CN112786507A - Modular semiconductor equipment transmission cavity unit and wafer transmission system - Google Patents
Modular semiconductor equipment transmission cavity unit and wafer transmission system Download PDFInfo
- Publication number
- CN112786507A CN112786507A CN202110043221.7A CN202110043221A CN112786507A CN 112786507 A CN112786507 A CN 112786507A CN 202110043221 A CN202110043221 A CN 202110043221A CN 112786507 A CN112786507 A CN 112786507A
- Authority
- CN
- China
- Prior art keywords
- conveying
- wafer
- cavity
- module
- semiconductor equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a modular semiconductor device transmission cavity unit and a wafer transmission system, wherein the transmission cavity unit comprises: the conveying cavity is of a regular polygon structure, each edge of the conveying cavity is provided with a conveying channel, and each conveying channel can be in butt joint with the plug-in module or another conveying cavity through a communicating structure; and the moving assembly is used for realizing the grabbing of the wafer and the conveying between the adjacent cavities. The transmission cavity is designed into a regular polygon structure, and the shape and the specification size of each transmission channel are completely consistent, so that the whole equipment can be freely butted and combined according to different installation sites, and the flexibility and the applicability are improved. In addition, a single-channel communication structure is adopted for butt joint among the cavities, so that at least one plug-in module is added to the secondary cavity. Meanwhile, the conveying cavity can adopt standard modular production due to the design, and the maintenance and the replacement are more convenient and quicker; the efficiency of production, installation and maintenance has greatly been improved.
Description
Technical Field
The invention belongs to the field of semiconductor manufacturing equipment, and particularly relates to a modular semiconductor equipment transmission cavity unit and a wafer transmission system.
Background
In order to meet the process requirements of semiconductor processing, most of the existing semiconductor processing equipment has a two-stage transmission cavity structure, namely: the functional transfer cavity and the process transfer cavity are two cavities; each conveying cavity can be externally hung with a plurality of functional modules and process modules according to process requirements; and the two stages of conveying cavities are butted in a double-channel connection mode, so that the wafers are conveyed in and out under the operation of the manipulator.
On one hand, the existing equipment structure is only suitable for a specific process flow, different equipment structures are required to be customized from manufacturers according to different process requirements, modular production cannot be achieved, and flexibility, interchangeability and applicability are poor during assembly.
On the other hand, the two-channel connection mode is adopted, two interfaces (or a larger external hanging space) are required to be occupied for the second-stage conveying cavity, and the two-channel connection mode is adopted, so that the two interfaces are required to be occupied for the second-stage conveying cavity, and therefore, the process flow applicable to the whole equipment has great limitation due to the limitation of the number of external hanging modules for the existing equipment. For example, for a regular octagonal configuration, a maximum of six process modules can be hung without the two interfaces occupied by the "dual channels" under the constraints of the overall configuration of the process modules and the platform.
Considering the need for process complexity, one solution is: the number of the external hanging process modules of the equipment is increased by increasing the integral volume of the equipment, so that the requirement of process complexity is met. However, as for semiconductor devices, increasing the volume of the device undoubtedly requires increasing the occupied area of the whole device, which results in extremely increased construction cost of the whole device; therefore, the existing design has a great limitation on the processing of the complex process flow requiring multiple process chambers.
Therefore, how to realize the modularization of the cavity and increase the external hanging cavities becomes a problem which needs to be solved urgently by the personnel in the field.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a modular semiconductor device transfer chamber unit and a wafer transfer system, which are used to solve the problems of limited number of external process modules of the transfer chamber, difficulty in modularization and inflexibility in use in the prior art.
To achieve the above and other related objects, the present invention provides a modular semiconductor device transfer chamber unit, comprising: the conveying cavity is of a regular polygon structure, each side of the regular polygon is provided with a conveying channel, and each conveying channel can be in butt joint with the plug-in module or another conveying cavity through a communicating structure; and the moving assembly is arranged in the conveying cavity and is used for realizing the grabbing of the wafer and the conveying between the adjacent cavities.
