CN208540368U - Cooling system and electronic equipment - Google Patents

Abstract

The utility model provides a kind of cooling system and electronic equipment.Cooling system includes heat sink, the exothermic parts for being connected to the heat sink, the fluid working substance in the heat sink and the exothermic parts, and the heat sink and the exothermic parts constitute loop.The heat sink is equipped with capillary pipe structure, and the fluid working substance is flowed along the capillary pipe structure of the heat sink.Fluid working substance in the heat sink gasifies after absorbing heat, and spreads along the heat sink to the exothermic parts direction.The fluid working substance liquefies after the heat of carrying is distributed by the surface of the exothermic parts and is back to the heat sink along the exothermic parts.Heat sink and exothermic parts constitute a loop, and fluid working substance carries out heat absorption and heat release function in heat sink and exothermic parts internal circulation flow, and heat exchange effect is good.The thickness of heat sink and exothermic parts is small, suitable for the lesser electronic equipment of thickness.

Description

Cooling system and electronic equipment

Technical field

The disclosure belongs to technical field of electronic equipment, is related to a kind of cooling system and electronic equipment.

Background technique

In the related art, electronic equipment, such as laptop, including shell and it is installed on the intracorporal control mould of shell Block, shell are equipped with display portion and are rotationally connected with the operation part of display portion.It is easily produced in control module operational process Raw a large amount of heat, the heat need outside discharge shell in time.Correspondingly, cooling system, heat dissipation system are equipped in electronic equipment System generates heat for distributing in electronic equipment operational process.Such as, fan is equipped in electronic equipment, fan accelerates processing in shell Air flowing at device, to carry out radiating treatment to processor.

The operation of fan needs corresponding installation space and heat-dissipating space, to reach suitable heat dissipation effect.However, in electricity Fan is added in sub- equipment, then easily lead to electronic equipment overall thickness can not do it is small.For example, in laptop, keyboard Side is equipped with causes the thickness of keyboard side that can not reduce for cooling fan.Also, phase is offered on the shell of keyboard side The heat release hole answered, good appearance degree are poor.

Utility model content

In view of this, the disclosure provides a kind of cooling system and electronic equipment.

Specifically, the disclosure is achieved by the following technical solution:

According to the first aspect of the embodiments of the present disclosure, provide a kind of cooling system, including heat sink, be connected to it is described The exothermic parts of heat sink, the fluid working substance in the heat sink and the exothermic parts, the heat sink and The exothermic parts constitute loop, and the heat sink is equipped with capillary pipe structure, and the fluid working substance is along the endothermic section The capillary pipe structure of part flows；

Fluid working substance in the heat sink gasifies after absorbing heat, and along the heat sink to the exothermic parts Direction diffusion, the fluid working substance liquefy after the heat of carrying is distributed by the surface of the exothermic parts and along the heat releases Component is back to the heat sink.

In one embodiment, the exothermic parts are equipped with flexible connection component, and the part exothermic parts are around the flexibility Connection component cyclic bending.

In one embodiment, the exothermic parts include the first radiating subassembly and the second radiating subassembly, the flexible connection Component includes the first flexible pipe and the second flexible pipe for connecting first radiating subassembly and second radiating subassembly, and described the One radiating subassembly is connected to the heat sink, and second radiating subassembly can be around first flexible pipe and the second flexible pipe phase For the first radiating subassembly cyclic bending, the fluid working substance can be along first flexible pipe from first radiating subassembly Second radiating subassembly is diffused to, and converges to first heat dissipation from second radiating subassembly along second flexible pipe Component.

In one embodiment, first radiating subassembly includes efferent duct and the input for being connected to the heat sink Pipe, the efferent duct are connect with first flexible pipe, and the input pipe is connect with second flexible pipe.

In one embodiment, one is set as continuous bend formation calandria structure at least within for the input pipe and efferent duct.

In one embodiment, the input pipe include the first input unit for being connected to the heat sink, be connected to it is described The first connecting portion of second flexible pipe, the first row pipe portion for connecting first input unit and the first connecting portion, institute It states first row pipe portion and is set as continuous bend formation calandria structure.

In one embodiment, first radiating subassembly further includes fitting in the input pipe and/or the efferent duct First soaking plate.

In one embodiment, first radiating subassembly includes the second soaking plate being tightly connected with the heat sink, Capillary pipe structure is equipped in second soaking plate, the fluid working substance diffuses to second soaking from the heat sink Plate, and the heat sink is back to along second soaking plate.

In one embodiment, second radiating subassembly includes being connected to first flexible pipe and described second soft The heat-dissipating pipe of property pipe.

In one embodiment, the heat-dissipating pipe includes sequentially connected second input unit, radiating part and second connecting portion, institute It states the second input unit and is connected to first flexible pipe, the second connecting portion is connected to second flexible pipe；The heat dissipation Portion is set as continuous bend and forms calandria structure.

In one embodiment, second radiating subassembly further includes the third soaking plate for fitting in the heat-dissipating pipe.

In one embodiment, second radiating subassembly include respectively with first flexible pipe and second flexible pipe 4th soaking plate of connection, is equipped with capillary tube structure in the 4th soaking plate, and the fluid working substance is from first flexible pipe The 4th soaking plate is diffused to, and flows into second flexible pipe along the 4th soaking plate.

In one embodiment, first flexible pipe and second flexible pipe are set as bellows.

In one embodiment, capillary pipe structure is equipped in first flexible pipe and second flexible pipe.

