CN208554664U - A kind of electrostatic atomization cooling system for high heat flux density surface - Google Patents
A kind of electrostatic atomization cooling system for high heat flux density surface Download PDFInfo
- Publication number
- CN208554664U CN208554664U CN201820734410.2U CN201820734410U CN208554664U CN 208554664 U CN208554664 U CN 208554664U CN 201820734410 U CN201820734410 U CN 201820734410U CN 208554664 U CN208554664 U CN 208554664U
- Authority
- CN
- China
- Prior art keywords
- flux density
- heat flux
- electrostatic
- controller
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Electrostatic Spraying Apparatus (AREA)
Abstract
The utility model discloses a kind of electrostatic atomization cooling systems for high heat flux density surface, including pipe-line system, electrostatic atomizer and controller；Pipe-line system is fluid reservoir, circulating pump, heat exchanger pass through piping connection；Electrostatic atomizer is that micron pore array and high pressure orifice plate are housed in spray head, is spraying chamber between micron pore array and nozzle housing；Flow controller, voltage controller are equipped in controller, the coolant liquid in circulating pump extraction fluid reservoir comes together in the bottom plate below spraying system by the coolant liquid that electrostatic atomizer ejects, connects heat exchanger by liquid back pipe and lead to fluid reservoir；Bottom plate can measure the temperature of cooled object equipped with temperature sensor, and the revolving speed of control loop pump changes flow to adapt to the cooling of high heat flux density basal plane；Voltage and atomization flow are accurately adjusted according to temperature, and is provided with circulating pipe system, solve the problems, such as that existing spray cooling device is difficult to the speed of adjustable spraying and size and coolant liquid and cannot recycle.
Description
Technical field
The utility model belongs to cooling heat transferring field, more particularly to a kind of electrostatic atomization for high heat flux density surface is cold
But system.
Background technique
Application with super high power laser and microwave generator in the fields such as military, medical, scientific research, aerospace,
Corresponding high heat flux density high efficiency and heat radiation problem becomes more and more important.However tradition is based on free convection, forced pair at this stage
The single-phase circulating air cooling of stream, (heat-sinking capability is respectively less than 100W/cm to circulation fluid refrigeration technique2) obviously it is not able to satisfy high-power pole
Thermal control requirement under the conditions of end.Therefore it is directed to high fever galvanic electricity subcomponent cooling technology and special Space Thermal load management demand,
Development height, superelevation heat flow density equipment cooling technology, it has also become the important research direction to involve the interests of the state and the people.
The spray cooling for consolidating multiphase heat transfer principle based on space vapour-liquid, since the high coefficient of heat transfer can be generated,
Hot-surface temperature gradient is smaller simultaneously and cooled wall surface does not have the advantages that thermal contact resistance to dissipate in space high heat flux density component
The prior development direction of heat and spacecraft future Evolution of Thermal Control Technique.Electrostatic spray is the new method of efficient spray cooling technology.This
The drop generated during kind is easily deformable broken, becomes smaller microlayer model.It compared with general pressure and aerodynamic atomization,
Has the advantages that uniqueness.Particle diameter can control in nanometer to micro-scaled range, this is the be difficult to reality of traditional atomization method
Existing.By extra electric field, the parameters such as controllable drop size and flow, spray angle are cooling to needing on microelectronic chip
Key position carries out accurate temperature controller.Electric field can control the movement of charged drop and increase its kinetic energy simultaneously, it is easier to around penetrating
Gas medium, go directly heat source surface.In the course of injection of charged drop, Coulomb force can also make drop it is mutually exclusive, dispersion,
Uniform deposition greatly improves heat exchange efficiency in heat source surface.
Existing patent proposes the Spray Way using electrostatic atomization technology at present.Utility model patent CN
102227593A proposes a kind of misting cooling equipment and spray method, cooling water supply to charged spray head, makes from band EFI
The particle water of mist head injection is charged and is atomized, and is adsorbed in human body surface, realizes cooling.The utility model applies electrostatic well
Atomization technique realizes the refinement of drop, but only for this kind of low-heat current density surface of human body surface it is slight it is cooling with
Refrigerant sense is obtained, and lacks the real-time regulating apparatus to voltage and flow, is not easy to according to face temperature and the size spirit of being cooled
Ground living adjustable spraying flow and flow field structure, system structure, function and way of realization and the utility model are entirely different.This
Outside, this cooling device lacks the recycling and circulator of cooling water, is unfavorable for economizing on resources.
