CN208391274U - It is a kind of can be to the silicon chip cutter installing mechanism that levelness is adjusted - Google Patents

Abstract

The utility model discloses one kind can be to the silicon chip cutter installing mechanism that levelness is adjusted, including station, fixinig plate, laser generator, high pressure blower, tuyere, angular wheel, dust-exhausting port, rotating barrier, connecting plate and handle, the top of the station is equipped with rotary shaft on one side, and the upper end of rotary shaft is provided with horn, the fixinig plate is mounted on the top of horn, and one end of fixinig plate is connected with telescopic arm, the laser generator is mounted on the lower end of fixinig plate, the upper end of rotary shaft is arranged in the high pressure blower, the tuyere is mounted on one end of wind conveying pipe, the angular wheel is mounted on the lower end of rotary shaft.This can be provided with horn with installing mechanism to the silicon chip cutter that levelness is adjusted and can be moved left and right on station by servo motor, facilitate the specific location according to the flexible moving cutting device of use demand, be conducive to more efficiently save trouble will need the silicon wafer processed to cut.

Description

It is a kind of can be to the silicon chip cutter installing mechanism that levelness is adjusted

Technical field

The utility model relates to silicon wafer cutting device technical fields, and specially one kind can be to the silicon wafer that levelness is adjusted Cutting machine installing mechanism.

Background technique

The earth is the home that we depend on for existence, and the earth provides various resources for us, for our science and technology Progress provides very big help, element silicon of the content up to 25.8% in the earth's crust, for monocrystalline silicon production provide it is inexhaustible Source, element silicon are indispensable important materials for solar battery is destined in this way into the product of mass market Matter, therefore occur a large amount of silicon wafer device on the market wherein just comprising silicon wafer cutting device, with the development of science and technology, silicon wafer Cutting machine installing mechanism, which has, significantly to be developed, its development brings great convenience when processing silicon wafer to people. Although silicon chip cutter installing mechanism type and quantity currently on the market are very more, most of silicon chip cutter is used Installing mechanism use is simultaneously not flexible, cannot be moved and be adjusted according to demand using angle, generated during cutting Impurity can not be more laborsaving cleaning, the fixation silicon to be cut which cannot more consolidate during cutting Piece, this is significantly limited can be to the use scope for the silicon chip cutter installing mechanism that levelness is adjusted.

Utility model content

The purpose of this utility model is to provide it is a kind of can to the silicon chip cutter installing mechanism that levelness is adjusted, It is used with installing mechanism and not flexible with solving the silicon chip cutter currently on the market that above-mentioned background technique proposes, it cannot basis Demand is moved and is adjusted using angle, and what the impurity which generates during cutting can not be more laborsaving is clear Reason, what cannot more be consolidated during cutting goes the problem of fixing silicon wafer to be cut.

To achieve the above object, the utility model provides the following technical solutions: one kind can be to the silicon that levelness is adjusted Piece cutting machine installing mechanism, including station, fixinig plate, laser generator, high pressure blower, tuyere, angular wheel, dust discharge Mouth, rotating barrier, connecting plate and handle, the top of the station are equipped with rotary shaft, and the upper end setting of rotary shaft on one side There is horn, the fixinig plate is mounted on the top of horn, and one end of fixinig plate is connected with telescopic arm, the laser generator peace The bottom of the lower end of fixinig plate, and laser generator is provided with laser scribing, rotary shaft is arranged in the high pressure blower Upper end, and wind conveying pipe is connected at the top of high pressure blower, the tuyere is mounted on one end of wind conveying pipe, the angular wheel installation In the lower end of rotary shaft, and screw rod is connected in angular wheel, one end of the screw rod is provided with servo motor, the dust-exhausting port It being mounted on the side of rotary shaft, and the bottom of dust-exhausting port is connected with glove compartment, the rotating barrier is mounted on the side of station, And telescopic rod is connected on one end body wall of station, one end of the telescopic rod is connected with connecting plate, sets on the connecting plate There is screw, and the bottom of screw is provided with fixed block, the handle is mounted on the side of horn.

Preferably, it constitutes and is slidably connected between the station and horn, and the maximum sliding distance of horn is no more than behaviour Make the length of platform.

Preferably, the horn, which passes through, constitutes rotational structure between rotary shaft and station, and the rotation angle of horn Range is 0-360 °.

Preferably, there are two the fixinig plate settings, and stretching structure is constituted by telescopic arm between fixinig plate, and solid The maximal dilation distance of stator is no more than itself collapsing length of telescopic arm.

Preferably, stretching structure is constituted between the telescopic rod and connecting plate, and the maximal dilation distance of connecting plate does not surpass Cross the flexible length of telescopic rod itself.

Preferably, there are four the connecting plate settings, and each connecting plate is one group, and two groups of connecting plates are with station Centered on be symmetrically mounted on the two sides of station.

Compared with prior art, the utility model has the beneficial effects that this can cut the silicon wafer that levelness is adjusted Machine installing mechanism:

1. being provided with horn can be moved left and right on station by servo motor, facilitate flexible according to use demand Moving cutting device specific location, be conducive to more efficiently to save trouble will need the silicon wafer processed to cut；

2. 0-360 ° of angular adjustment can be carried out by rotary shaft on station by being provided with horn, facilitate according to different Using the position of angular adjustment cutter device, while also facilitating and cutter device is transferred to other angles, does not influence folding and unfolding needs The silicon wafer of cutting, will not accidentally injure user of service, and safety coefficient is high；

3. being provided with the miscellaneous dirt generated when high pressure blower works to cutting machine to clear up, silicon wafer when keeping cutting silicon wafer Neatly；

4. telescopic rod drives connecting plate to be stretched by flexible, facilitate according to different size of silicon wafer by being telescopically connected to Strip is moved fixed block and is fixed, it is ensured that silicon wafer will not fall off when cutting, while will not damage silicon wafer；

5. 0-90 ° of angular adjustment can be carried out by being provided with rotating barrier and station, convenient to hinder the object of cutting Anti-dropout is blocked, while the impurity that can be stopped in cutting process collapses out.

Detailed description of the invention

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model station the schematic diagram of the section structure；

Fig. 3 is the utility model fixed-block-architecture (FBA) schematic diagram.

In figure: 1 station, 2, rotary shaft, 3, horn, 4, fixinig plate, 5, telescopic arm, 6, laser generator, 7, laser scribing Piece, 8, high pressure blower, 9, wind conveying pipe, 10, tuyere, 11, angular wheel, 12, screw rod, 13, servo motor, 14, dust-exhausting port, 15, Glove compartment, 16, rotating barrier, 17, telescopic rod, 18, connecting plate, 19, screw, 20, fixed block, 21, handle.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: one kind can cut the silicon wafer that levelness is adjusted Cutting mill installing mechanism, including station 1, rotary shaft 2, horn 3, fixinig plate 4, telescopic arm 5, laser generator 6, laser scribing 7, high pressure blower 8, wind conveying pipe 9, tuyere 10, angular wheel 11, screw rod 12, servo motor 13, dust-exhausting port 14, glove compartment 15, rotation Turn partition 16, telescopic rod 17, connecting plate 18, screw 19, fixed block 20 and handle 21, the top of station 1 is equipped with rotation on one side Shaft 2, and the upper end of rotary shaft 2 is provided with horn 3, constitutes and is slidably connected between station 1 and horn 3, and the maximum of horn 3 Sliding distance is no more than the length of station 1, and horn 3 drives angular wheel 11 to be moved left and right by servo motor 13, side Just it is moved according to mobile 3 pairs of horn is different using position, use is more flexible, saves manpower, and horn 3 passes through rotary shaft Rotational structure is constituted between 2 and station 1, and the range of the rotation angle of horn 3 is 0-360 °, it is convenient to pass through rotation horn 3 It adjusts the cutting that angle carries out different angle, while horn 3 can also be removed facilitate pickup when placing and taking out silicon wafer, Gu Stator 4 is mounted on the top of horn 3, and one end of fixinig plate 4 is connected with telescopic arm 5, and there are two the settings of fixinig plate 4, and fixed Stretching structure is constituted by telescopic arm 5 between piece 4, and the maximal dilation distance of fixinig plate 4 is no more than itself stretching for telescopic arm 5 Contracting length, the convenient position that laser scribing 7 is adjusted by stretching, is adjusted, using flexible for different cutting demands Manpower is saved, laser generator 6 is mounted on the lower end of fixinig plate 4, and the bottom of laser generator 6 is provided with laser scribing 7, high The upper end of rotary shaft 2 is arranged in pressure fan 8, and the top of high pressure blower 8 is connected with wind conveying pipe 9, and tuyere 10 is mounted on wind conveying pipe 9 One end, angular wheel 11 is mounted on the lower end of rotary shaft 2, and screw rod 12 is connected in angular wheel 11, one end of screw rod 12 It is provided with servo motor 13, dust-exhausting port 14 is mounted on the side of rotary shaft 2, and the bottom of dust-exhausting port 14 is connected with glove compartment 15, Rotating barrier 16 is mounted on the side of station 1, and telescopic rod 17 is connected on one end body wall of station 1, telescopic rod 17 with Stretching structure is constituted between connecting plate 18, and the maximal dilation distance of connecting plate 18 is no more than the length that telescopic rod 17 itself stretches Degree facilitates and drives fixed block 20 to be fixed by being telescopically connected to plate 18 according to different size of silicon wafer, it is ensured that when cutting Silicon wafer will not fall off, while will not damage silicon wafer, and one end of telescopic rod 17 is connected with connecting plate 18, and connecting plate 18 is provided with four It is a, and every 2 connecting plates 18 are one group, and two groups of connecting plates 18 are symmetrically mounted on station 1 centered on station 1 Two sides, convenient preferably to fix silicon wafer to be cut, the position accurately cut prevents cutting from making mistakes and wastes material, and connects Plate 18 is equipped with screw 19, and the bottom of screw 19 is provided with fixed block 20, and handle 21 is mounted on the side of horn 3.

Working principle: when can be to the silicon chip cutter installing mechanism that levelness is adjusted using this, it is necessary first to One simple understanding can be carried out with installing mechanism to the silicon chip cutter that levelness is adjusted to this, by silicon to be cut Piece is placed on the table top of station 1, drives connecting plate 18 that length is adjusted according to different silicon wafers using telescopic rod 17 is flexible Degree, rotary screw 19 drive fixed block 20 that silicon wafer is fixed, and pull rotary shaft 2 that horn 3 is driven to carry out angle by handle 21 Degree is adjusted, and rotating barrier 16 is rotated 0-90 ° of progress barrier, the length for driving 4 telescopic adjustment of fixinig plate to need using telescopic arm 5 Degree, then drive screw rod 12 to rotate by servo motor 13, angular wheel 11 drives horn 3 to be controlled under the action of screw rod 12 Mobile adjustment position, starts laser generator 6 by power supply (being not drawn into figure) and laser scribing 7 is driven to work, start high-pressure blast Wind is transmitted air inlet mouth 10 from wind conveying pipe 9 by machine 8, and miscellaneous dirt is blown into dust-exhausting port 14 by tuyere 10, and miscellaneous dirt enters sundries by dust-exhausting port 14 Case 15, the content being not described in detail in this explanation belong to the prior art well known to professional and technical personnel in the field.

Although the utility model is described in detail with reference to the foregoing embodiments, come for those skilled in the art Say, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic into Row equivalent replacement, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on should all It is included within the scope of protection of this utility model.

Claims (6)

1. one kind can be to the silicon chip cutter installing mechanism that levelness is adjusted, including station (1), fixinig plate (4), swashs Photoproduction grows up to be a useful person (6), high pressure blower (8), tuyere (10), angular wheel (11), dust-exhausting port (14), rotating barrier (16), connecting plate (18) and handle (21), it is characterised in that: the top of the station (1) is equipped with rotary shaft (2) on one side, and rotary shaft (2) Upper end be provided with horn (3), the fixinig plate (4) is mounted on the top of horn (3), and one end of fixinig plate (4) is connected with Telescopic arm (5), the laser generator (6) is mounted on the lower end of fixinig plate (4), and the bottom of laser generator (6) is provided with Laser scribing (7), high pressure blower (8) setting are connected with defeated in the upper end of rotary shaft (2), and at the top of high pressure blower (8) Air hose (9), the tuyere (10) are mounted on one end of wind conveying pipe (9), and the angular wheel (11) is mounted under rotary shaft (2) End, and be connected with screw rod (12) in angular wheel (11), one end of the screw rod (12) is provided with servo motor (13), the row Dirt mouth (14) is mounted on the side of rotary shaft (2), and the bottom of dust-exhausting port (14) is connected with glove compartment (15), the rotating barrier (16) it is mounted on the side of station (1), and is connected with telescopic rod (17), the telescopic rod on one end body wall of station (1) (17) one end is connected with connecting plate (18), and the connecting plate (18) is equipped with screw (19), and the bottom setting of screw (19) Have fixed block (20), the handle (21) is mounted on the side of horn (3).

2. one kind according to claim 1 can be to the silicon chip cutter installing mechanism that levelness is adjusted, feature It is: constitutes and be slidably connected between the station (1) and horn (3), and the maximum sliding distance of horn (3) is no more than operation The length of platform (1).

3. one kind according to claim 1 can be to the silicon chip cutter installing mechanism that levelness is adjusted, feature Be: the horn (3) is by constituting rotational structure, and the rotation angle of horn (3) between rotary shaft (2) and station (1) Range be 0-360 °.

4. one kind according to claim 1 can be to the silicon chip cutter installing mechanism that levelness is adjusted, feature Be: there are two fixinig plate (4) settings, and constitutes stretching structure by telescopic arm (5) between fixinig plate (4), and solid The maximal dilation distance of stator (4) is no more than itself collapsing length of telescopic arm (5).

5. one kind according to claim 1 can be to the silicon chip cutter installing mechanism that levelness is adjusted, feature It is: constitutes stretching structure between the telescopic rod (17) and connecting plate (18), and the maximal dilation distance of connecting plate (18) is not The length stretched more than telescopic rod (17) itself.

6. one kind according to claim 1 can be to the silicon chip cutter installing mechanism that levelness is adjusted, feature Be: there are four connecting plate (18) settings, and every 2 connecting plates (18) are one group, and two groups of connecting plates (18) are to grasp Make the two sides that station (1) is symmetrically mounted on centered on platform (1).