CN208478319U - A kind of chip assembling adhesive-spill-preventing structure - Google Patents
A kind of chip assembling adhesive-spill-preventing structure Download PDFInfo
- Publication number
- CN208478319U CN208478319U CN201821231000.2U CN201821231000U CN208478319U CN 208478319 U CN208478319 U CN 208478319U CN 201821231000 U CN201821231000 U CN 201821231000U CN 208478319 U CN208478319 U CN 208478319U
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- Prior art keywords
- plastic structure
- chip
- overflow plastic
- overflow
- mainboard
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Abstract
The utility model discloses a kind of chips to assemble adhesive-spill-preventing structure, including chip mainboard and anti-overflow plastic structure, the chip mainboard is integrally in a strip shape, the left side of the chip mainboard is equipped with insulation strip of paper used for sealing, the anti-overflow plastic structure is integrally embedded in the chip mainboard and is fixedly connected with the chip mainboard, the left and right layout pitch of the anti-overflow plastic structure is set as equidistant, the anti-overflow plastic structure there are two the position of anti-overflow plastic structure and the anti-overflow plastic structure in left side lower than right side is set above the chip mainboard, the anti-overflow plastic structure there are two the position of anti-overflow plastic structure and the anti-overflow plastic structure in left side lower than right side is set below the chip mainboard, four fixed card slots are symmetrically arranged at left and right sides of the chip mainboard.This kind of equipment is added to anti-overflow plastic structure on chip mainboard, and increases cross recess in the inside of anti-overflow plastic structure, and after dispensing, extra glue can flow to cross recess, does not spill over and reaches chip bonding purpose, promotes yields, and structure is simple, functional stronger.
Description
Technical field
The utility model relates to chip parts technical field, specially a kind of chip assembles adhesive-spill-preventing structure.
Background technique
Chip, English are Chip；Chipset is Chipset.Chip generally refers to the carrier of integrated circuit, and integrated electricity
Road after design, manufacture, encapsulation, test as a result, the usually one independent entirety that can be used immediately." chip " and
" integrated circuit " the two words often mix use, for example in everybody usual discussion topic, IC design and chip are set
What meter was said is a meaning, and chip industry, integrated circuit industry, IC industry are often also a meaning.In fact, the two words
It is related, also has any different.Integrated circuit entity will often exist in the form of chip, be to emphasize because of the integrated circuit of narrow sense
Circuit itself, for example, it is simple to only there are five the phaseshift oscillators that element is joined together to form, when it is also presented on drawing
When, we can also be its integrated circuit.
COB dispensing at present, die bond as COB produce in important step, dispensing use pressure injection method when, glue amount size by
Syringe caliber size, pressure size and pressing time determine that glue amount size is difficult to control, after existing die bond PAD dispensing, such as glue
Amount excessively will cause chip pollution, and when glue amount is very few, chip can not cling completely and cause to fall off, and the above is just needed to biography
The equipment of system improves, then how to design a kind of chip assembling adhesive-spill-preventing structure, this is asked as what we needed to solve
Topic.
Utility model content
The purpose of this utility model is to provide a kind of chips to assemble adhesive-spill-preventing structure, solves proposed in background technique
The problem of.
To achieve the above object, the utility model provides the following technical solutions: a kind of chip assembling adhesive-spill-preventing structure, including
Chip mainboard and anti-overflow plastic structure, the chip mainboard is integrally in a strip shape, and the left side of the chip mainboard is equipped with insulation strip of paper used for sealing, institute
It states anti-overflow plastic structure and is integrally embedded in the chip mainboard and be fixedly connected with the chip mainboard, the left and right of the anti-overflow plastic structure
Layout pitch is set as equidistantly, and the position there are two anti-overflow plastic structure and the anti-overflow plastic structure in left side is set above the chip mainboard
Lower than the anti-overflow plastic structure on right side, set below the chip mainboard there are two anti-overflow plastic structure and the anti-overflow plastic structure in left side
Position is lower than the anti-overflow plastic structure on right side, is symmetrically arranged with four fixed card slots at left and right sides of the chip mainboard.
As the further preferred embodiment of the utility model, the anti-overflow plastic structure includes outer circular layer, the outer circular layer
Inside circumference face is uniformly distributed copper sheet pillar, is equipped with viscose glue convex block at the inside center of the anti-overflow plastic structure, the viscose glue is convex
Raised line is connected and fixed on the right side of block, the right end of the fixed raised line connects copper sheet pillar.