Utility model content
The utility model is insufficient according to prior art and defect, proposes a kind of electrostatic for high heat flux density surface
Atomization cooling system prepares novel micron pore array electrostatic spray module using micro-nano processing method, to adapt to high heat flux density
The cooling of basal plane；Voltage and atomization flow can be accurately adjusted according to temperature, and is provided with circulating pipe system, solved existing
Spray cooling device be difficult to the speed of adjustable spraying and the problem of size and coolant liquid cannot recycle.
The technical solution adopted in the utility model is as follows:
A kind of electrostatic atomization cooling system for high heat flux density surface, including pipe-line system, electrostatic atomizer and
Controller；The pipe-line system is fluid reservoir, circulating pump, heat exchanger are formed by piping connection；The electrostatic atomizer is
Micron pore array and high pressure orifice plate are housed in nozzle housing, are spraying chamber between micron pore array and nozzle housing；Controller control
It is flow controller, voltage controller in device processed, flow controller connects circulating pump, and voltage controller connects electrostatic atomizer
High pressure orifice plate and city's voltage source.Circulating pump connects electrostatic atomizer by inlet tube, and fluid reservoir is followed for storing coolant liquid
The coolant liquid that ring pumping goes out in fluid reservoir comes together in the bottom below spraying device by the coolant liquid that electrostatic atomizer ejects
Plate connects heat exchanger by liquid back pipe and leads to fluid reservoir；The bottom plate is equipped with temperature sensor, for measuring the temperature of cooled object
Degree, and temperature information is transmitted to temperature display by signal wire；
Flow controller in the controller is potentiometer, and the revolving speed pumped by control loop changes flow, in pump
Exit is arranged flow sensor and flow information is transmitted to flow indication screen by signal wire；
City's power supply is converted into DC voltage by the stable dc power supply converter in controller, by booster circuit and whole
Stream device is transmitted to high pressure orifice electrode, and the voltage of high pressure orifice electrode is controlled by potentiometer, and voltage signal is passed through signal wire
The voltmeter being transmitted in control cabinet, and shown on voltage display screen；
The micron pore array is in 1cm2Silicon wafer process micron openings unit；
Hole will be arranged in a one-to-one correspondence on micron openings and high pressure orifice plate on the micron pore array；
The coolant liquid is the deionized water containing nanoparticle；
The nanoparticle is fine silver or carbon nanotube.
The utility model has the beneficial effects that
1) misting cooling is carried out using electrostatic atomization technology, realizes the accuracy controlling of convection current field structure, to realize to quilt
The accurate temperature controller of cooling surface；Make microlayer model be easier to reach and be deposited on cooled surface simultaneously, substantially increases heat exchange
Efficiency；
2) it by temperature sensing and display device, realizes the real-time monitoring of cooled object temperature, enables a user to root
Cooling procedure is in time neatly controlled according to temperature, changes the voltage of high pressure orifice plate, to change the intensity of external electric field, is changed micro-
Electrostatic repulsion between drop realizes the adjusting to the range of spray flow field；
3) by establishing the circulatory system of coolant liquid, the recycling of coolant liquid is realized, solves other misting coolings
Device can not effectively save the problem of coolant liquid resource.
Detailed description of the invention
Fig. 1 is a kind of electrostatic atomization cooling system schematic diagram for high heat flux density surface of the utility model；
Fig. 2 is the micron pore array electrostatic spray module diagram in the utility model；
Fig. 3 is the micron pore array bottom view in the utility model；
Fig. 4 is the orifice electrode bottom view in the utility model；
Fig. 5 is the control cabinet circuit block diagram in the utility model；
In figure, 1, control cabinet, 2, inlet tube, 3, electrostatic atomizer, 4, bracket, 5, liquid back pipe, 6, bottom plate, 7, cooled
Object, 8, signal wire, 9, temperature display, 10, voltage display screen, 11, flow indication screen, 12, flow knob, 13, voltage knob,
14, heat exchanger, 15, micron pore array, 16, high pressure orifice plate, 17, spraying chamber, 18, spraying chamber entrance.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used for explaining this
Utility model is not used to limit the utility model.