In one embodiment, the heat sink is connected with the exothermic parts by capillary pipe structure.

In one embodiment, the space that the loop of the heat sink and the exothermic parts is constituted is set as negative pressure.

In one embodiment, the heat sink includes heat absorbing member and the conducting element in the heat absorbing member, described to lead It flows and is equipped with capillary pipe structure in part.

According to the second aspect of an embodiment of the present disclosure, a kind of electronic equipment is provided, the electronic equipment includes: processing Device, casing and cooling system as described above, the cooling system are installed in casing, and the heat sink and the processing The corresponding setting of device.

In one embodiment, the casing includes the first noumenon and is rotationally connected with second of the first noumenon Body, the cooling system extend to second ontology from the first noumenon.

The technical scheme provided by this disclosed embodiment can include the following benefits:

Heat sink and exothermic parts constitute a loop, and fluid working substance is in heat sink and exothermic parts inner recirculation flow It is dynamic, and heat absorption and heat release function are carried out, heat exchange effect is good.Heat at heat sink diffuses to entire heat release with fluid working substance At component, heat dissipation area is big.Fluid working substance drives effect good using capillary force and the gasification bulbs of pressure as driving force, whole to tie Structure simplifies.The thickness of heat sink and exothermic parts is small, suitable for the lesser electronic equipment of thickness.

Detailed description of the invention

Fig. 1 is a kind of layout structure signal of the cooling system in electronic equipment shown in one exemplary embodiment of the disclosure Figure.

Fig. 2 is that another layout structure of cooling system in electronic equipment shown in one exemplary embodiment of the disclosure shows It is intended to.

Fig. 3 is that another layout structure of cooling system in electronic equipment shown in one exemplary embodiment of the disclosure shows It is intended to.

Fig. 4 is the schematic cross-sectional view of the flexible connection component shown in one exemplary embodiment of the disclosure.

Fig. 5 is the block diagram of a kind of electronic equipment shown according to an exemplary embodiment.

In figure, heat sink 10；Exothermic parts 20；It is flexibly connected component 21；First flexible pipe 211；Second flexible pipe 212；Capillary pipe structure 213；First radiating subassembly 22；Efferent duct 221；Input pipe 222；First input unit 2221；First connection Portion 2222；First row pipe portion 2223；First soaking plate 223；Second soaking plate 224；Second radiating subassembly 23；Heat-dissipating pipe 231；The Two input units 2311；Second connecting portion 2312；Radiating part 2313；Third soaking plate 232；4th soaking plate 233；Casing 30；The One ontology 31；Second ontology 32；Electronic equipment 40；Processing component 41, memory 42, power supply module 43, multimedia component 44, sound Frequency component 45, the interface 46 of input/output (I/O), sensor module 47, communication component 48, processor 49.

Specific embodiment

Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.

It is only to be not intended to be limiting the disclosure merely for for the purpose of describing particular embodiments in the term that the disclosure uses. The "an" of the singular used in disclosure and the accompanying claims book, " described " and "the" are also intended to including majority Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps It may be combined containing one or more associated any or all of project listed.

It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the disclosure A little information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.For example, not departing from In the case where disclosure range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ... When " or " in response to determination ".

As shown in Figure 1 to Figure 3, in one embodiment, cooling system includes heat sink 10, is connected to heat sink 10 Exothermic parts 20, the fluid working substance in heat sink 10 and exothermic parts 20, heat sink 10 and exothermic parts 20 are constituted Loop.Heat sink 10 is equipped with capillary pipe structure, and fluid working substance is flowed along the heat sink 10 of heat sink 10.Endothermic section Fluid working substance in part 10 gasifies after absorbing heat, and spreads along heat sink 10 to 20 direction of exothermic parts.Fluid working substance exists The heat of carrying liquefies after being distributed by the surface of exothermic parts 20 and is back to heat sink 10 along exothermic parts 20.

Heat sink 10 and exothermic parts 20 constitute loop, so that fluid working substance is in heat sink 10 and exothermic parts It is circulated between 20.Heat sink 10 is located near heating sources, so that the heat of heat source can be transferred to stream by heat sink 10 Body working medium.Fluid working substance absorbs gasification expansion after heat, and exothermic parts 20 are flowed into the form of gas or gas-liquid mixture In.It exports after fluid working substance gasification expansion from the output side of heat sink 10 and is flowed to 20 direction of exothermic parts outward.It inhales Fluid working substance in thermal part 10 enters the output side of heat sink 10 along capillary pipe structure under the action of capillary force.Together When, the fluid working substance in exothermic parts 20 enters heat sink 10 along capillary pipe structure and inputs side, so that fluid working substance exists It is circulated between heat sink 10 and exothermic parts 20.And heat absorption and heat release are completed in the gas-liquid change procedure of fluid working substance Step, heat transfer is steady, and heat exchange effect is good.

Heat at heat sink 10 diffuses at entire exothermic parts 20 with fluid working substance, and exothermic parts 20 are far from heat absorption Component 10, heat dissipation area is big.Fluid working substance drives effect good using capillary force and the gasification bulbs of pressure as driving force, whole to tie Structure simplifies.Heat sink 10 and the thickness of exothermic parts 20 are small, suitable for the lesser electronic equipment of thickness.For example, will heat dissipation System is applied in laptop, folding or bendable mobile phone in equal volume lesser electronic equipment.Optionally one In embodiment, the substance that the easily gas-liquid variation such as water inhale heat release function is can be used in fluid working substance.

