CN208478377U - A kind of LED encapsulation structure and LED lamp - Google Patents

Abstract

The utility model discloses a kind of LED encapsulation structure and LED lamps, wherein, the LED encapsulation structure includes metal pad and plastic stent, the plastic stent is set on metal pad, the metal pad includes the first pad and the second pad, and die bond has a LED chip on first pad, the bottom of the plastic stent, the second pad top there is a lug boss, the lug boss, which surrounds, forms a bowl, and on second pad, die bond has Zener diode in bowl region.By the way that a bowl is arranged in plastic stent, enhance the intensity of bracket, so that bracket be made to be difficult to be broken off；On the second pad, die bond Zener diode in bowl region, charge accumulation can be reduced, the ability of LED chip electrostatic damage is effectively promoted in burning voltage.

Description

A kind of LED encapsulation structure and LED lamp

Technical field

The utility model relates to LED field, in particular to a kind of LED encapsulation structure and LED lamp.

Background technique

Increasingly developed and mature with LED technology, LED is widely used to every field as new type light source, existing The LED support of LED lamp is fabricated to including stamping forming metal pad and plastic stent, and LED chip is arranged by technology On LED support, wherein the edge of metal pad is done step-like to improve contact area between the two, is welded however as high temperature Connect or Reflow Soldering operation process in temperature raising, the gap between metal pad and plastic stent will become larger, and lead to patch The air-tightness of bracket is deteriorated.In addition, being easy to produce charge accumulation in LED lamp use process, electrostatic breakdown is caused, is caused Component failure.

Thus the prior art could be improved and improve.

Utility model content

Place in view of above-mentioned deficiencies of the prior art, the purpose of this utility model is to provide a kind of LED encapsulation structure and LED lamp enhances the intensity of bracket, so that bracket be made to be difficult to be broken off by the way that a bowl is arranged in plastic stent；In the second weldering On disk, die bond Zener diode in bowl region, can be reduced charge accumulation, burning voltage, be effectively promoted LED chip prevent it is quiet The ability of electrodisintegration.

In order to achieve the above object, the utility model takes following technical scheme:

A kind of LED encapsulation structure, including metal pad and plastic stent, the plastic stent are set on metal pad, The metal pad includes the first pad and the second pad, and die bond has LED chip on first pad, the plastic stent Bottom, the second pad top there is a lug boss, the lug boss is around forming a bowl, on second pad, bowl Die bond has Zener diode in region.

In the LED encapsulation structure, the plastic stent includes integrally formed rim of a cup, wall of cup and bottom of a cup, the cup Bottom has the through-hole for exposing the first pad and the second pad, and the wall of cup is in slope surface shape, surround and forms reflective inner cavity, the rim of a cup In rectangle.

In the LED encapsulation structure, the section of the through-hole has several arc segments.

In the LED encapsulation structure, the arc radius of the arc segment is 0.3mm ~ 0.7mm, and angle is 20 ° ~ 120 °.

In the LED encapsulation structure, white adhesive layer is covered on the Zener diode.

In the LED encapsulation structure, the cup depth of the bowl is 0.1mm ~ 0.3mm.

In the LED encapsulation structure, fluorescent adhesive layer is covered outside the LED support.

In the LED encapsulation structure, blank space that first pad and the second pad are not wrapped up by plastic stent, with And non-die bond region is covered with white adhesive layer.

A kind of LED lamp, including the LED encapsulation structure as described in above-mentioned any one.

Compared to the prior art, in LED encapsulation structure and LED lamp provided by the utility model, the LED encapsulation structure Including metal pad and plastic stent, the plastic stent is set on metal pad, and the metal pad includes the first pad With the second pad, die bond has a LED chip on first pad, the bottom of the plastic stent, the second pad top have One lug boss, the lug boss, which surrounds, forms a bowl, and on second pad, die bond has Zener diode in bowl region. By the way that a bowl is arranged in plastic stent, enhance the intensity of bracket, so that bracket be made to be difficult to be broken off；On the second pad, bowl Die bond Zener diode in cup region, can be reduced charge accumulation, LED chip electrostatic damage is effectively promoted in burning voltage Ability.

Detailed description of the invention

Fig. 1 is the front schematic view of LED encapsulation structure provided by the utility model；

Fig. 2 is the side schematic view of LED encapsulation structure provided by the utility model.

Specific embodiment

The utility model provides a kind of LED encapsulation structure and LED lamp, by the way that a bowl, enhancing is arranged in plastic stent The intensity of bracket, so that bracket be made to be difficult to be broken off；On the second pad, die bond Zener diode in bowl region, it can be reduced The ability of LED chip electrostatic damage is effectively promoted in charge accumulation, burning voltage.

To keep the purpose of this utility model, technical solution and effect clearer, clear, develop simultaneously implementation referring to the drawings The utility model is further described in example.It should be appreciated that specific embodiment described herein is only practical to explain It is novel, it is not used to limit the utility model.

Please referring to Fig. 1 and Fig. 2, LED encapsulation structure provided by the utility model includes metal pad 10 and plastic stent 20, The plastic stent 20 is set on metal pad 10, and the metal pad 10 includes the first pad 11 and the second pad 12, institute Stating die bond on the first pad 11 has a LED chip (not shown), the bottom of the plastic stent 20, the second pad 12 top With a lug boss, the lug boss, which surrounds, forms a bowl 21, and on second pad there is together die bond in 12,21 region of bowl Receive diode (not shown).The utility model above 20 bottom of plastic stent, the second pad 12 by being arranged a protrusion Position is easier the dispensing operation on Zener diode, while enhancing the intensity of bracket around a bowl 21 is formed, thus Bracket is set to be difficult to be broken off；On the second pad 12, die bond Zener diode in 21 region of bowl, charge accumulation can be reduced, surely The ability of LED chip electrostatic damage is effectively promoted in constant voltage.

Further, silver coating (not shown) is set on the metal pad 10, for LED chip heat dissipation and member Electrical connection between part can promote the heat dissipation performance and member of LED chip because silver has excellent pyroconductivity and electric conductivity Electric conductivity between device.

When it is implemented, 10 edge of metal pad has step, the step is embedded in the plastic stent 20, So that the structure between metal pad 10 and plastic stent 20 is more firm.

Further, fluorescent adhesive layer (not shown) is covered outside the LED support, passes through the die bond on the first pad 11 LED chip exhales light equably among total, ensure that lamplight brightness is uniform.Preferably, the present embodiment In, the LED chip is that other LED chips also can be selected certainly in blue chip；By covering one layer outside plastic stent 20 Fluorescent adhesive layer, the blue light for issuing LED chip are white light by fluorescent adhesive layer excitation, realize white-light illuminating.

Specifically, it is covered with white glue (not shown) on the Zener diode, by covering on Zener diode White glue covers the black region on Zener diode, not only prevents Zener diode black region from absorbing light, moreover it is possible to further The light that reflection LED chip is issued, promotes the light emission luminance of LED.

Further, the depth of the bowl 21 is 0.1mm ~ 0.3mm, just can be more or less than LED together with LED chip Chip height avoids stopping the transmitting of LED chip light, and attenuation light reduces LED luminance.

Please continue to refer to Fig. 1 and Fig. 2, the plastic stent 20 includes integrally formed rim of a cup 210, wall of cup 220 and bottom of a cup 230, the bottom of a cup 230 has the through-hole 240 for exposing the first pad 11 and the second pad 12, and the wall of cup 220 is in slope surface shape, ring Around reflective inner cavity is formed, the rim of a cup 210 is in rectangle.In the present embodiment, through-hole 240 is opened up in 20 bottom of plastic stent, is only revealed First pad 11 and the second pad 12 out reduce the silver coating area of functional areas exposing, to reduce the silver coating to light Absorption, and then promoted product brightness；It is designed to the wall of cup 220 of slope surface shape, around reflective inner cavity is formed, constantly reflection LED The light that chip issues, further improves the brightness of product, ensure that excellent light emission rate, and rectangular rim of a cup is arranged 210 form a horn-like divergence of beam device with the wall of cup 220 of the relatively small bottom of a cup 230 of area and slope surface, increase light The range of exposures of line.

