CN208580721U - Wafer transmission system and semiconductor processing equipment - Google Patents
Wafer transmission system and semiconductor processing equipment Download PDFInfo
- Publication number
- CN208580721U CN208580721U CN201820710174.0U CN201820710174U CN208580721U CN 208580721 U CN208580721 U CN 208580721U CN 201820710174 U CN201820710174 U CN 201820710174U CN 208580721 U CN208580721 U CN 208580721U
- Authority
- CN
- China
- Prior art keywords
- chamber
- transmission
- wafer
- switch
- switch structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of wafer transmission system and semiconductor processing equipments.It include: transmission platform；At least two-stage transmission chamber interconnected, is successively set on the transmission platform, the first transmission manipulator is mounted in the transmission chambers at different levels, also, the lateral wall of the transmission chamber at different levels is mounted with multiple processing chambers；At least one first switch structure, between neighboring transmission chamber, so that the two neighboring transmission chamber selectively communicates with；Multiple second switch structures, be located at the transmission platform inside, and each second switch structure correspond to a processing chamber so that the processing chamber with its corresponding to transmission chamber selectively communicate with.First switch structure and second switch structure are installed in inside transmission platform, in this way, first switch structure and second switch structure can reduce the volume of transmission platform using identical mounting means so as to improve the maintainability of the wafer transmission system.
Description
Technical field
The utility model relates to semi-conductor device technology fields, and in particular to a kind of wafer transmission system and it is a kind of include should
The semiconductor processing equipment of wafer transmission system.
Background technique
Wafer transmission system is the important component in semiconductor manufacturing equipment.It, can be to silicon wafer during chip manufacture
Circle carries out a series of processing: absolute vacuum, chemical attack, and energetic plasma is hit and strong ultraviolet radiation etc.,
After the procedure of processing of hundreds of roads dispersion, it is electric that Silicon Wafer can just be polished into CPU, storage chip and graphics processor etc.
Sub- device.These process are very high to environmental requirement, therefore most of work all carry out in sealing vacuum chamber, pass through transmission
Wafer is moved on to another processing chamber from a processing chamber by system.
Generally, wafer transmission system includes transmission platform, the loading chamber being sequentially arranged on the transmission platform,
Primary Transmit chamber, second level transmission chamber etc., first order transmission chamber and second level transmission chamber are outer to hang with processing chamber.
Also, it is provided with valve between two-stage transmission chamber, is additionally provided with valve between the outside and each processing chamber of transmission platform
Door.
But the wafer transmission system of above structure, it is limited by the shape limitation of second level transmission chamber, the work mounted
The negligible amounts of skill chamber are unable to satisfy more processing chamber requirements.Secondly, valve and transmission platform inside transmission platform
External valve, due to installation site difference, the valve of position needs separately installed at two, also, due to the valve of position at two
Door mounting means is different, and selected valve model is also different, causes interchangeability not strong, increase the maintenance of wafer transmission system at
This.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art, proposes a kind of wafer transfer
System and a kind of semiconductor processing equipment including the wafer transmission system.
To achieve the goals above, the utility model in a first aspect, providing a kind of wafer transmission system, comprising:
Transmission platform；
At least two-stage transmission chamber interconnected, is successively set on the transmission platform, the transmission cavities at different levels
Interior is mounted on the first transmission manipulator, also, the lateral wall of the transmission chamber at different levels is mounted with multiple processing chambers；
At least one first switch structure, between neighboring transmission chamber, so that the two neighboring transmission chamber
It selectively communicates with；
Multiple second switch structures are located inside the transmission platform, and each second switch structure corresponding one
A processing chamber so that the processing chamber with its corresponding to transmission chamber selectively communicate with.
Optionally, further includes:
At least one connecting chamber, between two adjacent transmission chambers, the both ends of the connecting chamber respectively with
Adjacent two transmission chambers connection；Also,
The first switch is provided at the position that the connecting chamber two transmission chambers adjacent with this are connected
Structure, so that the connecting chamber two transmission chambers adjacent with this selectively communicate with.
Optionally, the first switch structure and the second switch structure include switch valve.
Optionally, the switch valve of the first switch structure is identical as the switch valve model of the second switch structure.
Optionally, further includes:
Front end chamber is mounted therein with the second transmission manipulator；
Chamber is loaded, between the front end chamber and first order transmission chamber, the both ends difference for loading chamber
It is connect with the front end chamber and the first order transmission chamber；Also,
Described load is respectively provided at the position that chamber is connected with the front end chamber, the first order transmission chamber
First switch structure is stated, so that the loading chamber selectively connects with the front end chamber, the first order transmission chamber
It is logical.
Optionally, including two-stage transmission chamber, respectively first order transmission chamber and second level transmission chamber；
The first order transmission chamber and the first order transmission chamber are vacuum transmission chamber, first conveyer
Tool hand is vacuum mechanical-arm；
The cross section of the lateral wall of the first order transmission chamber is transversal with the lateral wall of the second level transmission chamber
Face is in polygonized structure；
Each Bian Shangjun of the polygonized structure is mounted with the processing chamber.
Optionally, the cross section of the lateral wall of the first order transmission chamber is in quadrilateral structure；
The hexagonal structure in cross section of the lateral wall of the second level transmission chamber.
Optionally, further includes:
At least one loading stage is mounted on the transmission platform；It is placed on the loading stage for accommodating chip
Wafer case；
The loading stage and the front end chamber.
Optionally, further includes:
Control module, it is equal with control terminal, the control terminal of each second switch structure of each first switch structure
Electrical connection, to control the switch state of the first switch structure and the second switch structure.
The second aspect of the utility model provides a kind of semiconductor processing equipment, including the crystalline substance recorded above
Circle Transmission system.
The wafer transmission system of the utility model, by being provided at least two-stage transmission chamber, and transmission chamber at different levels is equal
Multiple processing chambers can be hung with outside, can significantly improve the type of the be able to carry out technique of wafer transmission system.In addition, this reality
With novel wafer transmission system, first switch structure and second switch structure are installed in inside transmission platform, in this way, the
One construction of switch and second switch structure can use identical mounting means, can so as to improve the wafer transmission system
Maintainability reduces the volume of transmission platform.
The semiconductor processing equipment of the utility model has the wafer transmission system recorded above, by be provided with to
Few two-stage transmission chamber, and transmission chamber at different levels can hang with multiple processing chambers outside, can significantly improve wafer transfer system
The type for be able to carry out technique of uniting.In addition, first switch structure and second switch structure are installed in inside transmission platform, this
Sample, first switch structure and second switch structure can use identical mounting means, so as to improve the semiconductor equipment
Maintainability, reduce the volume of transmission platform.
Detailed description of the invention
Attached drawing is to be used to provide a further understanding of the present invention, and constitute part of specification, and following
Specific embodiment be used to explain the utility model together, but do not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of wafer transmission system in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of wafer transmission system in another embodiment of the utility model.
Description of symbols
100: wafer transmission system；
110: transmission platform；
120: transmission chamber；
121: the first transmission manipulators；
122: processing chamber；
123: first order transmission chamber；
124: second level transmission chamber；
130: first switch structure；
140: second switch structure；
150: connecting chamber；
160: front end chamber；
161: the second transmission manipulators；
170: loading chamber；
180: loading stage；
190: control module.
Specific embodiment
Specific embodiment of the present utility model is described in detail below in conjunction with attached drawing.It should be understood that herein
Described specific embodiment is only used for describing and explaining the present invention, and is not intended to limit the utility model.
As depicted in figs. 1 and 2, the utility model in a first aspect, be related to a kind of wafer transmission system 100, including transmission
Platform 110, at least two-stage transmission chamber 120 interconnected, at least one first switch structure 130 and multiple second switch knots
Structure 140.
Wherein, transmission chambers 120 at different levels are successively set on transmission platform 110, are respectively mounted in transmission chambers 120 at different levels
There is the first transmission manipulator 121, also, the lateral wall of transmission chamber at different levels 120 is mounted with multiple processing chambers 122.
Between arbitrary neighborhood two-stage transmission chamber 120, it is provided with above-mentioned first switch structure 130, in this way, can lead to
The effect of first switch structure 130 is crossed, so that adjacent two-stage transmission chamber 120 selectively communicates with.
In the inside of transmission platform 110, it is provided with above-mentioned second switch structure 140, each second switch structure 140 is right
Answer a processing chamber 122 so that the processing chamber 121 with its corresponding to transmission chamber 120 selectively communicate with.Example
Such as, as shown in Figure 1, second switch structure 140 may be mounted on the inner sidewall of transmission platform 110.Alternatively, can also transmit
Platform interior is provided with a fixed bracket, which is fixedly connected with transmission platform, and the other end is used to support
Second switch structure 140.Certainly, other than this two ways, it is also an option that other set-up modes.
Specifically, as shown in Figure 1, wafer transmission system 100 may include two-stage transmission chamber 120, the respectively first order
Transmission chamber 123 and second level transmission chamber 124, first order transmission chamber 123 can be plug-in there are four processing chamber 122, the
Secondary transport chamber 124 can be plug-in there are six processing chamber 122, the function that each processing chamber 122 is realized can it is identical or
Person is different, for example, processing chamber 122 can be pre-cleaning cavity, go to gas chamber and coating chamber etc..
