CN104753600A - Metal packaging type optical receiving and transmitting module - Google Patents

Metal packaging type optical receiving and transmitting module Download PDF

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Publication number
CN104753600A
CN104753600A CN201310750948.4A CN201310750948A CN104753600A CN 104753600 A CN104753600 A CN 104753600A CN 201310750948 A CN201310750948 A CN 201310750948A CN 104753600 A CN104753600 A CN 104753600A
Authority
CN
China
Prior art keywords
electric conductor
upper cover
base
elastic electric
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310750948.4A
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Chinese (zh)
Inventor
王琳
张晓峰
何伟强
许君
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Neo Photonic Technology Co Ltd
Original Assignee
Shenzhen Neo Photonic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Neo Photonic Technology Co Ltd filed Critical Shenzhen Neo Photonic Technology Co Ltd
Priority to CN201310750948.4A priority Critical patent/CN104753600A/en
Publication of CN104753600A publication Critical patent/CN104753600A/en
Pending legal-status Critical Current

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Abstract

The invention provides a metal packaging type optical receiving and transmitting module. The module comprises a base, an upper cover, a PCB, first elastic conductors, second elastic conductors and a third elastic conductor, wherein a shielding baffle which downwards extends is arranged at the rear end of the upper cover; the first elastic conductors are attached on the four sidewalls of the shielding baffle; the second elastic conductors are attached on the four sidewalls of the upper cover and conductively connected with the sidewall of the base; the third elastic conductor is attached to the bottom part of the base; a plurality of conductive holes corresponding to the first elastic conductors and the third elastic conductors are formed in the upper surface and the lower surface of the PCB; the inner wall and four sides of the surface of each hole are plated with conductive metal films. According to the module, the second elastic conductors at the front end are extruded to the sidewall of the base to form a good conductive connection; the base, the PCB and the upper cover at the rear end form conductive contact; therefore, a complete electromagnetic shielding cavity is formed in the whole optical module, and the electromagnetic shielding effect of the optical receiving and transmitting module can be effectively improved.

