CN208389928U - It can avoid the electroplate liquid agitator of plating particle deposition - Google Patents
It can avoid the electroplate liquid agitator of plating particle deposition Download PDFInfo
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- CN208389928U CN208389928U CN201820582297.0U CN201820582297U CN208389928U CN 208389928 U CN208389928 U CN 208389928U CN 201820582297 U CN201820582297 U CN 201820582297U CN 208389928 U CN208389928 U CN 208389928U
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- wall
- electroplate liquid
- particle deposition
- barrel
- guide vane
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Abstract
The utility model discloses a kind of for can avoid the electroplate liquid agitator of plating particle deposition; belong to technical field of metallurgical equipment; including staving, bung, the rabbling mechanism being mounted on bung; inner wall of barrel is equipped with guide vane; guide vane and inner wall of barrel have the flow guiding slit of 2mm, and parcel plating particle can continue to flow by the flow guiding slit between guide vane and inner wall of barrel.Electroplate liquid stirring barrel structure is simple, under the stirring action of agitating shaft and impeller, cooperates improved guide vane, significantly improves mixing effect, stir evenly, provides good precondition for subsequent electroplating technology.
Description
Technical field
The utility model belongs to technical field of metallurgical equipment, is related to the agitator for stirring electroplate liquid, and in particular to one
Kind inner wall of barrel is equipped with the electroplate liquid agitator of guide vane.
Background technique
Currently, agitator used by plating production industry is fairly simple.Part agitator is only having for an inner wall smooth
Machine glass cylinder, under the action of stirring rod, electroplate liquid can form a big tapered vortex in bucket, seriously affect electroplate liquid
The uniformity coefficient of interior plating particle；It is dispersed with baffle on the agitator inner wall of part, the mixing effect of the agitator is centainly changed
It is kind, but when electroplate liquid is got on baffle, some plating particle is understood by baffle and blocks whereabouts accumulation, influences plating in bucket
The uniformity and utilization rate of grain.Existing old-fashioned agitator, bucket wall are smooth inner wall, and bucket Internal baffle is bonded nothing with bucket inner wall completely
Gap, by centrifugal forces affect, plating particle is more in periphery distribution, and inner ring is less, leads to that particulate matter quilt is electroplated in whipping process
Guide vane blocking sinks to a barrel bottom, depositional phenomenon occurs, influences the uniformity coefficient that particle is electroplated in bucket in electroplate liquid.Part is stirred
It mixes and auger mechanism is installed in bucket, mixing uniformity is preferable, but its spiral or double helix agitating shaft processing cost are higher, to stirring
The material for mixing axis has certain limitation, mostly metal material, and the processing of non-metallic material is more difficult, and yield rate is lower.
Summary of the invention
In view of the deficiencies of the prior art, plating particulate matter deposition is prevented the purpose of this utility model is to provide one kind and stir
Mix uniform electroplate liquid agitator.
To achieve the above object, the technical solution of the utility model is: can avoid the electroplate liquid stirring of plating particle deposition
Bucket, including staving, bung, the rabbling mechanism being mounted on bung, key is circumferentially there is water conservancy diversion along the inner wall of barrel
Blade, there are flow guiding slit, guide vane and rabbling mechanisms to cooperate between guide vane and inner wall of barrel, and formation blocks, holds in the palm liter, divides
The homogeneous texture of galvanic electricity plating particulate matter.
The guide vane being mounted vertically on inner wall of barrel, can to particulate matter formed block, make its upwards, inner ring return
Bullet, while partial particulate sinks to a barrel bottom by guide vane blocking, depositional phenomenon occurs, influences the concentration of whole solution in bucket；
And flow guiding slit is flowed out in guide vane and bucket inner wall, electroplate liquid particle can be made to continue to flow by flow guiding slit, avoid depositing, made
Electroplate liquid distribution of particles more evenly, improves the utilization rate of electroplating solution.
Further, the guide vane is uniformly distributed along inner wall of barrel, is provided with 2~8.Vertical place is conducive to electricity
Plating solution particle passes through flow guiding slit, and mobility is more preferable, in order to enhance eddy flow effect, is generally arranged 2~8, is preferably provided with 4.
Further, the shape of the guide vane is concave, is bonded in inner wall of barrel by the protrusion at its both ends
On, flow guiding slit is formed between the middle part and inner wall of barrel of concave guide vane, is passed through convenient for electroplate liquid and its particle.
Further, the guide vane is fixed on the mounting plate of inner wall of barrel by screw, and mounting plate is bonded in bucket
On internal wall, there are flow guiding slit between guide vane and inner wall of barrel, the shape of guide vane is the rectangle of rule, is above provided with
Elongated slot mounting hole, the width of flow guiding slit is adjusted by elongated slot mounting hole, and such fixed form is worn or damaged convenient for guide vane
Installation and replacement afterwards.
Further, the width of the flow guiding slit between the guide vane and inner wall of barrel is general are as follows: 1.5~3mm, it is preferably wide
Degree are as follows: 2mm.
Further, the rabbling mechanism includes the electric machine support being mounted on bung, stirring motor, agitating shaft, leaf
Wheel, stirring motor stands upside down vertically to be mounted on electric machine support, and one end of the mixing shaft passes through one group of locking screw, nut and motor shaft
Connection, the other end are connect with impeller by two groups of backing-up screws by passing through in bung insertion staving.
Further, the impeller is prismatic blade formula, and all blades are in the same plane.Impeller outer diameter accounts for staving internal diameter
2/3.
Further, the material of the staving and guide vane is transparent glass, relatively smooth using such material,
It is convenient to clean electroplating solution, the service condition of electroplating solution can be observed, carries out fluid infusion operation in time.
Further, the agitator lateral wall is equipped with liquid outlet, and liquid outlet with respect to the horizontal plane tilts 8~12 upwards
Degree prevents plating particulate matter in the deposition clogging of liquid outlet.
The beneficial effects of the utility model are: structure is simple, under the stirring action of agitating shaft and impeller, cooperate improved
Guide vane significantly improves mixing effect, stirs evenly, and provides good precondition for subsequent electroplating technology.It is comprehensive
Upper described, the electroplate liquid agitator is stable and reliable in work, not only meets Functional Requirement, but also reduce production cost.
The utility model is described in detail with reference to the accompanying drawing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model embodiment one；
Fig. 2 is the scheme of installation of guide vane and mounting plate；
Fig. 3 is the scheme of installation of the guide vane of embodiment two；
In attached drawing: 1 is staving, and 2 be bung, and 3 be rabbling mechanism, and 1-1 is guide vane, and 1-2 is mounting plate, and 1-3 is anti-
Loose screw, 1-4 are liquid outlets, and 3-1 is stirring motor, and 3-2 is electric machine support, and 3-3 is agitating shaft, and 3-4 is nut, and 3-3-1 is
Impeller.
Specific embodiment
Embodiment one is described further the utility model in conjunction with attached drawing 1, attached drawing 2.
The electroplate liquid agitator that can avoid plating particle deposition, including staving 1, bung 2, the stirring being mounted on bung 2
Mechanism 3,1 inner wall of staving are bonded with mounting plate 1-2, and elongated slot mounting hole and 1 inner wall upper mounting plate of staving are provided on guide vane 1-1
Threaded hole screw connection on 1-2, can adjust the water conservancy diversion of itself and 1 inner wall of staving during installation by elongated slot mounting hole
The width of seam, the width of flow guiding slit in the present embodiment are as follows: 2mm, so that parcel plating liquid and non-molten plating particle pass through.Blender
Structure 3 includes stirring motor 3-1, electric machine support 3-2, agitating shaft 3-3 and the impeller 3-3-1 being mounted on agitating shaft.Stirring motor
3-1 is stood upside down vertically on the electric machine support 3-2 being mounted on bung 2, and the one end agitating shaft 3-3 passes through one group of locking screw 1-
3, nut 3-4 is connect with stirring motor 3-1, and the other end passes through two groups of backing-up screws with impeller 3-3-1 by being inserted into bucket outside staving
1-3 connection.1 lateral wall of staving is equipped with liquid outlet 1-4, and liquid outlet 1-4 relative level tilts upwardly 8~12 degree, the blender
Structure 3 and liquid outlet 1-4 are constantly in working condition, not only ensure that the uniformity of the solution in liquid outlet discharge in bucket, but also prevent
The deposition clogging of plating particulate matter here.
