CN208524667U - A kind of cooking machine to be freezed by semiconductor chip - Google Patents
A kind of cooking machine to be freezed by semiconductor chip Download PDFInfo
- Publication number
- CN208524667U CN208524667U CN201721288561.1U CN201721288561U CN208524667U CN 208524667 U CN208524667 U CN 208524667U CN 201721288561 U CN201721288561 U CN 201721288561U CN 208524667 U CN208524667 U CN 208524667U
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- CN
- China
- Prior art keywords
- semiconductor
- freezed
- cup body
- cooking machine
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 238000010411 cooking Methods 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 235000013305 food Nutrition 0.000 claims abstract description 6
- 230000007704 transition Effects 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002826 coolant Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 230000005494 condensation Effects 0.000 claims 1
- 238000009833 condensation Methods 0.000 claims 1
- 235000015203 fruit juice Nutrition 0.000 abstract description 11
- 230000008859 change Effects 0.000 abstract description 5
- 230000001932 seasonal effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000012774 insulation material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229920005439 Perspex® Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- -1 Condenser pipe Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000016709 nutrition Nutrition 0.000 description 1
- 230000035764 nutrition Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Food-Manufacturing Devices (AREA)
Abstract
The utility model discloses a kind of cooking machines to be freezed by semiconductor chip, including cup body, cup lid and pedestal, cup lid includes upper cover, lower cover, the refrigerating plant between upper cover and lower cover, refrigerating plant includes that lower end extends to the intracorporal condenser pipe of cup, the heat-conductive plate of a transition temperature is connected in condenser pipe upper end, the semiconductor refrigeration chip of plate face setting is close in a plate face of the plate.The utility model can be realized according to self-demand by increasing semiconductor refrigeration chip/bottom-heated technology for slop refrigerating/heating in cup body and change the purpose of slop temperature.Avoiding people is influenced and bring sense of discomfort when Various Seasonal drinks fruit juice or slop by ambient temperature.After semiconductor refrigerating/bottom-heated, the temperature of food in adjustable cup body.People can drink hot fruit juice or drink in winter, and summer can drink ice-cold fruit juice or drink, to change the temperature disposal options of traditional fruit juice or drink, meet the demand of people.
Description
Technical field
The utility model belongs to a kind of integrated equipment field of semiconductor refrigerating/bottom-heated, especially a kind of to utilize half
Conductor refrigerating chip/heating module carries out the device of refrigerating/heating to liquid in cup body.
Background technique
Cooking machine is that typically used in the household electrical appliance of processed fruit/cereal or meat food.Due to processing fruit juice or meat
Class, the food materials of fresh working process are not because having the features such as chemically treated holding is genuine, is easily absorbed by the body to be made extensively
With.But the juice after processing is usually room temperature, easily cannot change temperature according to the hobby demand of people, be unable to satisfy
The mouthfeel of people.Cooking machine general utility functions at present on the market are single, and it includes many-sided comprehensive for not being able to satisfy one machine of people
The demand of function.With the continuous promotion of semiconductor chip efficiency, a variety of heating techniques are constantly improve, so that the utility model
Practical application become a reality, in this background, the utility model comes into being.
Utility model content
The utility model aim is to change fluid temperature in cup body by increasing semiconductor refrigeration chip/heating module, is made
The filled aqueous liquid foodstuff of cup body realizes the function of refrigerating/heating.
The utility model is achieved by the following technical solution:
A kind of cooking machine to be freezed by semiconductor chip, including upper cover, cup body and pedestal, the upper cover include top cover,
Seal flexible glue, lid, radiator fan, radiator, semiconductor heat-dissipating chip, temperature-uniforming plate, semiconductor refrigeration chip, thermal insulation material,
Condenser pipe, metal mesh；The cup body includes high speed knife, bearing, rotation axis, occlusion gear, heating element；The pedestal includes:
It is engaged gear, bearing, motor, radiator fan, main circuit board, control panel, rotational speed regulation button, power supply, microswitch；Upper cover and
Cup body is conductive by the connection of male and female end plug, and semiconductor refrigeration chip is transmitted to cup body center cold by condenser pipe in upper cover,
And conduction refrigeration is contacted with liquid；Bottom of cup is equipped with heating module, can be heat critical dimensions bottom-up, fruit juice knife
Rotation be conducive to cold or hot quick diffusion；Control panel has different control keys, such as beans above for different aqueous liquid foodstuffs
Slurry, rice paste, soup, mushy fruit juice, xylocarp juice etc., function is controlled by main circuit board, and power supply is cooperated to carry out rotational speed regulation.
