CN208589424U - Anti-pinch device - Google Patents

Anti-pinch device Download PDF

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Publication number
CN208589424U
CN208589424U CN201821219000.0U CN201821219000U CN208589424U CN 208589424 U CN208589424 U CN 208589424U CN 201821219000 U CN201821219000 U CN 201821219000U CN 208589424 U CN208589424 U CN 208589424U
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China
Prior art keywords
wafer
slit
slot door
pinch device
induction mechanism
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CN201821219000.0U
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Chinese (zh)
Inventor
栾剑峰
刘家桦
叶日铨
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Huaian Imaging Device Manufacturer Corp
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Huaian Imaging Device Manufacturer Corp
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Priority to CN201821219000.0U priority Critical patent/CN208589424U/en
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Abstract

The utility model relates to semiconductor equipment manufacturing technology fields, disclose a kind of anti-pinch device, it is installed in the cushion chamber between the process cavity of semiconductor processing equipment and transmission cavity, cushion chamber includes upper cover, bottom and side wall, slit is offered on side wall, cushion chamber further includes slot door, and slit is opened and closed, and anti-pinch device includes wafer induction mechanism and slot door control mechanism;Wafer induction mechanism detects the position of wafer and communicates to connect with slot door control mechanism;Slot door control mechanism controls the folding condition of slot door based on the signal of wafer induction mechanism.Anti-pinch device provided by the utility model can be by wafer induction mechanism to progress real-time monitoring at slit; observation slot door prepare close when whether have wafer fall on slit and mechanical arm whether from cushion chamber withdraw transmission cavity; and control slot door closure or openness in time according to monitoring result, realize the protection to wafer and semiconductor processing equipment.