When specifically used, stirring motor 3-1 is started, the electroplate liquid and non-molten plating particle in staving 1 are in stirring motor 3-1
Drive under start to flow, under the action of guide vane 1-1, electroplate liquid forms more stable flowing in staving 1,
There is not tapered vortex；Parcel plating particle is blocked when encountering guide vane 1-1 and revolution of sinking, another part then can
Continue to flow by the flow guiding slit between 1 inner wall of guide vane 1-1 and staving.It both ensure that the uniformity of whole solution in this way,
In turn avoid the depositional phenomenon that falls after plating particle is blocked by vertical guide vane 1-1.
Embodiment two is described further the example of the utility model in conjunction with attached drawing 3.
What is different from the first embodiment is that the shape of guide vane 1-1 are as follows: U shape is bonded by the protrusion at its both ends
On 1 inner wall of staving, flow guiding slit is formed between 1 inner wall of guide vane 1-1 and staving, for parcel plating liquid and plating particle
Pass through.
Claims (10)
1. can avoid the electroplate liquid agitator of plating particle deposition, including staving (1), stirring bung (2), be mounted on bung
Mechanism (3), it is characterised in that along the staving (1), inner wall is distributed with vertical guide vane (1-1), guide vane (1-1) with
There are flow guiding slit between inner wall of barrel, guide vane (1-1) and rabbling mechanism (3) cooperatively form and block, hold in the palm liter, shunt plating
The homogeneous texture of grain object.
2. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: described is perpendicular
To guide vane (1-1) circumferentially, be provided with 2~8 along staving (1) inner wall.
3. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: the water conservancy diversion
Blade (1-1) is fixed on the mounting plate (1-2) of inner wall of barrel by screw (1-3), and mounting plate (1-2) is bonded in inner wall of barrel
On.
4. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: the water conservancy diversion
Blade (1-1) is bonded on inner wall of barrel by the protrusion at its both ends, forms flow guiding slit between middle part and inner wall of barrel.
5. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: the water conservancy diversion
Flow guiding slit width between blade (1-1) and inner wall of barrel is 1.5~3mm.
6. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: the stirring
Mechanism (3) includes matched stirring motor (3-1), the electric machine support (3-2) being mounted on bung and impeller (3-3-1) is housed
Agitating shaft (3-3), the motor axis connection of agitating shaft one end (3-3) and stirring motor (3-1), the other end across bung (2) insert
Enter and is connect in staving with impeller (3-3-1).
7. the electroplate liquid agitator of avoidable plating particle deposition according to claim 6, it is characterised in that: the leaf
Taking turns (3-3-1) is prismatic blade formula, and all blades are in the same plane.
8. the electroplate liquid agitator of avoidable plating particle deposition according to claim 6, it is characterised in that: the leaf
Wheel (3-3-1) outer diameter accounts for the 2/3 of staving (1) internal diameter.
9. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: the bucket
The material of body (1) is transparent glass.
10. the electroplate liquid agitator of avoidable plating particle deposition according to claim 1, it is characterised in that: described
Staving lateral wall is equipped with liquid outlet (1-4), and liquid outlet relative level tilts upwardly 8~12 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820582297.0U CN208389928U (en) | 2018-04-23 | 2018-04-23 | It can avoid the electroplate liquid agitator of plating particle deposition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820582297.0U CN208389928U (en) | 2018-04-23 | 2018-04-23 | It can avoid the electroplate liquid agitator of plating particle deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208389928U true CN208389928U (en) | 2019-01-18 |
Family
ID=65061726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820582297.0U Active CN208389928U (en) | 2018-04-23 | 2018-04-23 | It can avoid the electroplate liquid agitator of plating particle deposition |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208389928U (en) |
-
2018
- 2018-04-23 CN CN201820582297.0U patent/CN208389928U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 050035 Xiangjiang Road 209, Shijiazhuang High-tech Zone, Hebei Province Patentee after: Hebei Huijin Group Co.,Ltd. Address before: 050035 Xiangjiang Road 209, Shijiazhuang High-tech Zone, Hebei Province Patentee before: HEBEI HUIJIN ELECTROMECHANICAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |