CN208420756U - A kind of imaging system - Google Patents
A kind of imaging system Download PDFInfo
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- CN208420756U CN208420756U CN201821196445.1U CN201821196445U CN208420756U CN 208420756 U CN208420756 U CN 208420756U CN 201821196445 U CN201821196445 U CN 201821196445U CN 208420756 U CN208420756 U CN 208420756U
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Abstract
The utility model discloses a kind of imaging systems, comprising: Fiber electron computed tomography (micro-CT) subsystem, sample processing subsystem and scanning electron microscope (SEM) and processor；The micro-CT subsystem includes: x-ray source and X-ray detector, for obtaining the 3-D image of sample；The sample processing subsystem includes: focused ion beam subsystem and mechanical cutting device；The focused ion beam subsystem is handled the sample with the first processing method, and the mechanical cutting device is handled the sample with the second processing method, obtains the object section of target area；The SEM, positioned at the top of the sample, for obtaining the two dimensional image of the object section；The processor obtains the three-dimensional imaging of the sample for carrying out three-dimensionalreconstruction to the two dimensional image.
Description
Technical field
The utility model relates to Scanning electron microscopy more particularly to a kind of imaging systems
Background technique
It is higher and higher to the observation requirements of sample with scientific research and industrial expansion；Especially in biology and investigation of materials
Field, the observation of the microstructure (such as vesica in nerve cell) of sample is required it is higher and higher, to be needed in scientific research
For the high-resolution three-dimension image (3D image) for obtaining sample, in brain science research, need to obtain neuronal cell
Three-dimensional figure finds out the interconnection mode of nerve cell.
In the related technology, the method for carrying out three-dimensional imaging to sample generally includes: Laser Scanning Confocal Microscope, x-ray tomography are swept
Retouch (Computed Tomography, CT) etc..However the above method usually has lower resolution ratio that (about tens receive to several hundred
Rice magnitude)；Scanning electron microscope (Scanning Electron Microscopy, SEM) is although higher point can be obtained
Resolution (several nanometers or even sub-nanometer magnitude), but the penetration depth of electronics only has micron dimension, it generally can not be directly to sample
Carry out three-dimensional imaging, especially cannot particular region of interest (Region of Interest, ROI) to sample interior carry out
Directly observe.Therefore, the detection imaging for carrying out high-resolution detection imaging and high-penetration depth to sample there is no effective solution
Certainly scheme.
Utility model content
In view of this, the utility model embodiment provides a kind of imaging system, the detection of resolution ratio can be carried out to sample
The detection imaging of imaging and high-penetration depth.
The embodiment of the present invention provides a kind of imaging system, comprising: micro-CT subsystem, sample processing subsystem and SEM
And processor；Wherein,
The micro-CT subsystem includes: x-ray source and X-ray detector, for obtaining the 3-D image of sample；
The sample processing subsystem includes: focused ion beam focused ion beam (Focused Ion Beam, FIB) subsystem
System and mechanical cutting device；The focused ion beam subsystem is handled the sample with the first processing method, the machine
Tool cutting apparatus is handled the sample with the second processing method, obtains the object section of target area；
The SEM, positioned at the top of the sample, for obtaining the two dimensional image of the object section；
The processor obtains the three-dimensional imaging of the sample for carrying out three-dimensionalreconstruction to the two dimensional image.
In above scheme, the processor is also used to determine the first area and firstth area of the 3-D image
The location information in domain；
The focused ion beam subsystem and/or the mechanical cutting device, be also used to in the sample except described the
Region other than one region is handled, so that the first area is exposed or will expose；
The micro-CT subsystem is also used to obtain the 3-D image of treated sample；
The processor is also used to navigate to the first area based on the 3-D image of treated the sample
Amendment obtains second area, and determines that the location information of the second area is the location information of the target area；The mesh
The location information in mark region is handled the sample for the sample processing subsystem.
In above scheme, the sample is set on sample stage, and the sample stage is able to carry out the movement of five degree of freedom.
In above scheme, the angle between the axis of the focused ion beam subsystem and the vertical direction of the sample is
θ, 0≤θ≤180 °.
In above scheme, the mechanical cutting device are as follows:
Glass cutter, stainless steel knife, diamond cutter or microtome.
In above scheme, the SEM further include: energy disperse spectroscopy EDS, the EDS are used to obtain the energy spectrum diagram of the sample.
In above scheme, the x-ray source, the X-ray detector and the sample are set on same straight line, and
The x-ray source and the X-ray detector are located at the two sides of the sample.
In the utility model embodiment, the three-dimensional figure of sample is obtained by Fiber electron computed tomography subsystem
Picture can be realized the detection imaging of the high-penetration depth of sample；The 3-D image of sample, energy are obtained using micro-CT subsystem
The enough resolution ratio improved to the detection imaging of sample；Also, by micro-CT subsystem, by focused ion beam subsystem and machinery
Sample processing subsystem, SEM and the processor that cutting apparatus is constituted are integrated into an imaging system, improve sample detection
Precision.
Detailed description of the invention
Fig. 1 is an optional composed structure schematic diagram of the utility model embodiment imaging system；
Positional diagram of Fig. 2 a between the utility model embodiment FIB and sample；
Fig. 2 b is the top view schematic diagram one of imaging system provided by the embodiment of the utility model；
Fig. 2 c is the top view schematic diagram two of imaging system provided by the embodiment of the utility model；
Fig. 2 d is the top view schematic diagram three of imaging system provided by the embodiment of the utility model；
Fig. 2 e is the top view schematic diagram four of imaging system provided by the embodiment of the utility model；
Fig. 3 provides the structural schematic diagram one applied to the imaging system of sample detection method for the utility model embodiment；
Fig. 4 provides the structural schematic diagram two applied to the imaging system of sample detection method for the utility model embodiment；
Fig. 5 provides the structural schematic diagram three applied to the imaging system of sample detection method for the utility model embodiment；
Fig. 6 provides the structural schematic diagram four applied to the imaging system of sample detection method for the utility model embodiment；
Fig. 7 is the optional processing flow schematic diagram of the utility model embodiment sample detection method.
Specific embodiment
With reference to the accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that this place is retouched
The specific embodiment stated is only used to explain the utility model, is not used to limit the utility model.
The optional composed structure schematic diagram of one of imaging system provided by the embodiment of the utility model, as shown in Figure 1, imaging
System 100 includes: the micro-CT subsystem being made of x-ray source 101 and X-ray detector 102；The micro-CT subsystem
The 3-D image united for obtaining sample 104；The sample 104 is placed on sample stage 103, and the sample stage 103 is able to carry out
The movement of five degree of freedom, the movement of the five degree of freedom include: D translation (translation on tri- directions X, Y and Z), around center
The rotation (R) and inclination (T) of axis.
The imaging system 100 further include: be made of focused ion beam subsystem (FIB) 105 and mechanical cutting device 106
Sample processing subsystem；The sample processing subsystem, the object section of the target area for obtaining sample 104.
An optional ion source of the FIB is liquid metal gallium ion, and the FIB105 is with the first processing method to sample
Product 104 are handled；For example, the FIB handles in a manner of micro/nano level processing sample 104 sample 104,
To realize that the tomography to sample 104 is cut.
In some embodiments, the positional relationship between the FIB105 and the sample 104 is as shown in Figure 2 a, described
FIB105 can carry out pitch tilt, the axis of the FIB105 and the sample stage 103 (or be located on the sample stage 103
Sample) vertical direction Z-direction have angle θ；The angle can be adjusted by mechanical device, adjustable range 0
≤θ≤180°。
Mechanical cutting device 106 is handled sample 104 with the second processing method；For example, the machine cut
Device 106 handles in a manner of rough machined sample 104 sample 104, to realize that the tomography to sample 104 is cut.Machine
The optional type of tool cutting apparatus 106 includes at least: glass cutter, stainless steel knife, diamond cutter and microtome；?
When it is implemented, can be according to the type of sample 104 and the type of cutting size selection mechanical cutting device 106.
The imaging system 100 further include: the SEM107 above sample 104, for obtaining the object section
Two dimensional image is realized and is detected to the high-resolution of sample 104；Based on multiple object sections, it is capable of forming a series of X-Y scheme
Picture, the two dimensional image include at least secondary electron (Secondary Electrons, SE) image and backscattered electron (Back
Scattered Electrons, BSE) image.
The SEM107, further includes energy disperse spectroscopy EDS, and the EDS is used to obtain the energy spectrum diagram of sample 104；By obtaining sample
The energy spectrum diagram of product 104 realizes the function of being analyzed the material composition of sample 104.
The imaging system 100 further include: processor 109 is obtained for carrying out three-dimensionalreconstruction to the two dimensional image of acquisition
The 3-D image of the target area.
Fig. 2 b, Fig. 2 c, the top view that Fig. 2 d and Fig. 2 e are imaging system 100 provided by the embodiment of the utility model；One
In a little alternative embodiments, the x-ray source 101, the X-ray detector 102 and the sample 104 are set to same straight line
On, and the x-ray source 102 and the X-ray detector 102 are located at the two sides of the sample 104.Such as Fig. 2 b, Fig. 2 c
With shown in Fig. 2 d, FIB105, SEM107 (or sample stage 103) can be conllinear with 106 three of sample cutting apparatus, such as Fig. 2 e institute
Show, FIB105, SEM107 (or sample stage 103) and 106 three of sample cutting apparatus can not also be conllinear；EDS108 and SEM107
It is placed adjacent.Also, the not office of the positional relationship between FIB105, SEM107 (or sample stage 103) and sample cutting apparatus 106
It is limited to Fig. 2 b, Fig. 2 c, positional relationship described in Fig. 2 d and Fig. 2 e.
In some optional embodiments, the FIB105 and/or the mechanical cutting device 106, are also used to the sample
Region in product 104 in addition to the first area is handled, so that the first area is exposed or will expose；Described
One region is the region detected to sample 104.
The micro-CT subsystem is also used to obtain the 3-D image of treated sample；
The processor 109 is also used to the 3-D image based on treated the sample and carries out to the first area
Navigation amendment obtains second area, and determines that the location information of the second area is the location information of the target area；Institute
The location information for stating target area is handled the sample for the sample processing subsystem.
Based on above-mentioned imaging system, the utility model embodiment also provides a kind of sample detection method, the sample detection
Method is applied to Fig. 3, Fig. 4, Fig. 5 and imaging system shown in fig. 6, and the imaging system includes: micro-CT subsystem, by gathering
Sample processing subsystem, SEM and the processor that pyrophosphate ion beam subsystem and mechanical cutting device are constituted；The detection method
Process flow, as shown in fig. 7, comprises following steps:
The 3-D image of step S101, micro-CT subsystem acquisition sample.
In some embodiments, micro-CT subsystem includes x-ray source and X-ray detector, the x-ray source, institute
It states X-ray detector and the sample is set on same straight line, and the x-ray source and X-ray detector difference
Positioned at the two sides of the sample.
As shown in figure 3, sample 304 is placed on sample stage 303, x-ray source 301 issues X-ray, through sample 304, throws
It is mapped on detector 302, by the rotation of sample stage 303, obtains a series of projected images, converted projected image by operation
For 3-D image 309, this 3-D image is for the navigation picture in subsequent observation.
It should be noted that be the prior art by the treatment process that projected image is converted to 3-D image, it is no longer superfluous here
It states.
Step S102, the location information based on the acquiring three-dimensional images target area.
Here, target area is the region detected to sample.
In some embodiments, the processor in imaging system determines the first area and described of the 3-D image
The location information in one region；Based on the location information, filled using the focused ion beam subsystem and/or the machine cut
Set and the region in the sample in addition to the first area handled so that the first area exposure or will be sudden and violent
Dew；The 3-D image of treated sample is obtained by the micro-CT subsystem；Treated the three of sample based on described
Dimension image carries out navigation amendment to the first area, obtains second area；Determine the location information of the second area for institute
State the location information of target area.As shown in Figure 3 310 are target area.As shown in Figure 4 410 are target area, and 411 are
Region above target area 410 need to cut off region 411, to be scanned into using SEM to target area 410
Picture.
In this way, carrying out navigation amendment, energy to the first area by the 3-D image based on sample after treatment
The amendment of navigation picture deviation caused by the deformation and displacement of target area, less to target area when enough realizations handle sample
The destruction in domain, and then improve the precision for obtaining the 3-D image of target area.
Step S103 is filled based on the location information using the focused ion beam subsystem and/or the machine cut
It sets and the sample is repeatedly handled, so that the object section exposure of the target area.
In some embodiments, using the focused ion beam subsystem or the mechanical cutting device to the sample
Target area carries out tomography cutting, obtains first object section；The 1st of the first object section the is obtained using the SEM
Tie up image；Tomography is carried out to the target area of the sample using the focused ion beam subsystem or the mechanical cutting device
Cutting, obtains the second object section；The second two dimensional image of second object section is obtained using the SEM；And so on,
Until completing to the imaging of the target area of the sample, the two dimensional image of multiple object sections of the sample is obtained.
Step S104 obtains the two dimensional image for repeatedly handling obtained multiple object sections.
In some embodiments, using the focused ion beam subsystem or the mechanical cutting device to the sample
Target area carries out tomography cutting, obtains first object section；The 1st of the first object section the is obtained using the SEM
Tie up image；Tomography is carried out to the target area of the sample using the focused ion beam subsystem or the mechanical cutting device
Cutting, obtains the second object section；The second two dimensional image of second object section is obtained using the SEM；And so on,
Until completing to the imaging of the target area of the sample, the two dimensional image of multiple object sections of the sample is obtained.
As shown in Figure 5 511 be the sample area comprising target area, and 512 be the two dimensional image of multiple object sections.
Step S105 carries out three-dimensionalreconstruction to the two dimensional image of acquisition, obtains the 3-D image of the target area.
In some optional embodiments, the processor of imaging system carries out Three-dimensional Gravity to a series of two dimensional images of acquisition
Structure obtains the 3-D image of the target area, obtained 3-D image, and as shown in FIG. 6 612.
The above, only the specific implementation mode of the utility model, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (7)
1. a kind of imaging system, which is characterized in that the system comprises: Fiber electron computed tomography micro-CT subsystem
System, sample processing subsystem and scanning electron microscope SEM and processor；Wherein,
The micro-CT subsystem includes: x-ray source and X-ray detector, for obtaining the 3-D image of sample；
The sample processing subsystem includes: focused ion beam subsystem and mechanical cutting device；The focused ion beam subsystem
System the sample is handled with the first processing method, the mechanical cutting device with the second processing method to the sample into
Row processing, obtains the object section of target area；
The SEM, positioned at the top of the sample, for obtaining the two dimensional image of the object section；
The processor obtains the three-dimensional imaging of the sample for carrying out three-dimensionalreconstruction to the two dimensional image.
2. imaging system according to claim 1, which is characterized in that the processor is also used to determine the three-dimensional figure
The location information of the first area of picture and the first area；
The focused ion beam subsystem and/or the mechanical cutting device, be also used to in the sample remove firstth area
Region other than domain is handled, so that the first area is exposed or will expose；
The micro-CT subsystem is also used to obtain the 3-D image of treated sample；
The processor is also used to the 3-D image based on treated the sample and carries out navigation to the first area repair
Just, second area is obtained, and determines that the location information of the second area is the location information of the target area；The target
The location information in region is handled the sample for the sample processing subsystem.
3. imaging system as claimed in claim 1 or 2, which is characterized in that the sample is set on sample stage, the sample
Platform is able to carry out the movement of five degree of freedom.
4. imaging system as claimed in claim 1 or 2, which is characterized in that the axis of the focused ion beam subsystem and institute
Stating the angle between the vertical direction of sample is θ, 0≤θ≤180 °.
5. imaging system as claimed in claim 1 or 2, which is characterized in that the mechanical cutting device are as follows:
Glass cutter, stainless steel knife, diamond cutter or microtome.
6. imaging system as claimed in claim 1 or 2, which is characterized in that the SEM further include: energy disperse spectroscopy EDS, the EDS
It is scanned for the surface to the sample, obtains the energy spectrum diagram of the sample.
7. imaging system as claimed in claim 1 or 2, which is characterized in that the x-ray source, the X-ray detector and institute
It states sample to be set on same straight line, and the x-ray source and the X-ray detector are located at the two of the sample
Side.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821196445.1U CN208420756U (en) | 2018-07-26 | 2018-07-26 | A kind of imaging system |
| US17/052,900 US11598732B2 (en) | 2018-07-26 | 2018-09-03 | Imaging system and method for specimen detection |
| PCT/CN2018/103852 WO2020019409A1 (en) | 2018-07-26 | 2018-09-03 | Imaging system and method for specimen detection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821196445.1U CN208420756U (en) | 2018-07-26 | 2018-07-26 | A kind of imaging system |
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| CN208420756U true CN208420756U (en) | 2019-01-22 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109142399A (en) * | 2018-07-26 | 2019-01-04 | 聚束科技（北京）有限公司 | A kind of imaging system and sample detection method |
| CN109709116A (en) * | 2018-11-23 | 2019-05-03 | 中国石油天然气股份有限公司 | Stepping rotating sample table, and micro-particle three-dimensional surface imaging method and system |
-
2018
- 2018-07-26 CN CN201821196445.1U patent/CN208420756U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109142399A (en) * | 2018-07-26 | 2019-01-04 | 聚束科技（北京）有限公司 | A kind of imaging system and sample detection method |
| CN109709116A (en) * | 2018-11-23 | 2019-05-03 | 中国石油天然气股份有限公司 | Stepping rotating sample table, and micro-particle three-dimensional surface imaging method and system |
| CN109709116B (en) * | 2018-11-23 | 2021-11-02 | 中国石油天然气股份有限公司 | Stepping rotating sample table, and micro-particle three-dimensional surface imaging method and system |
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