CN208514753U - A kind of ceramic wafer cutting equipment - Google Patents
A kind of ceramic wafer cutting equipment Download PDFInfo
- Publication number
- CN208514753U CN208514753U CN201820396620.5U CN201820396620U CN208514753U CN 208514753 U CN208514753 U CN 208514753U CN 201820396620 U CN201820396620 U CN 201820396620U CN 208514753 U CN208514753 U CN 208514753U
- Authority
- CN
- China
- Prior art keywords
- pressing plate
- along
- ceramic wafer
- axis
- mounting rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
This application provides a kind of ceramic wafer cutting equipments, the cutting equipment includes sliding rail extended along the x axis, the transport seat for placing ceramic plate slided along the sliding rail, the sliding rail has been sequentially arranged above longitudinally cutting unit and transverse cutting unit, the transverse cutting unit includes the first mounting rack, the first pressing plate that can be moved along Y-axis on first mounting rack is set, second pressing plate, first pressing plate and the second pressing plate is arranged along the x axis, with one along the gap that Z-direction extends between first pressing plate and the second pressing plate, a transverse cuts knife that can be moved along the y axis is additionally provided on the mounting rack, the transverse cuts knife is located at the surface in the gap, the longitudinally cutting unit includes the second mounting rack, it is mounted on second installation One or more longitudinally cutting knives on frame are additionally provided with the position sensor set for detecting the transportation seat on the sliding rail.
Description
Technical field
This application involves a kind of ceramic wafer cutting equipments.
Background technique
In the prior art, automating ceramic cutting equipment is usually to be cut ceramics with cutting blade, in the mistake of cutting
Cheng Zhong, the ceramic wafer cut may be subjected to displacement, and cause the phenomenon of cutting inaccuracy, also result in ceramic wafer rupture, sternly
Cutting efficiency is affected again.Common cutting equipment can be only done cutting laterally or longitudinally, be difficult to complete in an equipment
Horizontal and vertical cutting.When ceramic wafer needs to be cut into fritter, operate very complicated.
Utility model content
The application technical problems to be solved are to provide a kind of ceramic wafer cutting equipment.
In order to solve the above-mentioned technical problem, this application provides a kind of ceramic wafer cutting equipment, the cutting equipment packets
The transport seat for placing ceramic plate for including sliding rail extended along the x axis, being slided along the sliding rail, the sliding rail
Be sequentially arranged above longitudinally cutting unit and transverse cutting unit, the transverse cutting unit include the first mounting rack,
The first pressing plate that can be moved along Y-axis, the second pressing plate on first mounting rack, first pressing plate and the second pressing plate are set
It is arranged along the x axis, it is described with one along the gap that Z-direction extends between first pressing plate and the second pressing plate
Mounting rack on be additionally provided with a transverse cuts knife that can be moved along the y axis, the transverse cuts knife is located at described
The surface in gap, the longitudinally cutting unit includes the second mounting rack, be mounted on second mounting rack one
Or multiple longitudinally cutting knives, the position sensor set for detecting the transportation seat is additionally provided on the sliding rail.
Preferably, the end of the sliding rail is a rake tilted down, and the lower end of the rake is also set up
There is a rewinding case.
Preferably, multiple longitudinally cutting knives are provided on second mounting rack, multiple longitudinally cutting knives are along Z
The setting of axis direction compartment.
Preferably, the transverse cutting unit further includes for driving first pressing plate to move along the y axis
First cylinder, the second cylinder for driving second pressing plate to move along the y axis.
Preferably, the first spring, second pressure are provided between first pressing plate and first cylinder
Second spring is provided between plate and second cylinder.
Preferably, the transverse cutting unit further includes for driving the transverse cuts knife to move along the y axis
Third cylinder, the longitudinally cutting unit further includes for driving that the longitudinally cutting knife moves along the y axis
Four cylinders.
Preferably, a sliding seat that can be slided along Z-direction, the cross are additionally provided on first mounting rack
It is arranged on the sliding seat to cutter.
Preferably, the transverse cuts knife and longitudinally cutting knife are circular shear blade.
Preferably, the bottom of the sliding rail is provided with the supporting leg for being used to support bottom surface.
Preferably, the upper surface of the transport seat, which is recessed downwards, forms ceramic wafer rest area, and the ceramic wafer is placed
The upper surface in area is also provided with one or more grooves, and multiple grooves are spaced setting, the groove edge along the x axis
Z-direction is extended.
A kind of ceramic wafer cutting equipment of the application has transverse cutting unit and longitudinally cutting unit, in same equipment
On can complete transverse cuts and longitudinally cutting, it is easy to operate.In addition, being pushed down ceramic wafer by pressing plate, then carry out
Cutting, can be such that ceramic wafer is not subjected to displacement during cutting, prevent ceramic wafer from rupturing, improve the cutting of cutting equipment
Efficiency.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of ceramic wafer cutting equipment.
