CN208352265U - A kind of sintering mold for hydrid integrated circuit shell - Google Patents
A kind of sintering mold for hydrid integrated circuit shell Download PDFInfo
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- CN208352265U CN208352265U CN201820813569.3U CN201820813569U CN208352265U CN 208352265 U CN208352265 U CN 208352265U CN 201820813569 U CN201820813569 U CN 201820813569U CN 208352265 U CN208352265 U CN 208352265U
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- shell
- split type
- combination block
- type die
- integrated circuit
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Abstract
The utility model relates to a kind of sintering mold for hydrid integrated circuit shell, which includes die tray, is arranged in die tray and Split type die combination block compatible with shell and expansion compensation compatible with Split type die combination block mechanism.Compared with prior art, Split type die combination block can carry out correspondingly expansion or shrinkage with the expansion or shrinkage of shell in the utility model, guarantee constant with relative position at the pin positioning holes center in Split type die combination block at the pin jack center of shell, it can be by control errors within ± 0.1mm, ensure that the resistance of shell product meets the requirements, and stress problem is not present in sintered shell product, sealing reliability is good, and then ensure that the reliability of wiring board welding；Expansion compensation mechanism can correspondingly be moved with the expansion or shrinkage of Split type die combination block, guaranteed the tight fit of Split type die combination block and shell, do not needed to be manually operated, securely and reliably.
Description
Technical field
The utility model belongs to precision electronic element processing technique field, is related to a kind of for hydrid integrated circuit shell
Sintering mold.
Background technique
Hydrid integrated circuit shell generally includes the metal shell of half opening formula, multiple pins being plugged on metal shell
And the glass between pin and metal shell for sealing and insulating is set.Existing hydrid integrated circuit shell is being processed
When, using the monolithic mold of graphite material, first by glass bead sleeve on pin, monoblock type mould will be inserted by pin one by one later
On tool in corresponding hole, and metal shell is placed in the slot on monolithic mold, is formed through high temperature sintering.However, due to
Such mold design uses monolithic construction, and the distance between the adjacent leads for being sintered rear casing product is caused to differ with standard value
It is larger, the tolerance of ± 0.25mm also it is difficult to ensure that, be unable to satisfy the requirement of delicate electronic device.The main reason is that: due to
960-980 DEG C or so of high temperature (related with the material of product) is needed when sintering to guarantee pin and metal-back for glass melting
Sealing function between body, and the thermal expansion coefficient of metal is far longer than the thermal expansion coefficient of graphite, at high temperature metal shell
Relative displacement between graphite jig is larger, when being cooled to 650-700 DEG C, glass solidifies, at this moment pin and metal shell
Relative position is fixed, and since position of the pin in mold is certain, and the thermal expansion of metal shell is greater than graphite, causes
The glass orifice center of metal shell shifts with the Pin locations on mold at high temperature, and (metal shell is longer, relative displacement
It is bigger), so cause it is cooling after center between pin away from becoming smaller, resistance is unable to satisfy requirements, and since position is inclined when cooling
Poor bring stress also can bury hidden danger to the sealing performance of product, and influence subsequent product and link with the accurate of wiring board.
Utility model content
The purpose of this utility model is exactly to provide a kind of for mixing to overcome the problems of the above-mentioned prior art
The sintering mold of ic shell.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of sintering mold for hydrid integrated circuit shell, hydrid integrated circuit shell include shell and it is multiple insert
The pin being located on shell offers multiple pin jacks compatible with pin, the pin jack on the shell
Interior to be equipped with glass, the mold includes die tray, is arranged in die tray and Split type die compatible with shell
Combination block and expansion compensation compatible with Split type die combination block mechanism.Glass in pin jack be used for pin with
It is sealed and insulate between shell, glass is chosen as globular glass.
Further, multiple die cavitys are offered in the die tray, and Split type die group is equipped in each die cavity
Close block and expansion compensation compatible with Split type die combination block mechanism.Each die cavity correspondence processes a shell, mentions
The high utilization rate and processing efficiency of die tray.
