CN108452964A - A kind of electrostatic atomization cooling system for high heat flux density surface - Google Patents
A kind of electrostatic atomization cooling system for high heat flux density surface Download PDFInfo
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- CN108452964A CN108452964A CN201810472924.XA CN201810472924A CN108452964A CN 108452964 A CN108452964 A CN 108452964A CN 201810472924 A CN201810472924 A CN 201810472924A CN 108452964 A CN108452964 A CN 108452964A
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- 238000001816 cooling Methods 0.000 title claims abstract description 41
- 238000000889 atomisation Methods 0.000 title claims abstract description 25
- 230000004907 flux Effects 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 239000002826 coolant Substances 0.000 claims abstract description 24
- 239000011148 porous material Substances 0.000 claims abstract description 18
- 238000005507 spraying Methods 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000010946 fine silver Substances 0.000 claims description 3
- 239000003595 mist Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 230000005684 electric field Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005686 electrostatic field Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/16—Arrangements for supplying liquids or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/082—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to a condition of the discharged jet or spray, e.g. to jet shape, spray pattern or droplet size
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/005—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means the high voltage supplied to an electrostatic spraying apparatus being adjustable during spraying operation, e.g. for modifying spray width, droplet size
- B05B5/006—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means the high voltage supplied to an electrostatic spraying apparatus being adjustable during spraying operation, e.g. for modifying spray width, droplet size the adjustement of high voltage is responsive to a condition, e.g. a condition of material discharged, of ambient medium or of target
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Electrostatic Spraying Apparatus (AREA)
Abstract
The invention discloses a kind of electrostatic atomization cooling systems for high heat flux density surface, including pipe-line system, electrostatic atomizer and controller；Pipe-line system is fluid reservoir, circulating pump, heat exchanger pass through piping connection；Electrostatic atomizer is that micron pore array and high pressure orifice plate are housed in nozzle, is spraying chamber between micron pore array and nozzle housing；Flow controller, voltage controller are equipped in controller, the coolant liquid in cycle pumped fluid reservoir comes together in the bottom plate below spraying system by the coolant liquid that electrostatic atomizer ejects, and connecting heat exchanger by liquid back pipe leads to fluid reservoir；Bottom plate can measure the temperature of cooled object equipped with temperature sensor, and the rotating speed of control loop pump changes flow to adapt to the cooling of high heat flux density basal plane；Voltage and atomization flow are accurately adjusted according to temperature, and is provided with circulating pipe system, solve the problems, such as that existing spray cooling device is difficult to the speed of adjustable spraying and size and coolant liquid and cannot recycle.
Description
Technical field
The invention belongs to cooling heat transferring fields, more particularly to a kind of electrostatic atomization cooling system for high heat flux density surface
System.
Background technology
Application with super high power laser and microwave generator in the fields such as military, medical, scientific research, aerospace,
Corresponding high heat flux density high efficiency and heat radiation problem becomes more and more important.However at this stage tradition based on free convection, force pair
The single-phase circulating air cooling of stream, (heat-sinking capability is respectively less than 100W/cm to circulation fluid refrigeration technique2) it cannot obviously meet high-power pole
Thermal control requirement under the conditions of end.Therefore it is directed to high fever galvanic electricity subcomponent cooling technology and special Space Thermal load management demand,
Development height, superelevation heat flow density equipment cooling technology, it has also become the important research direction to involve the interests of the state and the people.
The spray cooling for consolidating multiphase heat transfer principle based on space vapour-liquid, since the high coefficient of heat transfer can be generated,
Hot-surface temperature gradient is smaller simultaneously and the advantages that cooled wall surface is not in contact with thermal resistance dissipates in space high heat flux density component
The prior development direction of heat and spacecraft future Evolution of Thermal Control Technique.Electrostatic spray is the new method of efficient spray cooling technology.This
The drop that kind generates in the process is easily deformable broken, becomes smaller microlayer model.It compared with general pressure and aerodynamic atomization,
Has the advantages that uniqueness.Particle diameter can be controlled in nanometer to micro-scaled range, this is the be difficult to reality of traditional atomization method
Existing.By extra electric field, the parameters such as controllable drop size and flow, spray angle, to needing cooling on microelectronic chip
Key position carries out accurate temperature controller.Electric field can control the movement of charged drop and increase its kinetic energy simultaneously, it is easier to around penetrating
Gas medium, go directly heat source surface.In the course of injection of charged drop, Coulomb force can also make drop it is mutually exclusive, dispersion,
Uniform deposition greatly improves heat exchange efficiency in heat source surface.
Existing patent proposes the Spray Way using electrostatic atomization technology at present.Patent of invention CN
102227593A proposes a kind of misting cooling equipment and spray method, and cooling water supply makes to charged spray head from band EFI
The particle water of mist head injection is charged and is atomized, and is adsorbed in human body surface, realizes cooling.The invention applies electrostatic atomization well
Technology realizes the refinement of drop, but only for the slight cooling to obtain of this kind of low-heat current density surface of human body surface
Refrigerant sense, and lack the real-time regulating apparatus to voltage and flow, it is not easy to according to being cooled face temperature and flexible in size
Adjustable spraying flow and flow field structure, system structure, function and way of realization and the present invention are entirely different.In addition, this cold
But device lacks recycling and the circulator of cooling water, is unfavorable for economizing on resources.
Invention content
The present invention is insufficient according to prior art and defect, it is proposed that a kind of electrostatic atomization for high heat flux density surface
Cooling system prepares novel micron pore array electrostatic spray module, to adapt to high heat flux density basal plane using micro-nano processing method
Cooling；Voltage and atomization flow can be accurately adjusted according to temperature, and is provided with circulating pipe system, solve existing spray
Fog cooling apparatus is difficult to the speed of adjustable spraying and the problem of size and coolant liquid cannot recycle.
The technical solution adopted by the present invention is as follows：
A kind of electrostatic atomization cooling system for high heat flux density surface, including pipe-line system, electrostatic atomizer and
Controller；The pipe-line system is fluid reservoir, circulating pump, heat exchanger are formed by piping connection；The electrostatic atomizer is
Micron pore array and high pressure orifice plate are housed in nozzle housing, are spraying chamber between micron pore array and nozzle housing；Controller control
It is flow controller in device processed, voltage controller, flow controller connects circulating pump, and voltage controller connects electrostatic atomizer
High pressure orifice plate and city's voltage source.Circulating pump connects electrostatic atomizer by inlet tube, and fluid reservoir is followed for storing coolant liquid
Coolant liquid in ring pumped fluid reservoir comes together in the bottom below spraying device by the coolant liquid that electrostatic atomizer ejects
Plate connects heat exchanger by liquid back pipe and leads to fluid reservoir；The bottom plate is equipped with temperature sensor, the temperature for measuring cooled object
Degree, and temperature information is transmitted to temperature display by signal wire；
Flow controller in the controller is potentiometer, and the rotating speed pumped by control loop changes flow, in pump
Flow information is transmitted to flow indication screen by exit setting flow sensor by signal wire；
City's power supply is converted into DC voltage by the stable dc power supply converter in controller, by booster circuit and whole
Stream device is transmitted to high pressure orifice electrode, and the voltage of high pressure orifice electrode is controlled by potentiometer, and voltage signal is passed through signal wire
The voltmeter being transmitted in control cabinet, and shown on voltage display screen；
The micron pore array is in 1cm2Silicon chip process micron openings unit；
Hole will be arranged in a one-to-one correspondence on micron openings and high pressure orifice plate on the micron pore array；
The coolant liquid is the deionized water containing nano-particle；
The nano-particle is fine silver or carbon nanotube.
Beneficial effects of the present invention：
1) misting cooling is carried out using electrostatic atomization technology, realizes the accuracy controlling of convection current field structure, to realize to quilt
The accurate temperature controller of cooling surface；Simultaneously so that microlayer model is easier to reach and be deposited on cooled surface, heat exchange is substantially increased
Efficiency；
2) by temperature sensing and display device, the real-time monitoring of cooled object temperature is realized so that user being capable of root
Cooling procedure is in time neatly controlled according to temperature, changes the voltage of high pressure orifice plate, to change the intensity of external electric field, is changed micro-
Electrostatic repulsion between drop realizes the adjusting to the range of spray flow field；
3) by establishing the circulatory system of coolant liquid, the recycling of coolant liquid is realized, solves other misting coolings
Device can not effectively save the problem of coolant liquid resource.
Description of the drawings
Fig. 1 is a kind of electrostatic atomization cooling system schematic diagram for high heat flux density surface of the present invention；
Fig. 2 is the micron pore array electrostatic spray module diagram in the present invention；
Fig. 3 is the micron pore array upward view in the present invention；
Fig. 4 is the orifice electrode upward view in the present invention；
Fig. 5 is the control cabinet circuit block diagram in the present invention；
In figure, 1, control cabinet, 2, inlet tube, 3, electrostatic atomizer, 4, holder, 5, liquid back pipe, 6, bottom plate, 7, cooled
Object, 8, signal wire, 9, temperature display, 10, voltage display screen, 11, flow indication screen, 12, flow knob, 13, voltage knob,
14, heat exchanger, 15, micron pore array, 16, high pressure orifice plate, 17, spraying chamber, 18, spraying chamber entrance.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only used for explaining the present invention, not
For limiting the present invention.
As shown in Figure 1, 2, the present invention is a kind of electrostatic atomization cooling system for high heat flux density surface, including pipeline
System, electrostatic atomizer and controller；Fluid reservoir, circulating pump, heat exchanger 14, valve and bottom plate 6 pass through in pipe-line system
Piping connection electrostatic atomizer 3 forms a cycle；Coolant liquid is housed in fluid reservoir, by piping connection to circulating pump, then
It is flowed into spraying chamber entrance 18 to the nozzle of electrostatic atomizer 3 by inlet tube 2；The coolant liquid ejected by nozzle is eventually
On bottom plate 6 set by falling below nozzle, by 5 inflow heat exchanger 14 of liquid back pipe on bottom plate 6, coolant liquid drops in heat exchanger
Wen Hou is again introduced into the fluid reservoir in control cabinet 1, completes a cyclic process.Wherein, 6 built-in temperature sensor of bottom plate is used
Temperature information is transferred to by signal wire 8 in control cabinet in the temperature for measuring cooled object 7, is shown on temperature display 9.
As shown in Figure 3,4, electrostatic atomizer 3 is that micron pore array 15 and high pressure orifice plate 16, micron openings are housed in nozzle
It is spraying chamber 17 between array 15 and nozzle housing；Spray chamber 17 for temporarily store coolant liquid, the micron pore array be
1cm2Silicon chip on by micro-nano processing method integrate hundreds of micron openings units (such as 500, the number of specific micron hole machined
Amount can be manufactured according to actual conditions), the hole processed on high pressure orifice plate 16 need and micron pore array 15 on micron openings list
Member corresponds；Coolant liquid flows into electrostatic atomizer 3 through inlet tube 2, under the high voltage electrostatic field of orifice electrode form
Occur to be atomized and form submicron order droplet group, is formed by microlayer model and realizes orientation under the collective effect of gravity and electrostatic force
Uniform deposition is sprayed, and 7 surface of cooled object of going directly cools down to cooled object 7, to meet the heat exchange on high heat flux density surface
Demand.Electrostatic atomizer 3 is fixed on by holder 4 right over bottom plate, it is ensured that pipeline stabilization will not during the work time
It vibrates.