Wherein: 1, sliding rail；11, supporting leg；2, seat is transported；3, the first mounting rack；41, the first cylinder；42, the first pressing plate；
51, the second cylinder；52, the second pressing plate；61, third cylinder；62, transverse cuts knife；12, rake；7, rewinding case；43, first
Spring；53, second spring；63, sliding seat.81, the second mounting rack；82, the 4th cylinder；83, longitudinally cutting knife.
Specific embodiment
The application is described further in the following with reference to the drawings and specific embodiments, so that those skilled in the art can be with
It more fully understands the application and can be practiced, but illustrated embodiment is not as the restriction to the application.
As shown, the cutting equipment includes prolonging along the x axis this application provides a kind of ceramic wafer cutting equipment
The sliding rail 1 for stretching setting, the transport seat 2 for placing ceramic plate slided along the sliding rail 1, the top of the sliding rail 1 according to
Secondary to be provided with longitudinally cutting unit and transverse cutting unit, the transverse cutting unit includes the first mounting rack 3, setting the
The first pressing plate 42 that can be moved along Y-axis, the second pressing plate 52 on one mounting rack 3, first pressing plate 42 and the second pressing plate
52 are arranged along the x axis, between first pressing plate 42 and the second pressing plate 52 with one between Z-direction extension
Gap is additionally provided with a transverse cuts knife 62 that can be moved along the y axis on first mounting rack 3, and the transverse direction is cut
Cutter 62 is located at the surface in the gap, the longitudinally cutting unit include the second mounting rack 81, be mounted on it is described
One or more longitudinally cutting knives 83 on second mounting rack 81 are additionally provided with for detecting the fortune on the sliding rail 1
The position sensor of defeated 2 position of seat.The end of the sliding rail 1 is a rake 12 tilted down, the rake 12
Lower end be additionally provided with a rewinding case 7.It is provided with multiple longitudinally cutting knives 83 on second mounting rack 81, it is multiple described
Longitudinally cutting knife 83 is arranged along Z-direction compartment.The transverse cutting unit further includes for driving first pressing plate
42 the first cylinder 41, the second cylinders for driving second pressing plate 52 to move along the y axis moved along Y axis direction
51.Be provided with the first spring 43 between first pressing plate 42 and first cylinder 41, second pressing plate 52 with
Second spring 53 is provided between second cylinder 51.The transverse cutting unit further includes for driving the cross
The third cylinder 61 moved along the y axis to cutter 62, the longitudinally cutting unit further include for driving described indulge
The 4th cylinder 82 moved along the y axis to cutter 83.Being additionally provided with one on first mounting rack 3 can be along Z axis side
To the sliding seat 63 of sliding, the transverse cuts knife 62 is arranged on the sliding seat 63.The transverse cuts knife 62
It is circular shear blade with longitudinally cutting knife 83.The bottom of the sliding rail 1 is provided with the supporting leg 11 for being used to support bottom surface.It is described
The upper surface of transport seat 2 be recessed form ceramic wafer rest area downwards, the upper surface of the ceramic wafer rest area is also provided with
One or more grooves, multiple grooves are spaced setting along the x axis, and the groove is extended along Z-direction.
A kind of ceramic wafer cutting equipment of the application has transverse cutting unit and longitudinally cutting unit, in same equipment
On can complete transverse cuts and longitudinally cutting, it is easy to operate.In addition, being pushed down ceramic wafer by pressing plate, then carry out
Cutting, can be such that ceramic wafer is not subjected to displacement during cutting, prevent ceramic wafer from rupturing, improve the cutting of cutting equipment
Efficiency.
X-axis described herein is the left and right directions in Fig. 1, and Y direction up and down direction shown in FIG. 1, Z-direction is figure
Front-rear direction shown in 1.
Embodiment described above is only the preferred embodiment lifted to absolutely prove the application, the protection model of the application
It encloses without being limited thereto.Those skilled in the art made equivalent substitute or transformation on the basis of the application, in the application
Protection scope within.The protection scope of the application is subject to claims.
Claims (10)
1. a kind of ceramic wafer cutting equipment, which is characterized in that the cutting equipment includes cunning extended along the x axis
Rail, the transport seat for placing ceramic plate slided along the sliding rail, the sliding rail have been sequentially arranged above longitudinal cut
Unit and transverse cutting unit are cut, the longitudinally cutting unit includes the second mounting rack, is mounted on second mounting rack
On the longitudinally cutting knives of one or more, the transverse cutting unit includes the first mounting rack, is arranged on the first mounting rack
The first pressing plate that can be moved along Y-axis, the second pressing plate, first pressing plate and the second pressing plate be arranged along the x axis,
It is also set along the gap that Z-direction extends, second mounting rack between first pressing plate and the second pressing plate with one
It is equipped with a transverse cuts knife that can be moved along the y axis, the transverse cuts knife is located at the surface in the gap, institute
The position sensor set for detecting the transportation seat is additionally provided on the sliding rail stated.
2. a kind of ceramic wafer cutting equipment as described in claim 1, which is characterized in that the end of the sliding rail is one downward
Inclined rake, the lower end of the rake are additionally provided with a rewinding case.
3. a kind of ceramic wafer cutting equipment as claimed in claim 2, which is characterized in that be provided on second mounting rack
Multiple longitudinally cutting knives, multiple longitudinally cutting knives are arranged along Z-direction compartment.
4. a kind of ceramic wafer cutting equipment as claimed in claim 3, which is characterized in that the transverse cutting unit further includes
The first cylinder for driving first pressing plate to move along the y axis, for driving second pressing plate along the y axis
The second mobile cylinder.
5. a kind of ceramic wafer cutting equipment as claimed in claim 4, which is characterized in that first pressing plate and described the
It is provided with the first spring between one cylinder, is provided with second spring between second pressing plate and second cylinder.
6. a kind of ceramic wafer cutting equipment as claimed in claim 5, which is characterized in that the transverse cutting unit further includes
Third cylinder for driving the transverse cuts knife to move along the y axis, the longitudinally cutting unit further includes being used for
The 4th cylinder that the driving longitudinally cutting knife moves along the y axis.
7. a kind of ceramic wafer cutting equipment as claimed in claim 6, which is characterized in that also set up on first mounting rack
There is a sliding seat that can be slided along Z-direction, the transverse cuts knife is arranged on the sliding seat.
8. a kind of ceramic wafer cutting equipment as claimed in claim 7, which is characterized in that the transverse cuts knife and longitudinal direction is cut
Cutter is circular shear blade.
9. a kind of ceramic wafer cutting equipment as claimed in claim 8, which is characterized in that the bottom setting of the sliding rail is useful
Supporting leg in support bottom surface.
10. a kind of ceramic wafer cutting equipment as claimed in claim 9, which is characterized in that the upper surface of the transport seat to
Lower recess forms ceramic wafer rest area, and the upper surface of the ceramic wafer rest area is also provided with one or more grooves, multiple
The groove is spaced setting along the x axis, and the groove is extended along Z-direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396620.5U CN208514753U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820396620.5U CN208514753U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208514753U true CN208514753U (en) | 2019-02-19 |
Family
ID=65341194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820396620.5U Active CN208514753U (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208514753U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262867A (en) * | 2018-03-22 | 2018-07-10 | 苏州伊而雅精密部件有限公司 | A kind of ceramic wafer cutting equipment |
| CN112157822A (en) * | 2020-09-23 | 2021-01-01 | 陈文均 | Equipment for cutting ceramic fiber board |
-
2018
- 2018-03-22 CN CN201820396620.5U patent/CN208514753U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262867A (en) * | 2018-03-22 | 2018-07-10 | 苏州伊而雅精密部件有限公司 | A kind of ceramic wafer cutting equipment |
| CN112157822A (en) * | 2020-09-23 | 2021-01-01 | 陈文均 | Equipment for cutting ceramic fiber board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208514753U (en) | A kind of ceramic wafer cutting equipment | |
| CN107810088A (en) | Lathe with workpiece bearing piece and for lathe workpiece bearing piece loading and unloading method | |
| CN108262867A (en) | A kind of ceramic wafer cutting equipment | |
| CN208468755U (en) | A kind of ceramic wafer cutting machine | |
| CN105365264A (en) | Semi-finished carton trimming device | |
| CN109352730A (en) | Punching apparatus for resin bumper | |
| CN206263347U (en) | A kind of bead cutter with waste material cutting function | |
| CN208529445U (en) | A kind of device for ceramic cutting | |
| CN105108783A (en) | Shearing device for corrugated paper | |
| CN207697133U (en) | A kind of separation machine | |
| CN108162210A (en) | A kind of ceramic wafer cutting machine | |
| CN206520011U (en) | A kind of product cutting means | |
| CN202639032U (en) | Rectangular pipe orifice punching mold | |
| CN211360347U (en) | Scale panel metal plate stamping die | |
| CN204162887U (en) | A kind of ultrasonic wave bead cutter | |
| CN108356999A (en) | A kind of device for ceramic cutting | |
| CN201702814U (en) | Cutting die module realizing bidirectional cutting | |
| CN208468557U (en) | A kind of automatic punching die | |
| CN202683710U (en) | Edge overturning machining tool | |
| CN206578874U (en) | A kind of PVC epidermises weaken component | |
| CN105014709A (en) | Device for cutting automobile rubber parts | |
| CN215279396U (en) | Silicon steel plate blanking clout handles frock | |
| CN204658423U (en) | The pre-cutting mill of a kind of metallic plate | |
| CN108994223A (en) | A kind of varistor accurate foot-cutting machine | |
| CN207915284U (en) | Fixed structure when tray substrate high pressure waterjet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 215000 First Floor of Building No. 4, 828 Fuyuan Road, Chengyang Street, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Yi Ya precision parts Co., Ltd. Address before: 215000 Diamond Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 1988 Patentee before: Suzhou Yi Ya precision parts Co., Ltd. |