Further, shell positioning chamber compatible with shell is offered in the Split type die combination block.Shell
For placing metal shell in positioning chamber.
Further, the Split type die combination block includes multiple angle mold blocks and multiple side mold blocks, described
The side of expansion compensation mechanism be in contact with Split type die combination block, the other side is in contact with the inner sidewall of die cavity.Angle mould
Tool block is adapted with four angles of shell, and side mold block is adapted with the side of shell.Multiple angle mold blocks and multiple side modes have
Block stitches and fastens, and forms completely shell positioning chamber compatible with shell.
Further, pin location hole compatible with pin is offered in the angle mold block and side mold block.
Pin location hole positions convenient for the insertion of pin.
Further, the pin location hole is arranged in vertical direction, and opens at the top of the pin location hole
Equipped with glass location hole compatible with glass.Glass location hole is convenient for positioning glass.
Further, the expansion compensation mechanism includes that a pair of supporting block being disposed in parallel in die cavity and movement are set
The briquetting between two supporting blocks is set, two supporting blocks are in contact with the inner sidewall of Split type die combination block, die cavity respectively.When point
When body formula die assembly block is with case swells, one of supporting block is moved to the direction of another supporting block；When shell is received
When contracting, under the pressure effect of briquetting, mobile supporting block counter motion resets, and realizes that the synchronous of Split type die combination block is received
Contracting.
Further, the supporting block is in horizontally disposed triangular prism shape, and the briquetting is in horizontally disposed cylinder
Shape, and the side of the briquetting is in contact with the inclined surface of supporting block.Pass through the side of briquetting and the inclined surface of supporting block
Cooperation, realize expansion compensation function.
Further, be equipped with a pair of of expansion compensation mechanism in the die cavity altogether, and two expansion compensation mechanisms respectively with
The adjacent two sides of Split type die combination block are in contact.Two expansion compensation mechanisms are arranged in a mutually vertical manner, respectively to Split type die
The dilation on dilation and width direction on combination block length direction compensates, and guarantees the matter of final shell product
Amount.
The material of the shell and pin is metal as a preferred technical solution, the Split type die group
The material for closing block and supporting block is graphite, and the material of the briquetting is steel.
The utility model will be inserted into split type mould by pin one by one later in practical application, by glass sock on pin
Have the pin positioning hole in combination block, and shell is placed in the shell positioning chamber in Split type die combination block, later
Carry out high temperature sintering.In high-temperature sintering process, shell expansion or shrinkage with the variation of temperature, in expansion compensation mechanism
Under effect, Split type die combination block carries out correspondingly expansion or shrinkage with the expansion or shrinkage of shell always, guarantees shell
It is constant with relative position at pin positioning holes center corresponding in Split type die combination block at the pin jack center of body, in turn
Guarantee that the pin on shell is in always at the center of respective pins jack, makes shell product that there is sufficiently high precision.
Compared with prior art, the utility model has the following characteristics that
1) Split type die combination block can carry out correspondingly expansion or shrinkage with the expansion or shrinkage of shell, guarantee
It is constant with relative position at the pin positioning holes center in Split type die combination block at the pin jack center of shell, it can incite somebody to action
Control errors are within ± 0.1mm, it is ensured that the resistance of shell product meets the requirements, and stress is not present in sintered shell product
Problem, sealing reliability is good, and then ensure that the reliability of wiring board welding；
2) expansion compensation mechanism can correspondingly be moved with the expansion or shrinkage of Split type die combination block, be protected
The tight fit for demonstrate,proving Split type die combination block and shell, does not need to be manually operated, securely and reliably.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of shell in the utility model；
Fig. 2 be in Fig. 1 A-A to schematic cross-sectional view；
Fig. 3 is the overlooking structure diagram of mold in the utility model；
Fig. 4 is B-B direction schematic cross-sectional view in Fig. 3；
Fig. 5 is the overlooking structure diagram of angle mold block in the utility model；
Fig. 6 be in Fig. 5 C-C to schematic cross-sectional view；
Fig. 7 is the overlooking structure diagram of side mold block in the utility model；
Fig. 8 be in Fig. 7 D-D to schematic cross-sectional view；
Description of symbols in figure:
1-shell, 2-pins, 3-glass, 4-die trays, 5-angle mold blocks, 6-side mold blocks, 7-pins are fixed
Position hole, 8-supporting blocks, 9-briquettings.
