CN208569494U - A kind of computer motherboard with long service life - Google Patents
A kind of computer motherboard with long service life Download PDFInfo
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- CN208569494U CN208569494U CN201821190717.7U CN201821190717U CN208569494U CN 208569494 U CN208569494 U CN 208569494U CN 201821190717 U CN201821190717 U CN 201821190717U CN 208569494 U CN208569494 U CN 208569494U
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Abstract
The utility model discloses a kind of computer motherboards with long service life, including mainboard ontology, component is provided at the top of the mainboard ontology, the mainboard ontology includes the first signals layer, the bottom of first signals layer is fixedly connected with the first insulating layer, the bottom of first insulating layer is fixedly connected with ground plane, and the bottom of ground plane is fixedly connected with second insulating layer.The utility model is used cooperatively by protective layer, the 4th insulating layer, heat dissipating layer, boron nitride heat conductive rubber, heat-conducting silica gel sheet, aluminium oxide heat conductive rubber, anti-corrosion layer, polypropylene layer, poly- four pvdf layer, polyvinyl chloride layer and heat release hole; the radiating efficiency for solving active computer mainboard is lower; and anticorrosion effect is poor; the problem of greatly shortening computer motherboard service life; the computer motherboard with long service life; have radiating efficiency height and the good advantage of anticorrosion effect; the use for the person of being convenient to use improves the practicability of computer motherboard.
Description
Technical field
The utility model relates to computer motherboard technical field, specially a kind of computer motherboard with long service life.
Background technique
Computer housing mainboard is called motherboard, system board or motherboard；It is divided into commercial mainboard and two kinds of industrial master board, it
Be mounted in cabinet, be microcomputer it is most basic be also one of most important component, the generally rectangular cross-section circuit board of mainboard is installed above
The main circuit system of composition computer generally has BIOS chip, I/O control chip, key and panel control switch interface, refers to
Show the DC power supply of lamp plug connector, expansion slot, mainboard and plug-in card for elements such as electrical connectors.
Computer motherboard is one of the ost important components in computer, but the radiating efficiency of active computer mainboard is lower,
And anticorrosion effect is poor, greatly shortens the service life of computer motherboard, it has not been convenient to which the use of user reduces computer
The practicability of mainboard.
Utility model content
The purpose of this utility model is to provide a kind of computer motherboard with long service life, has radiating efficiency height and resistance to
The good advantage of corrosive effect, the radiating efficiency for solving active computer mainboard is lower, and anticorrosion effect is poor, greatly shortens
The problem of computer motherboard service life.
To achieve the above object, the utility model provides the following technical solutions: a kind of computer motherboard with long service life,
Including mainboard ontology, it being provided with component at the top of the mainboard ontology, the mainboard ontology includes the first signals layer, and described the
The bottom of one signals layer is fixedly connected with the first insulating layer, and the bottom of first insulating layer is fixedly connected with ground plane, described
The bottom of ground plane is fixedly connected with second insulating layer, and the bottom of the second insulating layer is fixedly connected with bus plane, the electricity
The bottom of active layer is fixedly connected with third insulating layer, and the bottom of the third insulating layer is fixedly connected with second signal layer, described
Matcoveredn is arranged in the bottom of mainboard ontology, and the protective layer includes the 4th insulating layer, and the bottom of the 4th insulating layer is arranged
There is heat dissipating layer, the heat dissipating layer includes boron nitride heat conductive rubber, and the bottom of the boron nitride heat conductive rubber is fixedly connected with thermally conductive
Silica gel piece, the bottom of the heat-conducting silica gel sheet are fixedly connected with aluminium oxide heat conductive rubber, and the bottom of the heat dissipating layer is provided with resistance to
Corrosion layer, the anti-corrosion layer include polypropylene layer, and the bottom of the polypropylene layer is fixedly connected with poly- four pvdf layer, described poly-
The bottom of four pvdf layers is fixedly connected with polyvinyl chloride layer, and the bottom of the anti-corrosion layer offers heat release hole, the heat release hole
Quantity be no less than seven.