As the further preferred embodiment of the utility model, the inside of the viscose glue convex block is equipped with cross recess.
As the further preferred embodiment of the utility model, set on the outside of the viscose glue convex block there are four metal coupling.
As the further preferred embodiment of the utility model, strip copper sheet is equipped with immediately below the anti-overflow plastic structure.
Compared with prior art, the beneficial effects of the utility model are as follows:
1. the utility model makes the control of glue amount size in a certain range, glue amount is excessive by devising anti-overflow plastic structure
When, cross recess can be flowed to, does not spill over and reaches chip bonding purpose, promote yields, chip caused by reducing because of excessive glue pollution
It scraps, save the cost, improves by hand, semi-automatic die bond positional accuracy, reduce personnel's fatigue strength, and can be according to different big
Small chip designs suitable cross recess size, functional stronger.
2. the utility model by be added on chip mainboard multiple anti-overflow plastic structures and carry out different location distribution,
It is convenient for precise positioning operation, improves the accuracy of bonding, structure is simple, and practicability is stronger.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon:
Fig. 1 is the chip mainboard overall structure diagram that a kind of chip of the utility model assembles adhesive-spill-preventing structure；
Fig. 2 is the schematic diagram for the anti-overflow plastic structure that a kind of chip of the utility model assembles adhesive-spill-preventing structure.
In figure: chip mainboard -1, anti-overflow plastic structure -2, insulation strip of paper used for sealing -3, copper sheet pillar -4, viscose glue convex block -5, fixation are convex
Item -6, cross recess -7, metal coupling -8, strip copper sheet -9, fixed card slot -10, insulation strip of paper used for sealing -11.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
The utility model provides a kind of technical solution referring to FIG. 1-2: a kind of chip assembling adhesive-spill-preventing structure, including core
Piece mainboard 1 and anti-overflow plastic structure 2, the chip mainboard 1 is whole in a strip shape, and the left side of the chip mainboard 1 is equipped with insulation strip of paper used for sealing
11, anti-overflow 2 entirety of plastic structure is embedded in the chip mainboard 1 and is fixedly connected with the chip mainboard 1, described anti-overflow cementing
The left and right layout pitch of structure 2 is set as equidistantly, the top of the chip mainboard 1 set there are two anti-overflow plastic structure 2 and left side it is anti-overflow
The position of plastic structure 2 is lower than the anti-overflow plastic structure 2 on right side, and the lower section of the chip mainboard 1 is set there are two anti-overflow plastic structure 2 and a left side
The position of the anti-overflow plastic structure 2 of side is lower than the anti-overflow plastic structure 2 on right side, and the left and right sides of the chip mainboard 1 is symmetrically arranged with four
A fixed card slot 10.
The anti-overflow plastic structure 2 includes outer circular layer 3, and the inside circumference face of the outer circular layer 3 is uniformly distributed copper sheet pillar 4,
Viscose glue convex block 5 is equipped at the inside center of the anti-overflow plastic structure 2, the right side of the viscose glue convex block 5 is connected and fixed raised line 6, institute
State the right end connection copper sheet pillar 4 of fixed raised line 6.Design in this way can use outer circular layer 3 and carry out preventing glue and core
Piece mainboard 1 contacts, while fixed raised line 6 is connected to the circuit clear that copper sheet pillar 4 guarantees equipment.
The inside of the viscose glue convex block 5 is equipped with cross recess 7.Design in this way can use cross recess 7 will be more
Remaining glue is stored, and prevents from oozing out.
The outside of the viscose glue convex block 5 is set there are four metal coupling 8.Design in this way can use metal coupling 8
Progress is contacted with other chips, holding circuit connection.
The underface of the anti-overflow plastic structure 2 is equipped with strip copper sheet 9.Design in this way can use strip copper sheet
After 9 complete bonding, guarantee chipset normal use.
A kind of chip assembling adhesive-spill-preventing structure described in the utility model carries out a little in chip mainboard 1 in use
After glue, glue is injected into inside anti-overflow plastic structure 2, then carries out fitting assembling, recessed using the cross inside anti-overflow plastic structure 2
Extra glue can be flowed to cross recess 7 by slot 7, do not spilt over and reached chip bonding purpose, promote yields, residue glue is avoided to pollute
Chip and cause to scrap.
The chip mainboard -1 of the utility model, anti-overflow plastic structure -2, insulation strip of paper used for sealing -3, copper sheet pillar -4, viscose glue convex block -5,
Fixed raised line -6, cross recess -7, metal coupling -8, strip copper sheet -9, fixed card slot -10, insulation strip of paper used for sealing -11, component are
Universal standard part or component as known to those skilled in the art, structure and principle are all that this technology personnel can be by technology hand
Volume learns or knows by routine experiment method the utility model solves the problems, such as it is current COB dispensing, and die bond is raw as COB
Important step in production, when dispensing uses pressure injection method, glue amount size is by syringe caliber size, pressure size and pressing time
It determining, glue amount size is difficult to control, after existing die bond PAD dispensing, if glue amount excessively will cause chip pollution, when glue amount is very few,
Chip can not cling completely and cause to fall off, and the utility model is combined with each other by above-mentioned component, this kind of equipment is in chip master
It is added to anti-overflow plastic structure on plate, and increases cross recess in the inside of anti-overflow plastic structure, after dispensing, extra glue can flow to ten
Word groove does not spill over and reaches chip bonding purpose, promotes yields, and structure is simple, functional stronger.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. a kind of chip assembles adhesive-spill-preventing structure, including chip mainboard (1) and anti-overflow plastic structure (2), it is characterised in that: the core
Piece mainboard (1) is whole in a strip shape, and the left side of the chip mainboard (1) is equipped with insulation strip of paper used for sealing (11), and the anti-overflow plastic structure (2) is whole
Body is embedded in the chip mainboard (1) and is fixedly connected with the chip mainboard (1), the left and right distribution of the anti-overflow plastic structure (2)
Interval is set as equidistant, and the anti-overflow plastic structure (2) there are two anti-overflow plastic structure (2) and left side is set above the chip mainboard (1)
Position be lower than the anti-overflow plastic structure (2) on right side, set that there are two anti-overflow plastic structure (2) and left below the chip mainboard (1)
The position of the anti-overflow plastic structure (2) of side is lower than the anti-overflow plastic structure (2) on right side, and the left and right sides of the chip mainboard (1) is symmetrical
If there are four fixed card slot (10).
2. a kind of chip according to claim 1 assembles adhesive-spill-preventing structure, it is characterised in that: the anti-overflow plastic structure (2)
Including outer circular layer (3), the inside circumference face of the outer circular layer (3) is uniformly distributed copper sheet pillar (4), the anti-overflow plastic structure (2)
Inside center at be equipped with viscose glue convex block (5), be connected and fixed raised line (6) on the right side of the viscose glue convex block (5), the fixed raised line
(6) right end connects copper sheet pillar (4).
3. a kind of chip according to claim 2 assembles adhesive-spill-preventing structure, it is characterised in that: the viscose glue convex block (5)
Inside is equipped with cross recess (7).
4. a kind of chip according to claim 2 assembles adhesive-spill-preventing structure, it is characterised in that: the viscose glue convex block (5)
Outside is set there are four metal coupling (8).
5. a kind of chip according to claim 1 assembles adhesive-spill-preventing structure, it is characterised in that: the anti-overflow plastic structure (2)
Underface be equipped with strip copper sheet (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821231000.2U CN208478319U (en) | 2018-08-01 | 2018-08-01 | A kind of chip assembling adhesive-spill-preventing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821231000.2U CN208478319U (en) | 2018-08-01 | 2018-08-01 | A kind of chip assembling adhesive-spill-preventing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208478319U true CN208478319U (en) | 2019-02-05 |
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ID=65208058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821231000.2U Expired - Fee Related CN208478319U (en) | 2018-08-01 | 2018-08-01 | A kind of chip assembling adhesive-spill-preventing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208478319U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111404020A (en) * | 2020-03-30 | 2020-07-10 | 成都英思嘉半导体技术有限公司 | Laser diode chip mounting substrate |
-
2018
- 2018-08-01 CN CN201821231000.2U patent/CN208478319U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111404020A (en) * | 2020-03-30 | 2020-07-10 | 成都英思嘉半导体技术有限公司 | Laser diode chip mounting substrate |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 Termination date: 20210801 |
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| CF01 | Termination of patent right due to non-payment of annual fee |