Specific embodiment
The utility model is described in detail in the following with reference to the drawings and specific embodiments.The present embodiment is with the utility model
Implemented premised on technical solution, the detailed implementation method and specific operation process are given, but the guarantor of the utility model
Shield range is not limited to the following embodiments.
Embodiment:
Hydrid integrated circuit shell as shown in Figure 1 and Figure 2 includes shell 1 and multiple pins 2 being plugged on shell 1,
Multiple pin jacks compatible with pin 2 are offered on shell 1, are equipped with glass 3 in pin jack.As shown in Figure 3, Figure 4
Sintering mold for the hydrid integrated circuit shell includes die tray 4, is arranged in die tray 4 and fits with 1 phase of shell
The Split type die combination block and expansion compensation compatible with Split type die combination block mechanism matched.
Wherein, multiple die cavitys are offered in die tray 4, be equipped in each die cavity Split type die combination block and with
The compatible expansion compensation mechanism of Split type die combination block.It is offered in Split type die combination block compatible with shell 1
Shell positioning chamber.
Split type die combination block includes multiple angle mold blocks 5 and multiple side mold blocks 6, the side of expansion compensation mechanism
It is in contact with Split type die combination block, the other side is in contact with the inner sidewall of die cavity.
As shown in Fig. 5, Fig. 6, Fig. 7, Fig. 8, draw compatible with pin 2 is offered on angle mold block 5 and side mold block 6
Foot location hole 7.Pin location hole 7 is arranged in vertical direction, and the top of pin location hole 7 offers and is adapted with glass 3
Glass location hole.
Expansion compensation mechanism includes a pair of supporting block 8 being disposed in parallel in die cavity and mobile setting in two supporting blocks 8
Between briquetting 9, two supporting blocks 8 are in contact with the inner sidewall of Split type die combination block, die cavity respectively.Supporting block 8 is in level
The triangular prism shape of setting, briquetting 9 is in horizontally disposed cylindric, and the side of briquetting 9 connects with the inclined surface of supporting block 8
Touching.
Be equipped with a pair of of expansion compensation mechanism in die cavity altogether, and two expansion compensation mechanisms respectively with Split type die combination block
Adjacent two sides are in contact.
In practical application, on pin 2 by 3 sets of glass, Split type die combination block will be inserted by pin 2 one by one later
In pin location hole 7 in, and shell 1 is placed in the shell positioning chamber in Split type die combination block, is carried out later high
Temperature sintering.In high-temperature sintering process, the expansion or shrinkage with the variation of temperature of shell 1, in the effect of expansion compensation mechanism
Under, Split type die combination block carries out correspondingly expansion or shrinkage with the expansion or shrinkage of shell 1 always, guarantees shell 1
Pin jack center at it is constant with relative position at 7 center of pin location hole corresponding in Split type die combination block, in turn
Guarantee that the pin 2 on shell 1 is in always at the center of respective pins jack, makes shell product that there is sufficiently high precision.
It can understand the above description of the embodiments is intended to facilitate those skilled in the art and use practical
It is novel.Person skilled in the art obviously easily can make various modifications to these embodiments, and illustrating herein
General Principle be applied in other embodiments without having to go through creative labor.Therefore, the utility model is not limited to above-mentioned
Embodiment, those skilled in the art's announcement according to the present utility model, do not depart from improvement that the utility model scope is made and
Modification should be all within the protection scope of the utility model.
