CN208570584U - Cooling fin and cooking apparatus - Google Patents

Abstract

The utility model provides a kind of cooling fin and cooking apparatus, cooling fin includes heat dissipation sheet matrix and fin, fin connects on the base of the heat sink, the heat dissipation wind channel for forced-convection heat transfer is limited between two adjacent fins, wherein the height of cooling fin is H1, the height of fin is H2, the height of heat dissipation sheet matrix is H3, then the range that the range of H2/H1 is 0.3~0.9, H3/H1 is 0.1~0.5.Cooling fin provided by the utility model, on the one hand, by the way that the range of H3/H1 is arranged, the height for reducing heat dissipation sheet matrix accounts for the ratio of fin height, to reduce the material utilization amount of heat dissipation sheet matrix, the cost of cooling fin is reduced, on the other hand, by the range that H2/H1 is arranged, the height for increasing fin accounts for the ratio of fin height, so that the height of fin increases, to increase the cooling surface area of cooling fin, the heat dissipation effect of cooling fin is improved.

Description

Cooling fin and cooking apparatus

Technical field

The utility model relates to kitchen utensils fields, more specifically, are related to a kind of cooling fin and including the cooling fin Cooking apparatus.

Background technique

The heat dissipation effect of existing cooking apparatus such as electromagnetic oven, the cooling fin of bridge heap and IGBT on pcb board is bad, Influence bridge heap and IGBT service life and service performance, and heat radiating fin structure design it is unreasonable cause the cooling fin consumptive material compared with It is more, improve the production cost of cooling fin.

Utility model content

The utility model aims to solve at least one of the technical problems existing in the prior art.

For this purpose, the one aspect of the utility model is designed to provide a kind of cooling fin.

The other side of the utility model is designed to provide a kind of cooking apparatus including above-mentioned cooling fin.

To achieve the above object, the technical solution of the one aspect of the utility model provides a kind of cooling fin, comprising: dissipates Backing matrix；And fin, it is connected on the heat dissipation sheet matrix；Wherein, the height of the cooling fin is H1, the height of the fin Degree is H2, and the height of the heat dissipation sheet matrix is H3, then the range that the range of H2/H1 is 0.3~0.9, H3/H1 is 0.1~ 0.5。

The cooling fin that the utility model above-mentioned technical proposal provides, on the one hand, by the way that the range of H3/H1 is arranged, reduces and dissipate The height of backing matrix accounts for the ratio of fin height, thus reduce heat dissipation sheet matrix material utilization amount, reduce cooling fin at This, on the other hand, by the way that the range of H2/H1 is arranged, the height for increasing fin accounts for the ratio of fin height, so that the height of fin Degree increases, to increase the cooling surface area of cooling fin, improves the heat dissipation effect of cooling fin.

H2/H1 can be but be not limited to 0.3,0.4,0.5,0.6,0.7,0.8 or 0.9, and H3/H1 can be but be not limited to 0.1,0.2,0.3,0.4 or 0.5.

In addition, the cooling fin that the utility model above-mentioned technical proposal provides also has following additional technical feature:

In above-mentioned technical proposal, it is preferable that the heat dissipation sheet matrix is equipped with retention bead away from the surface of the fin, The retention bead limits the installation space for accommodating heating element, and the height of the retention bead is H4,0 < H4/ H1≤0.2, and H2+H3+H4=H1.

Retention bead and fin are oppositely arranged, and are located on two opposite surfaces of heat dissipation sheet matrix.Preferably, fever member The quantity of device be it is multiple, retention bead limits and multiple heating elements multiple installation spaces correspondingly, fever member Device and the installation space where it are interference fitted, and realize heating element in the interior positioning of installation space.Further, it sends out Hot component includes that IGBT (insulated gate bipolar transistor) He Qiaodui, IGBT and Qiao Dui is located in two installation spaces.

Heating element also realizes fixation on a heat sink by fastener in addition to being fixed by retention bead.

In above-mentioned technical proposal, it is preferable that the heat dissipation sheet matrix is equipped on the surface of the fin and is additionally provided with heat dissipation Protrusion, the quantity of heating element be it is multiple, the heat bulge corresponds to the gap setting of the two neighboring heating element, The height of the heat bulge is H5, and the range of H5/H1 is 0.1~0.5, and H5 < H2.

Heat bulge and fin are located on the same surface of heat dissipation sheet matrix.In view of between two neighboring heating element Temperature is lower, and therefore, the back side setting height of two neighboring heating element is convex lower than the heat dissipation of fin on the base of the heat sink It rises, saves the material utilization amount of cooling fin.Heat bulge also can increase the heat dissipation area of cooling fin simultaneously, carry out to heating element Heat dissipation.H5/H1 can be but be not limited to 0.1,0.2,0.3,0.4 or 0.5.

In above-mentioned technical proposal, it is preferable that the quantity of the fin be it is multiple, multiple fins include at least one the One fin and/or at least one second fin, the thickness that first fin extends along direction is uniform, second fin Thickness changes.

Multiple fins can be with all first fins, at this point, in whole fins of cooling fin, each fin side of extending along To thickness it is identical.Alternatively, multiple fins can be with all second fins, at this point, in whole fins of cooling fin, each fin It is in uneven thickness.It is partially the second fin alternatively, being divided into the first fin in the middle part of multiple fins.First fin it is easy to process, Second fin can increase fin heat dissipation area and reinforce heat-conductive characteristic so that heating element can be carried out effectively it is scattered Heat.

In above-mentioned technical proposal, it is preferable that the thickness on second fin close to one end of the heat dissipation sheet matrix is big Thickness in one end far from the heat dissipation sheet matrix.

In above-mentioned technical proposal, it is preferable that along the direction far from the heat dissipation sheet matrix, the thickness of second fin by It is decrescence small.

In above-mentioned technical proposal, it is preferable that second fin close to one end of the heat dissipation sheet matrix with a thickness of T1, One end far from the heat dissipation sheet matrix with a thickness of T2, the range of T2/T1 is 0.3~1.0, both can guarantee the rigid of the second fin Degree, moreover it is possible to increase the heat dissipation area of the second fin.

T2/T1 can be but be not limited to 0.3,0.4,0.5,0.6,0.7,0.8,0.9 or 1.0.

In above-mentioned technical proposal, it is preferable that first fin with a thickness of T3, second fin is close to the heat dissipation One end of sheet matrix with a thickness of T1, the range of T3/T1 is 0.1~0.8.

T3/T1 can be but be not limited to 0.1,0.2,0.3,0.4,0.5,0.6,0.7 or 0.8.

In above-mentioned technical proposal, it is preferable that the fin is equipped with groove.

Preferably, the surface of fin is equipped with a plurality of groove, to increase the heat dissipation area of cooling fin.

The technical solution of the utility model the second aspect provides a kind of cooking apparatus, comprising: in above-mentioned technical proposal Described in any item cooling fins；Heat dissipation sheet matrix is arranged on the surface of fin in heating element.

The cooking apparatus that the technical solution of the utility model the second aspect provides, because of the technical side including first aspect Cooling fin described in any one of case, thus with the cooling fin described in any one of above-mentioned technical proposal all beneficial to imitating Fruit, details are not described herein.

Preferably, cooking apparatus is electromagnetic oven, electric cooker, pressure cooker or other cooking apparatus.

In above-mentioned technical proposal, it is preferable that the heating element includes bridge heap and IGBT, the first wing of the cooling fin Piece corresponds to the bridge heap setting, and the second fin of the cooling fin corresponds to the IGBT setting.

Second fin, which is presented, is thinned shape, has biggish heat dissipation area, therefore, can correspond to the first device of the serious fever of fever Part (IGBT) setting.

The additional aspect and advantage of the utility model will become obviously in following description section, or practical new by this The practice of type is recognized.

Detailed description of the invention

The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will Become obvious and be readily appreciated that, in which:

Fig. 1 is the schematic cross-sectional view of cooling fin described in one embodiment of the utility model；

Fig. 2 is the structural schematic diagram of cooling fin described in one embodiment of the utility model.

Wherein, the corresponding relationship in Fig. 1 and Fig. 2 between appended drawing reference and component names are as follows:

100 cooling fins, 1 heat dissipation sheet matrix, 2 fins, 21 first fins, 22 second fins, 23 grooves, 3 retention beads, 31 Installation space, 4 heat bulges, 5 heat dissipation wind channels, 10 bridge heaps, 20IGBT, 30 heating elements.

Specific embodiment

In order to be more clearly understood that the above objects, features, and advantages of the utility model, with reference to the accompanying drawing and have The utility model is further described in detail in body embodiment.It should be noted that in the absence of conflict, this Shen The feature in embodiment and embodiment please can be combined with each other.

Many details are explained in the following description in order to fully understand the utility model, still, this is practical It is novel to be implemented using other than the one described here mode, therefore, the protection scope of the utility model not by The limitation of following public specific embodiment.

