-04-07 | 台晶(重庆)电子有限公司 | Temperature induction type quartz crystal resonator |
| CN115940875B (en) * | 2022-11-24 | 2023-06-09 | 台晶(重庆)电子有限公司 | Temperature-sensing quartz crystal resonator |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215129 14 Environmental Protection Industrial Park No. 369 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Patentee after: SUZHOU RF TOP ELECTRONIC COMMUNICATIONS Co.,Ltd. Address before: 215129 14 Environmental Protection Industrial Park No. 369 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Patentee before: SUZHOU RF TOP ELECTRONIC COMMUNICATION Co.,Ltd. |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 215000 No.65, Chengji Road, Hushuguan Town, high tech Zone, Suzhou City, Jiangsu Province Patentee after: SUZHOU RF TOP ELECTRONIC COMMUNICATIONS Co.,Ltd. Address before: 215129 14 Environmental Protection Industrial Park No. 369 Lushan Road, Suzhou High-tech Zone, Jiangsu Province Patentee before: SUZHOU RF TOP ELECTRONIC COMMUNICATIONS Co.,Ltd. |