CN208609318U - Lower air-supply data center micromodule structure - Google Patents
Lower air-supply data center micromodule structure Download PDFInfo
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- CN208609318U CN208609318U CN201821086131.6U CN201821086131U CN208609318U CN 208609318 U CN208609318 U CN 208609318U CN 201821086131 U CN201821086131 U CN 201821086131U CN 208609318 U CN208609318 U CN 208609318U
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Abstract
The utility model provides air-supply data center's micromodule structure under one kind, comprising: at least one set of stack of cabinets, inside static pressure case, several channel-type back door structures, raised flooring and several cooling backboards.The utility model can meet the needs of blowing in computer room under general floorings while adding more high fever density servers, it is cooled down by introducing the hot-air that cabinet is discharged in cooling backboard, the energy consumption for eliminating air conditioning terminal blower improves the radiating efficiency of cabinet, and saves computer room space.
Description
Technical field
The utility model relates to data center's technical fields, more particularly to data center's micromodule knot of blowing under one kind
Structure.
Background technique
With the rise for the generation information technology that artificial intelligence, big data and cloud computing are representative, data center's industry
Development be faced with unprecedented challenge.On the one hand the type and quantity that network application is increasingly rich bring magnanimity number
According to, while also more and higher requirement is proposed to this Internet infrastructure of data center.The rise of AI concept and
The landing of AI application is so that industry is increasing for the demand of supercomputing, compared to the GPU accelerometer that traditional CPU has more advantage
The deployment scale of server in the data center is calculated by sustainable growth, and the thermal energy that GPU accelerates calculation server to generate is tradition
The several times of CPU, to adapt to the development of future AI, the heat dissipation technology of data center must be changed.
However, being still deployed with a large amount of original low-heat density server cabinets in current data center, traditional machine is used
Room air-conditioning radiates.The heat that newly deployed high fever density server cabinet is discharged is much larger than original low-heat density service
Device cabinet can not continue to use low cooling capacity heat dissipation equipment as air conditioner in machine room and radiate.In addition, newly deployed high heat density
The high heat that server cabinet is discharged can also destroy the original airflow circuit of data center, and then influence data center
Integral heat sink effect.
Therefore, for the application demand of the data center of the close server cabinet of integrated high fever, it is necessary to propose a kind of new
Lower air-supply data center micromodule structure, to solve the above problems.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of new lower air-supply data
Center micromodule structure, for solving the problems, such as that available data center can not solve the close server machine cabinet heat radiation of high fever.
To achieve the above object and other related purposes, the utility model provide air-supply data center's micromodule knot under one kind
Structure characterized by comprising
At least one set of stack of cabinets, stack of cabinets described in one group include two-row spacing arrangement cabinet, the cabinet be equipped with
The outlet air surface and air intake surface being connected inside it, the outlet air surface and the air intake surface are respectively arranged at the two of the stack of cabinets pair
Side；The air intake surface of two cabinets is adjoining in the stack of cabinets；
Inside static pressure case is set between two rows of cabinets, is connected with the air intake surface of the cabinet；
Several channel-type back door structures are respectively arranged at the outside of the outlet air surface of each cabinet；The channel
The inner hollow of formula back door structure, bottom are equipped with the first air outlet being connected with inside it, and side is equipped with its internal and institute
State the first air inlet that interior of equipment cabinet is connected；
Raised flooring, aerial be set on substrate form overhead space between the substrate；The raised flooring position
In the stack of cabinets, the lower section of the inside static pressure case and the channel-type back door structure；The raised flooring is equipped with and institute
The second air inlet and the second air outlet that overhead space is connected are stated, second air outlet is located under the inside static pressure case
Side, second air inlet is located at the lower section of first air outlet, and is connected with first air outlet；
Several cooling backboards, are respectively arranged on the outlet air surface of each cabinet.
As a kind of preferred embodiment of the utility model, the lower air-supply data center micromodule structure further includes wind-warm syndrome out
Sensor is spent, the leaving air temp sensor is located in the channel-type back door structure.
As a kind of preferred embodiment of the utility model, the leaving air temp sensor is located at first air outlet.
As a kind of preferred embodiment of the utility model, the lower air-supply data center micromodule structure further includes air inlet temperature
Sensor is spent, the inlet air temperature sensor is located in the inside static pressure case.