Description

Anti-pinch device
Technical field
The utility model relates to semiconductor equipment manufacturing technology field, in particular to a kind of anti-pinch device.
Background technique
Currently, in the semiconductor processing equipment of semiconductor industry, wafer between a transmission cavity and multiple process cavities into Row transmits and carries out relevant treatment, and multiple cushion chambers are additionally provided between the sum of transmission cavity process cavity.In general, brilliant Circle can enter from process cavity via cushion chamber after technological reaction to be shared in transmission cavity, then is worn by the mechanical arm in transmission cavity The slit crossed in the cushion chamber for being arranged in and being connect with another process cavity and enter another process cavity and carry out new technological reaction.? Slot door is equipped at slit it to be opened and closed.
However, if deviation occurs in position of the wafer in process cavity, may be passed by mechanical arm in transmit process It slides, or is touched down from mechanical arm when passing through slit or mechanical arm is working from mechanical arm when sending It is likely to occur exception in the process, rests at slit.At this point, wafer or mechanical arm may be clipped to if slot door is closed, Cause wafer broken or mechanical arm is damaged, more changes jobs so as to cause the waste of wafer or the reparation of equipment.
Utility model content
The utility model is to propose in view of the above problems, and its purpose is to provide a kind of anti-pinch devices, is able to solve Slot door clips to the problem of wafer or mechanical arm.
It according to the utility model, is cooperated, can be transported from transmission cavity in wafer by induction mechanism and control mechanism To occur during process cavity it is unexpected and in the case where falling, detect wafer in time and control slot door, to protect crystalline substance Circle is not caught broken by slot door.Also, mechanical arm can also be avoided to be clipped to by slot door, the effect of protection is played to mechanical arm Fruit.
The utility model provides a kind of anti-pinch device, is installed between the process cavity of semiconductor processing equipment and transmission cavity Cushion chamber in, cushion chamber includes upper cover, bottom and side wall, and slit is offered on side wall, and cushion chamber further includes slot door, Slit is opened and closed, anti-pinch device includes wafer induction mechanism and slot door control mechanism;The detection of wafer induction mechanism is brilliant Round position is simultaneously communicated to connect with slot door control mechanism;Slot door control mechanism is controlled based on the signal of wafer induction mechanism The folding condition of slot door.
Compared to existing technologies, anti-pinch device provided by the utility model can be by wafer induction mechanism to slit Place carry out real-time monitoring, observation slot door prepare close when whether have wafer fall on slit and mechanical arm whether Transmission cavity is withdrawn from cushion chamber, and controls slot door closure or openness in time according to monitoring result, is realized to wafer and manipulator The protection of arm, to save production cost.
Preferably, wafer induction mechanism is photoelectric sensor, and photoelectric sensor includes opposed transmitting terminal and connects Receiving end.
Photoelectric sensor small volume will not influence the opening and closing movement of slot door.And its sensitivity detected is higher, because Whether this can be more accurately to having wafer to fall at slot door to detect.
Further, preferably, transmitting terminal is arranged in the side in bottom or upper cover, receiving end setting bottom or on Another party in lid, and the side edge of the close slit of bottom or upper cover is arranged in receiving end and transmitting terminal.
Transmitting terminal and receiving end are respectively arranged to upper cover or the bottom of cushion chamber, can be retained therebetween biggish Space, so as to ensure that opening and closing movement of the slot door in cushion chamber is gone on smoothly, and receiving end and transmitting terminal setting exist The side edge of the close slit of bottom or upper cover, it is ensured that detection range improves detection efficiency.
In addition, preferably, wafer induction mechanism is installed in the plane of the side wall where slit.
Wafer induction mechanism is arranged in the plane where slit, reduces distance of the wafer induction mechanism to slit, energy It enough further increases the precision of wafer induction mechanism and has more delicately detected whether that wafer is fallen on slit.
Further, preferably, photoelectric sensor be provided with it is multiple.
Multiple photoelectric sensors are successively set at slit, detection range can be refined and improve detection accuracy, work as crystalline substance When circle is fallen at the different location of slit, it is easier to be detected by photoelectric sensor, to preferably protect wafer.
In addition, preferably, further including driving device and a plurality of tracks, track is arranged in upper cover and bottom, at every Sliding part is installed on track, transmitting terminal or receiving end have been removably installed on each sliding part.
Can further it be expanded by setting track and sliding part so that the detection process of photoelectric sensor is more continuous The detection range of big photoelectric sensor improves detection accuracy of the photoelectric sensor at slit, it is ensured that when there is wafer to fall narrow It can be detected when at seam, so as to take safeguard measure to wafer in time.In addition, photoelectric sensor is using dismountable peace Dress mode can reduce the maintenance difficulty to photoelectric sensor.
Further, preferably, sliding part can synchronously move under the control of driving device.
Transmitting terminal and receiving end are oppositely arranged and synchronously move, and can ensure the light that transmitting terminal issues during the motion Line receiving end receives, so that light be made to be scanned across at slit, more accurately to whether having wafer or manipulator at slit Arm is detected, and the blind area of detection is reduced.
Further, preferably, further including the alarm mechanism with the communication connection of wafer induction mechanism, wafer induction mechanism Signal is sent to alarm mechanism, is issued and is reminded by alarm mechanism.
When wafer induction mechanism, which detects, is equipped with foreign matter at slit, it can be sounded an alarm by alarm mechanism, cause to grasp Make personnel's note that can be adjusted in time to semiconductor processing equipment.
Detailed description of the invention
Fig. 1 is that wafer falls in the schematic diagram at slit and being detected in the first embodiment of the utility model;
Fig. 2 is that mechanical arm is parked in the schematic diagram at slit and being detected in the first embodiment of the utility model;
Fig. 3 is the schematic diagram of the slot door closure of the utility model;
Fig. 4 is the schematic diagram that the side wall of slot door is equipped in the first embodiment of the utility model;
Fig. 5 makes the schematic diagram that 3 photoelectric sensors are equipped in the first embodiment of the utility model;
Fig. 6 is arranged in photoelectric sensor in the second embodiment of the utility model on sliding block and slides along the track Schematic diagram.
Description of symbols:
1- wafer;2- process cavity;3- transmission cavity;3a- mechanical arm;4- cushion chamber;4a- upper cover;The bottom 4b-;The side 4c- Wall;5- slot door;6- slit;7a- photoelectric sensor;7a1- transmitting terminal;The receiving end 7a2-;7b- slot door control mechanism;7c- Track;7d- sliding block.
Specific embodiment
Embodiment one
A kind of anti-pinch device that the first embodiment of the utility model provides, the technique for being installed on semiconductor processing equipment In cushion chamber 4 between chamber 2 and transmission cavity 3, cushion chamber 4 includes upper cover 4a, bottom 4b and side wall 4c, is opened up on side wall 4c There is slit 6, cushion chamber 4 further includes slot door 5, controls the slit 6 and carries out closure or openness, anti-pinch device includes wafer induction Mechanism (not shown) and slot door control mechanism 7b;Wafer induction mechanism detects the position of wafer 1 and gates with slit Mechanism 7b communication connection processed;Slot door control mechanism 7b controls the folding shape of slot door 5 based on the signal of wafer induction mechanism State.
In simple terms, whether wafer induction mechanism is used for cushion chamber 4, especially proximate to having at the side wall 4c of process cavity 2 Wafer 1, which is fallen, to be detected, so that it is guaranteed that when slot door 5 is closed, the wafer 1 or not unrecovered that does not fall at slit 6 Mechanical arm 3a.
In the present embodiment, shown in Figure 3, concrete operations when slot door 5 is closed are as follows: first from the bottom of cushion chamber 4 It is corresponding with slit 6 on the position of same level height that 4b rises arrival, then moves towards slit 6, until the two docking To which cavity be sealed.Therefore, have wafer 1 fall at slit 6 or mechanical arm 3a fail withdraw and be not timely detected In the case where arriving, wafer 1 or mechanical arm 3a can be clipped to by slot door 5, be caught broken so as to cause wafer 1 or mechanical arm 3a goes out Now damage.
Specifically, in the present embodiment, referring to figure 1 and figure 2, wafer induction mechanism is photoelectric sensor 7a, And photoelectric sensor 7a includes opposed transmitting terminal 7a1 and receiving end 7a2.
Photoelectric sensor 7a small volume, will not influence the opening and closing movement of slot door.And its sensitivity detected is higher, Therefore can be more accurately to whether thering is wafer 1 to fall on slit 6 to detect.Wherein, transmitting terminal 7a1 is to receiving end 7a2 Emitting light can illustrate do not have between transmitting terminal 7a1 and receiving end 7a2 if receiving end 7a2 can normally receive light Foreign matter.In the present embodiment, shown in Figure 1, receiving end 7a2 and transmitting terminal 7a1 are separately positioned on 6 two sides of slit, once When having wafer 1 to fall on slit 6, light can be stopped by wafer 1, therefore receiving end 7a2 can not receive light.At this point, photoelectric transfer Sensor 7a can inform that slot door control mechanism 7b has wafer 1 to fall by way of changing circuit state, and pass through slot door Control mechanism 7b stops the operation of closed slits door 5, to realize the protection to wafer 1.And it is fallen in when detecting no wafer 1 When at slit 6, control slot door 5 is closed.
Also, in the present embodiment, the side in bottom 4b or upper cover 4a is arranged in transmitting terminal 7a1, and receiving end 7a2 is set Another party in bottom 4b or upper cover 4a is set, and leaning on for bottom 4b or upper cover 4a is arranged in receiving end 7a2 and transmitting terminal 7a1 The side edge of nearly slit 6.
Referring to figure 1 and figure 2, transmitting terminal 7a1 and receiving end 7a2 are respectively arranged to upper cover 4a or the bottom of cushion chamber 4 Portion 4b is not susceptible to deviate, to enable photoelectric sensor 7a so that transmitting terminal 7a1 and receiving end 7a2 are mounted so as to stronger Enough effectively work, detects the wafer 1 fallen in time.And setting can also retain biggish space therebetween in this way, So that opening and closing movement of the slot door 5 in cushion chamber 4 is gone on smoothly.In the present embodiment, it is arranged with transmitting terminal 7a1 Upper cover 4a, receiving end 7a2 are illustrated for the bottom 4b of cushion chamber 4 is arranged in.
In addition, in the present embodiment, wafer induction mechanism is installed in the plane of the side wall 4c where slit 6, i.e. bottom The part that the side edge of the close slit 6 of portion 4b or upper cover 4a connects with side wall 4c.
Wafer induction mechanism is arranged in the plane where slit 6, thus reduce wafer induction mechanism to slit 6 away from From, can further increase the precision of wafer induction mechanism and more delicately detection fall the wafer 1 at slit 6.
Specifically, in the present embodiment, shown referring to Fig. 1, Fig. 2 and Fig. 4, cushion chamber 4 is arranged in receiving end 7a2 Bottom 4b is simultaneously bonded with the side for being provided with slit 6.Similarly, when upper cover 4a is closed, it is arranged in upper cover 4a and and receiving end 7a2 opposed transmitting terminal 7a1 can be also bonded with the side for being provided with slit 6.To reduce photoelectric sensor 7a and slit 6 The distance between mode improve to wafer 1 detect accuracy.
Preferably, in the present embodiment, photoelectric sensor 7a is provided with multiple.
Wherein, multiple photoelectric sensor 7a are successively set at slit 6, can be refined detection range and be improved detection essence Degree, when at the different location that wafer 1 falls in slit 6, can also be detected by photoelectric sensor 7a, so that preferably protection is brilliant Circle 1.
Specifically, in the present embodiment, shown in Figure 5, be so that 3 photoelectric sensor 7a to be arranged at slit 6 Example.One of photoelectric sensor 7a is arranged on the central axes of slit 6, other two photoelectric sensor 7a are symmetricly set on two Side and the both ends of close slit 6.
When wafer 1 falls on 6 middle part of slit, the photoelectric sensor 7a that can be arranged on 6 central axes of slit is detected, To prevent slot door 5 from being closed to realize the protection to wafer 1 by control mechanism.When 1 only a fraction of wafer falls in slit 6 When at both ends, the photoelectric sensor 7a being arranged on 6 central axes of slit can not detect wafer 1, if closing slit at this time Door 5 then will lead to wafer 1 and be caught broken.But it, can be 7a pairs by other two photoelectric sensor after 3 photoelectric sensor 7a are set Whether there is wafer 1 to be detected at the both ends of slit 6, so that wafer 1 and machine can preferably be protected by improving the precision of detection Tool arm 3a.Certainly, as the density of setting photoelectric sensor 7a improves, detection effect can also be increased accordingly.
In summary consider, anti-pinch device provided by the utility model can by wafer induction mechanism at slit 6 into Row real-time monitoring, whether observation has wafer 1 to fall on slit 6 when slot door 5 prepares and closes and whether mechanical arm 3a It is withdrawn from cushion chamber 4, and controls 5 closure or openness of slot door in time according to monitoring result, realized to wafer 1 and manipulator The protection of arm 3a, to save production cost.
Embodiment two
The second embodiment of the utility model provides a kind of anti-pinch device, and present embodiment is to first embodiment Further improvement, mainly the improvement is that, in the second embodiment of the utility model, further include driving device and A plurality of tracks 7c, track 7c are arranged in upper cover 4a and bottom 4b, sliding part are equipped on every track 7c, in each sliding part On be removably installed transmitting terminal 7a1 or receiving end 7a2.
Also, in the present embodiment, the external setting of driving device, and sliding part can be under the control of driving device Synchronously move.
When slot door 5 prepares to close, driving device controls sliding block 7d and is moved to the other end from one end of track 7c, and And transmitting terminal 7a1 and receiving end 7a2 are oppositely arranged and synchronously move, and can ensure that transmitting terminal 7a1 is issued during the motion Light receiving end 7a2 receive so that photoelectric sensor 7a generate light be scanned across slit 6, thus to being at slit 6 It is no have wafer 1 fall or unreclaimed mechanical arm 3a carry out the higher detection of precision, and photoelectric sensor 7a scanning behaviour It needs to complete between the closure of slot door 5.When finding to have foreign matter at slit 6 by photoelectric sensor 7a, pass through slit Door control mechanism 7b stops the closed action of slot door 5 in time.
Specifically, shown in Figure 6, in the present embodiment, track 7c is had two and is arranged in opposed mode, tool Body is separately positioned on the bottom 4b of upper cover 4a and cushion chamber 4, and the extending direction of two track 7c is the length side of slit 6 To.The sliding block 7d that can be slided under driving device control along track 7c, and sliding block are provided in every track 7c 7d keeps opposed state in sliding process.It is removably disposed photoelectric sensor respectively on the opposite face two sliding block 7d The transmitting terminal 7a1 and receiving end 7a2 of 7a, and receiving end 7a2 can receive the light of transmitting terminal 7a1 sending.It is moved in sliding block 7d When dynamic, photoelectric sensor 7a is moved together, and makes light with scanning mode by slit 6, to whether have at slit 6 wafer 1 or Person's mechanical arm 3a is detected.If testing result normally if 5 normal switching-off of slot door;If detecting when having abnormal at slit 6, Slot door control mechanism 7b prevents slot door 5 from closing, so that wafer 1 or mechanical arm 3a be protected not to be gripped to.
Present embodiment makes static detection become dynamic detection in a manner of track 7c and sliding block 7d is arranged and cooperates, thus So that the detection process of photoelectric sensor 7a is more continuous, it is capable of the detection range of further expansion photoelectric sensor 7a, improves Detection accuracy of the photoelectric sensor 7a at slit 6, further ensuring that can be detected when there is wafer 1 to fall at slit 6 It arrives, to take safeguard measure to wafer 1 in time.
In addition, in the present embodiment, anti-pinch device further includes the alarm mechanism (figure with the communication connection of wafer induction mechanism In be not shown), wafer induction mechanism to alarm mechanism send signal, by alarm mechanism issue remind.
When being equipped with foreign matter at wafer induction mechanism detects slit 6, it can be sounded an alarm by alarm mechanism, cause to grasp Make personnel's note that can be adjusted in time to semiconductor processing equipment.
It will be understood by those skilled in the art that in above-mentioned each embodiment, in order to keep reader more preferably geographical It solves the application and proposes many technical details.But even if without these technical details and based on the respective embodiments described above Various changes and modifications can also realize each claim of the application technical solution claimed substantially.Therefore, in reality In, can to above embodiment, various changes can be made in the form and details, without departing from the spirit of the utility model And range.

