CN208488520U - A kind of Hi-pot test device at compound inslation interface - Google Patents
A kind of Hi-pot test device at compound inslation interface Download PDFInfo
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- CN208488520U CN208488520U CN201821297786.8U CN201821297786U CN208488520U CN 208488520 U CN208488520 U CN 208488520U CN 201821297786 U CN201821297786 U CN 201821297786U CN 208488520 U CN208488520 U CN 208488520U
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- plate
- test device
- lower skateboard
- upper slide
- pot test
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Abstract
The utility model discloses a kind of Hi-pot test device at compound inslation interface, including the upper slide being parallel to each other and lower skateboard, the left plate and right side plate, at least one elastomeric element, lower plate that are parallel to each other；It is equipped with left rail on the inside of the left plate, is equipped with right guide rail on the inside of the right side plate, the upper slide is connected on the left rail and right guide rail, and the lower skateboard is also connected on the left rail and right guide rail；The elastomeric element is connected between the upper slide and lower skateboard；The lower plate is connect with the left plate and right side plate, is located at below the lower skateboard, and forms one for placing the accommodating chamber of sample to be tested between the lower skateboard, and the position that the accommodating chamber is corresponded on the left plate and right side plate is respectively equipped with hole location.The breakdown test of double hyer insulation material interface may be implemented in the utility model, measures the breakdown voltage at interface, provides effective device for the electrical strength research at compound inslation interface.
Description
Technical field
The utility model belongs to electric insulation field, fills more particularly to a kind of Hi-pot test at compound inslation interface
It sets.
Background technique
It is widely used in power equipment by the compound inslation that double hyer insulation material forms, two layers of insulation material of compound inslation
There is interfaces between material, such as the compound inslation interface between cable major insulation in cable connector and cable accessory insulation.Investigation hair
Existing, compound inslation interface is the Frequent Troubles position in numerous power equipments, and compound inslation interface is the weakness in insulation system
Position.Therefore, the electrical strength detection at compound inslation interface has important engineering value and scientific research value.However, for double
The electrical strength at layer compound inslation interface does not have simple and feasible test device.
Utility model content
To make up for the shortcomings of the above existing technologies, the utility model proposes a kind of surveys of the electrical strength at compound inslation interface
Trial assembly is set.
The technical issues of the utility model, is resolved by technical solution below:
A kind of Hi-pot test device at compound inslation interface, comprising: the upper slide and lower skateboard that are parallel to each other, mutually
Parallel left plate and right side plate, at least one elastomeric element, lower plate；Left rail, the right side are equipped on the inside of the left plate
Side plate interior sides are equipped with right guide rail, and the upper slide is connected on the left rail and right guide rail, and the lower skateboard is also distinguished
It is connected on the left rail and right guide rail；The elastomeric element is connected between the upper slide and lower skateboard；The bottom
Plate is connect with the left plate and right side plate, is located at below the lower skateboard, and is formed one between the lower skateboard and be used for
The accommodating chamber of sample to be tested is placed, the position that the accommodating chamber is corresponded on the left plate and right side plate is respectively equipped with hole location.
Preferably, the elastomeric element includes spring and guide rod, and the guide rod is fixedly connected with the lower skateboard, described to lead
Bar is slidably connected with the upper slide, and the spring is set on the guide rod.
Preferably, it there are four the elastomeric elements, is uniformly distributed and is connected between the upper slide and lower skateboard.
Preferably, the Hi-pot test device further includes rocker elements, and the rocker elements and the upper slide connect
It connects.
Preferably, the Hi-pot test device further includes upper plate, the upper plate and the left plate and right side
Plate connection, is located above the upper slide, and the rocker elements include screw rod and handle, the screw rod pass through the upper plate with
The upper plate is threadedly coupled, and one end of the screw rod is fixedly connected on the upper slide, the other end of the screw rod and institute
State handle connection.
Preferably, the bottom of the lower plate is also provided with observation window.
It preferably, further include backboard, the backboard is connect with the left plate and right side plate, and is equipped on the backboard
Multiple through-holes.
The beneficial effects of the utility model include: the Hi-pot test device at the compound inslation interface of the utility model can
To realize the breakdown test of double hyer insulation material interface, the breakdown voltage at interface is measured, is the electrical strength at compound inslation interface
Research provides effective device.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of the Hi-pot test device in the preferred embodiment in the utility model；
Fig. 2 is the main view of Fig. 1.
Fig. 3 is the schematic diagram of the sample to be tested and electrode in the preferred embodiment in the utility model.
Specific embodiment
Below against attached drawing and in conjunction with preferred embodiment, the utility model is described in further detail.It needs to illustrate
It is that in the absence of conflict, the features in the embodiments and the embodiments of the present application can be combined with each other.