In one optionally embodiment, the space that the loop of heat sink 10 and exothermic parts 20 is constituted is set as negative Pressure.Heat sink 10 and the connection of exothermic parts 20 form loop, have inside heat sink 10 and exothermic parts 20 and supply The space of fluid working substance flowing.The pressure in the space is equipped with negative pressure, so that it is more fast to convert the gas-liquid state of fluid working substance Speed.Optionally, which is set as the low pressure state of evacuated state or similar vacuum.

In one optionally embodiment, heat sink 10 includes heat absorbing member and the conducting element in heat absorbing member, conducting element It is interior to be equipped with capillary pipe structure.Heat absorbing member is set as thin-walled workpiece, and both ends are sealed with the intersection area of exothermic parts 20 respectively to be connected It connects.Conducting element is set as guiding fluid working substance to flow in heat absorbing member, as conducting element is fixed on the side-walls of heat absorbing member and along suction The extending direction of warmware extends.The capillary pipe structures such as capillary groove are equipped in conducting element, so that fluid working substance is distributed in capillary In structure.

When heat source and heat absorbing member are bonded to each other or are close to each other, the heat of heat source output is transferred to water conservancy diversion by heat absorbing member Part, the fluid working substance gasification in conducting element expand and expand to 20 direction of exothermic parts and push fluid working substance in exothermic parts 20 Interior flowing, so that the heat of heat source be made to extend to entire exothermic parts 20, the heat absorption efficiency of heat sink 10 by fluid working substance It is high.As the expansion of fluid working substance is gasified, the fluid working substance of 20 other end of exothermic parts enters along the capillary pipe structure of conducting element It into heat sink 10, is circulated, radiating efficiency is high.For cooling system without additional setting driving source, energy-saving effect is good, Noise is small.

In one embodiment, heat sink 10 is connected with exothermic parts 20 by capillary pipe structure.In 20 He of exothermic parts The binding site of heat sink 10 is connected by capillary pipe structure, so that fluid working substance can enter heat unit along heat sink 10 At part 20.Fluid working substance absorbs heat at heat sink 10 to be expanded into exothermic parts 20, and fluid working substance is in exothermic parts 20 Condensation forms the fluid working substance of liquid after heat release, and the fluid working substance of liquid is back at heat sink 10 by capillary force, with complete At the circulation of fluid working substance, heat transfer effect is good.

In one optionally embodiment, hollow channel is equipped in exothermic parts 20, capillary pipe structure is adsorbed in exothermic parts At 20 tube wall.Gaseous fluid working substance can be flowed along the hollow channel of exothermic parts 20, and the fluid working substance of liquid can be along capillary The circulation of pipe structure, fluid working substance circulating effect are good.

With continued reference to Fig. 1 to Fig. 3, in one embodiment, exothermic parts 20 are equipped with flexible connection component 21, partial exothermic portion Part 20 is around flexible connection 21 cyclic bending of component.It is flexibly connected component 21 and exothermic parts 20 is separated to form several parts, so that The different zones energy local inclination that exothermic parts 20 are separated by flexible connection component 21 rotates.For example, flexible connection component 21 will Exothermic parts 20 are separated into two parts, and a portion exothermic parts 20 can be bent relative to another part exothermic parts 20, with Exothermic parts 20 are made to form transformable angle structure.To be flexibly connected the exothermic parts 20 that separate of component 21 be distributed in it is different Heat-delivery surface, fluid working substance flow in the different zones of exothermic parts 20 along flexible connection component 21, and heat dissipation area is big, layout It is more flexible.

For example, cooling system is applied in laptop, laptop includes keyboard side and display screen side, wherein will A part of exothermic parts 20 is set to keyboard side, and another part is set to display screen side, and flexible connection component 21 is located at display screen side At the connecting portion of keyboard side.Exothermic parts 20 can be rotated with the rotation of display screen side, and dissipating exothermic parts 20 Hot face extends to display screen side and keyboard side, and heat dissipation area is big, good heat dissipation effect.

Exothermic parts 20 by flexible connection component 21 separate be in flexible multiple component parts, exothermic parts 20 it is curved It is bent flexible, have a wide range of application.Fluid working substance can flow in the various pieces of exothermic parts 20, and heat dissipation range is big, and flowing is flexible Property is good.

In one embodiment, exothermic parts 20 include the first radiating subassembly 22 and the second radiating subassembly 23, flexible connection group Part 21 includes the first flexible pipe 211 and the second flexible pipe 212 of connection the first radiating subassembly 22 and the second radiating subassembly 23.First Radiating subassembly 22 is connected to heat sink 10, and the second radiating subassembly 23 can be opposite around the first flexible pipe 211 and the second flexible pipe 212 In 22 cyclic bending of the first radiating subassembly.Fluid working substance can diffuse to second from the first radiating subassembly 22 along the first flexible pipe 211 Radiating subassembly 23, and the first radiating subassembly 22 is converged to from the second radiating subassembly 23 along the second flexible pipe 212.