Claims (8)

1. a kind of anti-pinch device is installed in the cushion chamber between the process cavity of semiconductor processing equipment and transmission cavity, described slow Rushing chamber includes upper cover, bottom and side wall, and slit is offered on the side wall, and the cushion chamber further includes slot door, control The slit carries out closure or openness, which is characterized in that the anti-pinch device includes wafer induction mechanism and slot door control Mechanism;
The wafer induction mechanism detects the position of the wafer and communicates to connect with the slot door control mechanism;
The slot door control mechanism controls the folding condition of the slot door based on the signal of the wafer induction mechanism.
2. anti-pinch device according to claim 1, which is characterized in that the wafer induction mechanism is photoelectric sensor, and And the photoelectric sensor includes opposed transmitting terminal and receiving end.
3. anti-pinch device according to claim 2, which is characterized in that transmitting terminal setting the bottom or it is described on A side in lid, the receiving end are arranged in another party in the bottom or the upper cover, and the receiving end and described The side edge close to the slit of the bottom or the upper cover is arranged in transmitting terminal.
4. anti-pinch device according to claim 2, which is characterized in that the wafer induction mechanism is installed on where slit In the plane of the side wall.
5. according to described in any item anti-pinch devices of claim 2-4, which is characterized in that the photoelectric sensor is provided with more It is a.
6. anti-pinch device according to claim 2, which is characterized in that it further include driving device and a plurality of tracks, it is described Track is arranged in the upper cover and the bottom, sliding part is equipped on every track, on each sliding part It has been removably installed the transmitting terminal or the receiving end.
7. anti-pinch device according to claim 6, which is characterized in that the sliding part can be in the control of the driving device It is synchronously moved under system.
8. anti-pinch device according to claim 7, which is characterized in that further include being communicated to connect with the wafer induction mechanism Alarm mechanism, the wafer induction mechanism to the alarm mechanism send signal, by the alarm mechanism issue remind.
CN201821219000.0U 2018-07-30 2018-07-30 Anti-pinch device Active CN208589424U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821219000.0U CN208589424U (en) 2018-07-30 2018-07-30 Anti-pinch device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821219000.0U CN208589424U (en) 2018-07-30 2018-07-30 Anti-pinch device

Publications (1)

Publication Number Publication Date
CN208589424U true CN208589424U (en) 2019-03-08

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CN (1) CN208589424U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112392978A (en) * 2020-11-11 2021-02-23 上海华力集成电路制造有限公司 Slit valve device
WO2021218942A1 (en) * 2020-04-29 2021-11-04 长鑫存储技术有限公司 Wafer processing device and wafer transferring method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021218942A1 (en) * 2020-04-29 2021-11-04 长鑫存储技术有限公司 Wafer processing device and wafer transferring method
CN112392978A (en) * 2020-11-11 2021-02-23 上海华力集成电路制造有限公司 Slit valve device

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