Description

A kind of optical transceiver module of metallic packaging
Technical field
The present invention relates to a kind of optical transceiver module of metallic packaging.
Background technology
Along with the transmission rate of the optical transceiver module of metallic packaging is accelerated, relate to electromagnetic interference EMI (Electromagnetic Interference, hereinafter referred to as EMI) more and more.EMI is the electromagnetic noise produced by optical transceiver module internal electronic component, emitting electromagnetic wave.The metallic packaging base of high rate optical transceiver module with between upper cover owing to being that rigid member is connected, certain gap can be there is at its faying face, the electromagnetic wave especially easily causing module to produce is gone out from clearance leakage and is produced EMI, causes other electron component normally to run.Especially, when optical transceiver module speed increases, identical gap will decline greatly to the shield effectiveness of frequency electromagnetic waves.Electromagnetic shielding utilizes shield to produce attenuation to electromagnetic wave, thus minimizing avoids electromagnetic wave to cause interference or injury.The material being used as shielding is divided into high conductivity material and high-permeability material.Wherein electric conducting material is shielding principle is utilize it will to produce larger induced current under electromagnetic effect, these electric currents will weaken electromagnetic passing through according to Lenz's law, the frequency electromagnetic waves that the electronic devices and components of inside of shield casings produce, is unlikely to affect external equipment or human-body safety.For the electromagnetic shielding of optical transceiver module, adopt one-piece encapsulation in theory, its EMI shield effectiveness is best, but in practical application, because design and assembling need, the installation that integral seamless encapsulation is difficult to realize internal component is often fixed.Usually electronic devices and components are installed in metab, sealed by a upper cover, because the problem of machining accuracy will certainly exist some openings and gap between base and upper cover, the electromagnetic wave in module will leak from these openings and gap, affects effectiveness.
Summary of the invention
For overcoming above shortcoming, the invention provides the optical transceiver module of the good metallic packaging of a kind of EMI shield effectiveness.
For reaching above goal of the invention, the invention provides a kind of optical transceiver module of metallic packaging, comprise: a base, a upper cover, a PCB, first, second, and third elastic electric conductor, described upper cover back-end is provided with the shielding baffle plate stretched downwards, and described first elastic electric conductor is attached to described shielding baffle plate surrounding sidewall; Described second elastic electric conductor is attached to upper cover surrounding sidewall and conducts electricity with described base side wall and be connected; Described 3rd elastic electric conductor is attached to base bottom; Described PCB rear end upper and lower surface is provided with multiple conductive hole with the first elastic electric conductor and described 3rd elastic electric conductor opposite position place respectively, this hole inwall and surperficial surrounding plating conductive metal film.
Described conductive hole runs through formation conductive through hole from described PCB upper surface to lower surface.
Described conductive hole is positioned at the described upper and lower both sides of PCB conductive metal layer.
Described upper cover surrounding sidewall is provided with the first groove, and described shielding baffle plate surrounding sidewall is provided with the second groove, and first, second elastic electric conductor part described embeds in groove, and another part outwardly.
First, second elastic electric conductor described is conductive rubber strip.
Due to the optical transceiver module of the metallic packaging of said structure, due to module front end, its upper cover arranges the second elastic electric conductor, formed with base side wall and extrude, formed and conduct electricity connection preferably, and module rear end, the shielding baffle plate arranged by upper cover, and this baffle plate surrounding is provided with the second elastic electric conductor, with the upper surface conductive metal film of PCB, conductive hole, the lower surface conductive metal film of PCB and the 3rd elastic electric conductor and base conductive contact, thus base, conductive contact is formed between PCB and upper cover, like this, just whole optical module inside can be made to form complete electromagnetic shielding cavity, effectively improve optical transceiver module effectiveness.
Accompanying drawing explanation
Fig. 1 represents the decomposing schematic representation of the optical transceiver module of metallic packaging of the present invention;
Fig. 2 represents that the base of optical transceiver module shown in Fig. 1 and upper cover are in conjunction with generalized section;
Fig. 3 represents the upper cover sectional perspective structural representation of optical transceiver module shown in Fig. 1;
Fig. 4 A represents the embodiment of pcb board first shown in Fig. 1 partial cutaway schematic;
Fig. 4 B represents the embodiment of pcb board second shown in Fig. 1 partial cutaway schematic.
Embodiment
Preferred embodiment is described in detail below in conjunction with accompanying drawing.
The optical transceiver module of metallic packaging as shown in Figure 1, comprising: base 10, upper cover 60, PCB 30, first, second, and third elastic electric conductor 40,50,20.Upper cover 60 rear end is provided with shielding baffle plate 61, first elastic electric conductor 40 stretched downwards and is attached to shielding baffle plate 61 surrounding sidewall 6101; Second elastic electric conductor 50 is attached to upper cover 60 surrounding sidewall 62 and conducts electricity with base 10 sidewall 11 and be connected; 3rd elastic electric conductor 20 is attached to bottom base 10, and the material of above-mentioned elastic electric conductor can adopt conductive rubber strip, conducting foam etc.As shown in Figure 4 A, PCB 30 rear end upper and lower surface is provided with multiple conductive hole 31 with the first elastic electric conductor 40 and the 3rd elastic electric conductor 20 opposite position place respectively, this hole inwall 31 and surperficial surrounding plating conductive metal film 32, conductive hole 31 is positioned at the upper and lower both sides of PCB 30 conductive metal layer 33, be convenient to pcb board mounting related components like this, if pcb board surface installing space allows, directly conductive hole 31 can be got through hole from top to bottom, as shown in Figure 4 B.Be no matter the conductive hole of which kind of structure, all can realize by the galvanic circle of base 10, the 3rd elastic electric conductor 20, pcb board, the first elastic electric conductor 40 to upper cover 60.
As shown in Figures 2 and 3, upper cover 60 surrounding sidewall 62 is provided with the first groove 6201, shielding baffle plate 61 surrounding sidewall 6101 is provided with the second groove 6102, first, second elastic electric conductor 40, 50 is conductive rubber strip, two rubber strip parts embed in groove, another part outwardly, jut is extruded in groove by the sidewall 11 of base 10, formed and conduct electricity connection preferably, in existing structure, generally that the second elastic electric conductor 50 is realized electromagnetic shielding by upper cover 60 and the top edge of base 10 compression that faces down, but, metal top cover easily produce stress deformation backward on arch upward, the effectiveness of the second elastic electric conductor 50 is caused to reduce.
If elastic electric conductor adopts conducting foam, be then directly attached to relevant position by bonding method, do not need recessing.

Claims (5)

