CN208570589U - 一种芯片封装结构、芯片功能模组及电子设备 - Google Patents
一种芯片封装结构、芯片功能模组及电子设备 Download PDFInfo
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- CN208570589U CN208570589U CN201820992937.5U CN201820992937U CN208570589U CN 208570589 U CN208570589 U CN 208570589U CN 201820992937 U CN201820992937 U CN 201820992937U CN 208570589 U CN208570589 U CN 208570589U
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- lead
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 94
- 230000008054 signal transmission Effects 0.000 claims abstract description 30
- 230000005540 biological transmission Effects 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 235000013399 edible fruits Nutrition 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- -1 PI) Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960000074 biopharmaceutical Drugs 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- WABPQHHGFIMREM-OIOBTWANSA-N lead-204 Chemical compound [204Pb] WABPQHHGFIMREM-OIOBTWANSA-N 0.000 description 1
- WABPQHHGFIMREM-BJUDXGSMSA-N lead-206 Chemical compound [206Pb] WABPQHHGFIMREM-BJUDXGSMSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820992937.5U CN208570589U (zh) | 2018-06-26 | 2018-06-26 | 一种芯片封装结构、芯片功能模组及电子设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820992937.5U CN208570589U (zh) | 2018-06-26 | 2018-06-26 | 一种芯片封装结构、芯片功能模组及电子设备 |
Publications (1)
Publication Number | Publication Date |
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CN208570589U true CN208570589U (zh) | 2019-03-01 |
Family
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Family Applications (1)
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CN201820992937.5U Withdrawn - After Issue CN208570589U (zh) | 2018-06-26 | 2018-06-26 | 一种芯片封装结构、芯片功能模组及电子设备 |
Country Status (1)
Country | Link |
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CN (1) | CN208570589U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987369A (zh) * | 2018-06-26 | 2018-12-11 | 深圳信炜生物识别科技有限公司 | 一种芯片封装结构、芯片功能模组及电子设备 |
-
2018
- 2018-06-26 CN CN201820992937.5U patent/CN208570589U/zh not_active Withdrawn - After Issue
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108987369A (zh) * | 2018-06-26 | 2018-12-11 | 深圳信炜生物识别科技有限公司 | 一种芯片封装结构、芯片功能模组及电子设备 |
CN108987369B (zh) * | 2018-06-26 | 2024-03-26 | 柳州梓博科技有限公司 | 一种芯片封装结构、芯片功能模组及电子设备 |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210323 Address after: 545000 No.108, 2nd floor, building 2, 29 Xinliu Avenue, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee after: Liuzhou Zibo Technology Co.,Ltd. Address before: 518055 room 2104, Kim Chi Chi house, 1 Tong Ling Road, Taoyuan street, Shenzhen, Guangdong, Nanshan District Patentee before: SHENZHEN XINWEISHENGWUSHIBIE TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20190301 Effective date of abandoning: 20240326 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20190301 Effective date of abandoning: 20240326 |
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AV01 | Patent right actively abandoned | ||
AV01 | Patent right actively abandoned |