CN208385112U - The noninductive power resistor of strong pressure resistance thick film - Google Patents
The noninductive power resistor of strong pressure resistance thick film Download PDFInfo
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- CN208385112U CN208385112U CN201820820066.9U CN201820820066U CN208385112U CN 208385112 U CN208385112 U CN 208385112U CN 201820820066 U CN201820820066 U CN 201820820066U CN 208385112 U CN208385112 U CN 208385112U
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- China
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- thick film
- resistive layer
- pin electrode
- power resistor
- porcelain
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Abstract
The utility model discloses a kind of noninductive power resistors of strong pressure-resistant thick film, the resistance includes porcelain substrate, shell, thick film resistive layer is printed on the porcelain substrate, the porcelain substrate is installed on lower part of the housing, the porcelain base lower surface is flushed with housing lower surface, the porcelain upper surface of base plate is equipped with pin electrode, there are two the pin electrode is set, on the thick film resistive layer printing porcelain substrate, and thick film resistive layer is between pin electrode, the thick film resistive layer both ends are connect with pin electrode, the thick film resistive layer upper surface is coated with insulating layer, grafting pin is welded on the pin electrode, grafting pin passes through shell for being plugged into circuit board, matcoveredn is also smeared on the porcelain substrate, the protective layer covers pin electrode, thick film resistive layer and insulating layer.
Description
Technical field
The utility model relates to technical field of electronic components more particularly to the passive electric discharges of new-energy automobile electric drive control
Resistance.
Background technique
Currently, the passive discharge resistance of internal controller uses 10W aluminum hull in existing new-energy automobile electric drive design
Wire-wound resistor, the receiving voltage class of resistance in 400V hereinafter, gold aluminum casing resistor RX24-10W for example on the market, but this
The superimposed voltage that quasi-resistance volume is big, inductance generates in resistance wire when having inductance, especially high resistant in design leads to overtension
It is easy the defect blown.
Utility model content
Shortcoming present in view of the above technology, the utility model provide a kind of strong pressure-resistant thick film small in size noninductive function
Rate resistor.
Another of the utility model is designed to provide a kind of strong pressure-resistant noninductive power resistor of thick film, the resistor at
This is low, easy to process, and flatness is high, and processing flow is few, easy to maintain, easy to spread.
To achieve the above object, the utility model provides strong pressure-resistant thick film noninductive power resistor, which includes porcelain
Substrate, shell, are printed with thick film resistive layer on the porcelain substrate, and the porcelain substrate is installed on lower part of the housing, under the porcelain substrate
Surface is flushed with housing lower surface, and the porcelain upper surface of base plate is equipped with pin electrode, there are two the pin electrode is set, the thickness
Film resistive layer prints on porcelain substrate, and thick film resistive layer, between pin electrode, resistive layer is printed in resistance thick film, described
Thick film resistive layer both ends are connect with pin electrode, and the thick film resistive layer upper surface is coated with insulating layer, are welded on the pin electrode
It is connected to grafting pin, grafting pin passes through shell for being plugged into circuit board, also smears matcoveredn on the porcelain substrate, institute
State protective layer covering pin electrode, thick film resistive layer and insulating layer.
By being equipped with pin electrode in porcelain substrate, thick film resistive layer is printed to porcelain substrate, is printed in thick film resistive layer
There is insulating layer, forms noninductive thick-film resistor, it is small in size, not will form high voltage, porcelain base lower surface and shell in high resistance
Lower surface, which flushes, to be easily installed to radiating on radiator, and resistance to pressure is strong, when smearing matcoveredn and being buffered in injection casing
It expands with heat and contract with cold deformation, is installed and be easy using grafting pin.
Further, the thick film resistive layer is equipped with two, and two thick film resistive layers are arranged in parallel, and two thick film resistive layers
Parallel connection, the grafting pin welding ends is located between two resistive layers, and grafting pin welding ends is parallel with resistive layer.
It is arranged in parallel using two resistive layers, the power even distribution born can be made.
Further, the pin electrode is in T-shape, the setting of two strip electrode piece pin axial symmetry.
Further, grafting pin upper end is equipped with spliced eye, and the protective layer is coating silica gel.
Further, the left and right side of the shell is equipped with installation flank, the lower surface of the installation flank and housing lower surface
It flushes, the installation flank is equipped with mounting hole.
Further, the installation flank lower surface is equipped with precompensation protrusion.It is avoided using precompensation protrusion in injection-moulded housing
When entire bottom surface it is excessively smooth, cause both sides flank tilting cause out-of-flatness, housing lower surface can not be properly fit onto heat dissipation
On device.
Further, precompensation protrusion is located at installation flank half and to installation flank outer end extended position.
Further, the shell is molded using insulating resin material, and the housing upper surface, which is equipped with, reinforces raised line, is reinforced convex
Item is equipped with two and is arranged in X, and two reinforcement raised line infalls are equipped with round raised line.
Further, the porcelain substrate 1.0mm thickness, 20mm long, 14mm money, the porcelain substrate are alumina ceramics substrate.
The beneficial effects of the utility model are:
By being equipped with pin electrode in porcelain substrate, thick film resistive layer is printed to porcelain substrate, is printed in thick film resistive layer
There is insulating layer, forms noninductive thick-film resistor, it is small in size, not will form high voltage, porcelain base lower surface and shell in high resistance
Lower surface, which flushes, to be easily installed to radiating on radiator, and resistance to pressure is strong, when smearing matcoveredn and being buffered in injection casing
It expands with heat and contract with cold deformation, is installed and be easy using grafting pin.
Detailed description of the invention
Fig. 1 is the schematic diagram of the noninductive power resistor of strong pressure-resistant thick film of the utility model.
Fig. 2 is the schematic rear view of the noninductive power resistor of strong pressure-resistant thick film of the utility model.
Fig. 3 is the schematic diagram of resistance in the noninductive power resistor of strong pressure-resistant thick film of the utility model.
Fig. 4 is the porcelain substrate schematic diagram of the noninductive power resistor of strong pressure-resistant thick film of the utility model.
Fig. 5 illustrates to be printed with thick film resistive layer on the noninductive power resistor porcelain substrate of strong pressure-resistant thick film of the utility model
Figure.
Specific embodiment
In order to more clearly state the utility model, the utility model is further described with reference to the accompanying drawing.
Such as Fig. 1~5, the utility model noninductive power resistor of pressure-resistant thick film by force, which includes porcelain substrate 1, shell
2, porcelain substrate 1 is installed on 2 lower part of shell, and 1 lower surface of porcelain substrate is flushed with 2 lower surface of shell, and 1 upper surface of porcelain substrate is equipped with pin
Electrode 3 there are two pin electrode 3 is set, is coated with thick film resistive layer 11, and thick film resistive layer 11 is located at pin electrode 3 on porcelain substrate 1
Between, 11 both ends of thick film resistive layer are connect with pin electrode 3, and 11 upper surface of thick film resistive layer is coated with insulating layer 12, insulating layer 12
Common insulated paint and high-temperature insulating paint can be used, grafting pin 4 is welded on pin electrode 3, grafting pin 4 passes through shell
Body 2 also smears matcoveredn 5, protective layer 5 covers pin electrode 3, thick film resistive layer for being plugged into circuit board on porcelain substrate
11 and insulating layer 12.
Thick film resistive layer 11 is equipped with two, and two thick film resistive layers 11 are arranged in parallel, and two thick film resistive layers 11 pass through
Pin electrode 3 is in parallel, and 4 welding ends of grafting pin is located between two thick film resistive layers, and 4 welding ends of grafting pin and thick film electricity
Resistance layer 11 is parallel.Pin electrode 3 is in T-shape, and two pin electrode axis are symmetrical arranged, so that resistance volume is smaller.Grafting pin 4
Upper end, which is equipped with spliced eye 41, can be used for direct welding lead, and protective layer 5 is coating silica gel, hot in injection molding for bumper housing 2
Swollen shrinkage.The left and right side of shell 2 is equipped with installation flank 21, and the lower surface of installation flank 21 flushes with 2 lower surface of shell, installs
21 are equipped with fixation of the mounting hole 22 for screw or other fasteners on flank.
21 lower surface of flank is installed and is equipped with precompensation protrusion 23.The entire bottom in injection-moulded housing is avoided using precompensation protrusion
Face is excessively smooth, causes flank tilting in both sides to cause out-of-flatness, housing lower surface can not be properly fit on radiator.In advance
Compensation protrusion 23 be located at installation 21 half of flank and to installation flank outer end extended position.
Shell 2 is molded using insulating resin material, and 2 upper surface of shell, which is equipped with, reinforces raised line 24, is reinforced raised line 24 and is equipped with two
Item is simultaneously arranged in " X ", and two reinforcement 24 infalls of raised line are equipped with round raised line 25.
Porcelain substrate 1.0mm thickness, 20mm long, 14mm money, porcelain substrate are alumina ceramics substrate, pre-compensate for raised 23 thickness 0.005
~0.1mm.Resistance in the technical program can accomplish that 0.5 Ω -1M Ω, resistance can be carried out just in 25W power, temperature 50 C
Often work, dielectric withstanding voltage 3500VAC, maximum working voltage 1000VDC, precision 1%-10%.
