CN208545494U - A kind of vapor deposition apparatus - Google Patents
A kind of vapor deposition apparatus Download PDFInfo
- Publication number
- CN208545494U CN208545494U CN201820933195.9U CN201820933195U CN208545494U CN 208545494 U CN208545494 U CN 208545494U CN 201820933195 U CN201820933195 U CN 201820933195U CN 208545494 U CN208545494 U CN 208545494U
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- CN
- China
- Prior art keywords
- case
- high temperature
- deposition
- temperature
- vacuum tank
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- Expired - Fee Related
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- Chemical Vapour Deposition (AREA)
Abstract
The utility model discloses a kind of vapor deposition apparatus, it includes that gas flows into case etc., vacuum tank is located at the side that gas flows into case, plasma gas storage box is located at the side of vacuum tank, workbench is fixed on gas and flows into case, vacuum tank, in plasma gas storage box, conveyance conduit connects plasma gas storage box, multiple high temperature deposition casees are all fixed on the two sides of high temperature deposition case and high-temperature molding case, multiple cooling tubes are all fixed on the top of high temperature deposition case and high-temperature molding case, and multiple display screens are all fixed on the side of high temperature deposition case and high-temperature molding case.The utility model effectively completes vapor deposition by high temperature, improves the speed and efficiency of deposition, molding speed is also improved; the deposition of gas phase is allowed to become more convenient; temperature can be effectively reduced, protection depositing device is safer, improves the service life of depositing device.
Description
Technical field
The utility model relates to a kind of chemical industry equipments, more particularly to a kind of vapor deposition apparatus.
Background technique
Vapor deposition is a kind of Chemical Engineering Technology, which is mainly vapor-phase using the one or more containing film element
It closes object or simple substance, carry out chemical reaction generation film on the surface of a substrate, vapor deposition apparatus is a kind of with chemical vapor deposition
For product technology come the equipment for generating film, existing equipment can be always maintained at high temperature when carrying out high temperature deposition, prolonged high in this way
Temperature can generate damage to equipment, and the speed deposited is also relatively slow.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of vapor deposition apparatus, effectively complete by high temperature
At vapor deposition, the speed and efficiency of deposition are improved, molding speed is also improved, and the deposition of gas phase is allowed to become more
Add conveniently, temperature can be effectively reduced, protection depositing device is safer, improves the service life of depositing device.
The utility model is to solve above-mentioned technical problem by following technical proposals: a kind of vapor deposition apparatus,
It is characterized in that comprising gas flows into case, vacuum tank, plasma gas storage box, conveyance conduit, flow duct, workbench, branch
Support, depositing device, vacuum tank are located at the side that gas flows into case, and plasma gas storage box is located at the side of vacuum tank, work
Gas, which is fixed on, as platform flows into case, vacuum tank, in plasma gas storage box, conveyance conduit connects plasma gas storage box,
Flow duct connecting conveying pipe road and depositing device, multiple support frames are fixed on the table, and depositing device is located at multiple supports
Between frame, multiple support frames all connect flow duct, in which:
Depositing device includes high temperature deposition case, high-temperature molding case, cooling fin, cooling tube, display screen, protective coating, high temperature
Shaping box is located at the side of high temperature deposition case, and multiple high temperature deposition casees are all fixed on the two of high temperature deposition case and high-temperature molding case
Side, multiple cooling tubes are all fixed on the top of high temperature deposition case and high-temperature molding case, and multiple display screens are all fixed on high temperature deposition
The side of case and high-temperature molding case.
Preferably, the bottom of the high temperature deposition case and high-temperature molding case is designed with mounting rack.
Preferably, the workbench is equipped with mounting groove.
Preferably, the gas flows on case, is designed with operator control panel on vacuum tank, in plasma gas storage box.
Preferably, the volume of the high temperature deposition case and the volume of high-temperature molding case are identical.
The positive effect of the utility model is: the utility model effectively completes vapor deposition by high temperature,
The speed and efficiency of deposition are improved, molding speed is also improved, and allows the deposition of gas phase to become more convenient, Ke Yiyou
The reduction temperature of effect, protection depositing device is safer, improves the service life of depositing device.
Detailed description of the invention
Fig. 1 is the overall construction drawing of the utility model.
Fig. 2 is the structure chart of the depositing device of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 2, the utility model vapor deposition apparatus includes that gas flows into case 1, vacuum tank 2, plasma (orifice) gas
Body storage box 3, conveyance conduit 4, flow duct 5, workbench 6, support frame 7, depositing device 8, vacuum tank 2 are located at gas and flow into case
1 side, plasma gas storage box 3 are located at the side of vacuum tank 2, workbench 6 be fixed on gas flow into case 1, vacuum tank 2,
In plasma gas storage box 3, conveyance conduit 4 connects plasma gas storage box 3,5 connecting conveying pipe road 4 of flow duct with it is heavy
Product equipment 8, multiple support frames 7 are fixed on workbench 6, and depositing device 8 is between multiple support frames 7, and multiple support frames 7 are all
Connect flow duct 5, in which:
Depositing device 8 includes high temperature deposition case 9, high-temperature molding case 10, cooling fin 11, cooling tube 12, display screen 13, protection
Coating 17, high-temperature molding case 10 are located at the side of high temperature deposition case 9, and multiple high temperature deposition casees 9 are all fixed on 9 He of high temperature deposition case
The two sides of high-temperature molding case 10, multiple cooling tubes 12 are all fixed on the top of high temperature deposition case 9 and high-temperature molding case 10, Duo Gexian
Display screen 13 is all fixed on the side of high temperature deposition case 9 and high-temperature molding case 10.
The bottom of high temperature deposition case 9 and high-temperature molding case 10 is designed with mounting rack 14, install high temperature deposition case and high temperature at
Molding box is more convenient.
Workbench 6 is equipped with mounting groove 15, and installation elements are lighter.
Gas flow into case 1 on, on vacuum tank 2, operator control panel 16, using gas stream are designed in plasma gas storage box 3
Cartonning, vacuum tank, plasma gas storage box are simpler.
The volume of high temperature deposition case 9 and the volume of high-temperature molding case 10 be it is identical, improve the work of vapor deposition apparatus
Speed.
The working principle of the utility model is as follows: gas inflow gas flows into case, and the gas for flowing into case into gas passes through
Vacuum tank, plasma gas storage box enter conveyance conduit, and after gas enters conveyance conduit, vacuum tank is started to work, will be high
Warm sediment box and high-temperature molding case are evacuated, and are entered again by flow duct when gas enters flow duct by conveyance conduit
When high temperature deposition case, high temperature deposition case is started to work, and high temperature deposition case, which can be begun to warm up, allows gas to start in the event of high temperatures
Chemical deposition, at this moment the plasma gas of plasma gas storage box can significantly promote the chemical reaction of gas, make to deposit
It can carry out at normal temperature, when gas can flow into high-temperature molding case, height after high temperature deposition case completes deposition by flow duct
Warm shaping box is started to work, and high-temperature molding case, which can be initially added into, allows deposition that various chemical reaction moldings occur in the event of high temperatures
At various coatings, coating after molding is flowed out by flow duct again, thus completes vapor deposition in the case of a high temperature,
Vapor deposition is effectively completed by high temperature, improves the speed and efficiency of deposition, and molding speed is also improved, allows
The deposition of gas phase becomes more convenient.Depositing device is mounted on workbench, what such depositing device issued at work
High temperature does not interfere with other equipment, and height can be effectively reduced in the protective coating positioned at high temperature deposition case and high-temperature molding case surrounding
The high temperature that warm sediment box and high-temperature molding case issue at work, staff are not easy injury when working, and staff can be with
The working condition that high temperature deposition case and high-temperature molding case are observed by display screen, allows the use of depositing device to become more convenient,
High temperature deposition case and high-temperature molding case are all high temperature inside a very long time after the completion of work, are located at high temperature deposition case
With the cooling fins of high-temperature molding case two sides and be mounted on high temperature deposition case, the cooling tube of high-temperature molding box top can effectively drop
The temperature of low high temperature deposition case and high-temperature molding case, protection depositing device is safer, improves the service life of depositing device,
Support frame positioned at depositing device two sides is used to support flow duct, and fixed flow duct is stronger.
Claims (5)
1. a kind of vapor deposition apparatus, which is characterized in that it includes that gas flows into case, vacuum tank, plasma gas storage box, defeated
Pipeline, flow duct, workbench, support frame, depositing device are sent, vacuum tank is located at the side that gas flows into case, plasma gas
Storage box is located at the side of vacuum tank, and workbench is fixed on gas and flows into case, vacuum tank, in plasma gas storage box, conveying
Pipeline connects plasma gas storage box, and flow duct connecting conveying pipe road and depositing device, multiple support frames are fixed on work
On platform, for depositing device between multiple support frames, multiple support frames all connect flow duct, in which:
Depositing device includes high temperature deposition case, high-temperature molding case, cooling fin, cooling tube, display screen, protective coating, high-temperature molding
Case is located at the side of high temperature deposition case, and multiple high temperature deposition casees are all fixed on the two sides of high temperature deposition case and high-temperature molding case, more
A cooling tube is all fixed on the top of high temperature deposition case and high-temperature molding case, and multiple display screens are all fixed on high temperature deposition case and height
The side of warm shaping box.
2. vapor deposition apparatus as described in claim 1, which is characterized in that the bottom of the high temperature deposition case and high-temperature molding case
Portion is designed with mounting rack.
3. vapor deposition apparatus as described in claim 1, which is characterized in that the workbench is equipped with mounting groove.
4. vapor deposition apparatus as described in claim 1, which is characterized in that the gas flows on case, on vacuum tank, etc. from
Operator control panel is designed in sub- gas storage case.
5. vapor deposition apparatus as described in claim 1, which is characterized in that the volume and high-temperature molding of the high temperature deposition case
The volume of case is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820933195.9U CN208545494U (en) | 2018-06-15 | 2018-06-15 | A kind of vapor deposition apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820933195.9U CN208545494U (en) | 2018-06-15 | 2018-06-15 | A kind of vapor deposition apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208545494U true CN208545494U (en) | 2019-02-26 |
Family
ID=65422765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820933195.9U Expired - Fee Related CN208545494U (en) | 2018-06-15 | 2018-06-15 | A kind of vapor deposition apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208545494U (en) |
-
2018
- 2018-06-15 CN CN201820933195.9U patent/CN208545494U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190226 Termination date: 20200615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |