CN208433404U - Using metal-oxide-semiconductor plug-in unit cooling fan - Google Patents
Using metal-oxide-semiconductor plug-in unit cooling fan Download PDFInfo
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- CN208433404U CN208433404U CN201821267875.8U CN201821267875U CN208433404U CN 208433404 U CN208433404 U CN 208433404U CN 201821267875 U CN201821267875 U CN 201821267875U CN 208433404 U CN208433404 U CN 208433404U
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- frame body
- metal
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Metal-oxide-semiconductor plug-in unit cooling fan, including metal-oxide-semiconductor, PCB control panel and fan frame body are used the utility model discloses a kind of；Metal-oxide-semiconductor includes copper base, stitch and plastic casing；Stitch is bending-like, and stitch is connected on PCB control panel；Copper base is arranged outwardly backwards to PCB control panel, and copper base is connected on fan frame body.The utility model uses metal-oxide-semiconductor plug-in unit cooling fan, stitch inverse bending is simultaneously inserted into PCB control panel and is connected and fixed, so that copper base is relative to PCB control panel and outwardly, copper base is fastened on fan frame body, also PCB control panel is allowed for be assembled on fan frame body, copper base is arranged outwardly, reduce the thermal resistance of metal-oxide-semiconductor, it can be realized the reduction of the temperature of metal-oxide-semiconductor, so that the heat of PCB control panel is easy to be transmitted on fan frame body, so that it is guaranteed that fan can reliably work, extend the service life of fan, it is lower to solve the environment temperature that existing fan can adapt to, the shorter problem of service life.
Description
Technical field
The utility model relates to fan assembly technical fields, use metal-oxide-semiconductor plug-in unit cooling fan more particularly to a kind of.
Background technique
Main component of the fan as cooling system, with the miniaturization of equipment and the requirement of high power radiation density,
It is higher and higher to the performance requirement of fan.Fan needs to supply bigger air quantity, and works under the conditions of harsher temperature,
Such as even 70 DEG C of 60 DEG C of environment temperature.
The design of existing fan, motor current switch are welded on PCB control panel using encapsulation metal-oxide-semiconductor patch.Outside metal-oxide-semiconductor
Portion's encapsulation includes copper base, plastic casing, stitch.The welding of metal-oxide-semiconductor patch is welded to copper base on PCB control panel, simultaneously will
Stitch is welded on PCB, and heat is transmitted on PCB control panel by copper base, is then spread by PCB control panel and MOS
Pipe plastic casing gluing, plastic casing pastes fan frame body, then heat is conducted.The thermal coefficient of plastic cement is larger, therefore MOS
Pipe thermal resistance can be bigger, and temperature is not easy to lower.
Utility model content
Metal-oxide-semiconductor plug-in unit cooling fan is used the purpose of this utility model is to provide a kind of, to solve in the prior art
The environment temperature that existing fan can adapt to is lower, the shorter technical problem of fan service life.
To achieve the goals above, the utility model uses following technical scheme:
It is provided by the utility model a kind of using metal-oxide-semiconductor plug-in unit cooling fan, including metal-oxide-semiconductor, PCB control panel and fan
Framework；
The metal-oxide-semiconductor includes copper base, stitch and plastic casing；
The stitch is bending-like, and the stitch is connected on the PCB control panel；
The copper base is arranged outwardly backwards to the PCB control panel, and the copper base is connected on the fan frame body.
Further, the stitch is welded to connect on the PCB control panel.
Further, the copper base is fitted and connected on the fan frame body.
Further, it is corresponded on the fan frame body and is provided with radiating subassembly at the assembly of the PCB control panel.
Further, the radiating subassembly is arranged on the outer wall of the fan frame body.
Further, the radiating subassembly includes multiple radiating fins；
Multiple radiating fins are arranged in a ring.
Further, the shape of the radiating fin is arc plate.
Further, the shape of the radiating fin is tabular.
Further, the radiating subassembly includes multiple groups radiating fin；
The quantity of every group of the radiating fin is multiple；
Every group of multiple radiating fins are arranged in a ring；
The center of radiating fin described in multiple groups is overlapped.
Further, the material of the fan frame body is aluminium alloy.
Provided by the utility model to use metal-oxide-semiconductor plug-in unit cooling fan, stitch inverse bending is rolled over towards plastic casing direction
Curved, stitch insertion PCB control panel is simultaneously connected and fixed, so that copper base is relative to PCB control panel and outwardly, copper base is connected and fixed
It on fan frame body, also allows for PCB control panel and is assembled on fan frame body, copper base is arranged outwardly, reduces the heat of metal-oxide-semiconductor
Resistance, can be realized the reduction of the temperature of metal-oxide-semiconductor, so that the heat of PCB control panel is easy to be transmitted on fan frame body, so that it is guaranteed that
Fan can reliably work, and extend the service life of fan, solve environment temperature that existing fan can adapt to compared with
It is low, the shorter problem of service life.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is that a kind of part-structure using metal-oxide-semiconductor plug-in unit cooling fan that the utility model embodiment one provides shows
It is intended to；
Fig. 2 is a kind of knot using the metal-oxide-semiconductor in metal-oxide-semiconductor plug-in unit cooling fan that the utility model embodiment one provides
Structure schematic diagram；
Fig. 3 is a kind of metal-oxide-semiconductor using in metal-oxide-semiconductor plug-in unit cooling fan that provides of the utility model embodiment one another
Structural schematic diagram under one visual angle；
Fig. 4 is that a kind of part-structure using metal-oxide-semiconductor plug-in unit cooling fan that the utility model embodiment one provides shows
It is intended to；
Fig. 5 is that a kind of structural blast using metal-oxide-semiconductor plug-in unit cooling fan that the utility model embodiment one provides shows
It is intended to.
Appended drawing reference:
000- flabellum；100-MOS pipe；200-PCB control panel；
300- fan frame body；101- copper base；102- stitch；
103- plastic casing；401- radiating fin.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
Embodiment one:
It is as shown in Figures 1 to 4, provided in this embodiment a kind of using metal-oxide-semiconductor plug-in unit in the optinal plan of the present embodiment
Cooling fan, including metal-oxide-semiconductor 100, PCB control panel 200 and fan frame body 300；Metal-oxide-semiconductor 100 includes copper base 101, stitch
102 and plastic casing 103；Stitch 102 is bending-like, and stitch 102 is connected on PCB control panel 200；Copper base 101 is controlled backwards to PCB
Making sheet 200 and be arranged outwardly, copper base 101 is connected on fan frame body 300.
In the present embodiment, 102 inverse bending of stitch, i.e., towards 103 direction bending of plastic casing, stitch 102 is inserted into PCB control
Plate 200 is simultaneously connected and fixed, so that copper base 101 is relative to PCB control panel 200 and outwardly, copper base 101 is fastened on fan
It in framework 300, also allows for PCB control panel 200 and is assembled on fan frame body 300, copper base 101 is arranged outwardly, reduces MOS
The thermal resistance of pipe 100 can be realized the reduction of the temperature of metal-oxide-semiconductor 100, so that the heat of PCB control panel 200 is easy to be transmitted to fan
In framework 300, so that it is guaranteed that fan can reliably work, the service life of fan is extended.
In the optinal plan of the present embodiment, stitch 102 is welded to connect on PCB control panel 200.
In the present embodiment, metal-oxide-semiconductor 100 is welded using contact pin type, and copper base 101 is arranged outwardly.
In the optinal plan of the present embodiment, copper base 101 is fitted and connected on fan frame body 300.
In the present embodiment, AB glue is applied on copper base 101 and be fitted and connected on fan frame body 300.
In the optinal plan of the present embodiment, as shown in figure 5, corresponding to the assembly of PCB control panel 200 on fan frame body 300
Place is provided with radiating subassembly.
