CN208521768U - A kind of electronic chip packaging shell - Google Patents
A kind of electronic chip packaging shell Download PDFInfo
- Publication number
- CN208521768U CN208521768U CN201821672420.4U CN201821672420U CN208521768U CN 208521768 U CN208521768 U CN 208521768U CN 201821672420 U CN201821672420 U CN 201821672420U CN 208521768 U CN208521768 U CN 208521768U
- Authority
- CN
- China
- Prior art keywords
- pin foot
- main body
- lead terminal
- housing main
- electronic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Abstract
The utility model relates to a kind of electronic chip packaging shells, for placing and welding coil, including the housing main body being made by thermosetting property fire proofing and PIN foot, in the box-like of opening at the top of the housing main body, the housing main body includes side wall of outer shell, for the PIN foot through side wall of outer shell, the PIN foot that the PIN foot is located at the open-mouth is bonding wire terminal；The bonding wire terminal extends to form PIN foot elongated end to the side of the housing main body, and the PIN foot elongated end is equipped with notch arrangement, and the most narrow place's width of opening of the notch arrangement is less than the diameter of the lead terminal of coil.Since the most narrow place's width of opening of notch arrangement is less than the diameter of the lead terminal of coil, so, lead terminal is fastened on highly stable in the notch arrangement of PIN foot elongated end, it will not move, efficiency is very high, it is wrapped on PIN foot elongated end relative to by lead terminal, the fixed efficiency of lead terminal improves at least ten times.
Description
Technical field
The utility model relates to electronic chip packaging skinning technique field, especially a kind of electronic chip packaging shell.
Background technique
Existing electronic chip packaging shell, places the coil in shell, needs for the lead terminal of coil to be wrapped in
Then the lead of coil is welded in PIN foot by the PIN foot end of transformer case so that lead terminal is fixed, this coil
The fixed form of lead terminal, in the welding process of coil, the time of coiling is longer, and working efficiency is lower.
Utility model content
The utility model provides a kind of electronic chip packaging shell, to solve above-mentioned electronic chip packaging shell in coil
In welding process, the time of coiling is longer, the lower technical problem of working efficiency.
In order to solve the above-mentioned technical problem, the utility model provides a kind of electronic chip packaging shell, for placing and welding
Wiring circle, including housing main body and PIN foot, in the box-like of opening, the housing main body includes shell at the housing main body top
Side wall, the PIN foot passes through the side wall of outer shell and extends to the open-mouth of housing main body from the bottom of housing main body, described
PIN foot forms bonding wire terminal in the open-mouth；The bonding wire terminal prolongs to the direction perpendicular to the side wall of outer shell outer surface
It stretches to form PIN foot elongated end, the PIN foot elongated end is equipped with notch arrangement, and the most narrow place's width of the opening of the notch arrangement is small
In the diameter of the lead terminal of coil.
The beneficial effects of the utility model are: being placed the coil in transformer case in the welding process of coil, so
The lead terminal of coil is drawn to PIN foot elongated end afterwards, lead terminal is finally directly fastened on to the notch of PIN foot elongated end
In structure, since the most narrow place's width of opening of notch arrangement is less than the diameter of the lead terminal of coil, so, lead end subcard is set
It is highly stable in the notch arrangement of PIN foot elongated end, it will not move, efficiency is very high, is wrapped in PIN relative to by lead terminal
On foot elongated end, the fixed efficiency of lead terminal is improved more than at least ten times.
Further, the most narrow place's width of opening of the notch arrangement is .7 times of the diameter of the coil lead terminal to .9
Times.
Beneficial effect using above-mentioned further scheme is: the diameter of coil lead terminal is arranged in above range, really
Lead end subcard is protected to set well.
Further, the open end of the notch arrangement is set as V-groove structure.
Beneficial effect using above-mentioned further scheme is: being set as V slot structure convenient for guiding to lead terminal, just
It is fastened at notch arrangement in by lead terminal.
Further, the PIN foot is multiple, how much PIN foot elongated end shapes positioned at described side wall of outer shell the same side
Integral structure.
Beneficial effect using above-mentioned further scheme is: ipsilateral multiple PIN foot elongated ends form overall structure, are convenient for
The removal of later period PIN foot elongated end.