First radiating subassembly 22 and the second radiating subassembly 23 are connected by flexible connection component 21 and form a closed stream Circulation passage, fluid working substance circuit sequentially stream between the first radiating subassembly 22, flexible connection component 21 and the second radiating subassembly 23 It is dynamic.First flexible pipe 211 and the second flexible pipe 212 are connected to the both ends of the first radiating subassembly 22, and the two of heat sink 10 End is connected to the first radiating subassembly 22 and corresponding with the first flexible pipe 211 and the second flexible pipe 212, so that gaseous state or gas The fluid working substance self-priming thermal part 10 of liquid mixture shape is delivered to the first radiating subassembly 22, and along the first radiating subassembly 22 and first Flexible pipe 211 is delivered to the second radiating subassembly 23.The fluid working substance of gaseous state or gas-liquid mixture shape in the second radiating subassembly 23 and The first radiating subassembly of part 22 connecting with the second flexible pipe 212 carries out heat exchange, so that heat is in the area that fluid working substance flows through Domain carries out heat exchange.

Second radiating subassembly 23 around the first flexible pipe 211 and 212 cyclic bending of the second flexible pipe and can will not influence fluid The flowing of working medium, the first radiating subassembly 22 and the second radiating subassembly 23 can be respectively arranged on the shell that two are rotatably connected to expand The heat dissipation area of big exothermic parts 20.

It is illustrated for above-mentioned cooling system is applied to laptop.The installation of first radiating subassembly 22 In keyboard side and corresponding with heat sink 10 and the pyrotoxin of keyboard side is made, specifically, the place of heat sink 10 and keyboard side It is corresponding to manage device, the heat distributed when working with absorption processor.First radiating subassembly 22 is contacted with the shell of keyboard side, so that When fluid working substance flows through the first radiating subassembly 22, partial heat is subjected to heat exchange by the shell and atmosphere of keyboard side.

Second radiating subassembly 23 is located at display screen side, and the first flexible pipe 211 and the second flexible pipe 212 are arranged in parallel and difference Connection is located at the first radiating subassembly 22 and the second radiating subassembly 23 of display screen side and keyboard side two sides.First flexible pipe, 211 He Second flexible pipe 212 is located at the place that is rotatably connected of display screen side Yu keyboard side, can be bent with the rotation of display screen side, and Being connected to for the first radiating subassembly 22 and the second radiating subassembly 23 is kept, the scene opened and closed repeatedly that laptop uses is met.

Second radiating subassembly 23 is contacted with the shell of display screen side, when so that fluid working substance flowing through the second radiating subassembly 23, Partial heat is subjected to heat exchange by the shell and atmosphere of display screen side.The heat dissipation area of cooling system is big, required thickness Size is small, is conducive to the lightening design of laptop.

In one embodiment, the first radiating subassembly 22 includes efferent duct 221 and the input for being connected to heat sink 10 Pipe 222, efferent duct 221 are connect with the first flexible pipe 211, and input pipe 222 is connect with the second flexible pipe 212.

Efferent duct 221 and input pipe 222 are set as tubular structure, such as round tube, flat tube tubular structure.Efferent duct 221 connects In output one end of heat sink 10, for guiding the fluid working substance of gaseous state or gas-liquid mixture shape to be flowed into the second radiating subassembly At 23.Input pipe 222 is connected to input one end of heat sink 10, for guiding liquid or gas-liquid in the second radiating subassembly 23 mixed The fluid working substance for closing object shape is back to heat sink 10.Heat sink 10 is connect with efferent duct 221 and input pipe 222 respectively, peace Fill the flow direction for being conveniently conveniently adjusted fluid working substance and flow path and range.Efferent duct 221 and input pipe 222 are set as flat Pipe structure reduces the thickness of the first radiating subassembly 22, and the thickness of required installation space reduces, and lightening suitable for shell is answered Use scene.

In one optionally embodiment, capillary pipe structure, the capillary knot are equipped in input pipe 222 and/or efferent duct 221 Structure is surrounded at the tube wall of input pipe 222 and/or efferent duct 221, and is formed with flow channel in centre.Input pipe 222 And/or the capillary pipe structure in efferent duct 221 can provide flow channel for the fluid working substance of liquid, improve the flowing of fluid working substance Property.

In one embodiment, one is set as continuous bend formation comb knot at least within for input pipe 222 and efferent duct 221 Structure.

Calandria structure is that the calandria structure for forming U-shaped is successively bent by a root canal material comprising straight tube and curved pipe, In, it is parallel to each other between straight tube, it is connected between adjacent two straight tube by curved pipe.Other Curveds can also be used in calandria structure The calandria structure of formula.Input pipe 222 is set as calandria structure, so that fluid working substance circulates in input pipe 222, heat dissipation area is big. Similarly, efferent duct 221 is set as calandria structure, so that fluid working substance circulates in efferent duct 221, heat dissipation area is big.Input pipe 222 and efferent duct 221 simultaneously be set as calandria structure, the layout of the first radiating subassembly 22 can be made more flexible, heat dissipation range it is big.

As shown in Figure 1, being illustrated so that input pipe 222 is set as calandria structure as an example in an optionally embodiment. Input pipe 222 includes being connected to the first input unit 2221 of heat sink 10, being connected to the first connecting portion of the second flexible pipe 212 2222, the first row pipe portion 2223 of the first input unit 2221 and first connecting portion 2222,2223 company of being set as of first row pipe portion are connected It is continuous to be formed by bending calandria structure.

The first input unit 2221 and first connecting portion 2222 is arranged to adjust heat sink 10 and the second flexibility in input pipe 222 Opposite link position between pipe 212 so that the installation site of heat sink 10 is flexible, and makes the second flexible pipe 212 and heat absorption Fluid working substance keeps the duration and stationarity of flowing in component 10.For example, the first input unit 2221 and first connecting portion 2222 At right angles, the extending direction of heat sink 10 is vertical with the extending direction of the second flexible pipe 212, the placement position of heat sink 10 And angle is more flexible.