In the present embodiment, the installed position that flabellum 000 is corresponded on fan frame body 300 is arranged in radiating subassembly.
In the optinal plan of the present embodiment, radiating subassembly is arranged on the outer wall of fan frame body 300.
In the optinal plan of the present embodiment, radiating subassembly includes multiple radiating fins 401；Multiple radiating fins 401 are in
It is circular layout.
In the present embodiment, radiating fin 401 is set on fan frame body 300, increases heat dissipation area, accelerates fan cooling.
In the optinal plan of the present embodiment, the shape of radiating fin 401 is arc plate.
In the present embodiment, the radiating fin 401 of arc plate, the heat dissipation area of unit space is bigger, is conducive to improve
Radiating efficiency.
In the optinal plan of the present embodiment, the material of fan frame body 300 is aluminium alloy.
In the present embodiment, fan frame body 300 is formed by aluminium alloy compression casting.
It should be noted that metal-oxide-semiconductor 100 is the main heater element of fan PCB control panel 200, operating temperature requirements
It could be worked normally at 80 DEG C or less, the height of the thermal conductivity ratio plastic casing 103 of the copper base 101 of metal-oxide-semiconductor 100, by copper base
101 fit to outwardly on fan frame body 300, while increasing the heat dissipation area of fan frame body 300 by radiating fin 401, effectively
Ground reduces the operating temperature of metal-oxide-semiconductor 100, works, prolongs under the conditions of so that the component inside fan is at lower temperature
The service life of fan entirety is grown.
Also, when fan work, the temperature of internal component is reduced, but also the use environment range of fan obtains
To expansion.For example, existing fan, when environment temperature is 50 DEG C, fan internal component temperature is up to 80 DEG C, if environment
Temperature is more than 50 DEG C, and fan is easy to burn out, and uses the fan of the present embodiment, when environment temperature is 60 DEG C, member inside fan
Device temperature is not more than 80 DEG C, therefore, can this fan can be worked normally under higher environment temperature.
Embodiment two:
It is provided in this embodiment a kind of using metal-oxide-semiconductor plug-in unit cooling fan in the optinal plan of the present embodiment, including
Metal-oxide-semiconductor 100, PCB control panel 200 and fan frame body 300；Metal-oxide-semiconductor 100 includes copper base 101, stitch 102 and plastic casing 103；
Stitch 102 is bending-like, and stitch 102 is connected on PCB control panel 200；Copper base 101 is backwards to PCB control panel 200 and towards peripheral hardware
It sets, copper base 101 is connected on fan frame body 300.
In the present embodiment, 102 inverse bending of stitch, i.e., towards 103 direction bending of plastic casing, stitch 102 is inserted into PCB control
Plate 200 is simultaneously connected and fixed, so that copper base 101 is relative to PCB control panel 200 and outwardly, copper base 101 is fastened on fan
It in framework 300, also allows for PCB control panel 200 and is assembled on fan frame body 300, copper base 101 is arranged outwardly, reduces MOS
The thermal resistance of pipe 100 can be realized the reduction of the temperature of metal-oxide-semiconductor 100, so that the heat of PCB control panel 200 is easy to be transmitted to fan
In framework 300, so that it is guaranteed that fan can reliably work, the service life of fan is extended.
In the optinal plan of the present embodiment, stitch 102 is welded to connect on PCB control panel 200.
In the present embodiment, metal-oxide-semiconductor 100 is welded using contact pin type, and copper base 101 is arranged outwardly.
In the optinal plan of the present embodiment, copper base 101 is fitted and connected on fan frame body 300.
In the present embodiment, AB glue is applied on copper base 101 and be fitted and connected on fan frame body 300.
In the optinal plan of the present embodiment, corresponded on fan frame body 300 be provided at the assembly of PCB control panel 200 it is scattered
Hot component.
In the present embodiment, the installed position that flabellum 000 is corresponded on fan frame body 300 is arranged in radiating subassembly.
In the optinal plan of the present embodiment, radiating subassembly is arranged on the outer wall of fan frame body 300.
In the optinal plan of the present embodiment, radiating subassembly includes multiple radiating fins 401；Multiple radiating fins 401 are in
It is circular layout.
In the present embodiment, radiating fin 401 is set on fan frame body 300, increases heat dissipation area, accelerates fan cooling.
In the optinal plan of the present embodiment, the shape of radiating fin 401 is tabular.
Embodiment three:
It is provided in this embodiment a kind of using metal-oxide-semiconductor plug-in unit cooling fan in the optinal plan of the present embodiment, including
Metal-oxide-semiconductor 100, PCB control panel 200 and fan frame body 300；Metal-oxide-semiconductor 100 includes copper base 101, stitch 102 and plastic casing 103；
Stitch 102 is bending-like, and stitch 102 is connected on PCB control panel 200；Copper base 101 is backwards to PCB control panel 200 and towards peripheral hardware
It sets, copper base 101 is connected on fan frame body 300.
In the present embodiment, 102 inverse bending of stitch, i.e., towards 103 direction bending of plastic casing, stitch 102 is inserted into PCB control
Plate 200 is simultaneously connected and fixed, so that copper base 101 is relative to PCB control panel 200 and outwardly, copper base 101 is fastened on fan
It in framework 300, also allows for PCB control panel 200 and is assembled on fan frame body 300, copper base 101 is arranged outwardly, reduces MOS
The thermal resistance of pipe 100 can be realized the reduction of the temperature of metal-oxide-semiconductor 100, so that the heat of PCB control panel 200 is easy to be transmitted to fan
In framework 300, so that it is guaranteed that fan can reliably work, the service life of fan is extended.
In the optinal plan of the present embodiment, stitch 102 is welded to connect on PCB control panel 200.
In the present embodiment, metal-oxide-semiconductor 100 is welded using contact pin type, and copper base 101 is arranged outwardly.
In the optinal plan of the present embodiment, copper base 101 is fitted and connected on fan frame body 300.
In the present embodiment, AB glue is applied on copper base 101 and be fitted and connected on fan frame body 300.
In the optinal plan of the present embodiment, corresponded on fan frame body 300 be provided at the assembly of PCB control panel 200 it is scattered
Hot component.
In the present embodiment, the installed position that flabellum 000 is corresponded on fan frame body 300 is arranged in radiating subassembly.
In the optinal plan of the present embodiment, radiating subassembly is arranged on the outer wall of fan frame body 300.
In the optinal plan of the present embodiment, radiating subassembly includes multiple groups radiating fin 401；Every group of radiating fin 401
Quantity be it is multiple；Every group of multiple radiating fins 401 are arranged in a ring；The center of multiple groups radiating fin 401 is overlapped.
In the present embodiment, the center of multiple annulars corresponding to multiple groups radiating fin 401 is overlapped.
In the present embodiment, radiating fin 401 is set on fan frame body 300, increases heat dissipation area, accelerates fan cooling.
In the optinal plan of the present embodiment, the shape of radiating fin 401 is arc plate.
Example IV:
It is provided in this embodiment a kind of using metal-oxide-semiconductor plug-in unit cooling fan in the optinal plan of the present embodiment, including
Metal-oxide-semiconductor 100, PCB control panel 200 and fan frame body 300；Metal-oxide-semiconductor 100 includes copper base 101, stitch 102 and plastic casing 103；
Stitch 102 is bending-like, and stitch 102 is connected on PCB control panel 200；Copper base 101 is backwards to PCB control panel 200 and towards peripheral hardware
It sets, copper base 101 is connected on fan frame body 300.
In the present embodiment, 102 inverse bending of stitch, i.e., towards 103 direction bending of plastic casing, stitch 102 is inserted into PCB control
Plate 200 is simultaneously connected and fixed, so that copper base 101 is relative to PCB control panel 200 and outwardly, copper base 101 is fastened on fan
It in framework 300, also allows for PCB control panel 200 and is assembled on fan frame body 300, copper base 101 is arranged outwardly, reduces MOS
The thermal resistance of pipe 100 can be realized the reduction of the temperature of metal-oxide-semiconductor 100, so that the heat of PCB control panel 200 is easy to be transmitted to fan
In framework 300, so that it is guaranteed that fan can reliably work, the service life of fan is extended.
In the optinal plan of the present embodiment, stitch 102 is welded to connect on PCB control panel 200.
In the present embodiment, metal-oxide-semiconductor 100 is welded using contact pin type, and copper base 101 is arranged outwardly.
In the optinal plan of the present embodiment, copper base 101 is fitted and connected on fan frame body 300.
In the present embodiment, AB glue is applied on copper base 101 and be fitted and connected on fan frame body 300.
In the optinal plan of the present embodiment, corresponded on fan frame body 300 be provided at the assembly of PCB control panel 200 it is scattered
Hot component.
In the present embodiment, the installed position that flabellum 000 is corresponded on fan frame body 300 is arranged in radiating subassembly.
In the optinal plan of the present embodiment, radiating subassembly is arranged on the outer wall of fan frame body 300.
In the optinal plan of the present embodiment, radiating subassembly includes multiple groups radiating fin 401；Every group of radiating fin 401
Quantity be it is multiple；Every group of multiple radiating fins 401 are arranged in a ring；The center of multiple groups radiating fin 401 is overlapped.
In the present embodiment, the center of multiple annulars corresponding to multiple groups radiating fin 401 is overlapped.
In the present embodiment, radiating fin 401 is set on fan frame body 300, increases heat dissipation area, accelerates fan cooling.
In the optinal plan of the present embodiment, the shape of radiating fin 401 is tabular.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (10)
1. a kind of use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that including metal-oxide-semiconductor, PCB control panel and fan frame body；
The metal-oxide-semiconductor includes copper base, stitch and plastic casing；
The stitch is bending-like, and the stitch is connected on the PCB control panel；
The copper base is arranged outwardly backwards to the PCB control panel, and the copper base is connected on the fan frame body.
2. according to claim 1 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the stitch is welded to connect
On the PCB control panel.
3. according to claim 1 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the copper base fitting connects
It connects on the fan frame body.
4. according to claim 1 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that right on the fan frame body
It answers and is provided with radiating subassembly at the assembly of the PCB control panel.
5. according to claim 4 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the radiating subassembly setting
On the outer wall of the fan frame body.
6. according to claim 5 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the radiating subassembly includes
Multiple radiating fins；
Multiple radiating fins are arranged in a ring.
7. according to claim 6 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the shape of the radiating fin
Shape is arc plate.
8. according to claim 6 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the shape of the radiating fin
Shape is tabular.
9. according to claim 5 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the radiating subassembly includes
Multiple groups radiating fin；
The quantity of every group of the radiating fin is multiple；
Every group of multiple radiating fins are arranged in a ring；
The center of radiating fin described in multiple groups is overlapped.
10. according to claim 1 use metal-oxide-semiconductor plug-in unit cooling fan, which is characterized in that the material of the fan frame body
Matter is aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821267875.8U CN208433404U (en) | 2018-08-07 | 2018-08-07 | Using metal-oxide-semiconductor plug-in unit cooling fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821267875.8U CN208433404U (en) | 2018-08-07 | 2018-08-07 | Using metal-oxide-semiconductor plug-in unit cooling fan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208433404U true CN208433404U (en) | 2019-01-25 |
Family
ID=65097942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821267875.8U Active CN208433404U (en) | 2018-08-07 | 2018-08-07 | Using metal-oxide-semiconductor plug-in unit cooling fan |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208433404U (en) |
-
2018
- 2018-08-07 CN CN201821267875.8U patent/CN208433404U/en active Active
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