The beneficial effects of the utility model are: thick film resistive layer is printed to porcelain base by being equipped with pin electrode in porcelain substrate
On plate, it is printed with insulating layer in thick film resistive layer, forms noninductive thick-film resistor, it is small in size, in high resistance not will form height
Voltage, porcelain base lower surface is flushed with housing lower surface to be easily installed to radiating on radiator, and resistance to pressure is strong, is coated with
Protective layer expands with heat and contract with cold deformation when being buffered in injection casing, is installed and is easy using grafting pin.
The preferred embodiment of the utility model is enumerated above, is not intended to limit the utility model, it is all practical new at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the protection of the utility model within the spirit and principle of type
Within the scope of.
Claims (9)
- The noninductive power resistor of the last 1. pressure resistance thick film, which includes porcelain substrate, shell, is printed with thick film on the porcelain substrate Resistive layer, the porcelain substrate are installed on lower part of the housing, and the porcelain base lower surface is flushed with housing lower surface, it is characterised in that institute Porcelain upper surface of base plate is stated equipped with pin electrode, there are two the pin electrode is set, the thick film resistive layer is printed on porcelain substrate, And thick film resistive layer, between pin electrode, the thick film resistive layer both ends are connect with pin electrode, the thick film resistive layer Upper surface is coated with insulating layer, and grafting pin is welded on the pin electrode, and grafting pin passes through shell for being plugged into circuit On plate, matcoveredn, the protective layer covering pin electrode, thick film resistive layer and insulating layer are also smeared on the porcelain substrate.
- 2. the noninductive power resistor of strong pressure-resistant thick film according to claim 1, it is characterised in that the thick film resistive layer is set There are two, two thick film resistive layers are arranged in parallel, and two thick film resistive layer parallel connections, and the grafting pin welding ends is located at two Between resistive layer, and grafting pin welding ends is parallel with resistive layer.
- 3. the noninductive power resistor of strong pressure-resistant thick film according to claim 2, it is characterised in that the pin electrode is in " T " Type, two pin electrode axis are symmetrical arranged.
- 4. the noninductive power resistor of strong pressure-resistant thick film according to claim 3, it is characterised in that grafting pin upper end Equipped with spliced eye, the protective layer is coating silica gel.
- 5. the noninductive power resistor of strong pressure-resistant thick film according to claim 1, it is characterised in that the left and right side of shell Equipped with installation flank, the lower surface of the installation flank is flushed with housing lower surface, and the installation flank is equipped with mounting hole.
- 6. the noninductive power resistor of strong pressure-resistant thick film according to claim 5, it is characterised in that the installation flank following table Face is equipped with precompensation protrusion.
- 7. the noninductive power resistor of strong pressure-resistant thick film according to claim 6, it is characterised in that the raised position of the precompensation In installation flank half and to installation flank outer end extended position.
- 8. the noninductive power resistor of strong pressure-resistant thick film according to claim 7, it is characterised in that the shell is using insulation Resin material injection molding, the housing upper surface, which is equipped with, reinforces raised line, reinforces raised line and is arranged equipped with two in X, two reinforcement raised lines Infall is equipped with round raised line.
- 9. the noninductive power resistor of strong pressure-resistant thick film according to claim 8, it is characterised in that the porcelain substrate 1.0mm Thickness, 20mm long, 14mm money, the porcelain substrate are alumina ceramics substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820820066.9U CN208385112U (en) | 2018-05-29 | 2018-05-29 | The noninductive power resistor of strong pressure resistance thick film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820820066.9U CN208385112U (en) | 2018-05-29 | 2018-05-29 | The noninductive power resistor of strong pressure resistance thick film |
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| Publication Number | Publication Date |
|---|---|
| CN208385112U true CN208385112U (en) | 2019-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820820066.9U Active CN208385112U (en) | 2018-05-29 | 2018-05-29 | The noninductive power resistor of strong pressure resistance thick film |
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| CN (1) | CN208385112U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112067931A (en) * | 2020-09-16 | 2020-12-11 | 中国电子科技集团公司第二十四研究所 | Thick film resistor reliability test structure and test method |
-
2018
- 2018-05-29 CN CN201820820066.9U patent/CN208385112U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112067931A (en) * | 2020-09-16 | 2020-12-11 | 中国电子科技集团公司第二十四研究所 | Thick film resistor reliability test structure and test method |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200429 Address after: 523000 Room 101, building 17, Lihe Bauhinia intelligent manufacturing center, No. 105, Qingbin East Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: GUANGDONG YIJIE TECHNOLOGY Co.,Ltd. Address before: 518000, 23 buildings, 5 and 6 buildings, Shenzhen science and Technology Industrial Park, Shenzhen, Guangdong Patentee before: EBG-SHENZHEN Co.,Ltd. |