CN208384184U - A kind of high power light module heat dissipation structure - Google Patents
A kind of high power light module heat dissipation structure Download PDFInfo
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- CN208384184U CN208384184U CN201821263170.9U CN201821263170U CN208384184U CN 208384184 U CN208384184 U CN 208384184U CN 201821263170 U CN201821263170 U CN 201821263170U CN 208384184 U CN208384184 U CN 208384184U
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- frame
- connection frame
- fixedly connected
- heat dissipation
- optical module
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Abstract
The utility model discloses a kind of high power light module heat dissipation structures, bottom case including top end opening, mainboard, optical module, radiating block, the upper casing being covered on bottom case be fixedly connected with frame, mainboard is fixed on the inside bottom of bottom case, optical module is installed on mainboard, the upper surface of optical module is affixed the lower end surface of connection radiating block, the upper surface of radiating block is abutted with the lower end surface of upper casing, the medial surface for being fixedly connected with frame is abutted with the side of optical module, the medial surface for being fixedly connected with frame is abutted with the side of radiating block, the side wall for being fixedly connected with frame is equipped with radiating fin, radiating fin is in array-like arrangement, the short side wall of bottom case is equipped with heat release hole, heat release hole is in array-like arrangement.Heat release hole, radiating fin and the heat release hole of the utility model setting can effectively radiate, and reduce optical mode deblocking temperature；It is fixedly connected with frame optical module and radiating block link into an integrated entity, can be used as standard component, process can be simplified, improve production efficiency.
Description
Technical field
The utility model belongs to technical field of heat dissipation, specifically, being a kind of high power light module heat dissipation structure.
Background technique
Currently, with being developed rapidly based on the network communication market that backbone network is optical fiber, the communication products speed such as light net
Leap is promoted, and especially along with the universal of 4K video, the application of technology of Internet of things, the low rates such as traditional fixed network terminal product is
It is not able to satisfy the demand that modern people pursue ultimate attainment experience, but with the promotion of speed, the increase of product function module, module function
Consumption also increases, this results in module heating serious, if not in time dispersed heat, to reduce module temperature, will seriously affect
Networking speed reduces product service life.
The heat dissipation of existing high power module device is generally dissipated using the combination of heat-conducting glue, cooling fin and heat-conducting silica gel sheet
Heat, this assembling operation is relatively complicated, increases working hour and process.
Utility model content
The purpose of this utility model is that in view of the above shortcomings of the prior art, a kind of high power light module device is provided
Radiator is fixedly connected after frame is fixedly connected with optical module and radiating block, can use as standard component, realize module metaplasia
It produces, simplifies process；Radiating fin is additionally provided in fixedly connected part, moreover it is possible to improve optical module radiating efficiency.
To solve the above problems, technical solution adopted in the utility model is:
A kind of high power light module heat dissipation structure, bottom case, mainboard, optical module, radiating block and lid including top end opening close
Upper casing on the bottom case, the mainboard are fixed on the inside bottom of the bottom case, and the optical module is installed on the mainboard
On, the upper surface of the optical module is affixed the lower end surface for connecting the radiating block, the upper surface of the radiating block and the upper casing
Lower end surface abut, further include being fixedly connected with frame, the medial surface for being fixedly connected with frame is abutted with the side of the optical module, institute
It states and is fixedly connected with the medial surface of frame and is abutted with the side of the radiating block, the side wall for being fixedly connected with frame is equipped with radiating fin, institute
It states radiating fin to be in array-like arrangement, the short side wall of the bottom case is equipped with heat release hole, and the heat release hole is in array-like arrangement.
Further technical solution is, the frame that is fixedly connected includes the first connection frame and the second connection frame, described the
One connection frame and second connection frame are flexibly connected.
Further technical solution is that one end of first connection frame is equipped with the first protrusion, and the other end is equipped with first
Groove；One end of second connection frame is equipped with the second protrusion corresponding with first groove, and the other end is equipped with and described the
One corresponding second groove of protrusion, second protrusion are connected together with first groove, second groove and described the
One protrusion is connected together.
Further technical solution is that one end of first connection frame is equipped with third protrusion, second connection frame
One end be equipped with third groove corresponding with the third protrusion, the third protrusion is connected together with the third groove, institute
The other end for stating the other end and second connection frame of the first connection frame is hinged.
Further technical solution is that one end of first connection frame is equipped with the 4th protrusion, second connection frame
The hinged flexible connection piece in one end, the connection sheet is equipped with through-hole, and the through-hole raised engages with the described 4th；Described first
The other end of connection frame and the other end of second connection frame are hinged.
Further technical solution is that the material for being fixedly connected with frame is the heat-conducting plastic of high conductance.
Further technical solution is that the radiating block is thermal conductivity foam.
The beneficial effects of adopting the technical scheme are that
(1) it is fixedly connected with the radiating fin that frame is equipped with, improves radiating efficiency；
(2) using optical module and radiating block after frame is fixed is fixedly connected with, it can be used as standard component, accomplish modularization
Installation, reduces flow chart and working hour, operation mode are simple；
(3) in this radiator structure, radiating block can transfer heat to shell and radiate, additionally it is possible to better solve
Ground connection, EMC problem avoid rigid substance contact optical module, cause optical module deformation impaired.
Generally speaking, the utility model combination product functional requirement, cleverly will be thermally conductive, conductive and filling wide arc gap melt for
One, optical module and resultant metal outer casing are linked together, while heat to be quickly transmitted to product casing heat dissipation,
Also it preferably allows system earth, solves the problems, such as EMC, while its unique structure can be to avoid the compressing for using rigid contact to generate
Power allows device to deform.While effectively heat dissipation, process can be simplified, improve production efficiency, it is easy to use, it is low in cost.
Detailed description of the invention
Fig. 1 is the utility model explosive view；
Fig. 2 is the first, is fixedly connected with frame schematic diagram for second；
Fig. 3 is that the first is fixedly connected with frame explosive view；
Fig. 4 is the schematic diagram that the third is fixedly connected with frame；
Fig. 5 is the 4th bump diagrams；
Fig. 6 is connection sheet schematic diagram.
In figure: 1- bottom case；2- optical module；3- radiating block；4- upper casing；5- is fixedly connected with frame；6- radiating fin；7- heat release hole；
The first connection frame of 8-；The second connection frame of 9-；The first protrusion of 10-；The first groove of 11-；12- mainboard；13- connection sheet；14- the 4th is convex
It rises；15- through-hole.
Specific embodiment
The embodiments of the present invention is described in further detail with reference to the accompanying drawings and examples.Following embodiment
For illustrating the utility model, but cannot be used to limit the scope of the utility model.
A kind of high power light module heat dissipation structure, bottom case 1, mainboard 12, optical module 2,3 and of radiating block including top end opening
The upper casing 4 being covered on the bottom case 1, the mainboard 12 are fixed on the inside bottom of the bottom case 1, and the optical module 2 is installed
In on the mainboard 12, the upper surface of the optical module 2 is affixed the lower end surface for connecting the radiating block 3, the radiating block 3 it is upper
End face is abutted with the lower end surface of the upper casing 4, and the radiating block 3 is thermal conductivity foam, and radiating block 3 can be rapidly by heat
It passes to shell to radiate, while also can preferably be grounded, solve the problems, such as that EMC, thermal conductivity foam can be to avoid rigid boards
Matter contacts optical module, causes optical module deformation impaired.The utility model further includes being fixedly connected with frame 5, the frame 5 that is fixedly connected
Medial surface is abutted with the side of the side of the optical module 2 and radiating block 3, and the side wall for being fixedly connected with frame 5 is equipped with radiating fin
6, the radiating fin 6 is in array-like arrangement, and the short side wall of the bottom case 1 is equipped with heat release hole 7, and the heat release hole 7 is in array-like
Arrangement, this symmetrically arranged radiating fin 6 and the second heat release hole 7 are more convenient for radiating.
The frame 5 that is fixedly connected is split type mechanism, and material is the heat-conducting plastic of high conductance, described to be fixedly connected with frame 5
Including the first connection frame 8 and the second connection frame 9, first connection frame 8 and second connection frame 9 are flexibly connected:
The first movable connection method: one end of the first connection frame 8 is equipped with the first protrusion 10, and the other end is equipped with the first groove
11；One end of second connection frame 9 is equipped with second protrusion corresponding with first groove 11, and the other end is equipped with and described the
One raised 10 corresponding second grooves, second protrusion are connected together with first groove 11, second groove and institute
The first protrusion 10 is stated to be connected together.
Second of movable connection method: one end of first connection frame 8 is equipped with third protrusion, second connection frame 9
One end be equipped with third groove, the third protrusion is connected together with the third groove, the other end of first connection frame 8
It is hinged with the other end of second connection frame 9.
