CN108162210A - A kind of ceramic wafer cutting machine - Google Patents
A kind of ceramic wafer cutting machine Download PDFInfo
- Publication number
- CN108162210A CN108162210A CN201810240867.2A CN201810240867A CN108162210A CN 108162210 A CN108162210 A CN 108162210A CN 201810240867 A CN201810240867 A CN 201810240867A CN 108162210 A CN108162210 A CN 108162210A
- Authority
- CN
- China
- Prior art keywords
- pressing plate
- ceramic wafer
- cutting machine
- along
- cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 44
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
Abstract
This application provides a kind of ceramic wafer cutting machines, the cutting machine includes the sliding rail being extended along X-direction, the transport seat for placing ceramic plate slided along the sliding rail, cutter unit is provided with above the sliding rail, the cutter unit includes mounting bracket, the first pressing plate that can be moved along Y-axis being arranged on mounting bracket, second pressing plate, first pressing plate and the second pressing plate is arranged along X-direction to be set, there is a gap extended along Z-direction between first pressing plate and the second pressing plate, the cutter that can be moved along Y direction are additionally provided on the mounting bracket, the cutter are located at the surface in the gap.A kind of ceramic wafer cutting machine of the application, under the action of pressing plate, ceramic wafer will not be subjected to displacement in cutting, prevent ceramic wafer from being ruptured in cutting.
Description
Technical field
This application involves a kind of ceramic wafer cutting machines.
Background technology
In the prior art, it is typically to be cut ceramics with cutting blade to automate ceramic cutting equipment, in the mistake of cutting
The phenomenon that Cheng Zhong, cut ceramic wafer may be subjected to displacement, cause to cut inaccuracy, also results in ceramic wafer rupture, sternly
Cutting efficiency is affected again.
Apply for content
The application technical problems to be solved are to provide a kind of ceramic wafer cutting machine.
In order to solve the above-mentioned technical problem, this application provides a kind of ceramic wafer cutting machine, the cutting machine is included along X
Sliding rail that axis direction is extended, the transport seat for placing ceramic plate slided along the sliding rail, the sliding rail it is upper
Side is provided with cutter unit, and the cutter unit includes mounting bracket, can be moved along Y-axis first be arranged on mounting bracket
Pressing plate, the second pressing plate, first pressing plate and the second pressing plate are arranged along X-direction and are set, first pressing plate and second
There is a gap extended along Z-direction, one is additionally provided on the mounting bracket to be moved along Y direction between pressing plate
Cutter, the cutter are located at the surface in the gap.
Preferably, the cutter unit further include for drive that first pressing plate moves along Y direction first
Cylinder, the second cylinder for second pressing plate to be driven to be moved along Y direction.
Preferably, the cutter unit further includes the third vapour for the cutter to be driven to be moved along Y direction
Cylinder.
Preferably, the cutter can be slided along the mounting bracket along Z-direction and be set.
Preferably, the bottom of the sliding rail is provided with the supporting leg for being used to support bottom surface.
Preferably, it is additionally provided with to detect the position sensor that the transportation seat is put on the sliding rail.
Preferably, the upper table of the transport seat downwards into ceramic wafer rest area, the ceramic wafer place by concave shape
The upper surface in area is further opened with one or more grooves, and multiple grooves are arranged at intervals along X-direction, the groove edge
Z-direction is extended.
Preferably, the cutting machine further includes the stepping for the transport seat to be driven to be moved on the sliding rail
Motor.
Preferably, the cutter unit further includes to drive the cutter along Z axis in the mounting bracket
Mobile driving motor.
A kind of ceramic wafer cutting machine of the application can be transported by transporting seat to the downside of cutter unit, and cutter are along Z
Axis direction moves, and ceramic cutting plate is equipped with the first pressing plate and the second pressing plate on mounting bracket, the first pressing plate and the second pressing plate it
Between have one for ceramic wafer by gap, under the action of pressing plate, ceramic wafer cutting when will not be subjected to displacement, prevent ceramics
Plate is ruptured in cutting.
Description of the drawings
Fig. 1 is a kind of structure diagram of ceramic wafer cutting machine,
Wherein：1st, sliding rail；11st, supporting leg；2nd, seat is transported；3rd, mounting bracket；41st, the first cylinder；42nd, the first pressing plate；51st,
Two cylinders；52nd, the second pressing plate；61st, third cylinder；62nd, cutter.