Further, the groove that fractures is equipped between the PIN foot elongated end and bonding wire terminal.
Beneficial effect using above-mentioned further scheme is: the groove that fractures is easy to fractureing for PIN foot elongated end, improves folding
The efficiency of disconnected removal.
Further, the side wall of outer shell at the bonding wire terminal is equipped with lead terminal holding tank.
Beneficial effect using above-mentioned further scheme is: lead terminal holding tank is convenient for the placement of lead, meanwhile, also use
In the guiding function of lead terminal.
Further, the bottom of the line terminals holding tank is located at 1/3 to 2/3 place of the housing main body depth.
Beneficial effect using above-mentioned further scheme is: the bottom of line terminals holding tank is located at housing main body depth
1/3 to 2/3 place, it is ensured that lead terminal will not be in nature arc transition state by direct bending on shell, improve and become
The service life and reliability of depressor.
Further, the housing main body is made by thermosetting property fire proofing.
Beneficial effect using above-mentioned further scheme is: thermosetting property fire proofing has good insulating properties and fire resistance
Energy.
The utility model also provides electronic chip packaging manufacture of casing, comprising the following steps:
Step 1: PIN foot punch forming is formed notch arrangement in PIN foot elongated end, the width of the notch arrangement is small
In the diameter of the lead terminal of coil；
Step 2: the PIN foot is bent, solder terminal is formed in the bending place close to the PIN foot elongated end；
Step 3: the PIN foot after bending is embedded in the injection molding together with housing main body；The solder terminal is located at shell
The open-mouth of main body.
The utility model mentions the having the beneficial effect that by will be by lead terminal of a kind of electronic chip packaging manufacture of casing
It is fastened in the notch arrangement of PIN foot elongated end, since the most narrow place's width of opening of notch arrangement is less than the lead terminal of coil
Diameter, lead terminal is fastened on highly stable in the notch arrangement of PIN foot elongated end, will not move, and efficiency is very high, relative to
Lead terminal is wrapped on PIN foot elongated end, the fixed efficiency of lead terminal improves at least ten times.
Further, the groove that fractures is equipped between the PIN foot elongated end and the bonding wire terminal.
Beneficial effect using above-mentioned further scheme is:, can be by the groove that fractures by PIN foot when sealing wire is completed
Elongated end fractures removal together with lead terminal from bonding wire terminal, improves the manufacture efficiency of electronic chip packaging product.
Detailed description of the invention
Fig. 1 is one front schematic view of the utility model electronic chip packaging enclosure implementations,
Fig. 2 is A-A directional profile figure in Fig. 1,
Fig. 3 is the perspective view of the utility model embodiment,
Fig. 4 is the schematic diagram during the utility model manufacturing method after PIN foot bending,
Fig. 5 is the flow chart of the utility model manufacturing method.
In attached drawing, parts list represented by the reference numerals are as follows:
01, housing main body, 011, side wall of outer shell, 012, lead terminal holding tank, 02, PIN foot, 03, PIN foot elongated end,
031, notch arrangement, 032, fracture groove
Specific embodiment
The utility model is further described with embodiment with reference to the accompanying drawing.
One front schematic view of the utility model electronic chip packaging enclosure implementations referring to Fig. 1,
A kind of electronic chip packaging shell, for placing and welding coil, including housing main body 01 and PIN foot 02, shell
In open box-like at the top of main body 01, housing main body 01 includes side wall of outer shell 011, and PIN foot 02 passes through side wall of outer shell 011 and from outer
The bottom of shell main body 01 extends to the open-mouth of housing main body 01, and PIN foot 02 forms bonding wire terminal in open-mouth；Bonding wire terminal to
PIN foot elongated end 03 is extended to form perpendicular to the direction of 011 outer surface of side wall of outer shell, PIN foot elongated end 03 is equipped with notch arrangement
031, the most narrow place's width of opening of notch arrangement 031 is less than the diameter of the lead terminal of coil.
It in the welding process of coil, places the coil in transformer case, then by the lead terminal of coil to PIN
Lead terminal, is finally directly fastened in the notch arrangement of PIN foot elongated end, due to notch arrangement 031 by the traction of foot elongated end
The most narrow place's width of opening be less than coil lead terminal diameter, so, lead terminal is fastened on the notch of PIN foot elongated end
It is highly stable in structure, it will not move, efficiency is very high, is wrapped on PIN foot elongated end relative to by lead terminal, lead terminal
Fixed efficiency improve at least ten times.
In the present embodiment, the most narrow place's width of opening of notch arrangement 031 is 0.8 times of the diameter of coil lead terminal.
The diameter of coil lead terminal is arranged in above range, it is ensured that lead end subcard is set well.
In the present embodiment, the open end of notch arrangement 031 is set as V-groove structure.V slot structure is set as to be convenient for drawing
Line terminals guide, convenient for lead terminal to be fastened at notch arrangement.
In the present embodiment, unilateral PIN foot 02 is 8,8 few PIN foot elongated ends 03 positioned at 011 the same side of side wall of outer shell
Form overall structure.Ipsilateral multiple PIN foot elongated ends form overall structure, convenient for the removal of later period PIN foot elongated end.
In the present embodiment, the groove 032 that fractures is equipped between PIN foot elongated end 03 and bonding wire terminal.The groove that fractures is easy to
PIN foot elongated end fractures, and improves the efficiency for the removal that fractures.
In the present embodiment, the side wall of outer shell 011 at bonding wire terminal is equipped with lead terminal holding tank 012.Lead terminal holds
Slot of receiving is convenient for the placement of lead, meanwhile, it is also used for the guiding function of lead terminal.
In the present embodiment, the bottom of line terminals holding tank 012 is located at the 1/2 of 01 depth of housing main body.Ensure lead
Terminal on shell will not by direct bending, but be in nature arc transition state, improve transformer service life and can
By property.
Referring to fig. 2, the bottom of line terminals holding tank 012 is located at the 1/ of 01 depth of housing main body to A-A directional profile figure in Fig. 1
At 2.Ensure that lead terminal will not be in nature arc transition state by direct bending on shell, improves transformer
Service life and reliability.
The perspective view of the utility model embodiment is provided in the brightness of housing main body 01 and is clamped for upper cover referring to Fig. 3
Card slot.
A kind of embodiment of the network transformer of the electronic chip packaging shell of the utility model is referring to fig. 4, including outer
Shell and coil 04, shell are above-mentioned electronic chip packaging shell, and shell two sides include 6 bonding wire PIN foot, two groups of coils, line
Circle 04 is arranged in housing main body 01, and in wire bonding process, the lead terminal of coil 04 is fastened in notch arrangement 031.
It in the welding process of coil, places the coil in transformer case, then by the lead terminal of coil to PIN
Lead terminal, is finally directly fastened in the notch arrangement of PIN foot elongated end, due to notch arrangement 031 by the traction of foot elongated end
The most narrow place's width of opening be less than coil lead terminal diameter, so, lead terminal is fastened on the notch of PIN foot elongated end
It is highly stable in structure, it will not move, efficiency is very high, is wrapped on PIN foot elongated end relative to by lead terminal, lead terminal
Fixed efficiency improve at least ten times.
The embodiments of the present invention also mention a kind of electronic chip packaging manufacture of casing, referring to Fig. 5, including following step
It is rapid:
Step 1: 02 punch forming of PIN foot is formed into notch arrangement 031 in PIN foot elongated end 03, notch arrangement 031
Width is less than the diameter of the lead terminal of coil；
Step 2: PIN foot 02 is bent, solder terminal is formed in the bending place close to PIN foot elongated end 03, is formed as schemed
Structure shown in 3；
Step 3: the insertion of PIN foot 02 and housing main body 01 together injection molding after playing；Solder terminal is located at shell
The open-mouth of main body 01.
By the way that lead terminal to be fastened in the notch arrangement of PIN foot elongated end, since the opening of notch arrangement 031 is most narrow
Locate width be less than coil lead terminal diameter, lead terminal be fastened on it is highly stable in the notch arrangement of PIN foot elongated end,
It will not move, efficiency is very high, is wrapped on PIN foot elongated end relative to by lead terminal, and the fixed efficiency of lead terminal improves
At least ten times.Meanwhile PIN foot elongated end 03 fractureing removal together with lead terminal from bonding wire terminal, improve electronic chip envelope
The manufacture efficiency of casing.
