CN208432760U - Conducting bracket and optical module - Google Patents

Conducting bracket and optical module Download PDF

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Publication number
CN208432760U
CN208432760U CN201821186023.6U CN201821186023U CN208432760U CN 208432760 U CN208432760 U CN 208432760U CN 201821186023 U CN201821186023 U CN 201821186023U CN 208432760 U CN208432760 U CN 208432760U
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China
Prior art keywords
optical module
compliant conductive
conducting bracket
piece
conductive piece
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CN201821186023.6U
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Chinese (zh)
Inventor
陈厚昌
朱浩
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Zhuomeicheng Electronic Technology (wuhan) Co Ltd
Shenzhen Tengshun Electronic Materials Co Ltd
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Zhuomeicheng Electronic Technology (wuhan) Co Ltd
Shenzhen Tengshun Electronic Materials Co Ltd
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Priority to CN201821186023.6U priority Critical patent/CN208432760U/en
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Abstract

The utility model provides a kind of conducting bracket and optical module, the conducting bracket includes: compliant conductive piece, the compliant conductive on piece is provided at least one vacancy section, the position of printed circuit board of position and optical module of the vacancy section is corresponding, and the compliant conductive piece is bonded the shell docking region and optical interface region of the optical module;To constitute an ideal faraday cup to eliminate electromagnetic-wave leakage.Conductive bracket structure in the utility model is simple, without changing the shell mechanism of optical module, use easy to spread, and the shell docking region and optical interface region of optical module can be bonded well, to completely eliminate the electromagnetic-wave leakage of optical module.

Description

Conducting bracket and optical module
Technical field
The utility model relates to power electronics field more particularly to a kind of conducting brackets and optical module.
Background technique
With the development of communication technology, also higher and higher to the performance requirement of optical module.Wherein, optical module is mainly used for height Frequency photoelectric conversion is the important devices of optic communication.With the development and propulsion of 5G technology, applied to 25GHz, 40GHz or more Optical module will be used in communication equipment more and more.Optical module generally all includes shell, printed circuit board (Printed Circuit Board, PCB) is integrated with optical interface, circuit, chip etc. on PCB.Due to the signal frequency of optical module Rate is very high, therefore its wavelength is very short, and the gap of very little will also result in electromagnetic wave leakage on shell, to influence communication equipment Normal operation.
Currently, electromagnetic wave leakage is generally solved the problems, such as using four kinds of modes, and 1) conductive silicon sebific duct is arranged at optical interface Or conductive fabric;2) metal spring leaf is wrapped up at the housing slot of optical module;3) stria is opened up at the shell docking of optical module For installing conductive adhesive tape;4) gap of optical module is filled up using gluing process.
But conductive silicon sebific duct is covered at optical interface, or wrap up metal spring leaf not at the housing slot of optical module The gap of optical module can be eliminated, optical module still has electromagnetic wave leakage.And stria is opened up at the shell docking of optical module The mode for installing electric silica gel requires height to technique, especially installs and leads in the mode that the circular arc of optical interface is difficult to adopt fluting Electric silica gel strip.Although adhesive dots adhesive process can achieve the effect of sealing off gap, but be difficult to meet width < 1mm, highly < The size requirement of 0.3mm, when encountering the track 3D (such as optical interface part), dispensing thickness and cross sectional shape can be inconsistent, to hold Easily cause new gap;And it is whole partially hard after conductive adhesive curing, it will increase the difficulty of assembly.
Utility model content
The utility model provides a kind of conducting bracket and optical module, realizes in the premise for not changing optical module shell mechanism Under, completely eliminate the electromagnetic leakage of optical module.
In a first aspect, the utility model provides a kind of conducting bracket, comprising: compliant conductive piece, the compliant conductive on piece It is provided at least one vacancy section, the position of printed circuit board of position and optical module of the vacancy section is corresponding, and described soft Property conductive sheet be bonded the shell docking region and optical interface region of the optical module.
In one embodiment, the compliant conductive on piece is additionally provided with location hole, the position of the location hole and institute The locating piece stated on the shell docking region of optical module is corresponding.
In one embodiment, the compliant conductive piece is an integral molding structure, the compliant conductive piece with a thickness of 0.2mm~0.3mm.