Preferably, the first adhesive layer, the top of first adhesive layer and master are fixedly connected at the top of the protective layer
Plate ontology is fixedly connected.
Preferably, the bottom of the 4th insulating layer is fixedly connected with the second adhesive layer, the bottom of second adhesive layer
It is fixedly connected with heat dissipating layer.
Preferably, the bottom of the heat dissipating layer is fixedly connected with third adhesive layer, the bottom of the third adhesive layer with it is resistance to
Corrosion layer is fixedly connected.
Preferably, the thickness of the boron nitride heat conductive rubber, heat-conducting silica gel sheet and aluminium oxide heat conductive rubber is equal, described
The thickness of polypropylene layer, poly- four pvdf layer and polyvinyl chloride layer is equal.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model passes through protective layer, the 4th insulating layer, heat dissipating layer, boron nitride heat conductive rubber, heat-conducting silica gel sheet, oxygen
Change being used cooperatively for aluminium heat conductive rubber, anti-corrosion layer, polypropylene layer, poly- four pvdf layer, polyvinyl chloride layer and heat release hole, solves
The radiating efficiency of active computer mainboard is lower, and anticorrosion effect is poor, greatly shortens asking for computer motherboard service life
Topic, the computer motherboard with long service life have radiating efficiency height and the good advantage of anticorrosion effect, the person's of being convenient to use
It uses, improves the practicability of computer motherboard.
2, the utility model passes through the setting of the first adhesive layer, plays the role of being fixedly connected with mainboard ontology and protective layer,
Keep the connection between mainboard ontology and protective layer stronger, avoids protective layer and occur being detached from from mainboard ontology when in use
The phenomenon that, keep the stablizing effect of protective layer more preferable, by the setting of the second adhesive layer, play be fixedly connected the 4th insulating layer and
Heat dissipating layer effect, keep the connection between the 4th insulating layer and heat dissipating layer stronger, avoid heat dissipating layer occur when in use from
The phenomenon that being detached from 4th insulating layer keeps the stablizing effect of heat dissipating layer more preferable, by the setting of third adhesive layer, plays fixation
Heat dissipating layer and anti-corrosion layer effect are connected, keeps the connection between heat dissipating layer and anti-corrosion layer stronger, avoids anti-corrosion layer
Occur the phenomenon that being detached from from heat dissipating layer when in use, keeps the stablizing effect of anti-corrosion layer more preferable.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the structural schematic diagram of the utility model mainboard ontology；
Fig. 3 is the structural schematic diagram of the utility model protective layer；
Fig. 4 is the structural schematic diagram of the utility model heat dissipating layer；
Fig. 5 is the structural schematic diagram of the utility model anti-corrosion layer.
In figure: 1, mainboard ontology；2, component；3, the first signals layer；4, the first insulating layer；5, ground plane；6, second absolutely
Edge layer；7, bus plane；8, third insulating layer；9, second signal layer；10, protective layer；11, the 4th insulating layer；12, heat dissipating layer；13,
Boron nitride heat conductive rubber；14, heat-conducting silica gel sheet；15, aluminium oxide heat conductive rubber；16, anti-corrosion layer；17, polypropylene layer；18, gather
Four pvdf layers；19, polyvinyl chloride layer；20, heat release hole；21, the first adhesive layer；22, the second adhesive layer；23, third adhesive layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-5 is please referred to, the utility model provides a kind of technical solution: a kind of computer motherboard with long service life, packet
Mainboard ontology 1 is included, the top of mainboard ontology 1 is provided with component 2, and mainboard ontology 1 includes the first signals layer 3, the first signals layer 3
Bottom be fixedly connected with the first insulating layer 4, the bottom of the first insulating layer 4 is fixedly connected with ground plane 5, the bottom of ground plane 5
It is fixedly connected with second insulating layer 6, the bottom of second insulating layer 6 is fixedly connected with bus plane 7, and the bottom of bus plane 7 is fixed to be connected
It is connected to third insulating layer 8, the bottom of third insulating layer 8 is fixedly connected with second signal layer 9, and the bottom of mainboard ontology 1 is provided with
Protective layer 10, protective layer 10 include the 4th insulating layer 11, and the bottom of the 4th insulating layer 11 is provided with heat dissipating layer 12, and heat dissipating layer 12 wraps
Boron nitride heat conductive rubber 13 is included, the bottom of boron nitride heat conductive rubber 13 is fixedly connected with heat-conducting silica gel sheet 14, heat-conducting silica gel sheet 14
Bottom be fixedly connected with aluminium oxide heat conductive rubber 15, the bottom of heat dissipating layer 12 is provided with anti-corrosion layer 16, and anti-corrosion layer 16 wraps
Polypropylene layer 17 is included, the bottom of polypropylene layer 17 is fixedly connected with poly- four pvdf layer 18, and the bottom of poly- four pvdf layer 18 is fixed to be connected
It is connected to polyvinyl chloride layer 19, the bottom of anti-corrosion layer 16 offers heat release hole 20, and the quantity of heat release hole 20 is no less than seven.