The third movable connection method: one end of first connection frame 8 is equipped with the 4th protrusion 14, second connection frame
9 one end articulated connection piece 13, the connection sheet 13 are equipped with through-hole 15, and the through-hole 15 engages with the 4th protrusion 14；
The other end of first connection frame 8 and the other end of second connection frame 9 are hinged.
When assembling the utility model, preparatory use is fixedly connected with frame 5 and fixed optical module 2 and radiating block 3 is assembled into module,
Module is connect with mainboard 12 again.It does so and guarantees that optical module and radiating block do not misplace, optical module and radiating block can have maximum
Contact surface.It is more preferable than the effect of individually packaged optical module and radiating module to assemble module, it is more efficient.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that:
It can still modify to technical solution documented by previous embodiment, or be equal to part of technical characteristic
Replacement；And these are modified or replaceed, the utility model embodiment technical solution that it does not separate the essence of the corresponding technical solution
Spirit and scope.
Claims (7)
1. a kind of high power light module heat dissipation structure, bottom case (1), mainboard (12), optical module (2), heat dissipation including top end opening
Block (3) and the upper casing (4) being covered on the bottom case (1), the mainboard (12) are fixed on the inside bottom of the bottom case (1),
The optical module (2) is installed on the mainboard (12), and the upper surface of the optical module (2) is affixed the connection radiating block (3)
Lower end surface, the upper surface of the radiating block (3) abuts with the lower end surface of the upper casing (4), it is characterised in that: further includes fixing
Connection frame (5), the medial surface for being fixedly connected with frame (5) is abutted with the side of the optical module (2), described to be fixedly connected with frame
(5) medial surface is abutted with the side of the radiating block (3), and the side wall for being fixedly connected with frame (5) is equipped with radiating fin (6), institute
It states radiating fin (6) to be in array-like arrangement, the short side wall of the bottom case (1) is equipped with heat release hole (7), and the heat release hole (7) is in battle array
Column-shaped arrangement.
2. a kind of high power light module heat dissipation structure according to claim 1, it is characterised in that: described to be fixedly connected with frame
It (5) include the first connection frame (8) and the second connection frame (9), first connection frame (8) and second connection frame (9) are movable
Connection.
3. a kind of high power light module heat dissipation structure according to claim 2, it is characterised in that: first connection frame
(8) one end is equipped with first raised (10), and the other end is equipped with the first groove (11)；One end of second connection frame (9) is equipped with
The second protrusion corresponding with the first groove (11), the other end are equipped with the second groove corresponding with described first raised (10),
Second protrusion is connected together with first groove (11), and second groove engages company with described first raised (10)
It connects.
4. a kind of high power light module heat dissipation structure according to claim 2, it is characterised in that: first connection frame
(8) one end is equipped with third protrusion, and it is recessed that one end of second connection frame (9) is equipped with third corresponding with the third protrusion
Slot, the third protrusion are connected together with the third groove, and the other end of first connection frame (8) is connect with described second
The other end of frame (9) is hinged.
5. a kind of high power light module heat dissipation structure according to claim 2, it is characterised in that: first connection frame
(8) one end is equipped with the 4th raised (14), the hinged flexible connection piece in one end (13) of second connection frame (9), the connection
Piece (13) is equipped with through-hole (15), and the through-hole (15) engages with the described 4th raised (14)；First connection frame (8) it is another
One end and the other end of second connection frame (9) are hinged.
6. according to a kind of described in any item high power light module heat dissipation structures of claim 3-5, it is characterised in that: the fixation
The material of connection frame (5) is the heat-conducting plastic of high conductance.
7. a kind of high power light module heat dissipation structure according to claim 6, it is characterised in that: the radiating block (3) is
Thermal conductivity foam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821263170.9U CN208384184U (en) | 2018-08-07 | 2018-08-07 | A kind of high power light module heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821263170.9U CN208384184U (en) | 2018-08-07 | 2018-08-07 | A kind of high power light module heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208384184U true CN208384184U (en) | 2019-01-15 |
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ID=64961892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821263170.9U Active CN208384184U (en) | 2018-08-07 | 2018-08-07 | A kind of high power light module heat dissipation structure |
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| CN (1) | CN208384184U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126216A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Heat dissipation shell, optical module with heat dissipation shell and communication equipment |
-
2018
- 2018-08-07 CN CN201821263170.9U patent/CN208384184U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113126216A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Heat dissipation shell, optical module with heat dissipation shell and communication equipment |
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