First row pipe portion 2223 is set as calandria structure, can expand 22 heat dissipation area of the first radiating subassembly, and be able to maintain fluid Working medium smooth flow in first row pipe portion 2223.First radiating subassembly 22 is the important heat dissipation region of exothermic parts 20 1, is expanded Big heat dissipation area is conducive to improve the integral heat sink efficiency of cooling system.

In one optionally embodiment, first row pipe portion 2223 and heat sink 10 are in same plane, first row pipe portion 2223 are in same plane with heat sink 10, so that fluid working substance energy smooth flow is to heat sink 10, flow resistance is small.The One comb portion 2223 is in planar structure, and installation effect is good.It is noted that can also be in first row pipe portion 2223 different flat Face is to adapt to the structure change of shell.

First row pipe portion 2223 is connected to the first input unit 2221 and first connecting portion 2222, can will radiate through second Fluid working substance further progress heat exchange after the heat dissipation of component 23, good heat dissipation effect, radiating efficiency are high.It is noted that the One comb portion 2223 can also be set on efferent duct 221.

As shown in Fig. 2, in one optionally embodiment, the first radiating subassembly 22 further include fit in input pipe 222 and/or First soaking plate 223 of efferent duct 221.First soaking plate 223 is the vacuum cavity that an inner wall has fine structure, optional Ground, the first soaking plate 223 are made of copper product.Its working principle is that: when heat is by heat source to evaporating area, in cavity Cooling medium starts to generate the gasification phenomenon of cooling medium after being heated in the environment of rough vacuum, and the cooling medium of gas phase is rapid It expands and is full of entire cavity.Condensation will be generated when the cooling medium of gas phase touches the lower region of temperature in soaking plate Phenomenon.The cooling medium of gas phase releases the heat accumulated in evaporation by condensation phenomenon, and the cooling medium after condensation can borrow Evaporating area is returned by the capillary channel of micro-structure, so that cooling medium recycles in cycles in the cavity.

First soaking plate 223 fits at input pipe 222 and/or efferent duct 221, so that input pipe 222 and/or efferent duct Heat transfer entrained by fluid working substance is to the first soaking plate 223 in 221, and fast by the contact site of the first soaking plate 223 Speed diffuses to entire first soaking plate 223, and radiating efficiency is high, and heat dissipation area is big.Flowing in input pipe 222 and/or efferent duct 221 Heat source of the fluid working substance as the first soaking plate 223, the good heat dissipation effect of exothermic parts 20.Fluid working substance further passes through Two radiating subassemblies 23 radiate, and radiating efficiency is high, and heat dissipation area is big.

As shown in figure 3, in one embodiment, the first radiating subassembly 22 include be tightly connected with heat sink 10 second Hot plate 224, the second soaking plate 224 is interior equipped with capillary pipe structure, and fluid working substance self-priming thermal part 10 diffuses to the second soaking plate 224, and heat sink 10 is back to along the second soaking plate 224.

Second soaking plate 224 is connect with heat sink 10, and the fluid working substance gasification in heat sink 10 expands and along second Soaking plate 224 is spread, and the heat that fluid working substance absorbs directly or indirectly carries out heat exchange with atmosphere by the second soaking plate 224, Good heat dissipation effect.The liquid fluid working medium formed after fluid working substance heat release liquefaction is back to heat sink 10 by capillary pipe structure Place, flowing is smooth, and circulating effect is good.

In one optionally embodiment, the first flexible pipe 211 and the second flexible pipe 212 connect with the second soaking plate 224 respectively It is logical, and be tightly connected with the edge of 224 binding site of the second soaking plate.First flexible pipe 211 and the second flexible pipe 212 divide The both ends of the second soaking plate 224 are not connected to, to guide the fluid working substance in the second soaking plate 224 to flow along the first flexible pipe 211 Enter into the second radiating subassembly 23, the fluid working substance in the second radiating subassembly 23 enters the second soaking along the second flexible pipe 212 In plate 224, with the range that circulates of further expansion fluid working substance, radiating efficiency is improved.

As shown in Figure 1 to Figure 3, in one embodiment, the second radiating subassembly 23 includes being connected to the first flexible pipe 211 With the heat-dissipating pipe 231 of the second flexible pipe 212.Heat-dissipating pipe 231 is set as tubular structure, such as round tube, flat tube tubular structure.Heat-dissipating pipe 231 both ends are connect with the first flexible pipe 211 and the second flexible pipe 212 respectively, and fluid working substance is flowed into along the first flexible pipe 211 to be dissipated Heat pipe 231, then the second flexible pipe 212 is flowed into along heat-dissipating pipe 231.Fluid working substance flows in heat-dissipating pipe 231, and passes through heat-dissipating pipe 231 carry out heat exchange with extraneous, improve heat dissipation area.Also, the first flexible pipe 211 and 212 bending energy of the second flexible pipe drive Heat-dissipating pipe 231 is rotated relative to the first radiating subassembly 22, and flexible swinging is good.Optionally, heat-dissipating pipe 231 is set as flat tube configuration, Installation space needed for the second radiating subassembly 23 can be reduced is suitable for the lightening design requirement of shell.Such as the second radiating subassembly 23 Applied to electronic equipments such as lightening mobile phone, computers.