As shown in Figure 1, 2, the utility model is a kind of electrostatic atomization cooling system for high heat flux density surface, including
Pipe-line system, electrostatic atomizer and controller；Fluid reservoir, circulating pump, heat exchanger 14, valve and bottom plate 6 in pipe-line system
A circulation is formed by piping connection electrostatic atomizer 3；Coolant liquid is housed in fluid reservoir, passes through piping connection to circulation
Pump, then spraying chamber entrance 18 is flowed into the spray head of electrostatic atomizer 3 by inlet tube 2；The coolant liquid ejected by spray head
On bottom plate 6 set by eventually falling in below spray head, by 5 inflow heat exchanger 14 of liquid back pipe on bottom plate 6, heat exchanger will be cold
But it after liquid cooling, is again introduced into the fluid reservoir in control cabinet 1, completes a cyclic process.Wherein, 6 built-in temperature of bottom plate passes
Sensor, temperature information is transferred in control cabinet by the temperature for measuring cooled object 7 by signal wire 8, in temperature display 9
Upper display.
As shown in Figure 3,4, electrostatic atomizer 3 is that micron pore array 15 and high pressure orifice plate 16, micron openings are housed in spray head
It is spraying chamber 17 between array 15 and nozzle housing；Spraying chamber 17 for temporarily storing coolant liquid, the micron pore array be
1cm2Silicon wafer on by micro-nano processing method integrate hundreds of micron openings units (such as 500, the number of specific micron hole machined
Amount can manufacture according to the actual situation), the hole processed on high pressure orifice plate 16 need and micron pore array 15 on micron openings list
Member corresponds；Coolant liquid flows into electrostatic atomizer 3 through inlet tube 2, under the high voltage electrostatic field of orifice electrode form
Occur to be atomized and form submicron order droplet group, is formed by microlayer model and realizes orientation under the collective effect of gravity and electrostatic force
Uniform deposition is spraying, and 7 surface of cooled object of going directly cools down to cooled object 7, to meet the heat exchange on high heat flux density surface
Demand.Electrostatic atomizer 3 is fixed on right above bottom plate by bracket 4, it is ensured that pipeline stabilization will not during the work time
It vibrates.
If improving the voltage applied to micron pore array electrostatic spray module 3, the microlayer model institute band of formation can be increased
The quantity of electric charge, while increasing the intensity of the external electric field between array micron openings and high pressure orifice electrode, to enhance between microlayer model
Electrostatic repulsion, increase the range of spray flow field, required with adapting to the cooling of the biggish cooled object of area.
As shown in figure 5, being equipped with the controller of electrostatic atomization cooling system in control cabinet 1, flow control is equipped in controller
Device processed, voltage controller, wherein voltage controller is potentiometer, built-in HV generator, is turned by stable dc power supply
Parallel operation, self-maintained circuit, step-up transformer, rectifier, voltage display screen 10 etc. form a whole, and stable dc power supply turns
City's power supply is converted into DC voltage by parallel operation, is transmitted to high pressure orifice electrode, high pressure orifice plate by booster circuit and rectifier
The voltage of electrode is controlled by potentiometer, and voltage signal is transmitted to the voltmeter in control cabinet by signal wire, and in voltage
It being shown on display screen, potentiometer adjusts the voltage that voltage is used to apply to micron pore array electrostatic spray module several kilovolts,
And the available voltage adjusting knob being connected with potentiometer adjusts the size of voltage, is stablized with reaching the micro- spraying atomization of accuracy controlling
The purpose of property and mist droplet granularity range.Temperature display 9 is connect with the temperature sensor in substrate, for showing cooled face
Temperature regulates and controls misting cooling process according to the temperature of cooled object convenient for operator.
Flow controller be flow adjustment knob by being connected with potentiometer by adjust the input voltage of circulating pump come
Its revolving speed is adjusted, so that the size of flow is adjusted, to achieve the purpose that accuracy controlling coolant rate.
Coolant liquid, selects the deionized water containing nanoparticle, and nanoparticle can be fine silver, carbon nanotube etc..Coolant liquid
In contain pure silver nanoparticles, have more significant heat transfer property, be more advantageous to it is heat conduction reinforced in cooling procedure, so as to increase
Strong cooling effect.