Optionally, the communicating structure is provided with a first conveying channel and a second conveying channel which are distributed up and down and independent, and penetrate through a first side surface and a second side surface of the communicating structure, and the first conveying channel and the second conveying channel are used for realizing wafer conveying between adjacent cavities; the first side surface and the second side surface are provided with butt joint parts for connecting the cavity and the communicating structure; the upper surface and the lower surface of the communicating structure are respectively provided with a first wafer placing chamber and a second wafer placing chamber which are independent from each other and are not communicated, and the first wafer placing chamber and the second wafer placing chamber are respectively communicated with the first conveying channel and the second conveying channel and are used for transferring and storing wafers which are processed or finished.
Optionally, a valve assembly is arranged on the butt joint part and can independently control the opening or closing of the first conveying channel and the second conveying channel.
Optionally, the wafer conveying directions in the first conveying channel and the second conveying channel are opposite.
Optionally, a visual cover plate is arranged on the communicating structure and used for controlling environmental parameters of the first wafer placing chamber and the second wafer placing chamber and observing the placing conditions of the wafers in real time.
Optionally, the docking portion is configured to connect the communicating structure and the transfer chamber by being embedded in a transfer passage of the transfer chamber.
Optionally, the shape and size of the transfer channels on each side of the regular polygon are uniform.
Optionally, the plug-in module includes one or both of a function module and a process module.
Optionally, the movement of the moving assembly comprises axial movement, radial movement and circumferential movement.
Optionally, the movement assembly comprises a vacuum robot assembly.
Optionally, the transfer chamber is a regular octagonal structure.
The invention also provides a wafer transmission system, which comprises: the device comprises a front-end module, a loading module and a transmission module; the loading module is connected between the front end module and the transmission module; the transfer module comprises at least one modular semiconductor device transfer chamber unit as described above.
Optionally, the transfer module includes a plurality of the modular semiconductor device transfer cavity units, and the plurality of the modular semiconductor device transfer cavity units are butted by the communicating structure.
Optionally, a plurality of the modular semiconductor device transmission cavity units are arranged in one of a linear type, an L-type, a U-type and an S-type.
As described above, the modular semiconductor device transfer chamber unit and the wafer transfer system of the present invention have the following advantages:
the transmission cavity is designed into a regular polygon structure, and the shape and the specification size of each transmission channel are completely consistent, so that the whole equipment can realize free butt joint combination according to different installation sites, such as a linear type, an L shape, a U shape, an S shape and the like, and the flexibility and the applicability are improved. Meanwhile, the conveying cavity can adopt standard modular production due to the design, and the maintenance and the replacement are more convenient and quicker; and the modular structural design greatly improves the efficiency of production, installation and maintenance.
The invention adopts a single-channel connection mode among different transmission cavities, can effectively reduce the occupation of the external hanging space of the secondary transmission cavity by the communication structure, and can increase at least one external hanging module in the secondary cavity. More importantly, the single channel is arranged into two layers of channels which are mutually independent from each other from top to bottom, so that the actual effect of double channels can be obtained by the design of the single channel. Take the two-level octagon as an example: in the connection mode of double channels in the prior art, the second-stage transmission module can only be externally hung with six process modules; by adopting the single-channel connection mode, seven process modules can be hung outside the second-stage transmission module; the applicability of the equipment is greatly improved.
Drawings
Fig. 1 is a schematic structural diagram of a modular semiconductor device transfer chamber unit according to an embodiment of the invention.
Fig. 2 to 3 are schematic views showing a communication structure of the modular semiconductor device transfer chamber unit according to the embodiment of the present invention.
Fig. 4 is a schematic assembly structure diagram of a modular semiconductor device transfer chamber unit according to an embodiment of the invention.
Fig. 5 is a schematic structural diagram of a wafer transfer system according to an embodiment of the invention.
Fig. 6 is a schematic view of an exemplary arrangement (linear type) of a wafer transfer system according to an embodiment of the present invention.
Fig. 7 is a schematic view of another specific arrangement (L-shaped) of the wafer transfer system according to the embodiment of the invention.
Description of the element reference numerals
1 Transmission Cavity Unit
10 transfer chamber
11 moving assembly
12 communication structure
121 first transfer path
122 second transfer channel
123 butt joint part
124 first wafer placing chamber
125 second wafer placing chamber
13 valve assembly
21 front end module
22 load module
23 Transmission Module
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structures are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.
In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 1 to 4, the present embodiment provides a modular semiconductor device transfer chamber unit 1, where the transfer chamber unit 1 includes: a transfer chamber 10, a communicating structure 12 and a moving assembly 11.
As shown in fig. 1, the conveying cavity 10 is a regular polygon structure, each side of the regular polygon is provided with a conveying channel, and each conveying channel can be butted with an external hanging module or another conveying cavity through a communicating structure 12.
As shown in fig. 1, the transfer chamber 10 is configured in a regular polygon structure, and the transfer passages on each side of the regular polygon are identical in shape and size, for example, the transfer chamber 10 has a regular hexagonal structure, a regular octagonal structure, or the like. In this embodiment, the transfer chamber 10 has a regular octagonal structure, and each side of the transfer chamber is provided with one transfer channel, and the shapes and sizes of the eight transfer channels are completely the same. The invention can lead the cavity to adopt standard modular production, and the maintenance and the replacement are more convenient and faster; the modular structure design greatly improves the production, installation and maintenance efficiency; and can be used independently or in combination according to the process requirements.
The conveying channel is slightly larger than the diameter of the wafer so as to facilitate the passing of the wafer. The opening of the conveying channel is in a shape of a rounded rectangle.
The plug-in module comprises one or two of a functional module and a process module so as to meet different wafer processing requirements. For example, the functional module may be a pre-cleaning module, an annealing module, a degassing module, etc.; the process module can be a coating module, an etching module and the like; respectively used for performing precleaning, annealing, degassing, coating and etching.
As shown in fig. 2 and fig. 3, wherein fig. 3 is a schematic cross-sectional structure view of the communicating structure 12 shown in fig. 2, the communicating structure 12 is provided with a first transmitting channel 121 and a second transmitting channel 122 which are distributed up and down and independently penetrate through a first side surface and a second side surface of the communicating structure 12, for realizing wafer transmission between adjacent transmitting cavities, and the first transmitting channel 121 and the second transmitting channel 122 are separated by a partition plate, so that the first transmitting channel 121 and the second transmitting channel 122 are independent of each other; preferably, the wafer transferring directions in the first transferring passage 121 and the second transferring passage 122 are opposite. The first side surface and the second side surface are provided with butt joint parts 123 for connecting the cavity with the communication structure 12; the upper surface and the lower surface of the communicating structure 12 are respectively provided with a first wafer placing chamber 124 and a second wafer placing chamber 125 which are independent from each other and are not communicated, and the first wafer placing chamber 124 and the second wafer placing chamber 125 are respectively communicated with the first conveying channel 121 and the second conveying channel 122 and are used for transferring and storing wafers which are substituted or processed. The invention adopts a single-channel connection mode among different transmission cavities, can effectively reduce the occupation of the external hanging space of the secondary transmission cavity by the communication structure, and can increase at least one external hanging module in the secondary cavity. More importantly, the single channel is arranged into two layers of channels which are mutually independent from each other from top to bottom, so that the actual effect of double channels can be obtained by the design of the single channel. Take the two-level octagon as an example: in the connection mode of 'double channels' in the prior art, the second-stage transmission module 23 can only be externally hung with six process modules; by adopting the single-channel connection mode of the invention, seven process modules can be hung outside the second-stage transmission module 23; the applicability of the equipment is greatly improved.
As shown in fig. 2 and 3, the docking portion 123 is inserted into the transfer passage of the transfer chamber 10 to connect the communicating structure 12 and the transfer chamber 10. Specifically, the abutting portion 123 has a protruding portion protruding from the side of the communicating structure 12, and the protruding portion and the opening of the conveying passage are identical in shape and size, so that the protruding portion can be directly inserted into the conveying passage to achieve airtight connection. In another embodiment, the abutting portion 123 has a protruding portion protruding from the side of the communicating structure 12, the protruding portion has a shape corresponding to the opening of the conveying channel and a size slightly smaller than the conveying channel, and when the connecting structure is connected, a sealing ring (such as a rubber ring) is sleeved around the protruding portion and then embedded into the conveying channel together, so as to achieve the airtight connection between the communicating structure 12 and the conveying channel. Subsequently, the communication structure 12 and the transmission channel may be further fixed by means of screws and screw holes.
As shown in fig. 4, the docking portion 123 may be provided with a valve assembly 13 for independently controlling the opening and closing of the first transfer passage 121 and the second transfer passage 122. In this embodiment, the transfer chamber 10 is provided with a groove at the upper and lower edges of each transfer channel, the valve assembly 13 is inserted into the groove to control the opening or closing of the first transfer channel 121 and the second transfer channel 122, and the valve assembly 13 is correspondingly disposed at both sides of the first transfer channel 121 and both sides of the second transfer channel, so that all the inlets and outlets of the first transfer channel 121 and the second transfer channel 122 can be independently opened or closed, thereby greatly improving the flexibility and safety of wafer transfer and avoiding the mutual influence between chambers. In this embodiment, the plurality of valve components 13 are identical in structure and size to improve versatility and ease of maintenance, as well as to improve interchangeability of the valves.
Preferably, a visual cover plate is disposed on the communicating structure 12, and is used for controlling environmental parameters of the first wafer placing chamber 124 and the second wafer placing chamber 125, such as temperature, and for observing the placing condition of the wafer in real time.
The moving assembly 11 is disposed in the conveying cavity, and the moving assembly 11 is used for realizing the grabbing of the wafer and the conveying between the adjacent cavities. Preferably, the movement of the moving assembly 11 includes an axial movement, a radial movement and a circumferential movement, so as to satisfy different moving operations of the wafer. In this embodiment, the moving assembly 11 comprises a vacuum robot assembly.
As shown in fig. 5 to 7, the present embodiment further provides a wafer transfer system, which includes: a front end module 21, a loading module 22 and a transmission module 23; the loading module 22 is connected between the front end module 21 and the transmission module 23; the transfer module 23 comprises at least one modular semiconductor device transfer chamber unit 1 as described above.
As shown in fig. 6 to 7, the transfer module 23 includes a plurality of the modular semiconductor device transfer chamber units 1, and the plurality of the modular semiconductor device transfer chamber units 1 are butted by the communication structure 12. For example, the modular semiconductor device transfer chamber units 1 are arranged in one of a linear type, an L-type, a U-type, and an S-type. Specifically, as shown in fig. 6, two transmission cavities may be arranged in a linear shape, and as shown in fig. 7, 3 transmission cavities may be arranged in an L shape, so as to save the overall area of the transmission system. Of course, according to the transmission cavity and the communication structure 12 of the present invention, the flexible and reasonable layout can be performed according to the actual plant area, so as to achieve a higher plant utilization rate.
As described above, the modular semiconductor device transfer chamber unit 1 and the wafer transfer system of the present invention have the following advantages:
the transmission cavity is designed into a regular polygon structure, and the shape and the specification size of each transmission channel are completely consistent, so that the whole equipment can realize free butt joint combination according to different installation sites, such as a linear type, an L shape, a U shape, an S shape and the like, and the flexibility and the applicability are improved. Meanwhile, the cavity can be produced in a standard modularization mode through the design, and the maintenance and the replacement are more convenient and faster; and the modular structural design greatly improves the efficiency of production, installation and maintenance.
The invention adopts a single-channel connection mode among different transmission cavities, can effectively reduce the occupation of the external hanging space of the secondary transmission cavity by the communication structure, and can increase at least one external hanging module in the secondary cavity. More importantly, the single channel is arranged into two layers of channels which are mutually independent from each other from top to bottom, so that the actual effect of double channels can be obtained by the design of the single channel. Take the two-level octagon as an example: in the connection mode of 'double channels' in the prior art, the second-stage transmission module 23 can only be externally hung with six process modules; by adopting the single-channel connection mode of the invention, seven process modules can be hung outside the second-stage transmission module 23; the applicability of the equipment is greatly improved.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (14)
1. A modular semiconductor device transfer chamber unit, comprising:
the conveying cavity is of a regular polygon structure, each side of the regular polygon is provided with a conveying channel, and each conveying channel can be in butt joint with the plug-in module or another conveying cavity through a communicating structure;
and the moving assembly is arranged in the conveying cavity and is used for realizing the grabbing of the wafer and the conveying between the adjacent cavities.
2. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the communicating structure is provided with a first conveying channel and a second conveying channel which are distributed up and down and are independent and penetrate through a first side surface and a second side surface of the communicating structure, and the first conveying channel and the second conveying channel are used for realizing wafer conveying between adjacent cavities; the first side surface and the second side surface are provided with butt joint parts for connecting the cavity and the communicating structure; the upper surface and the lower surface of the communicating structure are respectively provided with a first wafer placing chamber and a second wafer placing chamber which are independent from each other and are not communicated, and the first wafer placing chamber and the second wafer placing chamber are respectively communicated with the first conveying channel and the second conveying channel and are used for transferring and storing wafers which are processed or finished.
3. The modular semiconductor equipment transfer chamber unit of claim 2, wherein: the butt joint part is provided with a valve component which can independently control the opening or closing of the first conveying channel and the second conveying channel.
4. The modular semiconductor equipment transfer chamber unit of claim 2, wherein: the wafer conveying directions in the first conveying channel and the second conveying channel are opposite.
5. The modular semiconductor equipment transfer chamber unit of claim 2, wherein: the visual cover plate is arranged on the communicating structure and used for controlling the environmental parameters of the first wafer placing chamber and the second wafer placing chamber and observing the placing condition of the wafers in real time.
6. The modular semiconductor equipment transfer chamber unit of claim 2, wherein: the butt joint part is embedded into a conveying channel of the conveying cavity to realize the connection of the communicating structure and the conveying cavity.
7. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the transfer channels on each side of the regular polygon are uniform in shape and size.
8. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the plug-in module comprises one or two of a functional module and a process module.
9. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the movement of the moving component comprises axial movement, radial movement and circumferential movement.
10. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the movement assembly includes a vacuum robot assembly.
11. The modular semiconductor equipment transfer chamber unit of claim 1, wherein: the conveying cavity is of a regular octagonal structure.
12. A wafer transfer system, comprising: the device comprises a front-end module, a loading module and a transmission module; the loading module is connected between the front end module and the transmission module; the transfer module comprises at least one modular semiconductor device transfer chamber unit as claimed in any one of claims 1 to 11.
13. The wafer transfer system of claim 12, wherein: the transmission module comprises a plurality of modularized semiconductor equipment transmission cavity units, and the modularized semiconductor equipment transmission cavity units are butted through the communicating structure.
14. The wafer transfer system of claim 13, wherein: the modular semiconductor equipment transmission cavity units are arranged in one of a linear type, an L type, a U type and an S type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110043221.7A CN112786507A (en) | 2021-01-13 | 2021-01-13 | Modular semiconductor equipment transmission cavity unit and wafer transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110043221.7A CN112786507A (en) | 2021-01-13 | 2021-01-13 | Modular semiconductor equipment transmission cavity unit and wafer transmission system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112786507A true CN112786507A (en) | 2021-05-11 |
Family
ID=75755750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110043221.7A Pending CN112786507A (en) | 2021-01-13 | 2021-01-13 | Modular semiconductor equipment transmission cavity unit and wafer transmission system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112786507A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023172283A1 (en) * | 2022-03-11 | 2023-09-14 | Applied Materials, Inc. | Modular multi-chamber processing tool having link chamber for ultra high vacuum processes |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3723003B2 (en) * | 1998-12-18 | 2005-12-07 | 三菱重工業株式会社 | Vacuum processing system |
| CN101405856A (en) * | 2006-07-25 | 2009-04-08 | 应用材料股份有限公司 | Octagon transfer chamber |
| CN101495671A (en) * | 2006-04-11 | 2009-07-29 | 应用材料公司 | System architecture and method for solar panel formation |
| CN203639553U (en) * | 2012-09-07 | 2014-06-11 | 应用材料公司 | Load lock cavity with flow valve and device for forming component |
| CN105706227A (en) * | 2013-11-04 | 2016-06-22 | 应用材料公司 | Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods |
| CN110544660A (en) * | 2018-08-02 | 2019-12-06 | 北京北方华创微电子装备有限公司 | Modular wafer transfer system and semiconductor device |
-
2021
- 2021-01-13 CN CN202110043221.7A patent/CN112786507A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3723003B2 (en) * | 1998-12-18 | 2005-12-07 | 三菱重工業株式会社 | Vacuum processing system |
| CN101495671A (en) * | 2006-04-11 | 2009-07-29 | 应用材料公司 | System architecture and method for solar panel formation |
| CN101405856A (en) * | 2006-07-25 | 2009-04-08 | 应用材料股份有限公司 | Octagon transfer chamber |
| CN203639553U (en) * | 2012-09-07 | 2014-06-11 | 应用材料公司 | Load lock cavity with flow valve and device for forming component |
| CN105706227A (en) * | 2013-11-04 | 2016-06-22 | 应用材料公司 | Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods |
| CN110544660A (en) * | 2018-08-02 | 2019-12-06 | 北京北方华创微电子装备有限公司 | Modular wafer transfer system and semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023172283A1 (en) * | 2022-03-11 | 2023-09-14 | Applied Materials, Inc. | Modular multi-chamber processing tool having link chamber for ultra high vacuum processes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI618177B (en) | Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations | |
| US11087998B2 (en) | Transfer chambers with an increased number of sides, semiconductor device manufacturing processing tools, and processing methods | |
| JP6843493B2 (en) | Board processing equipment | |
| US10086511B2 (en) | Semiconductor manufacturing systems | |
| CN105580124B (en) | For mixing flatbed devices, system and the method for processing substrate | |
| KR102359364B1 (en) | Substrate Processing Apparatus | |
| US20080219806A1 (en) | Semiconductor manufacturing process modules | |
| CN102064123A (en) | Vacuum processing system and vacuum processing method of semiconductor processing substrate | |
| US20080124194A1 (en) | Semiconductor manufacturing process modules | |
| CN112786507A (en) | Modular semiconductor equipment transmission cavity unit and wafer transmission system | |
| US9669552B2 (en) | System and method for quick-swap of multiple substrates | |
| WO2021204050A1 (en) | Semiconductor processing device | |
| CN113782466A (en) | High throughput, multi-chamber substrate processing system | |
| US20080260499A1 (en) | Facet adapter for a wafer handler | |
| US20080124195A1 (en) | Semiconductor manufacturing process modules | |
| KR20170120345A (en) | Substrate transfer robot, equipment front-end module using the same, and method for transferring substrate using the same | |
| CN110544660B (en) | Modular wafer transfer system and semiconductor device | |
| CN114512431B (en) | Multi-cavity integrated semiconductor device | |
| CN208674075U (en) | Multi-chamber Wafer processing apparatus | |
| KR101845797B1 (en) | Substrate transfer robot and substrate processing equipment using the same | |
| CN101359582B (en) | Substrate processing apparatus | |
| US20100014945A1 (en) | Semiconductor processing apparatus having all-round type wafer handling chamber | |
| CN219404297U (en) | Wafer handling assembly, robot and transmission device | |
| CN220646876U (en) | Valve body structure | |
| KR20080092493A (en) | Loadlock chamber of dual layers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210511 |