As depicted in figs. 1 and 2, in one embodiment, heat-dissipating pipe 231 includes sequentially connected second input unit 2311, dissipates Hot portion 2313 and second connecting portion 2312, the second input unit 2311 are connected to the first flexible pipe 211, and second connecting portion 2312 connects To the second flexible pipe 212, radiating part 2313 is set as continuous bend and forms calandria structure.The second input unit is arranged in heat-dissipating pipe 231 2311 and second connecting portion 2312 opposite being connected with adjust between heat-dissipating pipe 231 and the first flexible pipe 211 and the second flexible pipe 212 Position is connect, so that the fluid working substance flowing in the first flexible pipe 211 and the second flexible pipe 212 is smooth, flow resistance is small.Radiating part 2313 can facilitate the flow range of adjustment fluid working substance, so that the shape of radiating part 2313 can be adapted to corresponding installation shell.

Radiating part 2313 is set as calandria structure, wherein calandria structure is that the row for forming U-shaped is successively bent by a root canal material Pipe structure, wherein straight-tube portion is parallel to each other, is connected between adjacent two straight tube by curved pipe.It can also be used in calandria structure Its arrangement architecture, so that the heat dissipation area of radiating part 2313 increases, and it is steady in radiating part 2313 to be able to maintain fluid working substance Flowing.Radiating part 2313 is connected to the second input unit 2311 and second connecting portion 2312, can will flow through the second radiating subassembly 23 fluid working substance carries out heat exchange, good heat dissipation effect, radiating efficiency height.

In one optionally embodiment, radiating part 2313 is in same plane.Radiating part 2313 is so that fluid working substance can be put down Current stabilization is moved in the second radiating subassembly 23, and flow resistance is small.Radiating part 2313 is in planar structure, and installation effect is good.It is worth mentioning , radiating part 2313 can also be in Different Plane to adapt to the structure change of shell.

As shown in Fig. 2, the second radiating subassembly 23 further includes fit in heat-dissipating pipe 231 in one optionally embodiment Three soaking plates 232.The working principle of third soaking plate 232 is identical as the working principle of the first soaking plate 223.Third soaking plate 232 fit at heat-dissipating pipe 231 so that in heat-dissipating pipe 231 heat transfer entrained by fluid working substance to third soaking plate 232, And entire third soaking plate 232 is diffused to rapidly by the contact site of third soaking plate 232, radiating efficiency is high, heat dissipation area Greatly.Heat source of the heat as third soaking plate 232 entrained by the fluid working substance flowed in heat-dissipating pipe 231, exothermic parts 20 Good heat dissipation effect.

As shown in figure 3, in one embodiment, the second radiating subassembly 23 includes soft with the first flexible pipe 211 and second respectively Property the 4th soaking plate 233 that connects of pipe 212, be equipped with capillary tube structure in the 4th soaking plate 233.Fluid working substance is from the first flexible pipe 211 diffuse to the 4th soaking plate 233, and flow into the second flexible pipe 212 along the 4th soaking plate 233.

The side of 4th soaking plate 233 is connect with the first flexible pipe 211, the fluid working substance gasification in the first radiating subassembly 22 It expands and diffuses to the 4th soaking plate 233 along the first flexible pipe 211, the heat that fluid working substance absorbs passes through the 4th soaking plate 233 Directly or indirectly heat exchange, good heat dissipation effect are carried out with atmosphere.The liquid or gas-liquid mixture form that fluid working substance heat release is formed Liquid fluid working medium be back at the first radiating subassembly 22 along the second flexible pipe 212, flow it is smooth, circulating effect is good.Wherein, 4th soaking plate 233 is with the bending of the first flexible pipe 211 and the second flexible pipe 212 and relative to 22 turns of the first radiating subassembly It is dynamic, using convenient.

In one optionally embodiment, the knot of the 4th soaking plate 233 and the first flexible pipe 211 and the second flexible pipe 212 The edge for closing position is tightly connected.4th soaking plate 233 and the first flexible pipe 211 and the second flexible pipe 212 constitute a closing Fluid working substance is locked in the 4th soaking plate 233 by space, and sealing effect is good.

As shown in figure 4, in one embodiment, the first flexible pipe 211 and the second flexible pipe 212 are set as bellows.First Flexible pipe 211 and the second flexible pipe 212 are set as bellows structure, and rotation flexibility is high.First flexible pipe 211 and the second flexible pipe 212 energy alternating bendings are so that the first radiating subassembly 22 and the formation of the second radiating subassembly 23 are rotatably connected.And the first flexible pipe 211 and second flexible pipe 212 be set as hollow tubular structure, fluid working substance can be made in the first flexible pipe 211 and the second flexible pipe 212 Interior flowing, mobility are strong.In one optionally embodiment, the first flexible pipe 211 and/or the second flexible pipe 212 are by stainless steel Bellows made of the materials such as material, copper, aluminium.

In one optionally embodiment, capillary pipe structure 213 is equipped in the first flexible pipe 211 and the second flexible pipe 212. When fluid working substance needs to guide by capillary pipe structure 213, hair is set in the first flexible pipe 211 and the second flexible pipe 212 Capillary structure 213, to improve the mobility of fluid working substance.Wherein, the capillary in the first flexible pipe 211 and the second flexible pipe 212 Pipe structure 213 is process by flexible material.For example, it is stainless to be equipped with liner in the first flexible pipe 211 and the second flexible pipe 212 The capillary pipe structure 213 that steel wire or copper mesh are constituted, so that the first flexible pipe 211 and the second flexible pipe 212 can alternating bendings And keep the mobility of good fluid working substance.

Fig. 5 is the block diagram of a kind of electronic equipment shown according to an exemplary embodiment.Electronic equipment includes: processor 49, casing 30 and such as cooling system provided by the above embodiment, cooling system is installed in casing 30, and heat sink 10 and place Manage the corresponding setting of device.

For example, electronic equipment 40 can be mobile phone, computer, digital broadcasting terminal, messaging device, game control Platform processed, tablet device, Medical Devices, body-building equipment, personal digital assistant etc..

In one optionally embodiment, casing 30 includes the first noumenon 31 and is rotationally connected with the second of the first noumenon 31 Ontology 32, cooling system extend to the second ontology 32 from the first noumenon 31.The first noumenon 31 and the second ontology 32 relatively rotate, and dissipate Hot systems extend to the second ontology 32 from the first noumenon 31, and heat dissipation range is big.Cooling system transfers heat to casing 30, and leads to It crosses casing 30 and ambient atmosphere carries out heat exchange, heat exchanger effectiveness is high.For example, electronic equipment is set as laptop, first Body 31 is keyboard side, and the second ontology 32 is set as display screen side, wherein display screen side can be rotated relative to keyboard side.Cooling system is certainly The first noumenon 31 extends to the second ontology 32, can radiate simultaneously in keyboard side and display screen side, heat dissipation area is big, heat exchange efficiency It is high.

Referring to Fig. 5, electronic equipment 40 may include following one or more components: processing component 41, memory 42, power supply Component 43, multimedia component 44, audio component 45, the interface 46 of input/output (I/O), sensor module 47 and communication set Part 48.

The integrated operation of the usual controlling electronic devices 40 of processing component 41, such as with display, telephone call, data communication, Camera operation and record operate associated operation.Processing component 41 may include that one or more processors 49 refer to execute It enables, to perform all or part of the steps of the methods described above.In addition, processing component 41 may include one or more modules, just Interaction between processing component 41 and other assemblies.For example, processing component 41 may include multi-media module, to facilitate more matchmakers Interaction between body component 44 and processing component 41.

Memory 42 is configured as storing various types of data to support the operation in electronic equipment 40.These data Example includes the instruction of any application or method for operating on electronic equipment 40, contact data, telephone directory number According to, message, picture, video etc..Memory 42 can by any kind of volatibility or non-volatile memory device or they Combination realize, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM) is erasable Programmable read only memory (EPROM), programmable read only memory (PROM), read-only memory (ROM), magnetic memory, quick flashing Memory, disk or CD.

Power supply module 43 provides electric power for the various assemblies of electronic equipment 40.Power supply module 43 may include power management system System, one or more power supplys and other with for electronic equipment 40 generate, manage, and distribute the associated component of electric power.

Multimedia component 44 includes the screen of one output interface of offer between electronic equipment 40 and user.Some In embodiment, screen may include liquid crystal display (LCD) and touch panel (TP).If screen includes touch panel, screen It may be implemented as touch screen, to receive input signal from the user.Touch panel includes one or more touch sensors To sense the gesture on touch, slide, and touch panel.Touch sensor can not only sense the boundary of a touch or slide action, But also detection duration and pressure relevant to touch or slide.In some embodiments, multimedia component 44 wraps Include a front camera and/or rear camera.When electronic equipment 40 is in operation mode, such as screening-mode or video mode When, front camera and/or rear camera can receive external multi-medium data.Each front camera and postposition camera shooting Head can be a fixed optical lens system or have focusing and optical zoom capabilities.

Audio component 45 is configured as output and/or input audio signal.For example, audio component 45 includes a microphone (MIC), when electronic equipment 40 is in operation mode, when such as call mode, recording mode, and voice recognition mode, microphone is matched It is set to reception external audio signal.The received audio signal can be further stored in memory 42 or via communication component 48 send.In some embodiments, audio component 45 further includes a loudspeaker, is used for output audio signal.

The interface 46 of input/output (I/O) provides interface, above-mentioned periphery between processing component 41 and peripheral interface module Interface module can be keyboard, click wheel, button etc..These buttons may include, but are not limited to: home button, opens volume button Dynamic button and locking press button.

Sensor module 47 includes one or more sensors, and the state for providing various aspects for electronic equipment 40 is commented Estimate.For example, sensor module 47 can detecte the state that opens/closes of equipment, the relative positioning of component, such as component as electricity The display and keypad of sub- equipment 40, sensor module 47 can also detect 40 1 components of electronic equipment 40 or electronic equipment Position change, the existence or non-existence that user contacts with electronic equipment 40,40 orientation of electronic equipment or acceleration/deceleration and electronics The temperature change of equipment 40.Sensor module 47 may include proximity sensor, be configured to connect in not any physics It is detected the presence of nearby objects when touching.Sensor module 47 can also include optical sensor, such as CMOS or ccd image sensor, For being used in imaging applications.In some embodiments, which can also include acceleration transducer, gyro Instrument sensor, Magnetic Sensor, pressure sensor or temperature sensor.

