CN208377259U - A kind of dyestripping mechanism of wafer Coating-removing machine - Google Patents
A kind of dyestripping mechanism of wafer Coating-removing machine Download PDFInfo
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- CN208377259U CN208377259U CN201821020749.2U CN201821020749U CN208377259U CN 208377259 U CN208377259 U CN 208377259U CN 201821020749 U CN201821020749 U CN 201821020749U CN 208377259 U CN208377259 U CN 208377259U
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- Prior art keywords
- roller bearing
- wafer
- removing machine
- coating
- gear
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Abstract
The utility model discloses a kind of dyestripping mechanisms of wafer Coating-removing machine, including Coating-removing machine ontology, the upper surface of the Coating-removing machine ontology is provided with wafer fixed disk, the upper surface of the wafer fixed disk is provided with wafer ontology, the two sides of the wafer ontology are provided with sliding rail, the upper surface of Coating-removing machine ontology is arranged in the sliding rail, the upper surface of the sliding rail is provided with connection frame, the connection frame is internally provided with roller bearing, the outer surface of the roller bearing is provided with gear, the outer surface of the gear is provided with guiding rack gear, the upper surface of Coating-removing machine ontology is arranged in the bottom surface of the guiding rack gear；The dyestripping roller bearing outer surface of equipment is additionally arranged gear, roller bearing is able to maintain during dyestripping to be rotated, dyestripping preferably can be carried out to wafer, the both ends of roller bearing are provided with limit occlusion sheet metal simultaneously, it is convenient for counter-rotating roller bearing when needing to remove the film of roller bearing side bonds and removes film, improves the working efficiency of staff.
Description
Technical field
The utility model belongs to wafer Coating-removing machine technical field, and in particular to a kind of dyestripping mechanism of wafer Coating-removing machine.
Background technique
Circle refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer, mesh
Preceding product is essentially 8 inch wafers and 12 inch wafers, and current wafer will do it encapsulation in process of production, convenient for not
Same place transport prevents wafer broken in transport, the surface of wafer will do it patch for the consideration to wafer quality safety
Film needs first to remove film before subsequent handling processing；Current dyestripping equipment is extremely inconvenient when using, and pad pasting is sticked to
The side surface of dyestripping mechanism roller bearing is not easy to remove, and staff's Use Limitation rate is low, uses when institute for current Coating-removing machine
Exposed problem, it is necessary to the improvement in structure be carried out to the dyestripping mechanism of plastic film machine, thus it is proposed that a kind of wafer dyestripping
The dyestripping mechanism of machine.
Utility model content
The purpose of this utility model is to provide a kind of dyestripping mechanisms of wafer Coating-removing machine, to solve in above-mentioned background technique
The current dyestripping equipment proposed is extremely inconvenient when using, and pad pasting is sticked to the surface of dyestripping mechanism and is not easy to remove, staff
The low problem of Use Limitation rate.
To achieve the above object, the utility model provides the following technical solutions: a kind of dyestripping mechanism of wafer Coating-removing machine, packet
Coating-removing machine ontology is included, the upper surface of the Coating-removing machine ontology is provided with wafer fixed disk, and the upper surface of the wafer fixed disk is set
It is equipped with wafer ontology, the two sides of the wafer ontology are provided with sliding rail, and the upper surface of Coating-removing machine ontology, institute is arranged in the sliding rail
The upper surface for stating sliding rail is provided with connection frame, and the connection frame is internally provided with roller bearing, the outer surface setting of the roller bearing
There is gear, the outer surface of the gear is provided with guiding rack gear, and Coating-removing machine ontology is arranged in the bottom surface of the guiding rack gear
Upper surface, the both ends of the roller bearing reach the outside of connection frame, the outer surface setting of the roller bearing through the side of connection frame
There is the second occlusion sheet metal, the outside of the roller bearing is provided with knob, and the inner surface of the knob is provided with the first occlusion
Sheet metal, the top of the roller bearing and the inner wall sleeve of knob connect in succession.