Claims (9)
1. a kind of sintering mold for hydrid integrated circuit shell, hydrid integrated circuit shell includes shell (1) and multiple
The pin (2) being plugged on shell (1), offer on the shell (1) it is multiple with pin (2) compatible pin jack,
Glass (3) are equipped in the pin jack, which is characterized in that the mold includes die tray (4), is arranged in mold support
On disk (4) and Split type die combination block compatible with shell (1) and expansion compatible with Split type die combination block
Compensation mechanism.
2. a kind of sintering mold for hydrid integrated circuit shell according to claim 1, which is characterized in that described
Multiple die cavitys are offered in die tray (4), and Split type die combination block and and Split type die are equipped in each die cavity
The compatible expansion compensation mechanism of combination block.
3. a kind of sintering mold for hydrid integrated circuit shell according to claim 2, which is characterized in that described
It is offered in Split type die combination block and shell (1) compatible shell positioning chamber.
4. a kind of sintering mold for hydrid integrated circuit shell according to claim 2, which is characterized in that described
Split type die combination block includes multiple angle mold blocks (5) and multiple side mold blocks (6), and the one of the expansion compensation mechanism
Side is in contact with Split type die combination block, and the other side is in contact with the inner sidewall of die cavity.
5. a kind of sintering mold for hydrid integrated circuit shell according to claim 4, which is characterized in that described
It is offered on angle mold block (5) and side mold block (6) and pin (2) compatible pin location hole (7).
6. a kind of sintering mold for hydrid integrated circuit shell according to claim 5, which is characterized in that described
Pin location hole (7) is arranged in vertical direction, and offers at the top of the pin location hole (7) and mutually fit with glass (3)
The glass location hole matched.
7. a kind of sintering mold for hydrid integrated circuit shell according to claim 4, which is characterized in that described
Expansion compensation mechanism includes a pair of supporting block in die cavity (8) and mobile setting of being disposed in parallel between two supporting blocks (8)
Briquetting (9), two supporting blocks (8) are in contact with the inner sidewall of Split type die combination block, die cavity respectively.
8. a kind of sintering mold for hydrid integrated circuit shell according to claim 7, which is characterized in that described
Supporting block (8) is in horizontally disposed triangular prism shape, and the briquetting (9) is in horizontally disposed cylindric and described briquetting
(9) side is in contact with the inclined surface of supporting block (8).
9. a kind of sintering mold for hydrid integrated circuit shell according to claim 7, which is characterized in that described
It is equipped with a pair of of expansion compensation mechanism in die cavity altogether, and two expansion compensation mechanisms respectively adjacent with Split type die combination block two
Side is in contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820813569.3U CN208352265U (en) | 2018-05-29 | 2018-05-29 | A kind of sintering mold for hydrid integrated circuit shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820813569.3U CN208352265U (en) | 2018-05-29 | 2018-05-29 | A kind of sintering mold for hydrid integrated circuit shell |
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| Publication Number | Publication Date |
|---|---|
| CN208352265U true CN208352265U (en) | 2019-01-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820813569.3U Active CN208352265U (en) | 2018-05-29 | 2018-05-29 | A kind of sintering mold for hydrid integrated circuit shell |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777252A (en) * | 2018-05-29 | 2018-11-09 | 上海科发电子产品有限公司 | A kind of sintering mold for hydrid integrated circuit shell |
| CN110666269A (en) * | 2019-10-11 | 2020-01-10 | 华东光电集成器件研究所 | Combined eutectic welding device and using method thereof |
-
2018
- 2018-05-29 CN CN201820813569.3U patent/CN208352265U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777252A (en) * | 2018-05-29 | 2018-11-09 | 上海科发电子产品有限公司 | A kind of sintering mold for hydrid integrated circuit shell |
| CN110666269A (en) * | 2019-10-11 | 2020-01-10 | 华东光电集成器件研究所 | Combined eutectic welding device and using method thereof |
| CN110666269B (en) * | 2019-10-11 | 2021-06-25 | 华东光电集成器件研究所 | Combined eutectic welding device and using method thereof |
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