Specific embodiment
The application is described further in the following with reference to the drawings and specific embodiments, so that those skilled in the art can be with
It more fully understands the application and can be practiced, but illustrated embodiment is not as the restriction to the application.
As shown in the figure, this application provides a kind of ceramic wafer cutting machine, the cutting machine includes setting along X-direction extension
The sliding rail 1 put, the transport seat 2 for placing ceramic plate slided along the sliding rail 1, the top of the sliding rail 1 is provided with
Cutter unit, the cutter unit include mounting bracket 3, the first pressing plate that can be moved along Y-axis being arranged on mounting bracket 3
42nd, the second pressing plate 52, first pressing plate 42 and the second pressing plate 52 are arranged along X-direction and are set, first pressing plate 42
And second have a gap extended along Z-direction between pressing plate 52, being additionally provided with one on the mounting bracket 3 can be along Y-axis
The cutter 62 of direction movement, the cutter 62 are located at the surface in the gap.The cutter unit further includes
For driving the first cylinder 41 that first pressing plate 42 moves along Y direction, for driving second pressing plate 52 along Y
Second cylinder 51 of axis direction movement.The cutter unit further includes that the cutter 62 is driven to move along Y direction
Dynamic third cylinder 61.The cutter 62 can be slided along the mounting bracket 3 along Z-direction and be set.The sliding rail 1
Bottom be provided with the supporting leg 11 for being used to support bottom surface.The transport seat 2 for detecting described is additionally provided on the sliding rail 1
The position sensor of position.The upper table of the transport seat 2 downwards into ceramic wafer rest area, the ceramic wafer put by concave shape
The upper surface for putting area is further opened with one or more grooves, and multiple grooves are arranged at intervals along X-direction, the groove
It is extended along Z-direction.The cutting machine further includes that the transport seat 2 is driven to move on the sliding rail 1
Stepper motor.The cutter unit further includes that the cutter 62 is driven to move up in the mounting bracket 3 along Z axis
Dynamic driving motor.
A kind of ceramic wafer cutting machine of the application can be transported by transporting seat 2 to the downside of cutter unit, cutter 62
It is moved along Z-direction, ceramic cutting plate, the first pressing plate 42 and the second pressing plate 52,42 He of the first pressing plate is installed on mounting bracket 3
Between second pressing plate 52 have one for ceramic wafer by gap, under the action of pressing plate, ceramic wafer cutting when will not occur
Displacement prevents ceramic wafer from being ruptured in cutting.
X-axis described herein is the left and right directions in Fig. 1, and Y direction upper and lower directions shown in FIG. 1, Z-direction is figure
Front-rear direction shown in 1.
Embodiment described above is only the preferred embodiment lifted to absolutely prove the application, the protection model of the application
It encloses without being limited thereto.The equivalent substitute or transformation that those skilled in the art are made on the basis of the application, in the application
Protection domain within.The protection domain of the application is subject to claims.
Claims (9)
1. a kind of ceramic wafer cutting machine, which is characterized in that the cutting machine includes the sliding rail being extended along X-direction, edge
The transport seat for placing ceramic plate that the sliding rail slides is provided with cutter unit above the sliding rail, described
Cutter unit includes mounting bracket, the first pressing plate that can be moved along Y-axis, the second pressing plate that are arranged on mounting bracket, and described the
One pressing plate and the second pressing plate are arranged along X-direction to be set, and has one between first pressing plate and the second pressing plate along Z-direction
The gap of extension is additionally provided with the cutter that can be moved along Y direction on the mounting bracket, and the cutter are located at
The surface in the gap.
2. a kind of ceramic wafer cutting machine as described in claim 1, which is characterized in that the cutter unit further includes to drive
It moves the first cylinder that first pressing plate moves along Y direction, moved along Y direction for driving second pressing plate
Second cylinder.
3. a kind of ceramic wafer cutting machine as claimed in claim 2, which is characterized in that the cutter unit further includes to drive
Move the third cylinder that the cutter are moved along Y direction.
4. a kind of ceramic wafer cutting machine as claimed in claim 3, which is characterized in that the cutter can be along the peace
It shelves to slide along Z-direction and set.