Preferably, the inside of the wafer fixed disk is evenly arranged with gas-guide tube, and the top of the gas-guide tube is provided with suction
Disk, the side of the sucker are provided with rubber seal, and the upper surface of wafer fixed disk is arranged in the rubber seal.
Preferably, the both ends outer surface of the roller bearing is symmetrically arranged with gear, and the gear is being rolled by cutting setting
The side of axis, the gear are structure as a whole with roller bearing, and the bottom surface of the gear is both provided with guiding rack gear, the guiding rack gear
It is symmetrically installed by wafer fixed disk.
Preferably, the upper surface of the Coating-removing machine ontology is opened up there are two sliding rail, and described two sliding rails are with wafer fixed disk
For symmetry axis installation.
Preferably, the side of the roller bearing is evenly arranged with the second occlusion sheet metal of a circle, and second occlusion is used
The side of sheet metal is provided with the first occlusion sheet metal, and the top of the second occlusion sheet metal is engaged sheet metal with first
Top is in contact.
Compared with prior art, the utility model has the beneficial effects that
(1) inside of equipment is additionally arranged wafer fixed equipment, and wafer Coating-removing machine during use can be preferably right
Wafer is fixed, while having better compatibility to the wafer of different sizes, convenient for the use of staff.
(2) the dyestripping roller bearing outer surface of equipment is additionally arranged gear, is able to maintain roller bearing during dyestripping and is revolved
Transhipment is dynamic, preferably can carry out dyestripping to wafer, while the both ends of roller bearing are provided with limit occlusion sheet metal, are needing to go
Except roller bearing side bonds film when convenient for counter-rotating roller bearing and film being removed, improve the working efficiency of staff.
Detailed description of the invention
Fig. 1 is the surface structure schematic diagram of the utility model；
Fig. 2 is the wafer fixing sucking disk cross section structure schematic diagram of the utility model；
Fig. 3 is the sucker overlooking structure diagram of the utility model；
Fig. 4 is the connecting frame structure schematic diagram of the utility model；
Fig. 5 is the knob cross section structure schematic diagram of the utility model；
Fig. 6 is the guiding rack gear structural schematic diagram of the utility model；
Fig. 7 is the wafer fixed disk cross section structure schematic diagram of the utility model；
Fig. 8 is the evacuated panel overlooking structure diagram of the utility model；
In figure: 1, Coating-removing machine ontology；2, wafer fixed disk；3, wafer ontology；4, roller bearing；5, gear；6, connection frame；7, it revolves
Button；8, it is oriented to rack gear；9, rubber seal；10, gas-guide tube；11, sucker；12, sliding rail；13, the first occlusion sheet metal；14,
Sheet metal is used in two occlusions；15, air discharge duct；16, rubber sheet gasket.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1
Please refer to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6, the utility model provides a kind of technical solution: a kind of wafer is torn
The upper surface of the dyestripping mechanism of film machine, including Coating-removing machine ontology 1, Coating-removing machine ontology 1 is equipped with wafer fixed disk 2, wafer fixed disk 2
Bottom end through Coating-removing machine ontology 1 upper surface reach Coating-removing machine ontology 1 inside, the upper surface of wafer fixed disk 2 is placed with
Wafer ontology 3, the two sides of wafer ontology 3 are equipped with sliding rail 12, and sliding rail 12 is located at the upper surface of Coating-removing machine ontology 1 by cutting, sliding
The upper surface of rail 12 is equipped with connection frame 6, and the inside of connection frame 6 is equipped with roller bearing 4, and the outer surface of roller bearing 4 is equipped with gear 5, gear 5
Outer surface be equipped with guiding rack gear 8, the underrun bolt of guiding rack gear 8 is fixed on the upper surface of Coating-removing machine ontology 1, roller bearing
4 both ends reach the outside of connection frame 6 through the side of connection frame 6, and the outer surface of roller bearing 4 is equipped with the second occlusion and uses sheet metal
14, the outside of roller bearing 4 is equipped with knob 7, and the inner surface of knob 7 is equipped with the first occlusion sheet metal 13, the top of roller bearing 4 and knob
7 inner wall sleeve connects in succession.
For the ease of the fixation to wafer ontology 3, so that the position of the wafer ontology 3 during dyestripping remains unchanged, this
In embodiment, it is preferred that the inside of wafer fixed disk 2 is uniformly provided with gas-guide tube 10, and the top of gas-guide tube 10 is equipped with sucker 11, inhales
The side of disk 11 is equipped with rubber seal 9, and rubber seal 9 is located at the upper surface of wafer fixed disk 2.
In order to keep the consistent of two end motions during equipment moving, in the present embodiment, it is preferred that outside the both ends of roller bearing 4
Side surface is symmetrically arranged with gear 5, and gear 5 is located at the side of roller bearing 4 by cutting, and gear 5 is structure as a whole with roller bearing 4, gear 5
Bottom surface be designed with guiding rack gear 8, and two guiding rack gears 8 are symmetrically installed.
In order to keep the stabilization of equipment, in the present embodiment, it is preferred that the upper surface of Coating-removing machine ontology 1 opens up that there are two sliding
Rail 12, two sliding rails 12 are symmetry axis installation with wafer fixed disk 2.
For the ease of staff's use, in the present embodiment, it is preferred that the side of roller bearing 4 is evenly arranged with the of a circle
Two occlusion sheet metals 14, the second occlusion are provided with the first occlusion sheet metal 13, the second occlusion gold with the side of sheet metal 14
The top for belonging to piece 14 is in contact with the top of the first occlusion sheet metal 13.
1 working principle of the embodiments of the present invention and process for using: the equipment in use puts wafer ontology 3
It sets the air-extractor after the upper surface of wafer fixed disk 2, starting device inside Coating-removing machine ontology 1 and gas is passed through into gas-guide tube
10 take away, the upper surface of sucker 11 and the following table face contact of wafer ontology 3, the top of rubber seal 9 and the bottom of wafer ontology 3
Face contact, and the upper surface of wafer fixed disk 2 is sealed, first the tear glue film of fraction of staff are wrapped in roller bearing 4
Side, staff moves knob 7 using hand push later, and knob 7 drives connection frame 6 in sliding rail 12 during being pushed
Upper surface movement, the synchronous upper surface in wafer ontology 3 of roller bearing 4 move, roller bearing 4 the process side of advance gear 5 with lead
It is contacted to rack gear 8, guiding rack gear 8 rotates roller bearing 4 in advancement, by 3 side of wafer ontology when roller bearing 4 rotates
Glue film winding is taken away, and completes after connection frame 6 is covered from 12 uplink of sliding rail to the dyestripping of wafer, staff is in sliding rail 12
Terminal inverts knob 7, and knob 7 drives the first occlusion sheet metal 13 to rotate in reversion, band when the first occlusion sheet metal 13 rotates
Dynamic second occlusion is rotated with sheet metal 14, and the second occlusion finally drives roller bearing 4 to reversely rotate with sheet metal 14, and final pad pasting is from rolling
The surface of axis 4 falls off.
Embodiment 2
Please refer to Fig. 1, Fig. 4, Fig. 5, Fig. 6, Fig. 7 and Fig. 8, the utility model provides a kind of technical solution: a kind of wafer is torn
The upper surface of the dyestripping mechanism of film machine, including Coating-removing machine ontology 1, Coating-removing machine ontology 1 is equipped with wafer fixed disk 2, wafer fixed disk 2
Bottom end through Coating-removing machine ontology 1 upper surface reach Coating-removing machine ontology 1 inside, the upper surface of wafer fixed disk 2 is placed with
Wafer ontology 3, the two sides of wafer ontology 3 are equipped with sliding rail 12, and sliding rail 12 is located at the upper surface of Coating-removing machine ontology 1 by cutting, sliding
The upper surface of rail 12 is equipped with connection frame 6, and the inside of connection frame 6 is equipped with roller bearing 4, and the outer surface of roller bearing 4 is equipped with gear 5, gear 5
Outer surface be equipped with guiding rack gear 8, the underrun bolt of guiding rack gear 8 is fixed on the upper surface of Coating-removing machine ontology 1, roller bearing
4 both ends reach the outside of connection frame 6 through the side of connection frame 6, and the outer surface of roller bearing 4 is equipped with the second occlusion and uses sheet metal
14, the outside of roller bearing 4 is equipped with knob 7, and the inner surface of knob 7 is equipped with the first occlusion sheet metal 13, the top of roller bearing 4 and knob
7 inner wall sleeve connects in succession.
For the ease of the fixation to wafer ontology 3, so that the position of the wafer ontology 3 during dyestripping remains unchanged, this
In embodiment, it is preferred that the inside of wafer fixed disk 2 is evenly arranged with gas-guide tube 10, and the top of gas-guide tube 10 is solid through wafer
The upper surface of price fixing 2 reaches the outside of wafer fixed disk 2, and the upper surface of wafer fixed disk 2 is provided with rubber sheet gasket by injection molding
16, the side surface of rubber sheet gasket 16 is provided with rubber seal 9, and the upper surface of rubber sheet gasket 16 is provided with air discharge duct by die casting
15, the top of gas-guide tube 10 is connected to the inside of air discharge duct 15.
In order to keep the consistent of two end motions during equipment moving, in the present embodiment, it is preferred that outside the both ends of roller bearing 4
Side surface is symmetrically arranged with gear 5, and gear 5 is located at the side of roller bearing 4 by cutting, and gear 5 is structure as a whole with roller bearing 4, gear 5
Bottom surface be designed with guiding rack gear 8, and two guiding rack gears 8 are symmetrically installed.
In order to keep the stabilization of equipment, in the present embodiment, it is preferred that the upper surface of Coating-removing machine ontology 1 opens up that there are two sliding
Rail 12, two sliding rails 12 are symmetry axis installation with wafer fixed disk 2.
For the ease of staff's use, in the present embodiment, it is preferred that the side of roller bearing 4 is evenly arranged with the of a circle
Two occlusion sheet metals 14, the second occlusion are provided with the first occlusion sheet metal 13, the second occlusion gold with the side of sheet metal 14
The top for belonging to piece 14 is in contact with the top of the first occlusion sheet metal 13.
2 working principle of the embodiments of the present invention and process for using: the equipment in use puts wafer ontology 3
It sets the air-extractor after the upper surface of wafer fixed disk 2, starting device inside Coating-removing machine ontology 1 and gas is passed through into gas-guide tube
10 take away, and the top of rubber seal 9 is contacted with the bottom surface of wafer ontology 3, and the progress of the upper surface of wafer fixed disk 2 is close
Envelope, 15 air pressure inside of air discharge duct reduces, so that the following table face contact of the upper surface of rubber sheet gasket 16 and wafer ontology 3, work people
First the tear glue film of fraction of member is wrapped in the side of roller bearing 4, and staff moves knob 7 using hand push later, and knob 7 is being pushed away
Connection frame 6 is driven to move in the upper surface of sliding rail 12 in dynamic process, the synchronous upper surface in wafer ontology 3 of roller bearing 4 moves, rolling
Gear 5 of the axis 4 in the process side of advance is contacted with guiding rack gear 8, and guiding rack gear 8 revolves roller bearing 4 in advancement
Turn, takes away the glue film winding of 3 side of wafer ontology when roller bearing 4 rotates, to crystalline substance after connection frame 6 is covered from 12 uplink of sliding rail
Round dyestripping is completed, and staff inverts knob 7 in the terminal of sliding rail 12, and knob 7 drives the first occlusion sheet metal in reversion
13 rotations, the second occlusion of drive is rotated with sheet metal 14 when the first occlusion sheet metal 13 rotates, and the second occlusion uses sheet metal 14 most
Roller bearing 4 is driven to reversely rotate eventually, final pad pasting falls off from the surface of roller bearing 4.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of dyestripping mechanism of wafer Coating-removing machine, including Coating-removing machine ontology (1), it is characterised in that: the Coating-removing machine ontology (1)
Upper surface be provided with wafer fixed disk (2), the upper surface of the wafer fixed disk (2) is provided with wafer ontology (3), the crystalline substance
The two sides of circle ontology (3) are provided with sliding rail (12), and the sliding rail (12) is arranged in the upper surface of Coating-removing machine ontology (1), the cunning
The upper surface of rail (12) is provided with connection frame (6), and the connection frame (6) is internally provided with roller bearing (4), the roller bearing (4)
Outer surface is provided with gear (5), and the outer surface of the gear (5) is provided with guiding rack gear (8), the guiding rack gear (8)
Bottom surface setting in the upper surface of Coating-removing machine ontology (1), the both ends of the roller bearing (4) are reached through the side of connection frame (6) to be connected
Connect the outside of frame (6), the outer surface of the roller bearing (4) is provided with the second occlusion sheet metal (14), the roller bearing (4) it is outer
Portion is provided with knob (7), and the inner surface of the knob (7) is provided with the first occlusion sheet metal (13), the top of the roller bearing (4)
It holds and is connect in succession with the inner wall sleeve of knob (7).
2. a kind of dyestripping mechanism of wafer Coating-removing machine according to claim 1, it is characterised in that: the wafer fixed disk
(2) inside is evenly arranged with gas-guide tube (10), and the top of the gas-guide tube (10) is provided with sucker (11), the sucker (11)
Side be provided with rubber seal (9), upper surface of the rubber seal (9) setting in wafer fixed disk (2).
3. a kind of dyestripping mechanism of wafer Coating-removing machine according to claim 1, it is characterised in that: the two of the roller bearing (4)
End outer surface is symmetrically arranged with gear (5), and the gear (5) is arranged by cutting in the side of roller bearing (4), the gear
(5) it is structure as a whole with roller bearing (4), the bottom surface of the gear (5) is both provided with guiding rack gear (8), and the guiding rack gear (8) is logical
Wafer fixed disk (2) is crossed to be symmetrically installed.
4. a kind of dyestripping mechanism of wafer Coating-removing machine according to claim 1, it is characterised in that: the Coating-removing machine ontology
(1) upper surface is opened up there are two sliding rail (12), and described two sliding rails (12) are symmetry axis installation with wafer fixed disk (2).
5. a kind of dyestripping mechanism of wafer Coating-removing machine according to claim 1, it is characterised in that: the side of the roller bearing (4)
Face is evenly arranged with the second occlusion sheet metal (14) of a circle, and second occlusion is provided with the with the side of sheet metal (14)
The top of one occlusion sheet metal (13), the second occlusion sheet metal (14) connects with the top of the first occlusion sheet metal (13)
Touching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020749.2U CN208377259U (en) | 2018-06-29 | 2018-06-29 | A kind of dyestripping mechanism of wafer Coating-removing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821020749.2U CN208377259U (en) | 2018-06-29 | 2018-06-29 | A kind of dyestripping mechanism of wafer Coating-removing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208377259U true CN208377259U (en) | 2019-01-15 |
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ID=64965143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821020749.2U Expired - Fee Related CN208377259U (en) | 2018-06-29 | 2018-06-29 | A kind of dyestripping mechanism of wafer Coating-removing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208377259U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110775385A (en) * | 2019-11-21 | 2020-02-11 | 湖南东神自动化设备有限公司 | Circuit board tectorial membrane stripping off device |
-
2018
- 2018-06-29 CN CN201821020749.2U patent/CN208377259U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110775385A (en) * | 2019-11-21 | 2020-02-11 | 湖南东神自动化设备有限公司 | Circuit board tectorial membrane stripping off device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190115 Termination date: 20210629 |