More specifically, as depicted in figs. 1 and 2, wafer is transferred in first order transmission chamber 123, it is assumed that the first order passes
Four plug-in processing chambers 122 of defeated chamber 123 are configured as Liang Gequ gas chamber and two pre-cleaning cavities, in the first order
In transmission chamber 123, according to process requirements, wafer needs to carry out degassing first, at this point it is possible to control gas chamber and the first order
First switch structure 130 between transmission chamber 123 is opened, so that wafer is by first in first order transmission chamber 123
Transmission manipulator 121 is transmitted to gas chamber, later, removes the first switch knot between gas chamber and first order transmission chamber 123
Structure 130 is closed, so that wafer is going to carry out degassing technique in gas chamber.After technique completion, air cavity is removed in control
First switch structure 130 between room and first order transmission chamber 123 reopens, first in first order transmission chamber 123
Transmission manipulator 121 is from the wafer that taking-up technique is completed in gas chamber is removed, and later, which is again switched off.Its
The switch motion of his processing chamber 122 and the first switch structure 130 corresponding to it and go to gas chamber and first order transmission chamber
The switch motion of first switch structure 130 between 123 is essentially identical, and therefore not to repeat here.
It should be noted that according to actual needs, wafer transmission system 100 can also include the transmission chamber of more stages
120, equally, the plug-in quantity of transmission chambers 120 at different levels can also include more or less etc..
The wafer transmission system 100 of the present embodiment structure, by being provided at least two-stage transmission chamber 120, and biography at different levels
Defeated chamber 120 can hang with multiple processing chambers 122 outside, can significantly improve the be able to carry out work of wafer transmission system 100
The type of skill.In addition, in the wafer transmission system 100 of the structure, first switch structure 130 and second switch structure 140
It is installed in inside transmission platform 110, in this way, first switch structure 130 and second switch structure 140 can use identical peace
Dress mode reduces the volume of transmission platform 110 so as to improve the maintainability of the wafer transmission system 100.
Optionally, as depicted in figs. 1 and 2, wafer transmission system 100 further includes at least one connecting chamber 150.The connection
Chamber 150 can be between two adjacent transmission chambers 120, the both ends of the connecting chamber 150 respectively adjacent with this two
A transmission chamber 120 connects.Also, it is all provided at the position that two transmission chambers 120 adjacent with this of connecting chamber 150 are connected
It is equipped with first switch structure 130, so that two transmission chambers 120 adjacent with this of connecting chamber 150 selectively communicate with.
It specifically, as depicted in figs. 1 and 2, for example, can be in first order transmission chamber 123 and second level transmission chamber 124
Between be provided with above-mentioned connecting chamber 150.
The wafer transmission system 100 of the present embodiment structure is provided with connecting chamber between adjacent two-stage transmission chamber 120
150, the bridge beam action for being connected to adjacent two-stage transmission chamber 120 is played, also, connecting chamber 150 also acts as the work of transition
With to improve the process yields of wafer.
Optionally, above-mentioned first switch structure 130 and second switch structure 140 may each comprise switch valve.Also, first
The switch valve of construction of switch 130 can be identical with the model of the switch valve of second switch structure 140.
In this way, identical mounting means can be used when assembling first switch structure 130 and second switch structure 140,
So as to improve the maintainability of the wafer transmission system 100, the volume of transmission platform 110 is reduced.
Optionally, as depicted in figs. 1 and 2, wafer transmission system 100 further includes front end chamber 160 and loading chamber 170.
Wherein, the second transmission manipulator 161 is installed in front end chamber 160.It loads chamber 170 and is located at front end chamber 160 and the first order
Between transmission chamber 123, the both ends of the loading chamber 170 are connect with front end chamber 160 and first order transmission chamber 123 respectively.
Also, it loads and is provided with first switch at the position that chamber 170 is connected with front end chamber 160, first order transmission chamber 123
Structure 130 selectively communicates with so that loading chamber 170 with front end chamber 160, first order transmission chamber 123.
Optionally, as depicted in figs. 1 and 2, above-mentioned first order transmission chamber 123 and second level transmission chamber 124 are true
Empty transmission chamber, correspondingly, the first transmission manipulator 121 are vacuum mechanical-arm.The second transmission in above-mentioned front end chamber 160
Manipulator 161 is atmospheric mechanical hand.
Wherein, the lateral wall of the cross section of the lateral wall of above-mentioned first order transmission chamber 123 and second level transmission chamber 124
Cross section be in polygonized structure, each Bian Shangjun of the polygonized structure is mounted with above-mentioned processing chamber 122.
Specifically, as depicted in figs. 1 and 2, the cross section of the lateral wall of first order transmission chamber 123 is in quadrilateral structure,
That is, four sides corresponding to the quadrilateral structure are mounted with one on the lateral wall of first order transmission chamber 123
Processing chamber 122.The hexagonal structure in the cross section of the lateral wall of second level transmission chamber 124, that is to say, that passed in the second level
On the lateral wall of defeated chamber 124, six sides corresponding to the hexagonal structure are mounted with a processing chamber 122.
The wafer transmission system 100 of the present embodiment structure, by changing the shape of second level transmission chamber 124, so as to
To dramatically increase the quantity for the processing chamber 122 that it is mounted, and then can significantly improve wafer transmission system 100 can be into
The type of row technique improves the production efficiency of wafer, reduces cost of manufacture.
Optionally, as depicted in figs. 1 and 2, wafer transmission system 100 further includes at least one loading stage 180, for example, such as
It may include three loading stages 180 shown in Fig. 1 and Fig. 2.The loading stage 180 is mounted on transmission platform 110, the loading stage
The wafer case (in figure and unlabeled) for accommodating chip is placed on 180.Wherein, loading stage 180 and front end chamber 160 connect
It is logical.
Optionally, for the ease of the switch state of above-mentioned first switch structure 130 and second switch structure 140.Such as Fig. 1 and
Shown in Fig. 2, wafer transmission system 100 further includes control module 190, wherein the control module 190 and each first switch structure
130 control terminal, the control terminal of each second switch structure 140 are electrically connected, to control first switch structure 130 and second switch
The switch state of structure 140.
The second aspect of the utility model provides a kind of semiconductor processing equipment (not showing that in figure), including above
The wafer transmission system 100 of record.
The semiconductor processing equipment of the utility model has the wafer transmission system 100 recorded above, by being provided with
At least two-stage transmission chamber 120, and transmission chamber at different levels 120 can hang with multiple processing chambers 122 outside, can significantly improve
The type of the be able to carry out technique of wafer transmission system 100.In addition, first switch structure 130 and second switch structure 140 are pacified
Inside transmission platform 110, in this way, first switch structure 130 and second switch structure 140 can use identical installation side
Formula reduces the volume of transmission platform 110 so as to improve the maintainability of the semiconductor equipment.
It is understood that embodiment of above is merely to illustrate that the principles of the present invention and uses exemplary
Embodiment, however the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case where the spirit and essence of utility model, various changes and modifications can be made therein, these variations and modifications are also considered as this reality
With novel protection scope.
Claims (10)
1. a kind of wafer transmission system characterized by comprising
Transmission platform；
At least two-stage transmission chamber interconnected, is successively set on the transmission platform, in the transmission chambers at different levels
It is mounted on the first transmission manipulator, also, the lateral wall of the transmission chamber at different levels is mounted with multiple processing chambers；
At least one first switch structure, between two neighboring transmission chamber, so that the two neighboring transmission chamber
It selectively communicates with；
Multiple second switch structures are located inside the transmission platform, and each second switch structure corresponds to an institute
State processing chamber so that the processing chamber with its corresponding to transmission chamber selectively communicate with.
2. wafer transmission system according to claim 1, which is characterized in that further include:
At least one connecting chamber, between two adjacent transmission chambers, the both ends of the connecting chamber respectively with the phase
Adjacent two transmission chambers connection；Also,
It is provided with the first switch structure at the position that the connecting chamber two transmission chambers adjacent with this are connected,
So that the connecting chamber two transmission chambers adjacent with this selectively communicate with.
3. wafer transmission system according to claim 2, which is characterized in that the first switch structure and described second is opened
Closing structure includes switch valve.
4. wafer transmission system according to claim 3, which is characterized in that the switch valve of the first switch structure and institute
The switch valve model for stating second switch structure is identical.
5. wafer transmission system as claimed in any of claims 1 to 4, which is characterized in that further include:
Front end chamber is mounted therein with the second transmission manipulator；
Load chamber, positioned at the front end chamber and first order transmission chamber between, it is described loading chamber both ends respectively with institute
Front end chamber is stated to connect with the first order transmission chamber；Also,
Described load is provided with described the at the position that is connected with the front end chamber, the first order transmission chamber of chamber
One construction of switch, so that the loading chamber is selectively communicated with the front end chamber, the first order transmission chamber.