5. a kind of ceramic wafer cutting machine as claimed in claim 4, which is characterized in that the bottom of the sliding rail, which is provided with, to be used for
Support the supporting leg of bottom surface.
6. a kind of ceramic wafer cutting machine as claimed in claim 5, which is characterized in that be additionally provided with to examine on the sliding rail
Survey the position sensor that the transportation seat is put.
7. a kind of ceramic wafer cutting machine as claimed in claim 6, which is characterized in that the upper table of the transport seat is recessed downwards
It falls into and forms ceramic wafer rest area, the upper surface of the ceramic wafer rest area is further opened with one or more grooves, multiple described
Groove be arranged at intervals along X-direction, the groove is extended along Z-direction.
8. a kind of ceramic wafer cutting machine as claimed in claim 7, which is characterized in that the cutting machine further includes to drive
The stepper motor that the transport seat moves on the sliding rail.
9. a kind of ceramic wafer cutting machine as claimed in claim 8, which is characterized in that the cutter unit further includes to drive
Move the driving motor that the cutter are moved along Z axis on the mounting bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810240867.2A CN108162210A (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810240867.2A CN108162210A (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108162210A true CN108162210A (en) | 2018-06-15 |
Family
ID=62512229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810240867.2A Pending CN108162210A (en) | 2018-03-22 | 2018-03-22 | A kind of ceramic wafer cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108162210A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113799275A (en) * | 2021-10-27 | 2021-12-17 | 河南建筑职业技术学院 | Cutting device is used in ceramic plate preparation |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204278263U (en) * | 2014-11-27 | 2015-04-22 | 宁波亚伯新型材料有限公司 | A kind of flexible clay facing tile cutter sweep |
| CN205497820U (en) * | 2016-04-20 | 2016-08-24 | 四川帕沃可矿物纤维制品有限公司 | Make -up machine is cut to rock wool |
| CN205551631U (en) * | 2016-05-09 | 2016-09-07 | 成都羿博智能设备有限公司 | Lower mode cutting machine |
| CN205929092U (en) * | 2016-08-17 | 2017-02-08 | 张守俊 | Novel stone cutter |
| CN206085166U (en) * | 2016-09-18 | 2017-04-12 | 上海超金节能科技股份有限公司 | Fire prevention and energy conservation board cutting device |
| CN208468755U (en) * | 2018-03-22 | 2019-02-05 | 苏州伊而雅精密部件有限公司 | A kind of ceramic wafer cutting machine |
-
2018
- 2018-03-22 CN CN201810240867.2A patent/CN108162210A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204278263U (en) * | 2014-11-27 | 2015-04-22 | 宁波亚伯新型材料有限公司 | A kind of flexible clay facing tile cutter sweep |
| CN205497820U (en) * | 2016-04-20 | 2016-08-24 | 四川帕沃可矿物纤维制品有限公司 | Make -up machine is cut to rock wool |
| CN205551631U (en) * | 2016-05-09 | 2016-09-07 | 成都羿博智能设备有限公司 | Lower mode cutting machine |
| CN205929092U (en) * | 2016-08-17 | 2017-02-08 | 张守俊 | Novel stone cutter |
| CN206085166U (en) * | 2016-09-18 | 2017-04-12 | 上海超金节能科技股份有限公司 | Fire prevention and energy conservation board cutting device |
| CN208468755U (en) * | 2018-03-22 | 2019-02-05 | 苏州伊而雅精密部件有限公司 | A kind of ceramic wafer cutting machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113799275A (en) * | 2021-10-27 | 2021-12-17 | 河南建筑职业技术学院 | Cutting device is used in ceramic plate preparation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215000 First Floor of Building No. 4, 828 Fuyuan Road, Chengyang Street, Xiangcheng Economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant after: Suzhou Yi Ya precision parts Co., Ltd. Address before: 215000 Diamond Road, Weitang Town, Xiangcheng District, Suzhou City, Jiangsu Province, 1988 Applicant before: Suzhou Yi Ya precision parts Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220530 Address after: 215000 No. 777, Fujia Road, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province Applicant after: Suzhou Gaoxin Zhongke Semiconductor Co.,Ltd. Address before: 215000 1st floor, building 4, 828 Fuyuan Road, Chengyang street, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant before: SUZHOU ELEGANT & RIGOROUS FINE ASSEMBLY Co.,Ltd. |
|
| TA01 | Transfer of patent application right |