As a kind of preferred embodiment of the utility model, the raised flooring includes that surface is provided with several be intervally arranged
The through-hole floor of through-hole goes out positioned at the through-hole in the stack of cabinets between the air intake surface of two cabinets as described second
Air port, the through-hole positioned at the lower section of first air outlet is as second air inlet.
As a kind of preferred embodiment of the utility model, if the raised flooring include surface be provided with several through-holes and
The through-hole floor of dry ventilation opening；Several described ventilation openings be located at two cabinets in the stack of cabinets air intake surface it
Between and first air outlet lower section, and be located at the stack of cabinets in two cabinets air intake surface between the ventilation opening
As second air outlet, the ventilation opening positioned at the lower section of first air outlet is as second air inlet；Institute
State the periphery that through-hole is located at several ventilation openings.
As a kind of preferred embodiment of the utility model, the cooling backboard is water cooling backboard or air-cooled backboard.
As a kind of preferred embodiment of the utility model, equipped with freezing water coil inside the water cooling backboard.
As a kind of preferred embodiment of the utility model, the width of the channel-type back door structure and the width of the cabinet
It is equal.
As a kind of preferred embodiment of the utility model, the channel-type back door structure is detachably connected with the cabinet.
As a kind of preferred embodiment of the utility model, glue is equipped between the channel-type back door structure and the cabinet
Pad.
As a kind of preferred embodiment of the utility model, the top of the channel-type back door structure is arc guide surface.
As a kind of preferred embodiment of the utility model, the width of the width of the cooling backboard and the cabinet outlet air surface
It is equal, and the height of the cooling backboard is equal with the height of the cabinet outlet air surface.
As a kind of preferred embodiment of the utility model, the width of the width of the cabinet outlet air surface and the inside static pressure case
It spends identical.
As a kind of preferred embodiment of the utility model, the depth of the inside static pressure case is not less than the depth of the cabinet
Twice；The height of the inside static pressure case is not less than cabinet height；The inside static pressure case is rectangular parallelepiped structure.
As a kind of preferred embodiment of the utility model, the inside static pressure case is equipped with the maintenance being connected with inside it
Door.
As described above, the utility model provides air-supply data center's micromodule structure under one kind, have the advantages that
The utility model can meet pressure fan under general floorings by introducing data center's micromodule structure of blowing under one kind
The demand of more high fever density servers is added in room simultaneously.The hot-air that cabinet is discharged is carried out by using cooling backboard cold
But, the energy consumption for eliminating air conditioning terminal blower improves the radiating efficiency of cabinet, and saves computer room space.
Detailed description of the invention
Fig. 1 is shown as the top view of provide in the utility model embodiment one one group of stack of cabinets.
Fig. 2 is shown as data center's micromodule of the several groups stack of cabinets provided in the utility model embodiment one composition
Top view.
Fig. 3 is shown as the structural representation of the lower air-supply data center micromodule structure provided in the utility model embodiment one
Figure.
The cross section that Fig. 4 is shown as the lower air-supply data center micromodule structure provided in the utility model embodiment one shows
It is intended to.
Fig. 5 is shown as the top view on the through-hole floor with through-hole provided in the utility model embodiment one.
Fig. 6 is shown as the vertical view on the through-hole floor with ventilation opening and through-hole provided in the utility model embodiment one
Figure.
Fig. 7 is shown as the structural representation of the lower air-supply data center micromodule structure provided in the utility model embodiment two
Figure.
Fig. 8 is shown as the structural representation of the lower air-supply data center micromodule structure provided in the utility model embodiment three
Figure.
The cross section that Fig. 9 is shown as the lower air-supply data center micromodule structure provided in the utility model embodiment three shows
It is intended to.
Component label instructions
11 cabinets
12 air intake surfaces
13 outlet air surfaces
14 raised floorings
140 through-hole floors
141 through-holes
142 ventilation openings
15 substrates
16 inside static pressure casees
17 channel-type back door structures
18 cooling backboards
19 maintenance door
The width of the cooling backboard of D1
The width of D2 channel-type back door structure
The height of H1 cabinet outlet air surface
The height of H2 inside static pressure case
The depth of W1 inside static pressure case
The depth of W2 cabinet
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands the further advantage and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.