Communication component 48 is configured to facilitate the communication of wired or wireless way between electronic equipment 40 and other equipment.Electricity Sub- equipment 40 can access the wireless network based on communication standard, such as WiFi, 2G or 3G or their combination.In an example Property embodiment in, communication component 48 receives broadcast singal from external broadcasting management system via broadcast channel or broadcast is related Information.In one exemplary embodiment, communication component 48 further includes near-field communication (NFC) module, to promote short range communication.Example Such as, NFC module can be based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra wide band (UWB) technology, Bluetooth (BT) technology and other technologies are realized.

In the exemplary embodiment, electronic equipment 40 can be by one or more application specific integrated circuit (ASIC), number Word signal processor (DSP), digital signal processing appts (DSPD), programmable logic device (PLD), field programmable gate array (FPGA), controller, microcontroller, microprocessor or other electronic components are realized, for executing the above method.

The above is only the preferred embodiments of the disclosure, not to limit the disclosure, all spirit in the disclosure and Within principle, any modification, equivalent substitution, improvement and etc. done be should be included within the scope of disclosure protection.

Claims (19)

1. a kind of cooling system, which is characterized in that including heat sink, the exothermic parts that are connected to the heat sink, be located at Fluid working substance in the heat sink and the exothermic parts, the heat sink and exothermic parts composition are closed back Road, the heat sink are equipped with capillary pipe structure, and the fluid working substance is flowed along the capillary pipe structure of the heat sink；

Fluid working substance in the heat sink gasifies after absorbing heat, and along the heat sink to the exothermic parts direction Diffusion, the fluid working substance liquefy after the heat of carrying is distributed by the surface of the exothermic parts and along the exothermic parts It is back to the heat sink.

2. cooling system according to claim 1, which is characterized in that the exothermic parts are equipped with flexible connection component, portion Divide the exothermic parts around the flexible connection component cyclic bending.

3. cooling system according to claim 2, which is characterized in that the exothermic parts include the first radiating subassembly and the Two radiating subassemblies, the flexible connection component include connect first radiating subassembly and second radiating subassembly first soft Property pipe and the second flexible pipe, first radiating subassembly are connected to the heat sink, and second radiating subassembly can be around described Relative to the first radiating subassembly cyclic bending, the fluid working substance can be along described first for first flexible pipe and the second flexible pipe Flexible pipe diffuses to second radiating subassembly from first radiating subassembly, and dissipates along second flexible pipe from described second Hot component converges to first radiating subassembly.

4. cooling system according to claim 3, which is characterized in that first radiating subassembly includes being connected to institute The efferent duct and input pipe of heat sink are stated, the efferent duct is connect with first flexible pipe, the input pipe and described the The connection of two flexible pipes.

5. cooling system according to claim 4, which is characterized in that one is set at least within for the input pipe and efferent duct Calandria structure is formed for continuous bend.

6. cooling system according to claim 5, which is characterized in that the input pipe includes being connected to the heat sink The first input unit, the first connecting portion, connection first input unit and described first that are connected to second flexible pipe connect The first row pipe portion of socket part, the first row pipe portion are set as continuous bend and form calandria structure.

7. cooling system according to claim 4, which is characterized in that first radiating subassembly further include fit in it is described First soaking plate of input pipe and/or the efferent duct.

8. cooling system according to claim 3, which is characterized in that first radiating subassembly includes and the endothermic section The second soaking plate that part is tightly connected, is equipped with capillary pipe structure in second soaking plate, and the fluid working substance is from the heat absorption Component diffuses to second soaking plate, and is back to the heat sink along second soaking plate.

9. cooling system according to claim 3, which is characterized in that second radiating subassembly includes being connected to institute State the heat-dissipating pipe of the first flexible pipe and second flexible pipe.

10. cooling system according to claim 9, which is characterized in that the heat-dissipating pipe includes sequentially connected second defeated Enter portion, radiating part and second connecting portion, second input unit is connected to first flexible pipe, the second connecting portion connection To second flexible pipe；The radiating part is set as continuous bend and forms calandria structure.

11. cooling system according to claim 9, which is characterized in that second radiating subassembly further includes fitting in institute State the third soaking plate of heat-dissipating pipe.

12. cooling system according to claim 3, which is characterized in that second radiating subassembly include respectively with it is described The 4th soaking plate that first flexible pipe is connected with second flexible pipe, the 4th soaking plate is interior to be equipped with capillary tube structure, institute It states fluid working substance and diffuses to the 4th soaking plate from first flexible pipe, and flow into described along the 4th soaking plate Two flexible pipes.

13. cooling system according to claim 3, which is characterized in that first flexible pipe and second flexible pipe It is set as bellows.

14. cooling system according to claim 13, which is characterized in that first flexible pipe and second flexible pipe Inside it is equipped with capillary pipe structure.

15. cooling system according to claim 1, which is characterized in that the heat sink and the exothermic parts pass through Capillary pipe structure connection.

16. cooling system according to claim 1, which is characterized in that the envelope of the heat sink and the exothermic parts The space that loop circuit is constituted is set as negative pressure.

17. cooling system according to claim 1, which is characterized in that the heat sink include heat absorbing member and be set to institute The conducting element in heat absorbing member is stated, is equipped with capillary pipe structure in the conducting element.

18. a kind of electronic equipment, which is characterized in that the electronic equipment includes processor, casing and such as claim 1 to 17 times Cooling system described in meaning one, the cooling system is installed in casing, and the heat sink is opposite with the processor It should be arranged.

19. electronic equipment according to claim 18, which is characterized in that the casing includes the first noumenon and rotatably connects It is connected to the second ontology of the first noumenon, the cooling system extends to second ontology from the first noumenon.