The semiconductor refrigeration chip is single or multiple and cascaded structure, and semiconductor refrigeration chip is in upper temperature-uniforming plate under
It among condenser pipe, or directly fits and is fixed between condenser pipe and radiator, semiconductor heat-dissipating chip is single or multiple
And cascaded structure, it fits between temperature-uniforming plate and radiator.
The temperature-uniforming plate fits between semiconductor refrigeration chip and semiconductor heat-dissipating chip.
The thermal insulation material fits in around semiconductor refrigeration chip, semiconductor heat-dissipating chip and temperature-uniforming plate.
The radiator fits in semiconductor heat-dissipating chip-side.
The radiator fan is located at upper tops, and radiator and radiator fan can also place side, and top or side have
Inlet and outlet, radiator fan are connect with power supply by conducting wire.
The juicing motor connects high speed knife, and is controlled by main circuit board, passes through the different revolving speed of rotational speed regulation button adjusting section.
The motor bottom is equipped with radiator fan, is radiated by bottom heat radiation hole to motor sub-assembly.
A kind of device carrying out longitudinal conduction cooling using semiconductor refrigeration chip and condenser pipe, while being equipped with internal heating skill
Art, the comprehensive slop demand for solving people in life in Various Seasonal or different time sections to different temperatures.
The utility model has the beneficial effects that
The utility model freezes/adds for slop in cup body by increasing semiconductor refrigeration chip/bottom-heated technology
Heat can be realized according to self-demand and change the purpose of slop temperature.It avoids people and drinks fruit juice in Various Seasonal
Or it is influenced and bring sense of discomfort when slop by ambient temperature.After semiconductor refrigerating/bottom-heated, adjustable cup
The temperature of internal food.People can drink hot fruit juice or drink in winter, and summer can drink ice-cold fruit juice or drink, thus
The temperature disposal options for changing traditional fruit juice or drink, meet the demand of people.The utility model passage capacity corrects one's mistakes, is electric
Gas Optimized Measures transmit cold and improved internal heating technique using three-dimensional condenser pipe, and refrigerating/heating performance has very big
It is promoted, greatly shortens refrigeration and heating time, ensure that the fresh taste and nutrition of fruit and food.The utility model is made
For a kind of integrated device of semiconductor refrigerating/internal module heating, there is structure novel, it is highly effective refrigeration/heating, at low cost, low
The advantages that noise, high reliablity, simple Operation and Maintenance, large-scale production easy to accomplish.Therefore the application field of the utility model
Wide, market application prospect is good.
Detailed description of the invention
Fig. 1 is the general illustration of an embodiment cup lid of utility model；
Fig. 2 is the general illustration of an embodiment single layer cup body of utility model；
Fig. 3 is the general illustration of one embodiment double-layer cup body of utility model；
Fig. 4 is one embodiment base general illustration of utility model；
Fig. 5 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model；
Fig. 6 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model.
Fig. 7 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model.
Fig. 8 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model.
Fig. 9 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model.
Figure 10 is the general illustration of one embodiment heating/refrigerating cooking machine of utility model.
Specific embodiment
Fig. 5/Fig. 6 is the overall schematic of first preferred embodiment of the utility model, and wherein Fig. 1/Fig. 2/Fig. 3/Fig. 4 is this
The dismantling that utility model is implemented illustrates schematic diagram；Fig. 7/Fig. 8 is second of preferred embodiment schematic diagram of the utility model；Fig. 9/figure
10 be the third preferred embodiment schematic diagram of the utility model.Second/the third preferred embodiment is in cup lid/cup body/pedestal
To the supplement of the first preferred embodiment in overall structure combining form, the utility model is done below with reference to embodiment schematic diagram
It further illustrates.
As shown in Figure 1, being the cup lid structure schematic diagram of the utility model first preferred embodiment.On the present embodiment includes
Lid 101, upper cover air inlet 102, radiator fan 103, radiator 104, lower cover 115, lower cover heat release hole 116, semiconductor heat-dissipating core
Piece 105, temperature-uniforming plate 106, semiconductor refrigeration chip 107, top male plug 117, condenser pipe 109, thermal insulation material 108, sealant
Circle 114, catch net 113 form, and after machine is powered, semiconductor refrigeration chip 107 can carry out control work by control panel, electricity
Source 307 can carry out the transmission of electricity of power supply frequency control to semiconductor refrigeration chip 107；107 top of semiconductor refrigeration chip is bonded samming
Plate 106,106 top of temperature-uniforming plate are fitted with semiconductor heat-dissipating chip 105, are bonded radiator at the top of semiconductor heat-dissipating chip 105
104, radiator fan 103 is housed, when semiconductor refrigeration chip 107 works, condenser pipe 109 is semiconductor at the top of radiator 104
Refrigerating chip generation is cold to be transferred to cup body center, to reduce aqueous liquid foodstuff temperature；It is generated at the top of semiconductor refrigeration chip 107
Thermal energy will be transferred to semiconductor heat-dissipating chip 105 by temperature-uniforming plate 106, and semiconductor heat-dissipating chip 105 passes through top heat sink 104
It radiates with fan 103, radiator fan is radiated by air inlet 102 and air outlet 116.Temperature-uniforming plate 106 is single-layer or multi-layer
Phase-change material is filled in metal laminate structure or hollow metal, temperature-uniforming plate is up and down and the face of chip contact can apply heat-conducting cream increase
The validity of contact.Condenser pipe 109 is deep into cup body center from cup lid bottom, and condenser pipe is that one or more metal tube is closely tied
Together in a metal platform, metal platform transmits cold medium as a contact and fits in semiconductor refrigeration chip, condenser pipe
Pipe material is the metals such as copper/steel/aluminium alloy, condenses and is conducive to cold accumulation filled with high conduction cooling medium 110 inside tubing 111
And transmission.Wherein cup lid bottom pyramidal net 113 is detachable structure, and when upper cover is inserted into cup body, pyramidal structure can be oriented to and protect
Condenser pipe 109, detachable structure cleaning easy to disassemble.
If 200 structure of Fig. 2/Fig. 3 cup body can be single or double layer structure, cup body 200 can generally transparent material such as high temperature
Compound glass, high-temperature resistance plastice etc.；Or the combination of transparent material and opaque material, such as transparent high-temperature compound glass and metal
In conjunction with, the combination of perspex and opaque plastic cement, perspex and the combination of metal etc..Cup body is by main wall 201, vacuum layer
212, high speed knife 202, heating element 203, bearing 204, rotation axis 205, vertical steel bracket 206, handle 210, interior harness 211, top
Female 207, the short plug 208 in bottom, the long plug 209 in bottom form.Cup body is vacuum structure in single layer structure or bilayer, cup body
Bottom periphery is equipped with heating module, and heating module is the heating of chassis electrothermal tube, jug with heating disk, stereo heating tube heating, ring
It is mountable to the interior outside of cup body according to demand around heating methods, heating modules such as heating.Pedestal and bottom of cup heat generating components
It is connected by male and female end plug；Upper cover is connected with cup body also by male and female end plug, and pedestal interior power passes through cup body lead handle
Each component in electrical energy transportation to upper cover.
Such as Fig. 4 or Fig. 7/Figure 10 interior base, pedestal by apical tooth wheel 301, bearing 302, motor 303, bottom radiator fan 304,
Air inlet 305, air outlet 306, power supply 307, rotational speed regulation button 310, main circuit board 309, function panel 308, male plug 311,
Microswitch 312, mother socket 313 form.Main control board is connected to control panel and rotational speed regulation knob, and bottom in pedestal
The switch of microswitch control complete machine, the gravity that microswitch is limited by cup body cut-off circuit in seat.The bottom of pedestal has
Heat release hole, pedestal radiator fan are fixed on above the shaft of motor, or are connected separately to the radiator fan of power supply.
Case is more preferably embodied in the utility model, only the utility model more preferably specific embodiment, and
It is non-to be used as restriction the scope of the utility model, the usual variation that those skilled in the art carries out in technical proposal scope
It should be construed as being included in the protection scope of the utility model with replacement.
Claims (9)
1. a kind of cooking machine to be freezed by semiconductor chip, including cup body, cup lid and pedestal, it is characterised in that: described
Cup lid includes upper cover, lower cover, the refrigerating plant between upper cover and lower cover, and refrigerating plant includes that extend to cup intracorporal for lower end
Condenser pipe connects the heat-conductive plate of a transition temperature in condenser pipe upper end, the half of plate face setting is close in a plate face of the plate
Conductor refrigerating chip.
2. a kind of cooking machine to be freezed by semiconductor chip according to claim 1, it is characterised in that: in semiconductor system
The back side that cold core piece is close to heat-conductive plate one side is close to semiconductor refrigeration chip and is provided with temperature-uniforming plate, and tight in the another side of temperature-uniforming plate
Paste the semiconductor heat-dissipating chip of temperature-uniforming plate setting.
3. a kind of cooking machine to be freezed by semiconductor chip according to claim 2, it is characterised in that: dissipated in semiconductor
It is equipped on hot chip to the radiator of semiconductor heat-dissipating chip cooling.
4. a kind of cooking machine to be freezed by semiconductor chip according to claim 3, it is characterised in that: further include to scattered
The radiator fan of hot device heat dissipation, radiator fan are installed on a heat sink or are installed on the upper cover, and being equipped on upper lid will be in upper cover
The heat release hole that portion is in communication with the outside.
5. a kind of cooking machine to be freezed by semiconductor chip according to claim 4, it is characterised in that: the condensation
Conduction cooling medium is perfused in pipe.
6. a kind of cooking machine to be freezed by semiconductor chip according to claim 4, it is characterised in that: the heat dissipation
Device is heat sink.
7. a kind of cooking machine to be freezed by semiconductor chip according to claim 1, it is characterised in that: in lower cover lower end
Outside is socketed with sealing rubber ring, convex in the gear that lower cover lower end falls off equipped with limitation sealing ring, keeps off convex from lower cover lower end to lower cover
Circumferentially extending and with lower cover integral structure.
8. a kind of cooking machine to be freezed by semiconductor chip according to claim 1, it is characterised in that: in lower cover lower end
It is connected with the metal mesh covered on outside condenser pipe.
9. a kind of cooking machine to be freezed by semiconductor chip according to claim 1, it is characterised in that: set on cup body
There are blade, the motor of driving blade operation, to the heating component of heat foods in cup body, is equipped on cup body by the electricity on pedestal
It conducts the lead to lid, pedestal and bottom of cup and passes through the series connection of male and female end plug in source；Upper cover and cup body are also by male and female
Plug connection is held, pedestal interior power, component each in electrical energy transportation to lid, is equipped with control by cup body lead on pedestal
The control panel of electrical component work on lid and cup body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721288561.1U CN208524667U (en) | 2017-10-09 | 2017-10-09 | A kind of cooking machine to be freezed by semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721288561.1U CN208524667U (en) | 2017-10-09 | 2017-10-09 | A kind of cooking machine to be freezed by semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208524667U true CN208524667U (en) | 2019-02-22 |
Family
ID=65398098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721288561.1U Expired - Fee Related CN208524667U (en) | 2017-10-09 | 2017-10-09 | A kind of cooking machine to be freezed by semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208524667U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107518782A (en) * | 2017-10-09 | 2017-12-29 | 浙江聚珖科技股份有限公司 | A kind of cooking machine to be freezed by semiconductor chip |
-
2017
- 2017-10-09 CN CN201721288561.1U patent/CN208524667U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107518782A (en) * | 2017-10-09 | 2017-12-29 | 浙江聚珖科技股份有限公司 | A kind of cooking machine to be freezed by semiconductor chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190222 |