In one embodiment, the compliant conductive piece includes: top surface, side wall and extension;The extension with it is described Top surface and/or side wall connection, the extension docks region with the shell of the optical module and optical interface region fits.
In one embodiment, the vacancy section is located on top surface;Wherein, the top surface of the compliant conductive piece with it is described The outer casing top surface of optical module fits, and the outer casing inner wall of the side wall and the optical module of the compliant conductive piece fits.
In one embodiment, the conducting bracket further include: insulating support, the insulating support are led with the flexibility Electric piece forming composite structure, and the insulating support is located at below the compliant conductive piece, to support and fix the flexibility Position of the conductive sheet in the optical module.
In one embodiment, at least one vacancy section, the position of the vacancy section are provided on the insulating support It is corresponding with the position of the printed circuit board of optical module.
In one embodiment, the making material of the insulating support is flexible material, comprising: rubber, silica gel.
In one embodiment, the making material of the compliant conductive piece includes: electric silica gel, conductive rubber.
Second aspect, the utility model provide a kind of optical module, comprising: shell, printed circuit board, and such as first aspect Any one of described in conducting bracket, the conducting bracket is mounted in the optical module, and the flexibility of the conducting bracket is led Electric piece docks region with shell, the optical interface region on printed circuit board fits.
Conducting bracket and optical module provided by the utility model are bonded the optical module by setting compliant conductive piece Shell docks region and optical interface region, wherein the compliant conductive on piece is provided at least one vacancy section, the vacancy section Position it is corresponding with the position of the printed circuit board of optical module, thus constitute an ideal faraday cup let out to eliminate electromagnetic wave Leakage.Conductive bracket structure in the utility model is simple, without changing the shell mechanism of optical module, use easy to spread, and It can be bonded the shell docking region and optical interface region of optical module well, so that the electromagnetic wave for completely eliminating optical module is let out Leakage.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, without creative efforts, It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the conducting bracket that the utility model embodiment one provides;
Fig. 2 is the mounting structure schematic diagram for the conducting bracket that the utility model embodiment two provides;
Fig. 3 is the structural schematic diagram for the conducting bracket that the utility model embodiment three provides.
In figure:
110- compliant conductive piece;
The vacancy section 111-;
112- location hole;
The top surface 113-;
114- side wall;
115- extension;
120- insulating support;
200- upper cover;
300- pedestal.
Through the above attached drawings, it has been shown that the specific embodiment of the disclosure will be hereinafter described in more detail.These attached drawings It is not intended to limit the scope of this disclosure concept by any means with verbal description, but is by referring to specific embodiments Those skilled in the art illustrate the concept of the disclosure.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.
The specification and claims of the utility model and term " first " in above-mentioned attached drawing, " second ", " third ", (if present)s such as " the 4 " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It answers The data that the understanding uses in this way are interchangeable under appropriate circumstances, so as to the embodiments of the present invention described herein, example As can with shown in herein or description those of other than sequence implement.In addition, term " includes " and " having " and Their any deformation, it is intended that cover and non-exclusive include.
Hereinafter, the part term in the application is explained, in order to those skilled in the art understand that:
1) optical module (Optical Module), is made of opto-electronic device, functional circuit and optical interface etc., photoelectron device Part includes emitting and receiving two parts.Briefly, the effect of optical module is exactly photoelectric conversion, and transmitting terminal converts electrical signals into Optical signal, after being transmitted by optical fiber, optical signal is converted into electric signal again by receiving end.The transmission rate of optical module includes: low speed Rate, 100,000,000, gigabit, 2.5G, 4.25G, 4.9G, 6G, 8G, 10G and 40G etc., wherein transmission rate refers to transmitted bit per second Number, unit Mb/s or Gb/s.
2) electric silica gel refers to and the conductive particles such as silver-coated copper powder, nickel coated graphite powder is evenly distributed in silica gel, by leading Electric particle contacts with each other connection, reaches good electric conductivity.Military and commercially have an application.Its main function is sealing And electromagnetic shielding.
Specifically, electric silica gel can be molded or extrusion molding, have on chip or other punching shapes available.Shielding Performance is up to 120dB (10GHz).Electric silica gel has good electromagnetic sealing and water vapor seal ability, under a certain pressure can Good electric conductivity (frequency is inhibited to reach 40GHz) is enough provided.
3) conductive rubber, refers to glass silvering, aluminium is silver-plated, the conductive particles such as silver-colored are evenly distributed in silicon rubber, passes through Pressure contacts conductive particle, reaches good electric conductivity.Military and commercially have an application.Its main function is sealing And electromagnetic shielding.
Specifically, conductive rubber can be molded or extrusion molding, have on chip or other punching shapes available.Shielding Performance is up to 120dB (10GHz), and existing silicon rubber includes: CONSIL-NC (silicon rubber is filled out in graphite nickel plating), CONSIL-V (silver Filled silicon rubber squeezes out liner) CONSIL-A (aluminium is silver-plated to fill out silicon rubber), CONSIL-N (nickel is silver-plated to fill out silicon rubber), CONSIL-C (copper is silver-plated to fill out silicon rubber), SC-CONSIL (graphite fills out silicon rubber), CONSIL-R (fine silver fills out silicon rubber), CONSIL-II (silver Fill out silicon rubber molded gasket) etc..
4) electromagnetic interference, electromagnetic wave is the major way that electromagnetic energy is propagated, can outside radiation electric when high-frequency circuit works Magnetic wave generates interference to neighbouring other equipment.On the other hand, the various electromagnetic waves in space can also sense in circuit, to electricity Road interferes.
5) it is electromagnetically shielded, refers to and electromagnetic wave propagation approach is cut off by shield, eliminate electromagnetic interference to reach Technology.
Under normal circumstances, the junction for shielding the different piece on shell can not completely attach to, and can only connect in certain points In touching, which constitute a pores arrays.Gap is to cause one of the main reason for shielding housing shroud performance degradation.And it is real Influence shield shield effectiveness only there are two factor: one be entire shield surface must be it is conductive continuous, another It is cannot have the conductor for being directed through shield.There are many conductive discontinuity poinies on shield, most important one kind is shield The non-conductive gap that different piece junction is formed.These nonconducting gaps just produce electromagnetic leakage.Solve this leakage A method be at gap filling conductive elastomer, eliminate non-conductive point.This elastic conduction packing material is exactly electricity Magnetic seal liner.In the prior art, generally electromagnetic wave leakage is solved the problems, such as using four kinds of modes, 1) it is arranged and leads at optical interface Electric silicone tube or conductive fabric;2) metal spring leaf is wrapped up at the housing slot of optical module;3) at the shell docking of optical module Stria is opened up for installing conductive adhesive tape;4) gap of optical module is filled up using gluing process.
But conductive silicon sebific duct is covered at optical interface, or wrap up metal spring leaf not at the housing slot of optical module The gap of optical module can be eliminated, optical module still has electromagnetic wave leakage.And stria is opened up at the shell docking of optical module The mode for installing electric silica gel requires height to technique, especially installs and leads in the mode that the circular arc of optical interface is difficult to adopt fluting Electric silica gel strip.Although adhesive dots adhesive process can achieve the effect of sealing off gap, but be difficult to meet width < 1mm, highly < The size requirement of 0.3mm, when encountering the track 3D (such as optical interface part), dispensing thickness and cross sectional shape can be inconsistent, to hold Easily cause new gap;And it is whole partially hard after conductive adhesive curing, it will increase the difficulty of assembly.
Aiming at the problems existing in the prior art, it the utility model proposes a kind of conducting bracket and optical module, realizes Under the premise of not changing optical module shell mechanism, the electromagnetic leakage of optical module is completely eliminated.
How to be solved with technical solution of the specifically embodiment to the technical solution of the utility model and the application below Above-mentioned technical problem is described in detail.These specific embodiments can be combined with each other below, for the same or similar Concept or process may repeat no more in certain embodiments.Below in conjunction with attached drawing, the embodiments of the present invention are carried out Description.
Fig. 1 is the structural schematic diagram for the conducting bracket that the utility model embodiment one provides, as shown in Figure 1, the present embodiment In conducting bracket may include: compliant conductive piece 110, the compliant conductive on piece is provided at least one vacancy section 111, institute The position for stating the position of vacancy section and the printed circuit board of optical module is corresponding, and the compliant conductive piece 110 is bonded the optical mode The shell docking region of block and optical interface region.
In the present embodiment, compliant conductive piece 110 can by be molded one-pass molding, specific structure can with optical module into Row customization, is bonded the housing slot of optical module completely with optical interface region slot with compliant conductive piece.So as to Eliminate the Electromagnetic Interference at optical module assembly trailing flank gap and optical interface at gap.
In the present embodiment, by the way that hollow out corresponding with the position of the printed circuit board of optical module is arranged in compliant conductive on piece Area avoids signal interference and leads to short circuit so as to prevent electric silica gel from contacting with pcb board and electronic component.
In one embodiment, the compliant conductive piece 110 is an integral molding structure, the compliant conductive piece 110 With a thickness of 0.2mm~0.3mm.
In the present embodiment, the selection thickness of compliant conductive piece, in practical applications, the thickness of compliant conductive piece are given Degree can be uniform or non-uniform.For example, in the docking region of optical module shell and optical interface regional flexibility conductive sheet Thickness will be lower than the thickness in other regions.
In another embodiment, the present embodiment can also be disposably compression molded into using conductive silicon film in homogeneous thickness Type.The present embodiment does not limit the specific processing technology of compliant conductive piece.
In one embodiment, the making material of the compliant conductive piece includes: electric silica gel, conductive rubber.
In the present embodiment, no matter the making material of compliant conductive piece is electric silica gel or conductive rubber, action principle It is similar.
Specifically, by taking conductive rubber as an example, the conductive particle filled in conductive rubber is when filling certain volume number, phase Mutually contact forms electronics continuous state, and when outside external electromagnetic field to conductive rubber, strong electromagnetic wave gets to conductive particle On free electron, free electron free movement, free electron forms the electromagnetic field opposite with external electromagnetic field during the motion, Interior external electromagnetic field is cancelled out each other, and achievees the purpose that weaken electromagnetic interference.
Further, when electromagnetic wave is got on free electron, in free electron motion process, since conductive particle is that have one Determine resistance, generate heat, is i.e. electromagnetic interference wave is converted into free electron motion energy, and then kinetic energy is converted into thermal energy, to reach To the effect for weakening electromagnetic interference wave.
Specifically, the principle of electromagnetic shield-ing of electric silica gel and the principle of electromagnetic shield-ing of conductive rubber are similar, no longer superfluous herein It states.In general, electric silica gel product has molding and squeezes out two kinds of profiles.Molding type conductive rubber can be made into the plate of various thickness, The plane gaskets of mechanograph, strip-shaped product and cross cutting.Extrusion type electric silica gel can be made into various regular cross sections, continuous lining Pad, rectangle, circle, " D " shape, " U " shape, " P " shape and various thin-wall constructions can also require to customize various cross sections according to user.
The present embodiment, the shell that the optical module is bonded by setting compliant conductive piece dock region and optical interface area Domain, wherein the compliant conductive on piece is provided at least one vacancy section, the position of the vacancy section and the printing electricity of optical module The position of road plate is corresponding, to constitute an ideal faraday cup to eliminate electromagnetic-wave leakage.
Conductive bracket structure in the utility model is simple, without changing the shell mechanism of optical module, use easy to spread, And it can be bonded the shell docking region and optical interface region of optical module well, to completely eliminate the electromagnetic wave of optical module Leakage.
Fig. 2 is the mounting structure schematic diagram for the conducting bracket that the utility model embodiment two provides, as shown in Fig. 2, flexible Conductive sheet 110 is mounted in optical module, and is fitted with the region of docking of the upper cover 200 of the optical module shell and pedestal 300.
In one embodiment, location hole 112 is additionally provided on the compliant conductive piece 110, the location hole 112 Position is corresponding with the locating piece 210 in the upper cover 200 of the shell of the optical module.
In the present embodiment, compliant conductive on piece is provided with location hole, by the outer casing upper cover of location hole and optical module Locating piece match.When compliant conductive piece is installed in optical module, location hole can be directed to the outer casing upper cover of optical module Locating piece, so as to preferably position and install the compliant conductive piece.
In one embodiment, the compliant conductive piece 110 includes: top surface 113, side wall 114 and extension 115;Institute It states extension 115 to connect with the top surface 113 and/or side wall 114, the extension 115 docks region with the shell of the optical module It fits with optical interface region.
The specific structure of compliant conductive piece is given in the present embodiment, but in practical applications, the knot of compliant conductive piece Structure can be designed according to optical module.For example, region, light can be docked according to the internal structure and optical module shell of optical module The structure of interface area designs the grinding tool of a customization.Pass through the corresponding compliant conductive piece of the grinding tool mass production.
In one embodiment, the vacancy section 111 is located on top surface 113;Wherein, the compliant conductive piece 110 Top surface 113 and the top surface of the upper cover 200 of the shell of the optical module fit, the side wall 114 of the compliant conductive piece 110 and institute The outer casing inner wall for stating optical module fits.
The present embodiment, the shell that the optical module is bonded by setting compliant conductive piece dock region and optical interface area Domain, wherein the compliant conductive on piece is provided at least one vacancy section, the position of the vacancy section and the printing electricity of optical module The position of road plate is corresponding, to constitute an ideal faraday cup to eliminate electromagnetic-wave leakage.Conduction in the utility model Supporting structure is simple, without changing the shell mechanism of optical module, use easy to spread, and can be bonded optical module well Shell docks region and optical interface region, to completely eliminate the electromagnetic-wave leakage of optical module.
Fig. 3 is the structural schematic diagram for the conducting bracket that the utility model embodiment three provides, as shown in figure 3, the conduction Bracket 100 further include: insulating support 120, the insulating support 120 and 110 forming composite structure of compliant conductive piece, and institute It states insulating support 120 and is located at 110 lower section of the compliant conductive piece, to support and fix the compliant conductive piece 110 described Position in optical module.
In one embodiment, at least one vacancy section, the position of the vacancy section are provided on the insulating support 120 It sets corresponding with the position of the printed circuit board of optical module.
In one embodiment, the making material of the insulating support is flexible material, comprising: rubber, silica gel.
Specifically, by taking conducting bracket shown in Fig. 3 as an example, insulating support uses General Purpose Rubber, and compliant conductive piece is used and led Electric rubber or electric silica gel are made.Insulating support below compliant conductive piece plays installation, fixed function;And top is soft Property conductive sheet rise electromagnetic shielding action.
It is to dock region and optical interface with the shell of optical module due to actually playing shielding Electromagnetic Field in the present embodiment The compliant conductive piece of region fitting.Therefore, in order to reduce the area of compliant conductive piece, production cost is reduced, it can be described soft again Property conductive sheet below be arranged insulating support, to support and fix position of the compliant conductive piece in the optical module.
In practical applications, the structure of compliant conductive piece and insulating support can be designed according to optical module.For example, can be with The mill of a customization is designed according to the structure of the internal structure of optical module and optical module shell docking region, optical interface region Tool.Pass through the corresponding compliant conductive piece of the grinding tool mass production and insulating support.
The present embodiment, the shell that the optical module is bonded by setting compliant conductive piece dock region and optical interface area Domain, wherein the compliant conductive on piece is provided at least one vacancy section, the position of the vacancy section and the printing electricity of optical module The position of road plate is corresponding, to constitute an ideal faraday cup to eliminate electromagnetic-wave leakage.
Conductive bracket structure in the utility model is simple, without changing the shell mechanism of optical module, use easy to spread, And it can be bonded the shell docking region and optical interface region of optical module well, to completely eliminate the electromagnetic wave of optical module Leakage.
The utility model also provides a kind of optical module, comprising: shell, printed circuit board, and as described in FIG. 1 to FIG. 3 Conducting bracket, the conducting bracket are mounted in the optical module, and the compliant conductive piece of the conducting bracket is docked with shell Optical interface region on region, printed circuit board fits.
The present embodiment, by optical module be arranged compliant conductive piece come be bonded the optical module shell dock region and Optical interface region, to constitute an ideal faraday cup to eliminate electromagnetic-wave leakage.
Conductive bracket structure in the utility model is simple, without changing the shell mechanism of optical module, use easy to spread, And it can be bonded the shell docking region and optical interface region of optical module well, to completely eliminate the electromagnetic wave of optical module Leakage.
In the description of the present invention, it should be understood that used term " center ", " length ", " width ", " thickness ", " top ", " bottom end ", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outside" " axis To ", the indicating positions such as " circumferential direction " or positional relationship all can be based on the orientation or positional relationship shown in the drawings, merely to just In description the utility model and simplify description, rather than the position of indication or suggestion meaning or original part there must be specific side Position, specifically to construct and operate, therefore should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. shall be understood in a broad sense, such as may be a fixed connection, may be a detachable connection, or be integrally formed;It can be machinery Connection is also possible to be electrically connected or can communicate with each other;It can be directly connected, the indirect phase of intermediary can also be passed through Even, the connection inside two elements or the interaction relationship of two elements can be made.For those of ordinary skill in the art For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Those skilled in the art will readily occur to the disclosure after considering specification and practicing utility model disclosed herein Other embodiments.The utility model is intended to cover any variations, uses, or adaptations of the disclosure, these changes Type, purposes or adaptive change follow the general principles of this disclosure and undocumented in the art including the disclosure Common knowledge or conventional techniques.The description and examples are only to be considered as illustrative, the true scope and spirit of the disclosure It is pointed out by following claims.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by appended claims System.

Claims (10)

1. a kind of conducting bracket characterized by comprising compliant conductive piece, the compliant conductive on piece are provided at least one Vacancy section, the position of printed circuit board of position and optical module of the vacancy section is corresponding, and the compliant conductive piece is bonded institute State the shell docking region and optical interface region of optical module.
2. conducting bracket according to claim 1, which is characterized in that the compliant conductive on piece is additionally provided with location hole, The position of the location hole is corresponding with the locating piece on the shell of optical module docking region.
3. conducting bracket according to claim 1, which is characterized in that the compliant conductive piece is an integral molding structure, institute State compliant conductive piece with a thickness of 0.2mm~0.3mm.
4. conducting bracket according to claim 1, which is characterized in that the compliant conductive piece includes: top surface, side wall, with And extension;The extension is connect with the top surface and/or side wall, and the extension docks region and light with the shell of the optical module Interface area fits.
5. conducting bracket according to claim 4, which is characterized in that the vacancy section is located on top surface;Wherein, described soft Property conductive sheet top surface and the outer casing top surface of the optical module fit, the side wall of the compliant conductive piece and the optical module Outer casing inner wall fits.
6. conducting bracket according to claim 1, which is characterized in that further include: insulating support, the insulating support and institute Compliant conductive piece forming composite structure is stated, and the insulating support is located at below the compliant conductive piece, to support and fix Position of the compliant conductive piece in the optical module.
7. conducting bracket according to claim 6, which is characterized in that be provided at least one hollow out on the insulating support Area, the position of printed circuit board of position and optical module of the vacancy section are corresponding.
8. conducting bracket according to claim 6, which is characterized in that the making material of the insulating support is flexible material Material, comprising: rubber, silica gel.
9. conducting bracket according to claim 1 to 8, which is characterized in that the production material of the compliant conductive piece Material includes: electric silica gel, conductive rubber.
10. a kind of optical module, feature exist, comprising: shell, printed circuit board, and as described in any one of claim 1-9 Conducting bracket, the conducting bracket is mounted in the optical module, and the compliant conductive piece of the conducting bracket and shell pair Region, the optical interface region on printed circuit board is connect to fit.
CN201821186023.6U 2018-07-25 2018-07-25 Conducting bracket and optical module Active CN208432760U (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110275256A (en) * 2019-07-15 2019-09-24 武汉华工正源光子技术有限公司 A kind of plastic packaging adapter device optical module and its optical port electromagnetic armouring structure
WO2024016711A1 (en) * 2022-07-21 2024-01-25 青岛海信宽带多媒体技术有限公司 Optical module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110275256A (en) * 2019-07-15 2019-09-24 武汉华工正源光子技术有限公司 A kind of plastic packaging adapter device optical module and its optical port electromagnetic armouring structure
WO2024016711A1 (en) * 2022-07-21 2024-01-25 青岛海信宽带多媒体技术有限公司 Optical module

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