Fig. 1 is please referred to Fig. 9.It should be noted that diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of utility model, though it is only shown with related component in the utility model rather than when according to actual implementation in diagram
Component count, shape and size are drawn, when actual implementation form, quantity and the ratio of each component can arbitrarily change for one kind
Become, and its assembly layout form may also be increasingly complex.
Embodiment one
As shown in Figures 1 to 6, the utility model provides air-supply data center's micromodule structure under one kind, comprising:
At least one set of stack of cabinets 10, stack of cabinets 10 described in one group include the cabinet 11 of two-row spacing arrangement, the cabinet 11
It is equipped with the air intake surface 12 and outlet air surface 13 being connected with inside it, the air intake surface 12 is respectively arranged at the outlet air surface 13
The opposite two sides of the cabinet 11；The air intake surface 12 of two cabinets 11 is adjoining in the stack of cabinets 10；
Inside static pressure case 16 is set between two rows of cabinets 11, is connected with the air intake surface of the cabinet 11；
Several channel-type back door structures 17 are respectively arranged at the outside of the outlet air surface 13 of each cabinet 11；Institute
The inner hollow of channel-type back door structure 17 is stated, bottom is equipped with the first air outlet being connected with inside it, and side is equipped with it
It is internal with the first air inlet being connected inside the cabinet 11；
Raised flooring 14, aerial be set on substrate 15 form overhead space between the substrate 15；It is described aerial
Floor 14 be located at the stack of cabinets 10, the lower section of the inside static pressure case 16 and the channel-type back door structure 17；It is described aerial
Floor 14 is equipped with the second air inlet and the second air outlet being connected with the overhead space, and second air outlet is located at institute
State the lower section of inside static pressure case 16, second air inlet is located at the lower section of first air outlet, and with first outlet air
Mouth is connected；
Several cooling backboards 18, are respectively arranged on the air intake surface 12 of each cabinet 11.
As shown in Figure 1, being the top view of one group of stack of cabinets 10, stack of cabinets 10 described in one group is by a pair of of cabinet 11 in interval row
Cloth is constituted, and the cabinet 11 is equipped with the air intake surface 12 and outlet air surface 13 being connected with its inner space, wherein the air intake surface
12 are located in one side adjoining between a pair of cabinet 11, and the outlet air surface 13 is located at opposite with the air intake surface 12
The other side.Adjoining air intake surface 12 for referring to two cabinets 11 of the air intake surface 12 of two cabinets 11 in the stack of cabinets 10
The opposite two sides of the inside static pressure case 16 between two cabinets 11.Each cabinet 11 is respectively arranged with correspondence
Channel-type back door structure 17, the channel-type back door structure 17 is located at the outside of the outlet air surface 13 of the cabinet 11.Often
A cabinet 11 is also respectively provided with corresponding cooling backboard 18, on the air intake surface 12 of the cabinet 11.Two
Inside static pressure case 16 is provided between the air intake surface 12 of a cabinet 11.
As shown in Fig. 2, being the top view for the data center's micromodule being made of several groups stack of cabinets 10, by five groups of stack of cabinets
10 arrange along A direction shown in arrow.Each cabinet 11 is respectively arranged with corresponding channel-type back door structure 17, described logical
Road formula back door structure 17 is located at the outside of the outlet air surface 13 of the cabinet 11.The cabinet 11 divides each of on each row
It is not provided with corresponding cooling backboard 18, on the outlet air surface 13 of each cabinet 11.In two rows of cabinets 11
The air intake surface 12 between be provided with inside static pressure case 16.The width D 1 of the cooling backboard 18 and the cabinet outlet air surface
13 width is equal.The width D 2 of the channel-type back door structure 17 is equal with the width of the cabinet 11.
Fig. 3 is the structural schematic diagram of lower air-supply data center's micromodule structure described in the present embodiment, it should be pointed out that
It is cabinet 11 described in figure, the inside static pressure case 16 and the channel-type back door structure in order to make details in figure be easier to show
17 have all done partially transparentization processing.As shown in figure 3, several groups stack of cabinets 10 is set on raised flooring 14, it is described aerially
Aerial be set on substrate 15 of plate 14 forms overhead space between the substrate 15, and the air-flow in overhead space can be certainly
By circulating.Preferably, the channel-type back door structure 17 is detachably connected with the cabinet 11, is torn open when to safeguard
It unloads；Junction is provided with rubber mat, to ensure the leakproofness of system.The inside static pressure case 16 is rectangular parallelepiped structure.Described
Inside static pressure case 16 is equipped with maintenance door 19 with the side that the cabinet 11 does not connect, and enters and leaves the inside static pressure case for maintenance personnel
16 are safeguarded, when the maintenance door 19 is closed, the inside static pressure case 16 is fully sealed, so that empty in micromodule
With outside air heat exchange does not occur for gas.In this example, the shape of the channel-type back door structure 17 can be rectangle, i.e. institute
The top of channel-type back door structure 17 is stated as planar guide face, and the top of the channel-type back door structure 17 and the channel-type
The side wall of back door structure 17 vertically connects.
As shown in figure 4, be the cross-sectional view of lower air-supply data center's micromodule structure provided by the present embodiment, wherein arrow
Head denotes the flow direction of air.When hot-air in the cabinet 11 is discharged via the outlet air surface 13, by described cold
But backboard 18 is cooled to cold air, and enters the channel-type back door structure 17；The cold air passes through the channel-type back door
Structure 17 and the overhead space enter the inside static pressure case 16, and enter the cabinet 11 via the air intake surface 12, and
Take away the heat of the cabinet 11.Preferably, the height phase of the height H1 of the cabinet outlet air surface 12 and the cooling backboard 18
It is not less than the height of the cabinet 11 Deng the height H2 of, the inside static pressure case 16, the depth W1 of the inside static pressure case 16 is not
Less than twice of the depth W2 of the cabinet 11.In the present embodiment, the height H2 of the inside static pressure case 16 is greater than the machine
The height of cabinet 11, such design can make the inside static pressure case 16 have bigger space, keep static pressure effect more preferable, optimize
Air-flow flowing in lower air-supply data center's micromodule structure.
As an example, the lower air-supply data center micromodule structure further includes leaving air temp sensor, the wind-warm syndrome out
Degree sensor is located in the channel-type back door structure 17.Enter channel-type back door knot to monitor from the outlet air surface 13
The leaving air temp of air in structure 17, the utility model are provided with leaving air temp in the channel-type back door structure 17 and sense
Device adjusts the refrigerating efficiency of the cooling backboard 18 to accurately hold the cooling effect of the cooling backboard 18 in real time, makes entire
Temperature in system maintains within the set range.
As an example, the leaving air temp sensor is located at first air outlet.As the preferred of the utility model
The leaving air temp sensor is set up directly on the position at first air outlet by scheme, can more accurately monitor from
The channel-type back door structure 17 enters the air themperature under the raised flooring.The leaving air temp not only reflects described in entrance
The air themperature of channel-type back door structure 17 can also make related technical personnel more accurately push away to obtain sky under the raised flooring
Temperature degree, and then hold the air circulation of entire data center's micromodule.
As an example, air-supply data center's micromodule further includes wind pushing temperature sensor below the floor, the air-supply
Temperature sensor is located in the inside static pressure case 16.By to the supply air temperature entered in the inside static pressure case 16
Monitoring, can accurately monitor the supply air temperature from under-floor air supply.When the wind pushing temperature sensor detects the air-supply temperature
When degree deviates the standard value of setting, it can sound an alarm in time, avoid the temperature in the cabinet 11 excessively high, server is caused to be delayed
Machine.
As an example, the raised flooring 14 includes the through-hole floor that surface is provided with several through-holes 141 being intervally arranged
140, using the through-hole 141 as the second air inlet or the second air outlet.As shown in figure 5, the raised flooring 14 is by several pieces
The through-hole floor 140 that the mobilizable surface of modularization is equipped with through-hole 141 forms.The through-hole floor 140 is laid on metallic support
On, the metallic support is set up on the substrate 15.The through-hole 141 can be connected to the upper following table on the through-hole floor
Face makes free air circulation.Several through-holes 141 can be collectively as second air inlet or second air outlet.
Preferably, in order to increase ventilation quantity, several bigger ventilation openings 142 that are open can be set on the through-hole floor 14, with
Increase the opening area of second air inlet or second air outlet.The ventilation opening 142 can also be with the through-hole 141
And deposit, 141 dispersed distribution of through-hole is realized be used as second air inlet or described together around the ventilation opening 142
The function of second air outlet, as shown in Figure 6.It should be pointed out that the through-hole 141 and the ventilation opening 142 in figure are in length
Only as an example, the through-hole 141 and the ventilation opening 142 of the utility model can be used any other reasonable circle
Geometry.
As an example, the cooling backboard 18 is water cooling backboard or air-cooled backboard.As a preferred embodiment of the present invention,
Use the means that water cooling backboard is cooling as hot-air, the heat that high fever density server generates can be disappeared to the maximum extent
It removes, has the advantages that high-efficiency low energy consumption.Certainly, other refrigeration hands such as air-cooled backboard also can be used in other embodiments
Section.
As an example, equipped with freezing water coil inside the water cooling backboard.The freezing water coil passes through the low of its inside
The heat exchange of warm circulating water flow makes to be cooled down by the air on its surface, is a kind of refrigeration means of high-efficiency low energy consumption.
Embodiment two
As shown in fig. 7, the utility model also provides air-supply data center's micromodule structure under one kind, described in the present embodiment
Lower air-supply data center micromodule structure specific structure and embodiment one described in lower air-supply data center micromodule knot
The specific structure of structure is roughly the same, and the difference of the two is: lower air-supply data center micromodule structure described in embodiment one
In the top of the channel-type back door structure 17 be planar guide face, and in the present embodiment, the channel-type back door structure 17
Top be arc guide surface.The setting of the arc guide surface has fully considered the lower air-supply data center micromodule structure
Internal hydrodynamics, keeps the airflow channel-type back door structure 17 inside more smooth, so raising it is described under give
The radiating efficiency of wind data center micromodule structure.It should be noted that the height of the inside static pressure case 16 in the present embodiment
The height H1 for spending H2 and the cabinet outlet air surface 12 is equal.
Lower number of blowing described in the other structures of lower air-supply data center module described in the present embodiment and embodiment one
It is identical according to the other structures of center module, referring specifically to embodiment one, it is not repeated herein.
Embodiment three
Fig. 8 and Fig. 9 are please referred to, the utility model also provides air-supply data center's micromodule structure under one kind.Such as Fig. 8 institute
Show, lower air-supply described in the specific structure of lower air-supply data center micromodule structure described in the present embodiment and embodiment two
The specific structure of data center's micromodule structure is roughly the same, and the difference of the two is: the present embodiment further increases described
The height of inside static pressure case 16.Not only it can increase the inside when the depth W1 of the inside static pressure case 16 is constant in this way
The volume of plenum chamber 16；The inside static pressure case can also be reduced as far as possible in the constancy of volume of the inside static pressure case 16
16 occupied area makes accounting for for entire lower air-supply data center's micromodule structure while ensuring a constant static-pressure effect
Ground area is smaller, saves occupied space.As shown in figure 9, being lower data center's micromodule structure of blowing described in the present embodiment
Cross-sectional view.Wherein, the height of the inside static pressure case 16 is increased compared to embodiment two, to improve quiet
Press effect；The top of the channel-type back door structure 17 is provided with arc guide surface, increases the circulation efficiency of internal gas flow, into
One step improves cooling effect.Air-flow flowing side in arrows in figure lower air-supply data center's micromodule structure
To, when the hot-air in the cabinet 11 is discharged via the outlet air surface 13, cold air is cooled to by the cooling backboard 18,
And enter the channel-type back door structure 17；The cold air by the channel-type back door structure 17 and the overhead space into
Enter the inside static pressure case 16, and enters the cabinet 11 via the air intake surface 12, and take away the heat of the cabinet 11, institute
The presence for stating arc guide surface makes circulation of the cold air in the channel-type back door structure 17 more smoothly.
In conclusion the utility model provides air-supply data center's micromodule structure under one kind, comprising: at least one set of machine
Cabinet group, inside static pressure case, several channel-type back door structures, raised flooring and several cooling backboards.The utility model can expire
The demand that more high fever density servers are blown in computer room while added under sufficient general floorings, by introducing cooling backboard to cabinet
The hot-air of discharge is cooled down, and the energy consumption of air conditioning terminal blower is eliminated, and improves the radiating efficiency of cabinet, and save machine
Room space.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (16)
1. the lower data center's micromodule structure of blowing of one kind characterized by comprising
At least one set of stack of cabinets, stack of cabinets described in one group include two-row spacing arrangement cabinet, the cabinet be equipped with in it
The outlet air surface and air intake surface that portion is connected, the outlet air surface and the air intake surface are respectively arranged at the two sides of the stack of cabinets pair；
The air intake surface of two cabinets is adjoining in the stack of cabinets；
Inside static pressure case is set between two rows of cabinets, is connected with the air intake surface of the cabinet；
Several channel-type back door structures are respectively arranged at the outside of the outlet air surface of each cabinet；After the channel-type
The inner hollow of door, bottom are equipped with the first air outlet being connected with inside it, and side is equipped with its internal and machine
The first air inlet being connected inside cabinet；
Raised flooring, aerial be set on substrate form overhead space between the substrate；The raised flooring is located at institute
State the lower section of stack of cabinets, the inside static pressure case and the channel-type back door structure；The raised flooring is equipped with and the frame
Absolutely empty the second air inlet and the second air outlet being connected, second air outlet are located at the lower section of the inside static pressure case,
Second air inlet is located at the lower section of first air outlet, and is connected with first air outlet；
Several cooling backboards, are respectively arranged on the outlet air surface of each cabinet.
2. lower air-supply data center micromodule structure according to claim 1, which is characterized in that in the lower air-supply data
Heart micromodule structure further includes leaving air temp sensor, and the leaving air temp sensor is located in the channel-type back door structure.
3. lower air-supply data center micromodule structure according to claim 2, which is characterized in that the leaving air temp sensing
Device is located at first air outlet.
4. lower air-supply data center micromodule structure according to claim 1, which is characterized in that in the lower air-supply data
Heart micromodule structure further includes inlet air temperature sensor, and the inlet air temperature sensor is located in the inside static pressure case.
5. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the raised flooring includes
Surface is provided with the through-hole floor of several through-holes being intervally arranged, positioned in the stack of cabinets between the air intake surface of two cabinets
The through-hole as second air outlet, positioned at the lower section of first air outlet the through-hole as described second into
Air port.
6. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the raised flooring includes
Surface is provided with several through-holes and the through-hole floor of several ventilation openings；Several described ventilation openings are located at the cabinet
Between the air intake surface of the two cabinets and lower section of first air outlet in group, and it is located at two cabinets in the stack of cabinets
Air intake surface between the ventilation of the ventilation opening as second air outlet, positioned at the lower section of first air outlet
Mouth is used as second air inlet；The through-hole is located at the periphery of several ventilation openings.
7. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the cooling backboard is water
Cold-scarce plate or air-cooled backboard.
8. lower air-supply data center micromodule structure according to claim 7, which is characterized in that inside the water cooling backboard
Equipped with freezing water coil.
9. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the channel-type back door knot
The width of structure is equal with the width of the cabinet.
10. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the channel-type back door
Structure is detachably connected with the cabinet.
11. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the channel-type back door
Rubber mat is equipped between structure and the cabinet.
12. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the channel-type back door
The top of structure is arc guide surface.
13. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the cooling backboard
Width is equal with the width of the cabinet outlet air surface, and the height phase of the height of the cooling backboard and the cabinet outlet air surface
Deng.
14. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the cabinet outlet air surface
Width and the inside static pressure case it is of same size.
15. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the inside static pressure case
Depth not less than twice of depth of the cabinet；The height of the inside static pressure case is not less than cabinet height；The inside
Plenum chamber is rectangular parallelepiped structure.
16. lower air-supply data center micromodule structure according to claim 1, which is characterized in that the inside static pressure case
It is equipped with the maintenance door being connected with inside it.
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| CN201821086131.6U CN208609318U (en) | 2018-07-10 | 2018-07-10 | Lower air-supply data center micromodule structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708921A (en) * | 2018-07-10 | 2020-01-17 | 上海宽带技术及应用工程研究中心 | Lower air supply data center micro-module structure |
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2018
- 2018-07-10 CN CN201821086131.6U patent/CN208609318U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708921A (en) * | 2018-07-10 | 2020-01-17 | 上海宽带技术及应用工程研究中心 | Lower air supply data center micro-module structure |
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Assignee: Shanghai Liuzi Technology Co., Ltd. Assignor: Shanghai Broadband Technology and Application Engineering Research Center Contract record no.: 2019310000046 Denomination of utility model: Little modular structure of floor lower air supply data center Granted publication date: 20190315 License type: Common License Record date: 20190718 |