Cooling fin and cooking apparatus according to some embodiments of the utility model is described with reference to the accompanying drawings.

As depicted in figs. 1 and 2, a kind of cooling fin 100 provided according to some embodiments of the utility model, comprising: heat dissipation Sheet matrix 1 and fin 2, fin 2 are connected on heat dissipation sheet matrix 1, limit between two adjacent fins 2 and change for forced convertion The heat dissipation wind channel 5 of heat.Preferably, fin 2 is an integral structure with heat dissipation sheet matrix 1, and heat dissipation sheet matrix is in tabular, cooling fin For copper and/or aluminium material.Wherein, the height of cooling fin 100 is H1, and the height of fin 2 is H2, and the height of heat dissipation sheet matrix 1 is H3, then the range that the range of H2/H1 is 0.3~0.9, H3/H1 is 0.1~0.5.

The cooling fin 100 that the utility model above-mentioned technical proposal provides, on the one hand, by the way that the range of H3/H1 is arranged, reduce The height of heat dissipation sheet matrix 1 accounts for the ratio of 100 height of cooling fin, to reduce the material utilization amount of heat dissipation sheet matrix 1, reduces heat dissipation The cost of piece 100, on the other hand, by the way that the range of H2/H1 is arranged, the height for increasing fin 2 accounts for the ratio of 100 height of cooling fin Example, to increase the cooling surface area of cooling fin 100, improves the heat dissipation effect of cooling fin 100 so that the height of fin 2 increases.

H2/H1 can be but be not limited to 0.3,0.4,0.5,0.6,0.7,0.8 or 0.9, and H3/H1 can be but be not limited to 0.1,0.2,0.3,0.4 or 0.5.

Preferably, heat dissipation sheet matrix 1 is equipped with retention bead 3 away from the surface of fin 2, and retention bead 3, which limits, to be used for The installation space 31 of heating element 30 is accommodated, the height of retention bead 3 is H4,0 H4/H1≤0.2 <, and H2+H3+H4= H1。

Retention bead 3 and fin 2 are oppositely arranged, and are located on two opposite surfaces of heat dissipation sheet matrix 1.Preferably, it sends out The quantity of hot component 30 be it is multiple, retention bead 3 limits and the one-to-one multiple installations skies of multiple heating elements 30 Between 31, heating element 30 and its where installation space 31 be interference fitted, realize heating element 30 in installation space 31 Interior positioning.Further, heating element 30 includes IGBT 20 (insulated gate bipolar transistor) and bridge heap 10, IGBT 20 It is located in two installation spaces 31 with bridge heap 10.

It is of course also possible to be not provided with retention bead, heater element is connected on a heat sink or is bonded in scattered by fastener On backing.

Preferably, heat dissipation sheet matrix 1 is equipped on the surface of fin 2 and is additionally provided with heat bulge 4, and heating element 30 includes Multiple, the gap setting of the corresponding two neighboring heating element 30 of heat bulge 4, the height of heat bulge 4 is H5, H5/H1's Range is 0.1~0.5, and H5 < H2.

Heat bulge 4 and fin 2 are located on the same surface of heat dissipation sheet matrix 1, as shown in Figure 1, heat bulge and fin On the upper surface of heat dissipation sheet matrix, retention bead and heating element are located on the lower surface of heat dissipation sheet matrix.It considers Temperature is lower between two neighboring heating element 30, therefore, the back of two neighboring heating element 30 on heat dissipation sheet matrix 1 Face setting height is lower than the heat bulge 4 of fin, and as depicted in figs. 1 and 2, heat bulge corresponds to retention bead setting, is located at limit The surface of position protrusion, to save the material utilization amount of cooling fin.Heat bulge 4 also can increase the heat dissipation area of cooling fin simultaneously, It radiates to heating element 30.H5/H1 can be but be not limited to 0.1,0.2,0.3,0.4 or 0.5.

Preferably, the quantity of fin 2 be it is multiple, multiple fins 2 include at least one first fin 21 and/or at least one Second fin 22, the thickness that the first fin 21 extends along direction is uniform, and the thickness of the second fin 22 changes.

Multiple fins 2 can be with all first fins 21, at this point, in whole fins 2 of cooling fin 100, each 2 edge of fin The thickness of its extending direction is identical.Alternatively, multiple fins 2 can be with all second fins 22, at this point, the whole of cooling fin 100 In fin 2, each fin 2 it is in uneven thickness.It is partially the second fin alternatively, being divided into the first fin 21 in the middle part of multiple fins 2 22。

Preferably, the thickness T1 on the second fin 22 close to one end of heat dissipation sheet matrix 1 is greater than far from heat dissipation sheet matrix 1 The thickness T2 of one end is formed and shape fin is thinned.

Preferably, along the direction far from heat dissipation sheet matrix 1, the thickness of the second fin 22 is gradually reduced.

Preferably, the second fin 22 close to one end of heat dissipation sheet matrix 1 with a thickness of T1, far from heat dissipation sheet matrix 1 one End with a thickness of T2, the range of T2/T1 is 0.3~1.0, both can guarantee the rigidity of the second fin 22, moreover it is possible to increase the second fin 22 heat dissipation area.

T2/T1 can be but be not limited to 0.3,0.4,0.5,0.6,0.7,0.8,0.9 or 1.0.

Preferably, the first fin 21 with a thickness of T3, the second fin 22 close to one end of heat dissipation sheet matrix 1 with a thickness of The range of T1, T3/T1 are 0.1~0.8, i.e. the thickness of the second fin root (close to heat dissipation sheet matrix one end) is greater than the first fin Thickness so that the heat dissipation effect of the second fin be better than the first fin.

T3/T1 can be but be not limited to 0.1,0.2,0.3,0.4,0.5,0.6,0.7 or 0.8.

First fin 21 it is easy to process, the second fin 22 can increase fin 2 heat dissipation area and reinforce heat conductivity Can, so that heating element 30 can be carried out effectively heat dissipation, therefore, can be closed according to the heat condition of heating element 30 Setting the first fin 21 and the second fin 22 of reason, such as the corresponding serious heating element 30 that generates heat of the second fin 22 is set It sets, the corresponding general heating element 30 that generates heat of the first fin 21 is arranged.

As depicted in figs. 1 and 2, part (the second fin) presents and shape is thinned in vertical fin, the thickness of fin from bottom to Top (from lower to upper) is gradually thinning, and straightened portion fin (the first fin) keeps uniform thickness, and shape fin bottom portion thickness is thinned For T1, top thickness T2, uniform fin with a thickness of T3, it is 0.1~0.8 that wherein T2/T1, which is 0.3~1, T3/T1,.Fig. 1 and Three fins, which are presented, in Fig. 2 is thinned shape, primarily directed to the serious heating element that generates heat, by the heat dissipation area for increasing fin And reinforce heat-conductive characteristic, so that heating element can be carried out effectively heat dissipation.Fin can be by all uniform thickness fins (the first fin) composition, can also be made of all thinned shape thickness fins (the second fin), similar also or in Fig. 1 and Fig. 2 As the form that combines with uniform thickness fin of type fin is partially thinned, according to practical radiating requirements combine accordingly with Meet cooling requirements.

This kind of novel heat sink structure can increase heat dissipation effectively for the serious heating element heat dissipation problem that generates heat The heat convection area of piece can effectively transfer heat in the convected air of heat dissipation wind channel 5, while cost is reduced It can be improved radiating efficiency.

Preferably, fin 2 is equipped with groove 23.

Preferably, the surface of fin 2 is equipped with a plurality of groove 23, to increase the heat dissipation area of cooling fin 100.

The technical solution of the utility model the second aspect provides a kind of cooking apparatus, including heating element 30 and as above The cooling fin 100 of any one of technical solution is stated, the heating element setting deviates from the surface of fin on the base of the heat sink On, cooling fin 100 is connected with heating element 30, for radiating to heating element 30.

The cooking apparatus that the technical solution of the utility model the second aspect provides, because of the technical side including first aspect The cooling fin 100 of any one of case, thus whole beneficial effects of the cooling fin 100 with any one of above-mentioned technical proposal, Details are not described herein.

Preferably, heating element 30 includes bridge heap 10 and IGBT 20, the corresponding bridge heap of the first fin 21 of cooling fin 100 10 settings, the corresponding IGBT 20 of the second fin 22 of cooling fin 100 are arranged.

Second fin 22, which is presented, is thinned shape, has biggish heat dissipation area, therefore, can correspond to the serious fever member of fever Device 30 (IGBT 20) setting.

In conclusion cooling fin 100 provided by the embodiment of the utility model, the surface of radiating fin 2 are contained a plurality of small Groove increases the heat dissipation area of vertical cooling fin, can effectively improve heat dissipation effect, have on matrix 1 for bridge heap and The positive stop lug boss 4 and matrix screw positive stop lug boss 5 of IGBT.

Electromagnetic oven heat radiation piece elevational cross-sectional view as shown in Figure 1, cooling fin bottom include two heating element bridge heaps and IGBT, cooling fin total height are H1, and fin height H2, cooling fin matrix height is H3, and bottom retention bead height is H4, is dissipated The height of hot protrusion is H5, and it be 0.1~0.5, H4/H1 is 0~0.2, H5/H1 0.1 that wherein H2/H1, which is 0.3~0.9, H3/H1, ~0.5.

In the utility model, 1) reduction of cooling fin matrix thickness, so that electromagnetic oven heat radiation piece aluminium consumption amount reduces, cost Decline；2) increase of fin thickness can improve electromagnetic oven heat radiation piece so that the cooling surface area of electromagnetic oven heat radiation piece increases Heat dissipation effect.

In the description of the present invention, unless otherwise clearly defined and limited, term " multiple " refers to two or two More than a；Unless otherwise prescribed or illustrate, term " connection ", " fixation " etc. shall be understood in a broad sense, for example, " connection " can be It is fixedly connected, may be a detachable connection, or be integrally connected, or electrical connection；It can be directly connected, it can also be in Between medium be indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood at this as the case may be Concrete meaning in utility model.

In the description of this specification, it is to be understood that the instruction such as term " on ", "lower", "front", "rear", "left", "right" Orientation or positional relationship be to be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the utility model and letter Change description, rather than the device or unit of indication or suggestion meaning must have specific direction, with specific orientation construct and Operation, it is thus impossible to be construed as a limitation of the present invention.

In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc. Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least the one of the utility model In a embodiment or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment Or example.Moreover, the particular features, structures, materials, or characteristics of description can be in any one or more embodiment or examples In can be combined in any suitable manner.

The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model Within, any modification, equivalent replacement, improvement and so on should be included within the scope of protection of this utility model.

Claims (11)

1. a kind of cooling fin characterized by comprising

Radiate sheet matrix；With

Fin is connected on the heat dissipation sheet matrix；

Wherein, the height of the cooling fin is H1, and the height of the fin is H2, and the height of the heat dissipation sheet matrix is H3, then The range that the range of H2/H1 is 0.3~0.9, H3/H1 is 0.1~0.5.

2. cooling fin according to claim 1, which is characterized in that

The heat dissipation sheet matrix is equipped with retention bead away from the surface of the fin, and the retention bead is limited for accommodating The installation space of heating element, the height of the retention bead are H4,0 H4/H1≤0.2 <, and H2+H3+H4=H1.

3. cooling fin according to claim 1, which is characterized in that

The heat dissipation sheet matrix is equipped on the surface of the fin and is additionally provided with heat bulge, and the quantity of heating element is more A, the heat bulge corresponds to the gap setting of the two neighboring heating element, and the height of the heat bulge is H5, The range of H5/H1 is 0.1~0.5, and H5 < H2.

4. cooling fin according to any one of claim 1 to 3, which is characterized in that

The quantity of the fin be it is multiple, multiple fins include at least one first fin and/or at least one second wing Piece, the thickness that first fin extends along direction is uniform, and the thickness of second fin changes.

5. cooling fin according to claim 4, which is characterized in that

Thickness on second fin close to one end of the heat dissipation sheet matrix is greater than one end far from the heat dissipation sheet matrix Thickness.

6. cooling fin according to claim 5, which is characterized in that

Along the direction far from the heat dissipation sheet matrix, the thickness of second fin is gradually reduced.

7. cooling fin according to claim 4, which is characterized in that

Second fin close to one end of the heat dissipation sheet matrix with a thickness of T1, one end far from the heat dissipation sheet matrix With a thickness of T2, the range of T2/T1 is 0.3~1.0.

8. cooling fin according to claim 4, which is characterized in that

First fin with a thickness of T3, second fin is close to one end of the heat dissipation sheet matrix with a thickness of T1, T3/ The range of T1 is 0.1~0.8.

9. cooling fin according to any one of claim 1 to 3, which is characterized in that

The fin is equipped with groove.

10. a kind of cooking apparatus characterized by comprising

Cooling fin as claimed in any one of claims 1-9 wherein；With

Heat dissipation sheet matrix is arranged on the surface of fin in heating element.

11. cooking apparatus according to claim 10, which is characterized in that

The heating element includes bridge heap and IGBT, and the first fin of the cooling fin corresponds to the bridge heap setting, described to dissipate Second fin of backing corresponds to the IGBT setting.