It should be noted that the positional terms such as left and right, upper and lower, top, bottom in the present embodiment, are only relatively general each other
It reads, or is to refer to, and should not be regarded as restrictive with the normal operating condition of product.
In a preferred embodiment, as illustrated in fig. 1 and 2, a kind of Hi-pot test device at compound inslation interface
Include: the upper slide 1 being parallel to each other and lower skateboard 3, the left plate 7 being parallel to each other and right side plate 8, at least one elastomeric element,
Lower plate 6；It is equipped with left rail 71 on the inside of left plate 7, is equipped with right guide rail 81 on the inside of right side plate 8, upper slide 1 is connected to a left side and leads
On rail 71 and right guide rail 81, lower skateboard 3 is also connected on left rail 71 and right guide rail 81；Elastomeric element is connected to upper slide
Between 1 and lower skateboard 3；Lower plate 6 is connect with left plate 7 and right side plate 8, is located at 3 lower section of lower skateboard, and between lower skateboard 3
One is formed for placing the accommodating chamber 9 of sample to be tested, the position that accommodating chamber 9 is corresponded on left plate 7 and right side plate 8 is set respectively
There is hole location 10.In this preferred embodiment, elastomeric element includes spring 5 and guide rod 2, and guide rod 2 is fixedly connected with lower skateboard 3, guide rod 2
It is slidably connected with upper slide 1, spring 5 is set on guide rod 2, in this example, there are four spring 5 and its matched guide rail 2 are each, uniformly
Distribution is connected between upper slide 1 and lower skateboard 3.
Wherein, the hole location 10 of setting is used to wear high-voltage line and ground wire when using the Hi-pot test device, will
Voltage is applied to the interface of sample to be tested.During Hi-pot test, upper slide 1 and lower skateboard 3 in sliding always
Keeping parallelism can be generated not by the compression of elastomeric element in the interface for the sample to be tested being made of double hyer insulation material
Same interface pressure.
Preferably, Hi-pot test device further includes rocker elements and upper plate 4, upper plate 4 and left plate 7 and the right side
Side plate 8 connects, and is located at 1 top of upper slide, and rocker elements include screw rod 11 and handle 12, and screw rod 11 passes through upper plate 4 and upper bottom
Plate 4 is threadedly coupled, and one end of screw rod 11 is fixedly connected on upper slide 1, and the other end of screw rod 11 is connect with handle 12.Pass through rotation
Turn that the screw rod 11 in rocker elements can draw upper slide 1 and lower skateboard 3 slides up and down.
Preferably, the bottom of lower plate 6 is also provided with observation window 61, can be used for the punch-through of observing interface.
It preferably, further include backboard 13, backboard 13 is connect with left plate 7 and right side plate 8, and equipped with more on backboard 13
A through-hole 131.It is used in the multiple through-holes 131 being arranged on backboard when Hi-pot test device to be placed in transformer oil,
Convenient for the flowing of transformer oil.
Wherein, upper lower skateboard, upper and lower bottom plate, left side plate, left and right rail can be insulating materials, can such as select Buddhist nun
Dragon, Teflon etc..
A method of using the electrical strength at the Hi-pot test device to test compound inslation interface, including such as
Lower step:
(1) sample to be tested being made of double hyer insulation material is placed in accommodating chamber 9 and (sample to be tested is supported by lower plate 6
Two layers of insulation material between interface and lower plate 6 and lower skateboard 3 between be parallel), slide downward upper slide 1, pressure
Contracting spring 5 simultaneously drives 3 slide downward of lower skateboard that sample to be tested is extruded between lower skateboard 3 and lower plate 6；
(2) Hi-pot test device is placed in transformer oil, is immersed in sample to be tested in transformer oil and (avoids
The generation of non-interface electric discharge)；
(3) apply voltage on the interface of sample to be tested, that is, connect high-field electrode and grounding electrode, gradually rise voltage
(preferably at the uniform velocity boost voltage), until the interface breakdown of sample to be tested.
Wherein, the manufacturing process of sample to be tested is as follows: according to the interface object of research, two kinds of insulating materials being sticked to form
The surface of tabular sample to be tested pass through cleaning treatment, paste one layer of copper foil electrode on its surface (can change according to experiment purpose
Electrode shape, spacing etc.), the edge at the interface between two layers of insulation material is sealed, using RTV sealant then to prevent transformation
Device oil immersion enters interface.
It is further illustrated below using above-mentioned apparatus by an example:
(1) as shown in figure 3, being beaten using crosslinked polyethylene (XLPE) sample and silicon rubber (SIR) sample with 400 mesh sand paper
XLPE sample is ground, SIR sample do not polish, then after cleaning two kinds of samples with alcohol test paper respectively, in XLPE sample or SIR sample
Surface mount arranges copper foil electrode, and 14 shape of electrode can use plate plate electrode shown in Fig. 3；Then by XLPE sample or SIR
Tabular sample to be tested 15 is made in sample after stacking, seal four sides at the interface of lamination with RTV sealant, place 24 hours to
Seal glue sticking solidification.
(2) sample to be tested is lain on lower plate, rotary screw, moves downward lower skateboard and is extruded in sample to be tested
Between lower skateboard and lower plate.
(3) Hi-pot test device is placed in transformer tank, is completely submerged in sample to be tested in transformer oil.
(4) high-field electrode and grounding electrode are accessed into frequency high voltage power supply, voltage is increased with the speed average rate of 1kV/s, directly
Puncture to interface, in this example, interface punctures in 18.5kV；Then ground connection electric discharge is carried out.
(5) opposite direction rotary screw takes out sample to be tested, dismantles two kinds of samples, and watching to interface has breakdown trace, because
This, in this example, 18.5kV is the interface breakdown voltage of XLPE and SIR.
The device of the utility model may be used also other than the breakdown voltage that can be realized plate two-layer compound insulator interface measures
With the electrical strength for studying the two-layer compound insulator interface under different interface pressure, different electrodes can also can be studied
Influence of the shape to the electrical strength at compound inslation interface.
It, cannot the above content is specific preferred embodiment further detailed description of the utility model is combined
Assert that the specific implementation of the utility model is only limited to these instructions.For those skilled in the art of the present invention
For, without departing from the concept of the premise utility, several equivalent substitute or obvious modifications, and performance can also be made
Or purposes is identical, all shall be regarded as belonging to the protection scope of the utility model.
Claims (7)
1. a kind of Hi-pot test device at compound inslation interface characterized by comprising
The upper slide and lower skateboard that are parallel to each other, the left plate being parallel to each other and right side plate, at least one elastomeric element, bottom
Plate；
It is equipped with left rail on the inside of the left plate, is equipped with right guide rail on the inside of the right side plate, the upper slide is connected to institute
It states on left rail and right guide rail, the lower skateboard is also connected on the left rail and right guide rail；
The elastomeric element is connected between the upper slide and lower skateboard；
The lower plate is connect with the left plate and right side plate, is located at below the lower skateboard, and between the lower skateboard
One is formed for placing the accommodating chamber of sample to be tested, the position point of the accommodating chamber is corresponded on the left plate and right side plate
It She You not hole location.
2. Hi-pot test device as described in claim 1, it is characterised in that: the elastomeric element includes spring and leads
Bar, the guide rod are fixedly connected with the lower skateboard, and the guide rod is slidably connected with the upper slide, and the spring is set in institute
It states on guide rod.
3. Hi-pot test device as claimed in claim 1 or 2, it is characterised in that: there are four the elastomeric elements, uniformly
Distribution is connected between the upper slide and lower skateboard.
4. Hi-pot test device as described in claim 1, it is characterised in that: the Hi-pot test device further includes
Rocker elements, the rocker elements are connect with the upper slide.
5. Hi-pot test device as claimed in claim 4, it is characterised in that: the Hi-pot test device further includes
Upper plate, the upper plate are connect with the left plate and right side plate, are located above the upper slide, and the rocker elements include
Screw rod and handle, the screw rod pass through the upper plate and are threadedly coupled with the upper plate, and one end of the screw rod is fixedly connected
On the upper slide, the other end of the screw rod is connect with the handle.
6. Hi-pot test device as described in claim 1, it is characterised in that: the bottom of the lower plate is also provided with sight
Examine window.
7. Hi-pot test device as described in claim 1, it is characterised in that: further include backboard, the backboard with it is described
Left plate is connected with right side plate, and multiple through-holes are equipped on the backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821297786.8U CN208488520U (en) | 2018-08-13 | 2018-08-13 | A kind of Hi-pot test device at compound inslation interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821297786.8U CN208488520U (en) | 2018-08-13 | 2018-08-13 | A kind of Hi-pot test device at compound inslation interface |
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| Publication Number | Publication Date |
|---|---|
| CN208488520U true CN208488520U (en) | 2019-02-12 |
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| CN201821297786.8U Active CN208488520U (en) | 2018-08-13 | 2018-08-13 | A kind of Hi-pot test device at compound inslation interface |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031068A (en) * | 2018-08-13 | 2018-12-18 | 清华大学深圳研究生院 | A kind of Hi-pot test device and method at compound inslation interface |
-
2018
- 2018-08-13 CN CN201821297786.8U patent/CN208488520U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031068A (en) * | 2018-08-13 | 2018-12-18 | 清华大学深圳研究生院 | A kind of Hi-pot test device and method at compound inslation interface |
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