In the utility model: the top of protective layer 10 is fixedly connected with the first adhesive layer 21, the top of the first adhesive layer 21
It is fixedly connected with mainboard ontology 1, by the setting of the first adhesive layer 21, plays and be fixedly connected with mainboard ontology 1 and protective layer 10
Effect, keeps the connection between mainboard ontology 1 and protective layer 10 stronger, avoids protective layer 10 and occur when in use from mainboard
The phenomenon that being detached from ontology 1 keeps the stablizing effect of protective layer 10 more preferable.
In the utility model: the bottom of the 4th insulating layer 11 is fixedly connected with the second adhesive layer 22, the second adhesive layer 22
Bottom is fixedly connected with heat dissipating layer 12, by the setting of the second adhesive layer 22, is played and is fixedly connected with the 4th insulating layer 11 and dissipates
Thermosphere 12 acts on, and keeps the connection between the 4th insulating layer 11 and heat dissipating layer 12 stronger, avoids heat dissipating layer 12 when in use
The phenomenon that appearance is detached from from the 4th insulating layer 11, keeps the stablizing effect of heat dissipating layer 12 more preferable.
In the utility model: the bottom of heat dissipating layer 12 is fixedly connected with third adhesive layer 23, the bottom of third adhesive layer 23
It is fixedly connected with anti-corrosion layer 16, by the setting of third adhesive layer 23, plays and be fixedly connected with heat dissipating layer 12 and anti-corrosion layer
16 effects, keep the connection between heat dissipating layer 12 and anti-corrosion layer 16 stronger, avoid anti-corrosion layer 16 and occur when in use
The phenomenon that being detached from from heat dissipating layer 12 keeps the stablizing effect of anti-corrosion layer 16 more preferable.
In the utility model: the thickness of boron nitride heat conductive rubber 13, heat-conducting silica gel sheet 14 and aluminium oxide heat conductive rubber 15 is equal
Equal, the thickness of polypropylene layer 17, poly- four pvdf layer 18 and polyvinyl chloride layer 19 is equal.
Working principle: it when the utility model is used, by the setting of the 4th insulating layer 11, plays exhausted to mainboard ontology 1
The effect of edge avoids interference of the mainboard ontology 1 by extraneous electric current, by heat dissipating layer 12, boron nitride heat conductive rubber 13, thermally conductive
Silica gel piece 14 and aluminium oxide heat conductive rubber 15 are used cooperatively, and boron nitride heat conductive rubber 13, heat-conducting silica gel sheet 14 and aluminium oxide are led
Hot rubber 15 all has preferable heat-conducting effect, can the heat quickly to 1 output of mainboard ontology conduct, improve mainboard
The radiating efficiency of ontology 1 passes through anti-corrosion layer 16, polypropylene layer 17, poly- four pvdf layer 18, polyvinyl chloride layer 19 and heat release hole 20
Be used cooperatively, polypropylene layer 17, poly- four pvdf layer 18 and polyvinyl chloride layer 19 all have preferable corrosion resistance, greatly improve
The corrosion resistance of the mainboard, so that the computer motherboard has effect with long service life.
In summary: the computer motherboard with long service life, by protective layer 10, the 4th insulating layer 11, heat dissipating layer 12,
Boron nitride heat conductive rubber 13, heat-conducting silica gel sheet 14, aluminium oxide heat conductive rubber 15, anti-corrosion layer 16, polypropylene layer 17, poly- four ethylene
Layer 18, polyvinyl chloride layer 19 and heat release hole 20 are used cooperatively, and the radiating efficiency for solving active computer mainboard is lower, and resistance to
The problem of corrosive effect is poor, greatly shortens computer motherboard service life.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of computer motherboard with long service life, including mainboard ontology (1), it is characterised in that: the mainboard ontology (1)
Top is provided with component (2), and the mainboard ontology (1) includes the first signals layer (3), the bottom of first signals layer (3)
It is fixedly connected with the first insulating layer (4), the bottom of first insulating layer (4) is fixedly connected with ground plane (5), the ground plane
(5) bottom is fixedly connected with second insulating layer (6), and the bottom of the second insulating layer (6) is fixedly connected with bus plane (7),
The bottom of the bus plane (7) is fixedly connected with third insulating layer (8), and the bottom of the third insulating layer (8) is fixedly connected with
Matcoveredn (10) are arranged in the bottom of second signal layer (9), the mainboard ontology (1), and the protective layer (10) includes the 4th exhausted
The bottom of edge layer (11), the 4th insulating layer (11) is provided with heat dissipating layer (12), and the heat dissipating layer (12) includes that boron nitride is led
The bottom of hot rubber (13), the boron nitride heat conductive rubber (13) is fixedly connected with heat-conducting silica gel sheet (14), the heat conductive silica gel
The bottom of piece (14) is fixedly connected with aluminium oxide heat conductive rubber (15), and the bottom of the heat dissipating layer (12) is provided with anti-corrosion layer
(16), the anti-corrosion layer (16) includes polypropylene layer (17), and the bottom of the polypropylene layer (17) is fixedly connected with poly- tetrem
The bottom of alkene layer (18), poly- four pvdf layer (18) is fixedly connected with polyvinyl chloride layer (19), the anti-corrosion layer (16)
Bottom offers heat release hole (20), and the quantity of the heat release hole (20) is no less than seven.
2. a kind of computer motherboard with long service life according to claim 1, it is characterised in that: the protective layer (10)
Top be fixedly connected with the first adhesive layer (21), the top of first adhesive layer (21) is fixedly connected with mainboard ontology (1).
3. a kind of computer motherboard with long service life according to claim 1, it is characterised in that: the 4th insulating layer
(11) bottom is fixedly connected with the second adhesive layer (22), and the bottom and heat dissipating layer (12) of second adhesive layer (22) are fixed to be connected
It connects.
4. a kind of computer motherboard with long service life according to claim 1, it is characterised in that: the heat dissipating layer (12)
Bottom be fixedly connected with third adhesive layer (23), the bottom of the third adhesive layer (23) and anti-corrosion layer (16) are fixed connects
It connects.
5. a kind of computer motherboard with long service life according to claim 1, it is characterised in that: the boron nitride is thermally conductive
The thickness of rubber (13), heat-conducting silica gel sheet (14) and aluminium oxide heat conductive rubber (15) is equal, the polypropylene layer (17), poly- four
The thickness of pvdf layer (18) and polyvinyl chloride layer (19) is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821190717.7U CN208569494U (en) | 2018-07-25 | 2018-07-25 | A kind of computer motherboard with long service life |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821190717.7U CN208569494U (en) | 2018-07-25 | 2018-07-25 | A kind of computer motherboard with long service life |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208569494U true CN208569494U (en) | 2019-03-01 |
Family
ID=65448191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821190717.7U Active CN208569494U (en) | 2018-07-25 | 2018-07-25 | A kind of computer motherboard with long service life |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208569494U (en) |
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2018
- 2018-07-25 CN CN201821190717.7U patent/CN208569494U/en active Active
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