Due to the microlayer model sprayed from array micron openings be all it is charged, drop can be avoided as much as due to electrostatic
Repulsion is in surface rebound, so can make full use of the cooling capacity of drop, enhances cooling effect.
Coolant liquid has achieved the effect that save resource by collecting and recycling, it can be achieved that repeatedly utilize.
It is further explained below with reference to the course of work of the utility model:
After control cabinet 1 is powered, cooled object 7 is placed on bottom plate 6 by turn-on flow rate knob 12 and voltage knob 13,
Temperature sensor between bottom plate 6 and cooled object 7, detects the temperature of cooled object 7, and shows in temperature display 9, work
Make personnel can according on flow indication screen 11 flow information, the information of voltage that shows on voltage display screen 10 and pass through temperature
The temperature information of cooled object 7 that degree sensor detects, by flow knob 12 and voltage knob 13 to the revolving speed of circulating pump
It is adjusted with the voltage of high pressure orifice plate 16, to control spraying flow, granularity and flow field structure；Coolant liquid is through inlet tube 2
Electrostatic atomizer 3 is flowed into, atomizing is issued in the high voltage electrostatic field of orifice electrode form and forms submicron order droplet
Group is formed by microlayer model and realizes that orientation uniform deposition is spraying under the collective effect of gravity and electrostatic force, and go directly cooled object 7
Surface cools down to cooled object 7；It finally collects on bottom plate 6, heat exchanger 14 is flowed to by liquid back pipe 5, heat exchanger 14 is right
Coolant liquid cools down, spare in being transported to fluid reservoir, to complete a cyclic process.
Above embodiments are merely to illustrate the design philosophy and feature of the utility model, in the art its object is to make
Technical staff can understand the content of the utility model and implement accordingly, and the protection scope of the utility model is not limited to above-mentioned implementation
Example.So it is all according to equivalent variations or modification made by the revealed principle of the utility model, mentality of designing, it is practical at this
Within novel protection scope.
Claims (8)
1. a kind of electrostatic atomization cooling system for high heat flux density surface, which is characterized in that including pipe-line system, electrostatic
Mist device (3) and controller；The pipe-line system is fluid reservoir, circulating pump, heat exchanger (14), bottom plate (6) pass through piping connection
It forms；The electrostatic atomizer (3) is made of the micron pore array (15) and high pressure orifice plate (16) being equipped in nozzle housing, micro-
It is spraying chamber (17) between metre hole array (15) and nozzle housing；Circulating pump connects electrostatic atomizer by inlet tube (2)
(3), the bottom plate (6) below electrostatic atomizer (3) leads to fluid reservoir by liquid back pipe (5) connection heat exchanger (14), for defeated
It send, store coolant liquid；It is flow controller, voltage controller in controller, flow controller connects circulating pump, voltage controller
Connect the high pressure orifice plate (16) and city's voltage source of electrostatic atomizer (3).
2. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The bottom plate (6) is equipped with temperature sensor, passes through signal wire (8) for measuring the temperature of cooled object (7), and by temperature information
It is transmitted to temperature display (9).
3. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The flow controller is potentiometer, and the revolving speed of control loop pump changes flow, and flow sensing is arranged in the exit of circulating pump
Flow information is transmitted to flow indication screen (11) by signal wire (8) by device.
4. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The voltage controller is potentiometer, and voltage signal is transmitted to the voltmeter in control cabinet (1) by signal wire (8), and
It is shown on voltage display screen (10).
5. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The micron pore array (15) is in 1cm2Silicon wafer process micron openings unit.
6. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 4 or 5, feature exist
In the hole unit of micron openings unit and high pressure orifice plate (16) is arranged in a one-to-one correspondence on the micron pore array (15).
7. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The coolant liquid is the deionized water containing nanoparticle.
8. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 7, which is characterized in that
The nanoparticle is fine silver particle or carbon nanotube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734410.2U CN208554664U (en) | 2018-05-17 | 2018-05-17 | A kind of electrostatic atomization cooling system for high heat flux density surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734410.2U CN208554664U (en) | 2018-05-17 | 2018-05-17 | A kind of electrostatic atomization cooling system for high heat flux density surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208554664U true CN208554664U (en) | 2019-03-01 |
Family
ID=65483439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820734410.2U Expired - Fee Related CN208554664U (en) | 2018-05-17 | 2018-05-17 | A kind of electrostatic atomization cooling system for high heat flux density surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208554664U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108452964A (en) * | 2018-05-17 | 2018-08-28 | 江苏大学 | A kind of electrostatic atomization cooling system for high heat flux density surface |
| CN110570391A (en) * | 2019-07-24 | 2019-12-13 | 天津科技大学 | Image analysis method for spray freezing coating effect based on Image J |
| CN112817345A (en) * | 2020-12-28 | 2021-05-18 | 中国航空工业集团公司沈阳飞机设计研究所 | Skin temperature control method and system |
| CN113365471A (en) * | 2021-05-20 | 2021-09-07 | 江苏大学 | Self-circulation phase change cooling device and method based on electric drive technology |
-
2018
- 2018-05-17 CN CN201820734410.2U patent/CN208554664U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108452964A (en) * | 2018-05-17 | 2018-08-28 | 江苏大学 | A kind of electrostatic atomization cooling system for high heat flux density surface |
| CN108452964B (en) * | 2018-05-17 | 2024-04-09 | 江苏大学 | Electrostatic atomization cooling system for high heat flux surface |
| CN110570391A (en) * | 2019-07-24 | 2019-12-13 | 天津科技大学 | Image analysis method for spray freezing coating effect based on Image J |
| CN112817345A (en) * | 2020-12-28 | 2021-05-18 | 中国航空工业集团公司沈阳飞机设计研究所 | Skin temperature control method and system |
| CN113365471A (en) * | 2021-05-20 | 2021-09-07 | 江苏大学 | Self-circulation phase change cooling device and method based on electric drive technology |
| CN113365471B (en) * | 2021-05-20 | 2022-09-16 | 江苏大学 | Self-circulation phase change cooling device and method based on electric drive technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208554664U (en) | A kind of electrostatic atomization cooling system for high heat flux density surface | |
| CN108452964A (en) | A kind of electrostatic atomization cooling system for high heat flux density surface | |
| CN106785822B (en) | A kind of system and method for cooling superelevation heat flow density heat source | |
| CN105025691B (en) | A kind of electronic installation, heat abstractor and its cooling means using liquid-cooling heat radiation | |
| US10436493B2 (en) | Freezing temperature controllable spray freezing tower for preparing micron-sized spherical ice particles | |
| CN102514733B (en) | Microgravity environment-based spray cooling loop device | |
| CN106871520B (en) | A kind of efficient radiating apparatus based on array spraying | |
| WO2016197559A1 (en) | Minimal lubricant grinding device integrating nanofluid electrostatic atomization with electrocaloric heat pipes | |
| CN105960145B (en) | The closed spray cooling device of tilt adjustable | |
| CN110536591A (en) | The cooling server system of evaporative phase-change and control method | |
| Takana et al. | Improvement of in-flight alumina spheroidization process using a small power argon DC-RF hybrid plasma flow system by helium mixture | |
| CN105611790A (en) | Enclosed spray cooling device | |
| CN107894114A (en) | A kind of electronic device flash boiling spray circulating cooling system with self-optimizing characteristic | |
| CN109980317A (en) | With the spatial overlay cold plate for actively adjusting cooling capacity distribution | |
| CN108132275A (en) | Closed spray cooling experiment system suitable for multiple cooling media | |
| Zhang et al. | Advanced study of spray cooling: from theories to applications | |
| CN108746652A (en) | A kind of preparation facilities of metal powder and preparation method thereof | |
| CN209861454U (en) | Portable piezoelectricity atomizing spraying cold drawing | |
| CN111540716A (en) | Electrostatic flash evaporation micro-spray circulating cooling system for heat dissipation of high-power chip | |
| CN206177550U (en) | Small -size wind tunnel experiment device of taking film cooling and particle spraying function | |
| CN109862764A (en) | A kind of portable piezoelectricity atomisation cold plate | |
| CN212746727U (en) | Outer quick-witted heat sink of wind power generation's air conditioner | |
| CN109743832A (en) | A kind of large power long service life plasma torch composite cooling apparatus and design method | |
| CN209001329U (en) | Spray cooling system based on the heat dissipation of tubulose laser gain medium | |
| CN109149326B (en) | Spray cooling system based on tubular laser gain medium heat dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190301 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |