CN208593200U - Blank assembly - Google Patents

Blank assembly Download PDF

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Publication number
CN208593200U
CN208593200U CN201820126994.5U CN201820126994U CN208593200U CN 208593200 U CN208593200 U CN 208593200U CN 201820126994 U CN201820126994 U CN 201820126994U CN 208593200 U CN208593200 U CN 208593200U
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CN
China
Prior art keywords
blank
face
writing
erasing
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820126994.5U
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Chinese (zh)
Inventor
涉谷崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
AGC Inc
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Filing date
Publication date
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Publication of CN208593200U publication Critical patent/CN208593200U/en
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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    • H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drawing Aids And Blackboards (AREA)

Abstract

The utility model provide it is a kind of be made of muti-piece blank carry out based on ink writing erasing writing wipe face when, improve write erasing face seam crossing ink erasing blank assembly.Blank assembly is with the muti-piece blank for writing erasing face and have composition above-mentioned writing erasing face for carrying out the writing erasing based on ink, wherein, each above-mentioned blank successively at least has glass plate and light scattering layer towards back side from the face side of a part as above-mentioned writing erasing face, 1.0mm is divided between the above-mentioned blank of muti-piece end face relative to each other hereinafter, above-mentioned blank assembly also has the epoxy resin layer for the seam for blocking above-mentioned writing erasing face.

Description

Blank assembly
Technical field
The utility model relates to blank assemblies.
Background technique
The blank with the erasing face of writing is sold in the market, and the writing based on ink can be carried out on above-mentioned writing erasing face It wipes (referring for example to patent document 1).The blank with will from write erasing face front projection to write erasing face shadow The effect of reflection type screen as shown in carrying out the user in the front against the erasing face of writing.It can be against the image projected Carry out the writing based on ink.
The blank recorded in patent document 1 has glass plate and the layer comprising light diffusing coating or pigment.Glass plate exists Surface has male and fomale(M&F), can be carried out the erasing of writing and the writing of the text or figure on male and fomale(M&F).Include light diffusing The layer of coating or pigment is formed in the back side of glass plate, and the light being incident on the surface of glass plate is reflected.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Laid-Open 2003-237295 bulletin
Utility model content
Utility model technical problem to be solved
If it is intended to the area for writing erasing face on one piece of blank is made to become larger, manufacturing cost, transportation cost, application property can be at For problem, therefore consider to be made of the erasing face of writing muti-piece blank.By manufacturing muti-piece blank respectively, transporting respectively, constructing Scene is assembled, and the above problem is able to solve.
But if the seam crossing in muti-piece blank forms gap, the residue generated when will lead to erasing ink accumulates In seam crossing.On the other hand, the filler as filling gap, if using general organic silicon sealant as filling glass The filler in the gap between plate then will lead to the pigment deposition of ink on the sealant that seam crossing uses.
The utility model is completed in view of above-mentioned technical problem, and main purpose is to provide one kind by muti-piece blank When constituting the writing erasing face for carrying out the erasing of the writing based on ink, the erasing of the ink of the seam crossing in the erasing face of writing is improved The blank assembly of property.
Technical scheme applied to solve the technical problem
In order to solve the above-mentioned technical problem, the utility model provides a kind of blank assembly,
It is with the writing erasing face for carrying out the writing erasing based on ink and to wipe face with above-mentioned writing is constituted The blank assembly of muti-piece blank, wherein
Each above-mentioned blank successively at least has from the face side of a part as above-mentioned writing erasing face towards back side Glass plate and light scattering layer,
Be divided into 1.0mm between the above-mentioned blank of muti-piece end face relative to each other hereinafter,
Above-mentioned blank assembly also has the epoxy resin layer for the seam for blocking above-mentioned writing erasing face.
Utility model effect
The utility model can provide it is a kind of be made of muti-piece blank carry out based on ink writing erasing writing erasing When face, the blank assembly of the erasing of the ink of the seam crossing in the erasing face of writing is improved.
Detailed description of the invention
Fig. 1 is the main view for showing the blank assembly an of embodiment.
Fig. 2 is the top view for showing the blank assembly an of embodiment.
Fig. 3 is the cross-sectional view for showing the blank of an embodiment.
Fig. 4 is the figure for showing the seam construction of blank assembly an of embodiment.
Symbol description
10 blank assemblies
11 write erasing face
13 recess portions
20 blanks
21 fronts
22 back sides
31 glass plates
32 adhesive layers
33 light scattering layers
34 reflection layers
35 protective layers
40 Foamex pieces
51 buffer substrate tablets
52 epoxy resin layers
53 silicone resin layers
80 installation components
Specific embodiment
Hereinafter, being described with reference to the form for implementing the utility model.In each attached drawing, for identical or corresponding knot Structure is marked with identical or corresponding symbol, and omits the description.
<blank assembly>
Fig. 1 is the main view for showing the blank assembly an of embodiment.Fig. 2 is the blank for showing an embodiment The top view of assembly.In Fig. 2, P indicates that projector, U indicate user.In the various figures, X-direction is laterally, before Y-direction is Rear direction, Z-direction are longitudinal.X-direction, Y-direction and Z-direction are mutually perpendicular directions, and X-direction and Y-direction are horizontally oriented, Z-direction is vertical direction.
Blank assembly 10 has the writing erasing face 11 for carrying out the erasing of the writing based on ink (referring to Fig. 2).Based on oil Writing appliances, the printer heads such as special token pen etc. can be used in the writing of ink.When wiping above-mentioned writing, it can be used and wipe word Apparatus (blackboard eraser), water, solvent etc..Ink is including, for example, pigment, the solvent and release agent of dissolution pigment.As solvent, can be used Alcohol etc..As release agent, oil etc. can be used.Pigment does not dissolve in release agent.
Blank assembly 10 can not shown frame encirclement.Settable hanging tool or stabilizer blade on the frame, on stabilizer blade Settable castor.Blank assembly 10 can be in for example indoor use.In addition, the field of employment of blank assembly 10 is not special It limits.For example, blank assembly 10 can be used for the wall material etc. of the vehicles or building.
Blank assembly 10 with will from write erasing face 11 front (downside in Fig. 2) projection to write erasing face The effect for the reflection type screen that the user U in 11 image against the front for writing erasing face 11 is shown.The projection of image Projector P etc. can be used.The writing based on ink can be carried out against the image projected.
Blank assembly 10 has the muti-piece blank 20 for constituting and writing erasing face 11.Muti-piece blank 20 in Fig. 1 transversely Arrangement, but can also be arranged in the vertical direction, it can also be arranged along the two horizontal and vertical directions.Constitute blank assembly 10 The block number of blank 20 is not limited to two pieces, is also possible to three pieces or more.
<blank>
Fig. 3 is the cross-sectional view for showing the blank of an embodiment.Each blank 20 has one as writing erasing face 11 Partial front 21 and with the positive 21 opposite back sides 22.Each blank 20 successively has from positive 21 sides towards 22 side of the back side Glass plate 31, adhesive layer 32, light scattering layer 33, reflection layer 34 and protective layer 35.Hereinafter, with said sequence to blank 20 Each constitute is illustrated.In addition, as long as blank 20 from positive 21 sides towards 22 side of the back side, at least there is glass plate 31 and light to dissipate Penetrate layer 33.Adhesive layer 32, reflection layer 34 and protective layer 35 are optional compositions, it is not necessary to composition.
(glass plate)
Glass plate 31 is formed by such as soda-lime glass, alumina silicate glass, alkali-free glass, borosilicate glass etc..In addition, Glass plate 31 can be any one of non-strengthened glass, strengthened glass.Non- strengthened glass is to molten glass into plate It is the glass before glass surface forms compressive stress layers and obtained by being annealed.The glass surface of non-strengthened glass Maximal compressed stress is 50MPa or less.On the other hand, strengthened glass is the glass after glass surface forms compressive stress layers Glass.Strengthened glass can be any one of physical strengthening glass, chemically reinforced glass.Physical strengthening glass is by will be uniform The glass plate of heating makes glass surface from the temperature chilling near softening point, using the temperature difference of glass surface and inside glass Compression stress is generated, thus glass obtained by glass surface is strengthened.Chemically reinforced glass is by utilizing ion-exchange etc. Glass surface is set to generate compression stress, thus glass obtained by glass surface is strengthened.
Glass plate 31 can be shaped by float glass process, fusion method etc..Glass plate 31 is flat surface plate in Fig. 3, but can also To be curved slab.As the bending forming that surface plate is bent to curved slab, gravity forming or press molding etc. can be used.Bending In forming, can by by uniformly heated glass plate from the temperature chilling near softening point, using in glass surface and glass The temperature difference in portion and make glass surface generate compression stress, thus by glass surface physical strengthening.In addition, chemically reinforced glass can By making glass surface generate compression stress using ion-exchange etc. and obtaining after bending forming.
Glass plate 31 penetrates the light of image.Glass plate 31 is colorless and transparent but it is also possible to be colored transparent.Glass Mist degree (Haze) value of plate 31 is 50% or less.If the haze value of glass plate 31 in 50 % hereinafter, if can get it is enough Lightness.In addition, the haze value of glass plate 31 is usually 1% or less.
Haze value is measured according to Japanese Industrial Standards (JIS K7136), as penetrating measure object on plate thickness direction The percentage of transmitted light in the transmitted light of breadboard, deviateing from incident light due to forescatering 2.5 ° or more and find out.Make Light source used in measurement for haze value uses the D65 light source recorded in Japanese Industrial Standards (JIS Z8720:2012).
The plate thickness of glass plate 31 is not particularly limited, e.g. 0.1mm~20mm.In addition, the plate thickness of glass plate 31 is preferred For 0.3mm~8mm.Such as be arranged on metope by blank assembly 10, if the plate thickness of glass plate 31 is less than 0.1mm is then easy to happen fluctuating, if the plate thickness of glass plate 31 is greater than 20mm, the heavier-weight of blank assembly 10, so having When need to carry out the reinforcing of wall etc..
The front of glass plate 31 has bumps.Using above-mentioned bumps, the light from projector P can be made to scatter, and can inhibit The generation of hot spot (hot spot).Hot spot refers to when on image projecting to reflection type screen, it can be seen that in reflection type screen The phenomenon that center portion etc. shines brightly.The phenomenon is to be generated incident light mirror-reflection by the front of reflection type screen. According to the present embodiment, it can will be scattered from the light of projector P using the positive bumps of glass plate 31, the hair of hot spot can be inhibited It is raw.
As the processing method that the front in glass plate 31 forms concave-convex glass plate, general processing method can be used, Such as the etching method for the method or wet type, dry type etc. that can be used sand-blast etc. mechanical.Erosion in etching method, as glass plate 31 Liquid is carved, can be used such as the aqueous solution or hydrogen fluoride ammonia spirit that are obtained by mixing hydrogen fluoride and ammonium fluoride.
(adhesive layer)
Adhesive layer 32 is arranged between glass plate 31 and light scattering layer 33, and glass plate 31 and light scattering layer 33 are bonded.It is viscous Layer 32 is connect to be formed as sheet for light scattering layer 33 and light scattering layer 33 is pasted onto the situation on glass plate 31.As adhesive layer 32, general adhesive layer can be used.
In addition, in the present embodiment, light scattering layer 33 is formed as sheet and is secured on glass plate 31, but can also It is formed so that the material liquid of light scattering layer 33 to be coated on glass plate 31.In the case where the latter, adhesive layer 32 is not needed.
(light scattering layer)
Light scattering layer 33 will transmit through the light scattering of glass plate 31.Whereby, light scattering layer 33 is white, so improving ink The contrast of writing and image.Light scattering layer 33 is formed by the different multiple material of refractive index.Light scattering layer 33 includes such as base Body portion and the light scattering part being dispersed in matrix part.
Matrix part may include any one of inorganic material, organic material.As inorganic material, silica can be enumerated Deng.As organic material, polyvinyl alcohol resin can be enumerated, polyvinyl butyral resin, epoxy resin, acrylic resin, gathered Ester resin, polycarbonate resin, melamine resin, polyurethane resin, propenoic methyl carbamate resin, organic siliconresin Deng.Organic material can be any one of heat-curing resin, light-cured resin, thermoplastic resin.
Light scattering part may include any one of particle, cavity, also may include the two.Particle can be inorganic particulate, have Any one of machine particle.As the material of inorganic particulate, silica, titanium oxide, aluminium oxide, zirconium oxide, oxidation can be enumerated Zinc, calcium carbonate, phosphinates, diphosphinic acid salt, barium sulfate, talcum and mica etc..As the material of organic filler, can enumerate poly- Styrene, acrylic resin, polyurethane resin etc..In addition, particle can be Porous particle.The emptying aperture of Porous particle it is thin Bore dia is preferably 2nm~50nm.The number average particle diameter of particle is 100nm~10 μm.Cavity is by stretched operation or foaming agent etc. It is formed.In the case that light scattering part includes cavity, light scattering layer 33 is porous layer.
Light scattering layer 33 also may include light absorption department in addition to matrix part and light scattering part.Light absorption department includes carbon black or titanium Black equal light absorption particle.Light absorption department ratio shared in light scattering layer 33 is such as 0.01 volume % of volume %~5, It is preferred that 0.1 volume of volume %~3 %.The contrast of light absorption department raising image.
The total light transmittance of light scattering layer 33 is 15%~40%." total light transmittance " is indicated relative to incidence angle The incident light of 0 ° of main surface (such as front) for being incident to light scattering layer 33, from another main surface of light scattering layer 33 The ratio (percentage) of the total transmission light of (such as back side) transmission.Total light transmittance is according to Japanese Industrial Standards (JIS K7136 it) measures, as transmissivity in transmitted light of the plate thickness direction through the breadboard of measure object, including spreading light It calculates.Light source used in measurement as total light transmittance uses note in Japanese Industrial Standards (JIS Z8720:2012) The D65 light source of load.
(reflection layer)
In the case where effect of the blank 20 with reflection type screen, in order to improve the image of projection to reflection type screen Brightness, settable reflection layer 34.Reflection layer 34 reflects the light of the image from projector P towards front.Light reflection Layer 34 reflects the light from light scattering layer 33 towards light scattering layer 33.
Reflection layer 34 is made of one or more layers.As the constituent material of layer, can specifically enumerate following.Reflection layer 34 It may include the layer of (1) metal layer, (2) comprising resin and the light reflective particle being dispersed in resin, in (3) multilayer dielectric film At least one, also may include any two or more.Combination is not particularly limited.As gold contained in reflection layer 34 Belong to, from the viewpoint of reflectivity and color, preferably comprises the metal simple-substance or alloy of at least one party of silver and aluminium.
In the case where reflection layer 34 includes metal layer, as the forming method of metal layer, it can enumerate and for example paste gold Belong to the physical vapor depositions such as method, the sputtering or vacuum evaporation of foil or metal plate, utilize silver mirror reaction or the method for plating etc..
In addition, reflection layer 34 may include resin and the light reflective particle that is dispersed in resin.In this case, light reflects Layer 34 is coated on light scattering layer 33 for example, by being blended with the liquid of resin combination and light reflective particle, makes coating Liquid curing and formed.Solvent can also be contained in aforesaid liquid.Alternatively, resin be thermoplastic resin in the case where, pass through by The resin material for being mixed with resin combination and light reflective particle is made sheet by extrusion molding etc. and is formed.It is anti-as light Such as metallic can be used in penetrating property particle.It is the metal simple-substance or alloy of at least one party comprising silver and aluminium as metal. The shape of light reflective particle can be any one of spherical, plate, but from the viewpoint of reflectivity, preferably plate.
In addition, reflection layer 34 may include multilayer dielectric film.Multilayer dielectric film can be by by different more of refractive index The method of dielectric stack is planted to be formed.As the dielectric of high refractive index, such as Si can be enumerated3N4、AlN、NbN、SnO2、 ZnO、SnZnO、Al2O3、MoO、NbO、TiO2And ZrO2.The low-refraction low as dielectric refractive index than high refractive index Dielectric, such as SiO can be enumerated2、MgF2And AlF3。
For reflection layer 34, the sum of specular reflectivity, scattered reflection rate, outer transmissive rate and absorptivity can be set as 100%.The sum of specular reflectivity and scattered reflection rate are total reflectivity.It is specularly reflecting the measurement sample of rate and scattered reflection rate Product use the sample that reflection layer 34 is formed on glass baseplate (the soda-lime glass plate of specially 2mm thickness).
The specular reflectivity of reflection layer 34 is measured as absolute reflectance.The specular reflectivity of reflection layer 34 is With the surface of the glass baseplate side in reflection layer 34 of the spectrophotometer detection for measuring sample from glass baseplate side to enter The light of 5 ° of incident wavelength 550nm of firing angle, and along the light of the direction of mirror-reflection reflection, as measured value.As spectrophotometer, Commercially available product (such as society, Hitachi manufacture, model: U-4100) can be used.
On the other hand, the scattered reflection rate of reflection layer 34 is by subtracting reflection layer from the total reflectivity of reflection layer 34 34 specular reflectivity and calculate.The total reflectivity of reflection layer 34 is measured as absolute reflectance.Reflection layer 34 Total reflectivity is will to measure the inside that integrating sphere is arranged in sample, the glass baseplate side in reflection layer 34 for measuring sample Surface from glass baseplate side with the light of 5 ° of incident wavelength 550nm of incidence angle, will be collected towards the light that all directions reflect with integrating sphere And detected with spectrophotometer, as measured value.
The specular reflectivity of reflection layer 34 is preferably 40% or more.If the specular reflectivity of reflection layer 34 is 40% More than, then almost without the fuzzy of image.The specular reflectivity of reflection layer is more preferably 50% or more.
The scattered reflection rate of reflection layer 34 is preferably shorter than 40%.If the scattered reflection rate of reflection layer 34 is lower than 40%, then almost without the fuzzy of image.
The specular reflectivity of reflection layer 34 and the total reflectivity of the total of scattered reflection rate, i.e. reflection layer 34 are preferably 30~100%.
The outer transmissive rate of reflection layer 34 is preferably shorter than 50%.If the outer transmissive rate of reflection layer 34 is lower than 50%, then it can sufficiently obtain the brightness of image.
In addition, reflection layer 34 is preferably metal layer.In this case, reflection layer 34 can pass through plating, sputtering, vapor deposition etc. It is formed on light scattering layer 33.
Reflection layer 34 is bonded on light scattering layer 33 in Fig. 3, can however, you can also not be bonded on light scattering layer 33 To form gap between reflection layer 34 and light scattering layer 33.
The front of reflection layer 34 preferably hardly has bumps.The positive arithmetic average roughness Ra of reflection layer 34 For such as 5 μm hereinafter, it is preferred that 1 μm or less.
(protective layer)
Protective layer 35 protects reflection layer before aftermentioned Foamex piece 40 is pasted onto the back side 22 of blank 20 34.In addition, Foamex piece 40 can have both the effect of matcoveredn 35.
<Foamex piece>
As shown in Fig. 2, Foamex piece 40 is pasted onto the back side 22 of blank 20 by adhesive 42 etc..As adhesive 42, general sealing material for building can be used, such as organic silicon sealant material, acrylic adhesives or conjunction can be enumerated At rubber adhesive etc..In addition, adhesive 42 can be the sheets such as double faced adhesive tape.In addition, adhesive 42 is preferably as building Material, with the high condition selection material of noninflammability and coating weight.
Foamex piece 40 can transport construction with blank 20 in the state of being pasted on the back side 22 of blank 20 together Scene.That is, being transported to construction site by the laminated body that blank 20 and Foamex piece 40 are constituted.The size of Foamex piece 40 Can be identical as the size of blank 20, Foamex piece 40 can be pasted onto the back side 22 of blank 20 on the whole.
At the construction field (site), Foamex piece 40 is pasted onto the installation components 80 such as plasterboard or modeling plywood with adhesive 82 is equal Front.As adhesive 82, adhesive same as adhesive 42 can be used.Installation component 80 front successively paste by The laminated body that Foamex piece 40 and blank 20 are constituted.Because pasting muti-piece laminated body, the positive face of installation component 80 Product is big.
Foamex piece 40 is arranged between blank 20 and installation component 80, absorbs the positive bumps of installation component 80, Inhibit the breakage of blank 20.Foamex piece 40 is preferably light weight and has the flame-retardant intumescent polyethylene tree of the flexibility of appropriateness Rouge, flame-retardant intumescent polyurethane resin or blown rubber.These resins can be used as construction material and obtain because being anti-flammability Obtain the identification of incombustible material.
The thickness of Foamex piece 40 is such as 2mm or more 8mm or less.25% compression of the resin of Foamex piece 40 Stress is such as 400kPa or less.The Shore C hardness of Foamex piece 40 is such as 10 or more 60 or less.Shore C hardness refers to The measured value of hardometer (the ASKER durometer c-type of A Shika company (ア ス カ ー society) manufacture).
<seam construction>
Fig. 4 is the cross-sectional view for showing the seam construction of multiple blanks an of embodiment.Muti-piece blank 20 is relative to each other End face interval S1 be 1mm or less.If interval S1 be 1mm hereinafter, if the writing erasing face 11 of blank assembly 10 connect It stitches unobvious.It is arranged such as buffer substrate tablet 51, epoxy resin layer 52 and silicone resin layer 53 in the seam.
In addition, the size at the back side of blank 20 can be identical with the positive size of Foamex piece 40, the end of blank 20 Face and the end face of Foamex piece 40 can be in the same faces.In this case, the end face that muti-piece Foamex piece 40 is relative to each other Interval S2 be 1mm or less.From the viewpoint of insertion buffer substrate tablet 51, interval S1 and interval S2 are preferably 0.1mm or more.
(buffer substrate tablet)
Buffer substrate tablet 51 inhibits the mutual collision of glass plate 31 when construction, and glass plate 31 is inhibited to generate notch.It is white in order to make The seam of plate 20 is unobvious, and buffer substrate tablet 51 can be white.As buffer substrate tablet 51, general maintenance piece etc. can be used.
Buffer substrate tablet 51 is used and Nian Jie at least one party of the end face relative to each other of muti-piece blank 20.In addition, buffering Piece 51 is used and Nian Jie with muti-piece Foamex piece 40 at least one party of end face relative to each other.
The laminated body that front-rear direction size (Y-direction size) ratio of buffer substrate tablet 51 is made of blank 20 and Foamex piece 40 Front-rear direction size (Y-direction size) it is small.Buffer substrate tablet 51 is formed in the seam crossing for writing erasing face 11 from writing erasing face 11 The recess portion 13 of recess.The bottom surface of recess portion 13 is made of buffer substrate tablet 51.
In the cross section view vertical with the extending direction of seam (being Z-direction in Fig. 4), recess portion 13 can be to be wiped from writing Except the depth in face 11 the deep, become narrower cone tank.The cone tank by such as glass plate 31 (referring to Fig. 3) fillet surface structure At.Epoxy resin layer 52 is filled in recess portion 13.
(epoxy resin layer)
The seam in erasing face 11 is write in the blocking of epoxy resin layer 52.It can prevent from forming gap in seam crossing, and can prevent from wiping The residue generated when except ink accumulates in seam crossing.In addition, epoxy resin layer 52 is by as the gap between filling glass plate The epoxy resin with high hardness of the general organic silicon sealant of filler is formed, so can prevent the pigment deposition of ink from connecing In seam, easy water etc. removes removal ink.
The Shore D hardness of epoxy resin is 60 or more 100 or less.Epoxy resin can be heat-curing type, room temperature curing Any one of type, but from the viewpoint of operability, preferably room temperature curing type.Epoxy resin may include the colorants such as pigment, The additives such as ultraviolet absorbing agent, silane coupling agent.