Please continue to refer to Fig. 1, the section of the through-hole 240 has several arc segments 241, the arc radius of the arc segment For 0.3mm ~ 0.7mm, angle is 20 ° ~ 120 °.By the way that arc segment 241 is arranged in the section of through-hole 240, make bracket and plastics knot Close it is closer, bracket infiltration when, make water penetrate into path it is full of twists and turns, increase the difficulty in water entered function area, improve branch The air-tightness of frame, to achieve the effect that waterproof.

Specifically, the blank space and do not consolidate that first pad 11 and the second pad 12 are not wrapped up by plastic stent 20 Crystalline region domain is covered with white adhesive layer (not shown).By the white adhesive layer covered, the silver coating being exposed not only is hidden, is kept away Exempt from silver coating and absorb the light that LED chip issues, and the light that LED chip is issued can also be reflected, promotion LED shines bright Degree.

Based on above-mentioned LED encapsulation structure, the utility model correspondingly provides a kind of LED lamp comprising as above-mentioned LED is sealed Assembling structure.Since the LED encapsulation structure being described in detail above, it is not described further herein.

In conclusion in LED encapsulation structure provided by the utility model and LED lamp, wherein the LED encapsulation structure Including metal pad and plastic stent, the plastic stent is set on metal pad, and the metal pad includes the first pad With the second pad, die bond has a LED chip on first pad, the bottom of the plastic stent, the second pad top have One lug boss, the lug boss, which surrounds, forms a bowl, and on second pad, die bond has Zener diode in bowl region. By the way that a bowl is arranged in plastic stent, enhance the intensity of bracket, so that bracket be made to be difficult to be broken off；On the second pad, bowl Die bond Zener diode in cup region, can be reduced charge accumulation, LED chip electrostatic damage is effectively promoted in burning voltage Ability.

It is understood that for those of ordinary skills, can with technical solution according to the present utility model and The design of its utility model is subject to equivalent substitution or change, and all these changes or replacement all should belong to appended by the utility model Scope of protection of the claims.

Claims (9)

1. a kind of LED encapsulation structure, including metal pad and plastic stent, the plastic stent are set on metal pad, It is characterized in that, the metal pad includes the first pad and the second pad, and die bond has LED chip on first pad, described The bottom of plastic stent, the second pad top there is a lug boss, the lug boss is around forming a bowl, second weldering Die bond has Zener diode on disk, in bowl region.

2. LED encapsulation structure according to claim 1, which is characterized in that the plastic stent includes integrally formed cup Mouth, wall of cup and bottom of a cup, the bottom of a cup have the through-hole for exposing the first pad and the second pad, and the wall of cup is in slope surface shape, surround Reflective inner cavity is formed, the rim of a cup is in rectangle.

3. LED encapsulation structure according to claim 2, which is characterized in that the section of the through-hole has several arc segments.

4. LED encapsulation structure according to claim 3, which is characterized in that the arc radius of the arc segment be 0.3mm ~ 0.7mm, angle are 20 ° ~ 120 °.

5. LED encapsulation structure according to claim 1, which is characterized in that be covered with white glue on the Zener diode.

6. LED encapsulation structure according to claim 1, which is characterized in that the cup depth of the bowl is 0.1mm ~ 0.3mm.

7. LED encapsulation structure according to claim 1, which is characterized in that cover fluorescent adhesive layer outside the LED support.

8. LED encapsulation structure according to claim 1, which is characterized in that first pad is not moulded with the second pad The blank space of material bracket package and non-die bond region are covered with white adhesive layer.

9. a kind of LED lamp, which is characterized in that including the LED encapsulation structure as described in claim 1-8 any one.