6. wafer transmission system as claimed in any of claims 1 to 4, which is characterized in that including two-stage transmission cavity
Room, respectively first order transmission chamber and second level transmission chamber；
The first order transmission chamber and the second level transmission chamber are vacuum transmission chamber, first transmission manipulator
For vacuum mechanical-arm；
The cross section of the lateral wall of the first order transmission chamber and the cross section of the lateral wall of the second level transmission chamber are equal
In polygonized structure；
Each Bian Shangjun of the polygonized structure is mounted with the processing chamber.
7. wafer transmission system according to claim 6, which is characterized in that
The cross section of the lateral wall of the first order transmission chamber is in quadrilateral structure；
The hexagonal structure in cross section of the lateral wall of the second level transmission chamber.
8. wafer transmission system according to claim 5, which is characterized in that further include:
At least one loading stage is mounted on the transmission platform；The chip for accommodating chip is placed on the loading stage
Box；
The loading stage and the front end chamber.
9. wafer transmission system as claimed in any of claims 1 to 4, which is characterized in that further include:
Control module is electrically connected with the control terminal of each first switch structure, the control terminal of each second switch structure
It connects, to control the switch state of the first switch structure and the second switch structure.
10. a kind of semiconductor processing equipment, which is characterized in that including wafer transfer described in any one of claim 1 to 9
System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820710174.0U CN208580721U (en) | 2018-05-14 | 2018-05-14 | Wafer transmission system and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820710174.0U CN208580721U (en) | 2018-05-14 | 2018-05-14 | Wafer transmission system and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208580721U true CN208580721U (en) | 2019-03-05 |
Family
ID=65507526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820710174.0U Active CN208580721U (en) | 2018-05-14 | 2018-05-14 | Wafer transmission system and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208580721U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544660A (en) * | 2018-08-02 | 2019-12-06 | 北京北方华创微电子装备有限公司 | Modular wafer transfer system and semiconductor device |
| CN112331548A (en) * | 2020-10-26 | 2021-02-05 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| CN112331547A (en) * | 2020-10-26 | 2021-02-05 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| CN116864415A (en) * | 2023-07-07 | 2023-10-10 | 北京屹唐半导体科技股份有限公司 | Process platform |
-
2018
- 2018-05-14 CN CN201820710174.0U patent/CN208580721U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110544660A (en) * | 2018-08-02 | 2019-12-06 | 北京北方华创微电子装备有限公司 | Modular wafer transfer system and semiconductor device |
| CN110544660B (en) * | 2018-08-02 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Modular wafer transfer system and semiconductor device |
| CN112331548A (en) * | 2020-10-26 | 2021-02-05 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| CN112331547A (en) * | 2020-10-26 | 2021-02-05 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| CN116864415A (en) * | 2023-07-07 | 2023-10-10 | 北京屹唐半导体科技股份有限公司 | Process platform |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208580721U (en) | Wafer transmission system and semiconductor processing equipment | |
| US8870514B2 (en) | Semiconductor manufacturing process module | |
| CN104380452B (en) | There is independent the energy arm-and-hand system in main body turning stage casing, Apparatus and method for | |
| US20080219810A1 (en) | Semiconductor manufacturing process modules | |
| JP2020115558A (en) | Mixed-platform apparatus, systems and methods for substrate processing | |
| TW201417209A (en) | Method and system related to semiconductor processing equipment | |
| JP2005079409A5 (en) | ||
| WO2007103887A2 (en) | Semiconductor manufacturing process modules | |
| US9698036B2 (en) | Stacked wafer cassette loading system | |
| US10229847B2 (en) | Substrate transfer chamber and container connecting mechanism with lid opening mechanisms | |
| CN102064123A (en) | Vacuum processing system and vacuum processing method of semiconductor processing substrate | |
| US20080145192A1 (en) | Semiconductor manufacturing process modules | |
| JP2013077819A5 (en) | ||
| US20080260499A1 (en) | Facet adapter for a wafer handler | |
| US20130085593A1 (en) | Modular semiconductor processing system | |
| CN110544660B (en) | Modular wafer transfer system and semiconductor device | |
| EP1237178B1 (en) | Self-supporting adaptable metrology device | |
| KR20110006093A (en) | A chamber and substrates treating method using the chamber | |
| US9962840B2 (en) | Substrate conveyance apparatus | |
| CN109841552B (en) | Modular press station and method for processing semiconductor using the same | |
| CN112786507A (en) | Modular semiconductor equipment transmission cavity unit and wafer transmission system | |
| US20100014945A1 (en) | Semiconductor processing apparatus having all-round type wafer handling chamber | |
| CN117690842A (en) | Wafer transmission system and semiconductor device | |
| JP2004080053A (en) | Semiconductor manufacturing apparatus | |
| JP2005166952A (en) | Storage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |