CN208580048U - The detection system of semiconductor laser chip end face appearance - Google Patents
The detection system of semiconductor laser chip end face appearance Download PDFInfo
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- CN208580048U CN208580048U CN201821284110.5U CN201821284110U CN208580048U CN 208580048 U CN208580048 U CN 208580048U CN 201821284110 U CN201821284110 U CN 201821284110U CN 208580048 U CN208580048 U CN 208580048U
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Abstract
The utility model discloses the detection systems of semiconductor laser chip end face appearance, including chip carrier, lower view camera, chip pickup apparatus, upper view camera light source, Optical devices and upper view camera；Semiconductor laser chip is drawn to Optical devices assigned work region by chip pickup apparatus, upper view camera light source is arranged in Optical devices assigned work region, light source is provided depending on camera to be upper, Optical devices project the lower surface of semiconductor laser chip and four side magnified images in upper view camera, and upper view camera obtains the amplification image of chip lower surface and four sides.The utility model realizes the detection of the multiple end faces of semiconductor laser chip by the light path design of coaxial microcobjective and multiple side viewing prisms, avoids chip rotation in the detection of traditional die appearance or more microscopical processing method is arranged；The matching design of Optical devices and upper view camera simultaneously, so that this system structure is simple, semiconductor laser chip appearance detection efficiency is high.
Description
Technical field
The utility model relates to chip manufacturing proces, particularly relate to the inspection of semiconductor laser chip end face appearance
Examining system, the appearance test suitable for chip manufacturing proces.
Background technique
Chip appearance detection be semiconductor technology production in an important link because had in chip fabrication processes compared with
More graphic defects, dirty, damaged, defect etc. bad order, in order to which the yield and the product that promote subsequent technique link are reliable
Property need to appearance parts carry out 100% microscopy.
General IC chip only needs to carry out microscopy to the one side of photoetching, and other faces are inspected by random samples.And for certain members
Part such as laser chip also has higher appearance requirement for its lap, in favor of subsequent technique.The dress of traditional detection chip appearance
It sets (see Fig. 1), including chip and chip carrier 01, be responsible for the positioning of chip and check the lower view camera 02 of chip upper surface, from
The pick device 03 of absorption chip 011 on chip carrier 01, for checking the upper view camera 05 of bottom surface, and for checking chip
The side view camera 04 of side；When carrying out end surface measurement to laser chip, need to be correspondingly arranged upper view phase in different endface positions
Machine 05, side view camera 04 microscope carry out microscopy.
If necessary to check that multiple faces just need chip to be rotated or be arranged more microscope processing, such system
System design is complex, and production efficiency is not high.
Utility model content
To solve the problems mentioned above in the background art, the purpose of this utility model is to provide semiconductor laser cores
The detection system of piece end face appearance.
To achieve the above object, the technical solution that the utility model is taken are as follows:
The utility model discloses the detection systems of semiconductor laser chip end face appearance, comprising:
Chip carrier is used for bearing semiconductor chip of laser；
Lower view camera, for knowing to the appearance of the semiconductor laser chip positioning and upper surface that are carried on chip carrier
Not；
Chip pickup apparatus, for by semiconductor laser chip from being drawn on chip carrier in assigned work region；
Upper view camera light source, for for semiconductor laser chip lower surface and four sides the light source of different angle is provided
Irradiation, to detect different types of defect；
Optical devices, for forming the reflected beams magnified image of the lower surface of semiconductor laser chip and four sides
Amplification image simultaneously detects；
Upper view camera is identified for the appearance of noise spectra of semiconductor lasers chip lower surface and four sides；
Semiconductor laser chip is drawn to the assigned work region of Optical devices by the chip pickup apparatus, it is described on
The assigned work region of the Optical devices is set depending on camera light source, provides light source depending on camera to be upper, the Optical devices will
The reflected beams magnified image of the lower surface of semiconductor laser chip and four sides projects in the upper view camera, it is described on
The amplification image of semiconductor laser chip lower surface and four sides is obtained depending on camera.
In above-mentioned technical proposal, the Optical devices include coaxial microcobjective and multiple side viewing prisms, Mei Gesuo
State the reflected light of semiconductor laser chip side of the side viewing prism for reflecting corresponding placement, the coaxial microcobjective
The reflected beams for receiving semiconductor laser chip lower surface and four sides amplify and form amplification image.
In above-mentioned technical proposal, the side viewing prism quantity is 1~4.
In above-mentioned technical proposal, each side viewing prism pre-adjusts angle so that prism right-angle surface perpendicular to
The surface of semiconductor laser chip is placed with the surface deflections angle of semiconductor laser chip.
It is described upper to be mounted on the coaxial microcobjective depending on camera in above-mentioned technical proposal.
In above-mentioned technical proposal, it is described it is lower depending on camera and it is upper include microlens and camera depending on camera.
In above-mentioned technical proposal, it is described it is upper regard camera light source and provide light source depending on camera to be upper, the light source includes axis light
Source, side irradiation source and color light source.
In above-mentioned technical proposal, the chip pickup apparatus includes suction nozzle, and the suction nozzle is connected to air by tracheae and compresses
Machine, the tracheae are equipped with electromagnetic valve, and the electromagnetic valve connects controller.
In above-mentioned technical proposal, the suction nozzle be can angle rotation absorption chip suction nozzle, the absorption chip suction nozzle uses
In drawing simultaneously rotating semiconductor chip of laser, cooperation is lower to be adjusted rotation angle depending on camera and keeps semiconductor laser chip
Edge direction is consistent with the lower view direction XY of camera.
Compared with prior art, the utility model has the beneficial effects that
By the coaxial microcobjective of Optical devices and the light path design of multiple side viewing prisms, semiconductor chip is realized
The detection of multiple end faces avoids chip in the detection of traditional die appearance and is rotated or be arranged more microscopical processing
Method.The utility model is by Optical devices and the upper matching design for regarding camera, so that this system structure is simple, semiconductor chip
Appearance detection efficiency is high.
Detailed description of the invention
Fig. 1 is traditional detection chip appearance schematic device in the prior art；
Fig. 2 is the detecting system schematic diagram of the utility model；
Fig. 3 is Optical devices index path；
Fig. 4 is the image of Optical devices；
Fig. 5 is the structural schematic diagram of chip carrier；
Fig. 6 is the structural schematic diagram of chip pickup apparatus；
Description of symbols:
01, chip carrier；011, chip；02, lower view camera；03, pick device；04, side view camera；05, upper view camera；
1, chip carrier；11, semiconductor laser chip；12, film support frame；13, film；2, lower view camera；3, core
Piece pick device；31, suction nozzle；32, tracheae；33, air compressor；34, electromagnetic valve；35, controller；4, upper view camera light
Source；5, Optical devices；51, coaxial microcobjective；52, side viewing prism；53, the reflected beams；54, amplify image；6, on
Depending on camera.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with the drawings and specific embodiments, it is further described how the utility model is implemented.
As shown in Figures 2 and 3, the detection system of semiconductor laser chip end face provided by the utility model appearance, packet
It includes:
Chip carrier 1 is used for bearing semiconductor chip of laser 11；
Lower view camera 2, for the outer of the positioning of semiconductor laser chip 11 and upper surface being carried on chip carrier 1
See identification；
Chip pickup apparatus 3, for semiconductor laser chip 11 to be drawn to assigned work region from chip carrier 1
In；
Upper view camera light source 4, for for semiconductor laser chip 11 lower surface and four sides different angle is provided
Light source irradiation, to detect different types of defect；
Optical devices 5, for by the reflected beams magnified image of the lower surface of semiconductor laser chip 11 and four sides
It forms amplification image and detects；
Upper view camera 6 is identified for the appearance of 11 lower surface of noise spectra of semiconductor lasers chip and four sides；
Semiconductor laser chip 11 is drawn to the assigned work region of Optical devices 5, institute by the chip pickup apparatus 3
The assigned work region that the Optical devices 5 are set depending on camera light source 4 is stated, provides light source, the optics depending on camera 6 to be upper
The reflected beams magnified image of the lower surface of semiconductor laser chip 11 and four sides is projected the upper view camera by device 5
In 6, Figure 54 is imaged in the upper amplification for obtaining 11 lower surface of semiconductor laser chip and four sides depending on camera 6.
As shown in Figure 3 and Figure 4, the Optical devices 5 include coaxial microcobjective 51 and multiple side viewing prisms 52, often
A side viewing prism 52 is used to reflect the reflected light of 11 side of semiconductor laser chip of corresponding placement, described coaxial
Microcobjective 51 is used to receive 11 lower surface of semiconductor laser chip and the reflected beams 53 of four sides amplify and form amplification
Image 54.As shown in figure 4, intermediate region is the amplification image of 11 lower surface of semiconductor laser chip, peripheral regions are
The amplification image of 11 4 side of semiconductor laser chip；The enlargement ratio of image is according to 11 ruler of semiconductor laser chip
It is very little etc. be designed into can identify subject to.
In the utility model, 52 quantity of side viewing prism is 1~4.Side viewing prism 52 can be according to need
It wants, controlled installation one to four is surveyed the different end face of semiconductor chip 11 for checking.And each side viewing prism
52 pre-adjust angle, so that surface or and semiconductor laser of the prism right-angle surface perpendicular to semiconductor laser chip 11
The surface deflections angle of chip 11 is placed.
It is described upper to be mounted on the coaxial microcobjective 51 depending on camera 6 in the utility model.
In the utility model, the lower view camera 2 and upper view camera 6 include microlens and camera.Microlens and
Camera can move up and down carry out automatic focusing camera, and this automatic Focussing function can adapt to the chip of different height
And side and upper surface or side and lower surface are observed simultaneously.
In the utility model, it is described it is upper regard camera light source 4 and provide light source depending on camera 6 to be upper, the light source includes axis light
Source, side irradiation source and color light source；The microlens for being used to view camera 6 provide different height projection light, and can
To be separately controlled the unlatching of light source and the brightness of adjustable light source according to test.The upper camera light source 4 that regards is industrial phase
The point light source applied to machine vision of machine configuration.
As shown in fig. 6, the chip pickup apparatus 3 includes suction nozzle 31, the suction nozzle 31 is connected to air pressure by tracheae 32
Contracting machine 33, the tracheae 32 are equipped with electromagnetic valve 34, and the electromagnetic valve 34 connects controller 35.Wherein, suction nozzle 31 be can
The absorption chip suction nozzle of angle rotation, the absorption chip suction nozzle is for drawing simultaneously rotating semiconductor chip of laser 11, cooperation
The direction XY one of the lower edge direction and lower view camera 2 for adjusting rotation angle depending on camera 2 and keeping semiconductor laser chip 11
It causes.
The chip pickup apparatus 3 can also be semiconductor chip pick device in the prior art.
As shown in figure 5, the chip carrier 1 includes film support frame 12, the film support frame 12 is equipped with film 13,
The film 13 is used to place the semiconductor laser chip 11 of several marshallings.
In the utility model, the detection method of semiconductor laser chip end face appearance, comprising the following steps:
Step 1: being positioned depending on camera 2 to the semiconductor laser chip 11 being carried on chip carrier 1 by lower, and right
11 upper surface of semiconductor laser chip carries out appearance identification；
Step 2: picking up the semiconductor laser chip 11 being carried on chip carrier 1 to light by chip pickup apparatus 3
Learn the assigned work region of device 5；
Step 3: regarding camera light source 4 by upper and providing difference as the lower surface of semiconductor laser chip 11 and four sides
The light source of angle irradiates；
Step 4: the lower surface of semiconductor laser chip 11 and four offside reflection light beams 53 are put by Optical devices 5
Big image simultaneously forms amplification imaging Figure 54 and projects upper camera 3；
Step 5: obtaining the amplification image of 11 lower surface of semiconductor laser chip and four sides by upper view camera 6
54 and carry out appearance identification.
Finally, it is stated that above embodiments are merely intended for describing the technical solutions of the present application, but not for limiting the present application, although ginseng
The utility model is described in detail according to preferred embodiment, those skilled in the art should understand that, it can be to this
The technical solution of utility model is modified or replaced equivalently, without departing from the objective and model of technical solutions of the utility model
It encloses, should all cover in the scope of the claims of the utility model.
Claims (9)
1. the detection system of semiconductor laser chip end face appearance characterized by comprising
Chip carrier (1) is used for bearing semiconductor chip of laser (11)；
Lower view camera (2), for semiconductor laser chip (11) positioning and upper surface being carried on chip carrier (1)
Appearance identification；
Chip pickup apparatus (3), for semiconductor laser chip (11) to be drawn to assigned work area from chip carrier (1)
In domain；
Upper view camera light source (4), for providing different angle for the lower surface of semiconductor laser chip (11) and four sides
Light source irradiation, to detect different types of defect；
Optical devices (5) are used for the reflected beams magnified image of the lower surface of semiconductor laser chip (11) and four sides
It forms amplification image and detects；
Upper view camera (6), for the identification of the appearance of noise spectra of semiconductor lasers chip (11) lower surface and four sides；
Semiconductor laser chip (11) is drawn to the assigned work region of Optical devices (5) by the chip pickup apparatus (3),
Upper view camera light source (4) setting provides light source in the assigned work region of the Optical devices (5) for upper view camera (6),
The Optical devices (5) project the reflected beams magnified image of the lower surface of semiconductor laser chip (11) and four sides
In the upper view camera (6), upper view camera (6) obtains the amplification of semiconductor laser chip (11) lower surface and four sides
Image (54).
2. the detection system of semiconductor laser chip end face according to claim 1 appearance, which is characterized in that the light
Learning device (5) includes coaxial microcobjective (51) and multiple side viewing prisms (52), each side viewing prism (52)
For reflecting the reflected light of semiconductor laser chip (11) side of corresponding placement, the coaxial microcobjective (51) is for connecing
The reflected beams (53) for receiving semiconductor laser chip (11) lower surface and four sides amplify and form amplification image (54).
3. the detection system of semiconductor laser chip end face according to claim 2 appearance, which is characterized in that the side
Viewing prism (52) quantity in face is 1~4.
4. the detection system of semiconductor laser chip end face according to claim 2 appearance, which is characterized in that Mei Gesuo
It states side viewing prism (52) and pre-adjusts angle, so that surface of the prism right-angle surface perpendicular to semiconductor laser chip (11)
Or it is placed with the surface deflections angle of semiconductor laser chip (11).
5. the detection system of semiconductor laser chip end face according to claim 2 appearance, which is characterized in that on described
It is mounted on the coaxial microcobjective (51) depending on camera (6).
6. the detection system of semiconductor laser chip end face according to claim 1 appearance, which is characterized in that under described
It include microlens and camera depending on camera (2) and upper view camera (6).
7. the detection system of semiconductor laser chip end face according to claim 1 appearance, which is characterized in that on described
It regards camera light source (4) and provides light source as upper view camera (6), the light source includes coaxial light source, side irradiation source and color light source.
8. the detection system of semiconductor laser chip end face according to claim 1 appearance, which is characterized in that the core
Piece pick device (3) includes suction nozzle (31), and the suction nozzle (31) passes through tracheae (32) connection air compressor (33), the tracheae
(32) electromagnetic valve (34) are equipped with, the electromagnetic valve (34) connects controller (35).
9. the detection system of semiconductor laser chip end face according to claim 8 appearance, which is characterized in that the suction
Mouth (31) be can angle rotation absorption chip suction nozzle, the absorption chip suction nozzle for draw and rotating semiconductor laser core
Piece (11), the lower edge direction and lower view for adjusting rotation angle depending on camera (2) and keep semiconductor laser chip (11) of cooperation
The direction XY of camera (2) is consistent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284110.5U CN208580048U (en) | 2018-08-10 | 2018-08-10 | The detection system of semiconductor laser chip end face appearance |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821284110.5U CN208580048U (en) | 2018-08-10 | 2018-08-10 | The detection system of semiconductor laser chip end face appearance |
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| Publication Number | Publication Date |
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| CN208580048U true CN208580048U (en) | 2019-03-05 |
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| CN201821284110.5U Active CN208580048U (en) | 2018-08-10 | 2018-08-10 | The detection system of semiconductor laser chip end face appearance |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109100366A (en) * | 2018-08-10 | 2018-12-28 | 武汉盛为芯科技有限公司 | The detection system and method for semiconductor laser chip end face appearance |
| TWI702384B (en) * | 2019-07-04 | 2020-08-21 | 和碩聯合科技股份有限公司 | Optical derection device |
| CN113375559A (en) * | 2021-07-06 | 2021-09-10 | 中国工程物理研究院机械制造工艺研究所 | Online measurement centering device, system and method based on multi-source sensing |
| CN115032208A (en) * | 2022-08-10 | 2022-09-09 | 弘润半导体(苏州)有限公司 | Semiconductor chip detection device |
-
2018
- 2018-08-10 CN CN201821284110.5U patent/CN208580048U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109100366A (en) * | 2018-08-10 | 2018-12-28 | 武汉盛为芯科技有限公司 | The detection system and method for semiconductor laser chip end face appearance |
| TWI702384B (en) * | 2019-07-04 | 2020-08-21 | 和碩聯合科技股份有限公司 | Optical derection device |
| CN113375559A (en) * | 2021-07-06 | 2021-09-10 | 中国工程物理研究院机械制造工艺研究所 | Online measurement centering device, system and method based on multi-source sensing |
| CN115032208A (en) * | 2022-08-10 | 2022-09-09 | 弘润半导体(苏州)有限公司 | Semiconductor chip detection device |
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