(silicone resin layer)
The front of the covering epoxy resin layer 52 of silicone resin layer 53.For example, silicone resin layer 53 is to cover such as ring The mode that the front of oxygen resin layer 52 is whole is formed, and is formed in such a way that the front in blank 20 squeezes out.Silicone resin layer 53 compared with epoxy resin layer 52, low with the compatibility of ink.It is therefore not necessary to using water, it only can be simply with wiping word apparatus Erasing is formed by the writing based on ink on the surface of silicone resin layer 53.
From the viewpoint of the compatibility and durability with ink, silicone resin layer 53 preferably comprises organic silicon solidification Object.Organic silicon solidfied material can be by making in the organic siliconresin of such as curability and the silicone oligomer of curability at least One side is condensation cured to be obtained.
In general, the difference of organic siliconresin and silicone oligomer is molecular weight, molecular weight is lower organic Silicone resin is known as silicone oligomer.Silicone oligomer typically refers to the change of dimer or tripolymer to molecular weight 1000 or so Close object.
The monomer of siliceous key unit is formed with (R ' -)aSi(-Z)4-aIt indicates.Wherein, a indicates that 0~3 integer, R ' indicate Hydrogen atom or 1 valence organic group, Z indicate hydroxyl, halogen atom or it is other being capable of 1 valence functional group in conjunction with silicon atom.In Z In the case where for hydrolization group, as the hydrolization group, alkoxy, acyloxy, isocyanate group etc. can be enumerated.
As the organic siliconresin of curability and the silicone oligomer of curability, commercially available compound can be used.For example, As the organic siliconresin of curability, can be used KR220L, KR220LP of SHIN-ETSU HANTOTAI's Chemical Co., Ltd. manufacture, KR242A, KR251, KR211, KR255, KR300, KR311, KR2621-1, Dong Li DOW CORNING Co., Ltd. (eastern レ ダ ウ U ー ニ Application グ Society) manufacture SR2402, AY42-163, Z6018 etc..As the silicone oligomer of curability, SHIN-ETSU HANTOTAI's chemistry strain formula can be used Commercial firm manufacture KC89S, KR515, KR500, X40-9225, X40-9246, X40-9250, KR401N, X40-9227, KR510, KR9218, KR213, KR400, X40-2327, KR401 etc..The one of which that can be used alone kind, can also group It closes and uses multiple kinds.
In order to improve the erasing of the writing based on ink, silicone resin layer 53 in addition to comprising organic silicon solidfied material, It also may include fluoride compound.As fluoride compound, C is preferably comprisednF2n+1Base and CnF2nThe compound of O base.N is 1 or more Natural number.
Silicone resin layer 53 passes through applied coating solution and is solidified to form the coating fluid of coating.Coating method can make With well known method, the methods of such as brushing, sponge coating, spraying can be used.Coating fluid includes the organic siliconresin of curability With in the silicone oligomer of curability at least one party and solvent.As needed, coating fluid can further include solidification catalysis At least one party in agent, fluoride compound, levelling agent and pigment.In order to promote to solidify, heating and/or active-energy are preferably carried out Radiation exposure.
The thickness of silicone resin layer 53 be preferably 0.01 μm or more 20 μm hereinafter, more preferable 0.05 μm or more 10 μm with Under.When the thickness of silicone resin layer 53 is less than 0.01 μm, durability is not enough.Silicone resin layer 53 is preferably with average film thickness Reach 0.1 μm of condition to be formed.
In addition, silicone resin layer 53 can be a part of blank 20, the front of glass plate 31 can also be formed in.This Outside, can be formed between glass plate 31 and silicone resin layer 53 improves the closely sealed of glass plate 31 and silicone resin layer 53 The basal layer of property.
Embodiment
[embodiment 1]
Firstly, preparing the blank of two pieces of vertical 300mm, horizontal 300mm, thickness 3mm.Each blank is as shown in Figure 3 by glass plate, viscous Layer, light scattering layer, reflection layer and protective layer is connect to constitute.As glass plate, vertical 300mm, horizontal 300mm, plate thickness 2.8mm are used Float glass (Asahi Glass Co., Ltd's manufacture, soda-lime glass are not strengthened).For the front of glass plate, wet type erosion is first passed through in advance It carves processing and assigns bumps.As light scattering layer, 38 μm of thickness of white PET film is used.As reflection layer, 0.1 μ of thickness is used The aluminium-vapour deposition layer of m.After the back side of white PET film forms aluminium-vapour deposition layer, make front and the back side phase of glass plate of white PET film It bonds together to and with adhesive.Then, it is bonded in the back side and the opposite mode in front of protective layer that make aluminium-vapour deposition layer Together.As protective layer, the PET film (Dongli Ltd.'s system, with a thickness of 50 μm) in front with adhesive is used.
Then, the front at the back side and Foamex piece that make blank is opposite, is bonded together with adhesive.It is set as foaming Rouge piece uses flame-retardant intumescent polythene strip (25% compression stress 120kPa, Shore C hardness 41, thickness 3mm).Make blank The size at the back side is identical with the positive size of Foamex piece, and the end face of the end face and Foamex piece that make blank is in the same face It is interior.Two laminated bodies being made of blank and Foamex piece are manufactured.The size of each laminated body is vertical 30cm, horizontal 30cm, thickness Spend 6mm.
Then, two laminated bodies are successively pasted onto the front of the plasterboard of thickness 12.5mm.Specifically, firstly, making The back side of one laminated body and the front of plasterboard are opposite, and with POS seal multi (Si Meiding Co., Ltd. (セ メ ダ イ Application society) manufacture) it bonds together.Then, the front at the back side and plasterboard that make a remaining laminated body is opposite, and uses POS Seal multi (manufacture of Si Meiding Co., Ltd.) bonds together.Two laminated bodies horizontally arrange fixation, make two layers Stack is divided into 0.5mm between end face relative to each other.Buffer substrate tablet is preset on the end face of a side, inhibits glass plate mutual Collision.As buffer substrate tablet, use P cut tape 4140 (temple ridge makes Co., Ltd., institute and manufactures, thickness 0.15mm).Here, The thickness of buffer substrate tablet is measuring before being clamped by two laminated bodies under natural conditions.Writing erasing is made of two pieces of blanks Face, the seam crossing in writing erasing face form recess portion, the bottom surface of recess portion are made of buffer substrate tablet.
Then, epoxy resin is filled in the recess portion of seam crossing for being formed in the erasing face of writing, makes its solidification, form epoxy Resin layer.As epoxy resin, the E250 manufactured using Ke Nixi Co., Ltd. (U ニ シ society).
Then, silicone resin layer is formd in the front of epoxy resin layer.As the material of silicone resin layer, use The KR400 of SHIN-ETSU HANTOTAI's Chemical Co., Ltd. manufacture.Silicone resin layer with a thickness of 1 μm.
Blank assembly has been made as a result,.From being carried out from the front 8m in the writing erasing face of blank assembly to it As a result, the seam in the erasing face of writing is unobvious.In addition, the seam crossing with special token pen in the erasing face of writing is drawn Line is used only without using water and wipes the energy non-pigment residual ground erasing of word apparatus.As special token pen, the white of red is used With marking pen, (KOKUYO Corporation (コク ヨ society) manufactures, blank marking pen PM-B102ND) plate.As word apparatus is wiped, make With blank with blackboard eraser (KOKUYO Corporation manufactures, RA-12NB-DM).
[embodiment 2]
In example 2, in addition to the front in epoxy resin layer does not form silicone resin layer and makes epoxy resin layer Other than exposing, blank assembly has been made similarly to Example 1.From blank assembly writing erasing face front 8m to it It is being observed as a result, write erasing face seam it is unobvious.In addition, for the connecing in the erasing face of writing with special token pen The line of picture at seam is wiped with being unable to non-pigment residual using only word apparatus is wiped, but can be wiped to non-pigment residual when being wiped with water.
[embodiment 3]
In embodiment 3, buffer substrate tablet is set in the two sides of the end face relative to each other of two laminated bodies, is clipping two block bufferings In the state of piece by laminated body against.As buffer substrate tablet, using P cut tape 4140 similarly to Example 1, between end face It is divided into 0.3mm.In addition to this, blank assembly has been made similarly to Example 1.From the writing erasing face of blank assembly It is that front 8m observes it as a result, write erasing face seam it is unobvious.In addition, for being write with special token pen The line that the seam crossing in erasing face is drawn is used only and wipes the energy non-pigment residual ground erasing of word apparatus.
[comparative example 1]
In comparative example 1, in addition to not forming buffer substrate tablet, epoxy resin layer and silicone resin layer, and makes to write and wipe The seam in face is to have made blank assembly similarly to Example 1 other than gap.From the writing erasing face of blank assembly It is that front 8m observes it as a result, can recognize write erasing face seam.Because seam is gap, seam and white The refringence of plate is excessive, as a result, seam can be identified.In addition, for special token pen glass plate front draw Line is wiped with word apparatus is wiped.Label on whiteboard surface can be wiped, but the residue wiped is filled between glass plate Seam in, pigment residue has occurred.
[comparative example 2]
In comparative example 2, in addition to not forming buffer substrate tablet, epoxy resin layer and silicone resin layer, silicone sealant is used Agent filling writes the seam in erasing face and the interval of the end face relative to each other of two laminated bodies is set as other than 3mm, with implementation Example 1 has similarly made blank assembly.Result from being carried out from the front 8m in the writing erasing face of blank assembly to it It is that can recognize the seam in the erasing face of writing.Because the width of seam is excessively wide, seam can be identified.In addition, being intended to wipe by water It wipes to wipe the line drawn with special token pen in the front of glass plate, but pigment deposition is in the joint, so observed color Element residual.
<deformation, improvement>
The embodiment etc. of the above dialogue plate assembly is illustrated, but the utility model is not limited to above-mentioned embodiment party Formula etc. can carry out various modifications in the range of the technical idea of the utility model that claims of patent application are recorded And improvement.
The writing erasing face 11 of blank assembly 10 can be male and fomale(M&F), may not be male and fomale(M&F) but flat surface.Book The bumps in the erasing face of writing 11 are unwanted in the case where not projecting image for inhibiting hot spot.It can be assembled in blank Body 10 with reflection type screen effect in the case where setting write erasing face 11 bumps.
In the case where writing erasing face 11 is male and fomale(M&F), the front of glass plate 31 can not be male and fomale(M&F) but flat Face.As long as the flat front in glass plate 31 forms buckle layer.As the forming method of the buckle layer, can be used alone Such as mold compresses method, etching method, stamped method, rubbing method etc. or they are used in any combination.It can be in the front of buckle layer Bumps are formed, form silicone resin layer etc. in the front for being formed with the bumps.In addition, silicone resin layer and buckle layer it Between can form the basal layer for improving the adaptation of silicone resin layer and buckle layer.
Blank assembly 10 can also have magnetosphere.Magnetosphere may include the Hard Magnetics such as the soft magnetic materials such as iron, permanent magnet Any one of property material.Using the adsorption capacity of magnet, paper etc. can be fixed on blank assembly 10, or blank is assembled Body 10 is mounted on wall.
Blank assembly 10 only can have glass plate 31 in the front side of light scattering layer 33, can also also have glass in rear side Plate.I.e., it is possible to which light scattering layer 33 etc. is arranged between two pieces of glass plates.Interlayer is constituted by two pieces of glass plates and light scattering layer 33 etc. Glass.In addition to light scattering layer 33, reflection layer 34 can be also set between two pieces of glass plates.
Reflection layer 34 can be scattered reflection and account for leading reflection layer than mirror-reflection.As such reflection layer 34, the layer for being dispersed with spherical reflexive particle, the layer with reflexive concaveconvex structure can be enumerated.With reflexive bumps The layer of structure can be obtained for example, by assigning metallic reflective coating along male and fomale(M&F).Reflexive concaveconvex structure can be unordered The concaveconvex structure of concaveconvex structure, rule, is also possible to hologram etc..

Claims (5)

1. a kind of blank assembly constitutes institute to wipe face with the writing for carrying out the writing erasing based on ink and having State the blank assembly of the muti-piece blank in the erasing face of writing, which is characterized in that
Each blank successively at least has glass towards back side from the face side as described a part for writing erasing face Plate and light scattering layer,
Be divided into 1.0mm between the end face relative to each other of blank described in muti-piece hereinafter,
The blank assembly also has the epoxy resin layer for blocking the seam for writing erasing face.
2. blank assembly as described in claim 1, which is characterized in that each blank is as the writing erasing face The front of a part has bumps.
3. blank assembly as claimed in claim 1 or 2, which is characterized in that have the front for covering the epoxy resin layer Silicone resin layer.
4. blank assembly as claimed in claim 1 or 2, which is characterized in that have and inhibit the phase each other of glass plate described in muti-piece Pair end face collision buffer substrate tablet,
The buffer substrate tablet forms the recess portion being recessed from the writing erasing face in the seam crossing for writing erasing face,
In the recess portion, the epoxy resin layer is set.
5. blank assembly as claimed in claim 1 or 2, which is characterized in that have and be pasted on the back side of each blank Foamex piece,
1.0mm or less is divided between Foamex piece end face relative to each other described in muti-piece.
CN201820126994.5U 2017-01-16 2018-01-25 Blank assembly Expired - Fee Related CN208593200U (en)

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CN112724731A (en) * 2020-12-29 2021-04-30 苏州德达材料科技有限公司 Magnetic writing wall and preparation process thereof

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WO2020212031A1 (en) * 2019-04-18 2020-10-22 Abb Power Grids Switzerland Ag Power semiconductor module with laser-welded leadframe

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JP4062191B2 (en) * 2003-07-03 2008-03-19 富士電機デバイステクノロジー株式会社 Semiconductor device and manufacturing method thereof
JP2013105789A (en) * 2011-11-10 2013-05-30 Sumitomo Electric Ind Ltd Wiring body with wiring sheet, semiconductor device, and method for manufacturing semiconductor device
US9899345B2 (en) * 2014-01-27 2018-02-20 Mitsubishi Electric Cooperation Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power

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CN112724731A (en) * 2020-12-29 2021-04-30 苏州德达材料科技有限公司 Magnetic writing wall and preparation process thereof
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