In specific manufacturing method, by the stamping forming PIN foot of PIN foot 02 be it is multiple, multiple PIN foot mutually interconnect at one end
It is connected into integral structure, notch arrangement 031 is the side with integral structure.
Meanwhile the groove 032 that fractures is formed between PIN foot elongated end 03 and solder terminal.After welding has been completed, directly from
Fracture the extra PIN foot that fractures at groove 032.Improve the manufacture efficiency of electronic chip packaging product.
In the description of the present invention, it should be understood that term " center ", " length ", " width ", "upper", "lower",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "top", "bottom", "inner" is orientation based on the figure or position
Relationship is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be
It is connected directly, the mutual of connection inside two elements or two elements can also be can be indirectly connected through an intermediary
Interactively.For the ordinary skill in the art, it can understand that above-mentioned term is practical new at this as the case may be
Concrete meaning in type.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
The electronic chip packaging shell and its manufacturing method of the utility model are described in detail above, answered herein
The principles of the present invention and embodiment are expounded with specific case.The explanation of above example is only intended to sides
Assistant solves the core concept of the utility model；At the same time, for those skilled in the art, the think of according to the utility model
Think, there will be changes in the specific implementation manner and application range, and to sum up, the content of the present specification should not be construed as to this reality
With novel limitation.
Claims (8)
1. a kind of electronic chip packaging shell, for placing and welding coil, including housing main body (01) and PIN foot (02), institute
It states at the top of housing main body (01) in the box-like of opening, which is characterized in that the housing main body (01) includes side wall of outer shell (011),
The PIN foot (02) passes through the side wall of outer shell (011) and extends to housing main body (01) from the bottom of housing main body (01)
Open-mouth, the PIN foot (02) form bonding wire terminal in the open-mouth；The bonding wire terminal is to perpendicular to the side wall of outer shell
(011) direction of outer surface extends to form PIN foot elongated end (03), and the PIN foot elongated end (03) is equipped with notch arrangement
(031), the most narrow place's width of opening of the notch arrangement (031) is less than the diameter of the lead terminal of coil.
2. electronic chip packaging shell according to claim 1, which is characterized in that the opening of the notch arrangement (031)
Most narrow place's width is 0.7 times to 0.9 times of the diameter of the coil lead terminal.
3. electronic chip packaging shell according to claim 1, which is characterized in that the opening of the notch arrangement (031)
End is set as V-groove structure.
4. electronic chip packaging shell according to any one of claims 1 to 3, which is characterized in that the PIN foot (02) is
Multiple, the multiple PIN foot elongated ends (03) for being located at the side wall of outer shell (011) the same side form overall structure.
5. electronic chip packaging shell according to claim 4, which is characterized in that the PIN foot elongated end (03) and weldering
It is equipped between line terminals and fractures groove (032).
6. electronic chip packaging shell according to any one of claims 1 to 3, which is characterized in that at the bonding wire terminal
Side wall of outer shell (011) be equipped with lead terminal holding tank (012).
7. electronic chip packaging shell according to claim 6, which is characterized in that the line terminals holding tank (012)
Bottom is located at 1/3 to 2/3 place of the housing main body (01) depth.
8. electronic chip packaging shell according to any one of claims 1 to 3, which is characterized in that the housing main body
(01) it is made by thermosetting property fire proofing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672420.4U CN208521768U (en) | 2018-10-15 | 2018-10-15 | A kind of electronic chip packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821672420.4U CN208521768U (en) | 2018-10-15 | 2018-10-15 | A kind of electronic chip packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208521768U true CN208521768U (en) | 2019-02-19 |
Family
ID=65333745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821672420.4U Ceased CN208521768U (en) | 2018-10-15 | 2018-10-15 | A kind of electronic chip packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208521768U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300666A (en) * | 2018-10-15 | 2019-02-01 | 德阳致达精密电子有限公司 | A kind of electronic chip packaging shell and its manufacturing method |
-
2018
- 2018-10-15 CN CN201821672420.4U patent/CN208521768U/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300666A (en) * | 2018-10-15 | 2019-02-01 | 德阳致达精密电子有限公司 | A kind of electronic chip packaging shell and its manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| IW01 | Full invalidation of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20220207 Decision number of declaring invalidation: 54030 Granted publication date: 20190219 |