If improving the voltage applied to micron pore array electrostatic spray module 3, the microlayer model institute band of formation can be increased
The quantity of electric charge, while increasing the intensity of the external electric field between array micron openings and high pressure orifice electrode, to enhance between microlayer model
Electrostatic repulsion, increase the range of spray flow field, required with adapting to the cooling of the larger cooled object of area.
As shown in figure 5, being equipped with the controller of electrostatic atomization cooling system in control cabinet 1, flow control is equipped in controller
Device processed, voltage controller, wherein voltage controller is potentiometer, built-in HV generator, is turned by stable dc power supply
Parallel operation, self-maintained circuit, step-up transformer, rectifier, voltage display screen 10 etc. form a whole, and stable dc power supply turns
City's power supply is converted into DC voltage by parallel operation, and high pressure orifice electrode, high pressure orifice plate are transmitted to by booster circuit and rectifier
The voltage of electrode is controlled by potentiometer, and voltage signal is transmitted to the voltmeter in control cabinet by signal wire, and in voltage
It being shown on display screen, potentiometer adjusts the voltage that voltage is used to apply to micron pore array electrostatic spray module several kilovolts,
And the available voltage adjusting knob being connected with potentiometer adjusts the size of voltage, the atomization to reach the micro- spraying of accuracy controlling is stablized
The purpose of property and mist droplet granularity range.Temperature display 9 is connect with the temperature sensor in substrate, for showing cooled face
Temperature, person easy to operation regulate and control misting cooling process according to the temperature of cooled object.
Flow controller be flow adjustment knob by being connected with potentiometer by adjust the input voltage of circulating pump come
Its rotating speed is adjusted, to adjust the size of flow, to achieve the purpose that accuracy controlling coolant rate.
Coolant liquid, it can be fine silver, carbon nanotube etc. to select the deionized water containing nano-particle, nano-particle.Coolant liquid
In contain pure silver nanoparticles, have more significant heat transfer property, be more advantageous to it is heat conduction reinforced in cooling procedure, so as to increase
Strong cooling effect.
Since the microlayer model sprayed from array micron openings is all charged, drop can be avoided as much as due to electrostatic
Repulsion is in surface rebound, so can make full use of the cooling capacity of drop, enhances cooling effect.
Coolant liquid has achieved the effect that save resource by collecting and recycling, it can be achieved that repeatedly utilize.
It is further explained with reference to the course of work of the present invention：
After control cabinet 1 is powered, cooled object 7 is placed on bottom plate 6 by turn-on flow rate knob 12 and voltage knob 13,
Temperature sensor between bottom plate 6 and cooled object 7, detects the temperature of cooled object 7, and is shown in temperature display 9, work
Make personnel can according on flow indication screen 11 flow information, the information of voltage that shows on voltage display screen 10 and pass through temperature
The temperature information of cooled object 7 that degree sensor detects, by flow knob 12 and voltage knob 13 to the rotating speed of circulating pump
It is adjusted with the voltage of high pressure orifice plate 16, to control flow, granularity and the flow field structure of spraying；Coolant liquid is through inlet tube 2
Electrostatic atomizer 3 is flowed into, fog is issued in the high voltage electrostatic field of orifice electrode form and forms submicron order droplet
Group is formed by microlayer model and realizes orientation uniform deposition spraying under the collective effect of gravity and electrostatic force, and go directly cooled object 7
Surface cools down to cooled object 7；It finally collects on bottom plate 6, heat exchanger 14 is flowed to by liquid back pipe 5, heat exchanger 14 is right
Coolant liquid cools down, spare in being transported to fluid reservoir, to complete a cyclic process.
Above example is merely to illustrate the design philosophy and feature of the present invention, and its object is to make technology in the art
Personnel can understand the content of the present invention and implement it accordingly, and protection scope of the present invention is not limited to the above embodiments.So it is all according to
According to equivalent variations or modification made by disclosed principle, mentality of designing, within protection scope of the present invention.
Claims (8)
1. a kind of electrostatic atomization cooling system for high heat flux density surface, which is characterized in that including pipe-line system, electrostatic
Mist device (3) and controller；The pipe-line system is fluid reservoir, circulating pump, heat exchanger (14), bottom plate (6) pass through piping connection
It forms；The electrostatic atomizer (3) is made of the micron pore array (15) and high pressure orifice plate (16) being equipped in nozzle housing, micro-
Metre hole array (15) is spraying chamber (17) between nozzle housing；Circulating pump connects electrostatic atomizer by inlet tube (2)
(3), the bottom plate (6) below electrostatic atomizer (3) leads to fluid reservoir by liquid back pipe (5) connection heat exchanger (14), for defeated
It send, store coolant liquid；It is flow controller in controller, voltage controller, flow controller connects circulating pump, voltage controller
Connect the high pressure orifice plate (16) and city's voltage source of electrostatic atomizer (3).
2. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The bottom plate (6) is equipped with temperature sensor, the temperature for measuring cooled object (7), and temperature information is passed through signal wire (8)
It is transmitted to temperature display (9).
3. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The flow controller is potentiometer, and the rotating speed of control loop pump changes flow, and flow sensing is arranged in the exit of circulating pump
Flow information is transmitted to flow indication screen (11) by device by signal wire (8).
4. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The voltage controller is potentiometer, and voltage signal is transmitted to the voltmeter in control cabinet (1) by signal wire (8), and
It is shown on voltage display screen (10).
5. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The micron pore array (15) is in 1cm2Silicon chip process micron openings unit.
6. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 4 or 5, feature exist
In the hole unit of micron openings unit and high pressure orifice plate (16) is arranged in a one-to-one correspondence on the micron pore array (15).
7. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 1, which is characterized in that
The coolant liquid is the deionized water containing nano-particle.
8. a kind of electrostatic atomization cooling system for high heat flux density surface according to claim 7, which is characterized in that
The nano-particle is fine silver particle or carbon nanotube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810472924.XA CN108452964B (en) | 2018-05-17 | 2018-05-17 | Electrostatic atomization cooling system for high heat flux surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810472924.XA CN108452964B (en) | 2018-05-17 | 2018-05-17 | Electrostatic atomization cooling system for high heat flux surface |
Publications (2)
| Publication Number | Publication Date |
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| CN108452964A true CN108452964A (en) | 2018-08-28 |
| CN108452964B CN108452964B (en) | 2024-04-09 |
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| CN201810472924.XA Active CN108452964B (en) | 2018-05-17 | 2018-05-17 | Electrostatic atomization cooling system for high heat flux surface |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109758853A (en) * | 2019-01-10 | 2019-05-17 | 江苏大学 | A kind of electrostatic precipitation and dehumidification system of the more micron pore arrays of V-type |
| CN112604833A (en) * | 2020-12-14 | 2021-04-06 | 哈尔滨工业大学 | Electric spray liquid drop radiation heat dissipation device driven by electric conduction pump |
| CN113329595A (en) * | 2021-05-20 | 2021-08-31 | 江苏大学 | Targeted temperature control electrostatic spray cooling device and method thereof |
| CN113411940A (en) * | 2021-05-20 | 2021-09-17 | 江苏大学 | Electrostatic atomization cooling system based on ionic wind strengthening and energy conversion and utilization |
| CN113494739A (en) * | 2021-06-22 | 2021-10-12 | 华南理工大学 | Electrostatic spray evaporation cooling device for air conditioner condenser and split air conditioner |
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| CN1993030A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Compact spray cooling heat exchanger |
| US20090266516A1 (en) * | 2008-04-28 | 2009-10-29 | University Of Washington | Electrospray Evaporative Cooling (ESC) |
| CN102227593A (en) * | 2009-01-19 | 2011-10-26 | 报知机股份有限公司 | Spray cooling facility and spray method |
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