1. the optical transceiver module of a metallic packaging, it is characterized in that, comprise: a base (10), a upper cover (60), a PCB (30), first, second, and third elastic electric conductor (40,50,20), described upper cover (60) rear end is provided with the shielding baffle plate (61) stretched downwards, and described first elastic electric conductor (40) is attached to described shielding baffle plate (61) surrounding sidewall (6101); Described second elastic electric conductor (50) is attached to upper cover (60) surrounding sidewall (62) and conducts electricity with described base (10) sidewall (11) and be connected; Described 3rd elastic electric conductor (20) is attached to base (10) bottom; Described PCB (30) rear end upper and lower surface is provided with multiple conductive hole (31) with the first elastic electric conductor (40) and described 3rd elastic electric conductor (20) opposite position place respectively, this hole inwall (31) and surperficial surrounding plating conductive metal film (32).
2. the optical transceiver module of metallic packaging according to claim 1, it is characterized in that, described conductive hole (31) runs through formation conductive through hole from described PCB (30) upper surface to lower surface.
3. the optical transceiver module of metallic packaging according to claim 1, it is characterized in that, described conductive hole (31) is positioned at described PCB (30) conductive metal layer (33) upper and lower both sides.
4. the optical transceiver module of metallic packaging according to Claims 2 or 3, it is characterized in that, described upper cover (60) surrounding sidewall (62) is provided with the first groove (6201), described shielding baffle plate (61) surrounding sidewall (6101) is provided with the second groove (6102), first, second elastic electric conductor described (40,50) part embeds in groove, and another part outwardly.
5. the optical transceiver module of metallic packaging according to claim 4, it is characterized in that, first, second elastic electric conductor described (40,50) is conductive rubber strip.
CN201310750948.4A 2013-12-31 2013-12-31 Metal packaging type optical receiving and transmitting module Pending CN104753600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310750948.4A CN104753600A (en) 2013-12-31 2013-12-31 Metal packaging type optical receiving and transmitting module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310750948.4A CN104753600A (en) 2013-12-31 2013-12-31 Metal packaging type optical receiving and transmitting module

Publications (1)

Publication Number Publication Date
CN104753600A true CN104753600A (en) 2015-07-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310750948.4A Pending CN104753600A (en) 2013-12-31 2013-12-31 Metal packaging type optical receiving and transmitting module

Country Status (1)

Country Link
CN (1) CN104753600A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105572816A (en) * 2015-12-23 2016-05-11 宁波环球广电科技有限公司 Multichannel parallel light transmitting and receiving module
CN106879240A (en) * 2017-02-07 2017-06-20 青岛海信宽带多媒体技术有限公司 Optical module
CN113419314A (en) * 2021-06-11 2021-09-21 长飞光纤光缆股份有限公司 Novel electromagnetic shielding optical module shell structure
CN113885144A (en) * 2021-09-27 2022-01-04 青岛海信宽带多媒体技术有限公司 Optical module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201181776Y (en) * 2004-12-16 2009-01-14 莫莱克斯公司 Connector with improved EMI shield
CN101470235A (en) * 2007-12-28 2009-07-01 日本光进株式会社 Optical transceiver module
CN201876577U (en) * 2010-10-25 2011-06-22 深圳市易飞扬通信技术有限公司 Unlock device for SFP optical transmit and receive integrative module
CN102834924A (en) * 2010-04-14 2012-12-19 罗伯特·博世有限公司 Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side, and photovoltaic module
CN202995097U (en) * 2012-12-18 2013-06-12 深圳新飞通光电子技术有限公司 Pluggable optical transmit-receive module
CN203691412U (en) * 2013-12-31 2014-07-02 深圳新飞通光电子技术有限公司 Optical transceiver module of metallic packaging

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201181776Y (en) * 2004-12-16 2009-01-14 莫莱克斯公司 Connector with improved EMI shield
CN101470235A (en) * 2007-12-28 2009-07-01 日本光进株式会社 Optical transceiver module
CN102834924A (en) * 2010-04-14 2012-12-19 罗伯特·博世有限公司 Method for producing a photovoltaic module comprising semiconductor cells contact-connected on the rear side, and photovoltaic module
CN201876577U (en) * 2010-10-25 2011-06-22 深圳市易飞扬通信技术有限公司 Unlock device for SFP optical transmit and receive integrative module
CN202995097U (en) * 2012-12-18 2013-06-12 深圳新飞通光电子技术有限公司 Pluggable optical transmit-receive module
CN203691412U (en) * 2013-12-31 2014-07-02 深圳新飞通光电子技术有限公司 Optical transceiver module of metallic packaging

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105572816A (en) * 2015-12-23 2016-05-11 宁波环球广电科技有限公司 Multichannel parallel light transmitting and receiving module
CN106879240A (en) * 2017-02-07 2017-06-20 青岛海信宽带多媒体技术有限公司 Optical module
CN113419314A (en) * 2021-06-11 2021-09-21 长飞光纤光缆股份有限公司 Novel electromagnetic shielding optical module shell structure
CN113419314B (en) * 2021-06-11 2022-03-18 长飞光纤光缆股份有限公司 Electromagnetic shielding optical module shell structure
CN113885144A (en) * 2021-09-27 2022-01-04 青岛海信宽带多媒体技术有限公司 Optical module

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Application publication date: 20150701

RJ01 Rejection of invention patent application after publication