CN208706578U - It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell - Google Patents
It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell Download PDFInfo
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- CN208706578U CN208706578U CN201821482656.1U CN201821482656U CN208706578U CN 208706578 U CN208706578 U CN 208706578U CN 201821482656 U CN201821482656 U CN 201821482656U CN 208706578 U CN208706578 U CN 208706578U
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- integrated circuit
- flat pin
- shell
- hydrid integrated
- supporting block
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Abstract
The utility model relates to a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell, including die tray and the sectional die block being arranged in die tray, offer hydrid integrated circuit shell positioning chamber in die tray, sectional die block includes the first expansion compensation mechanism, the second expansion compensation mechanism, is arranged in hydrid integrated circuit shell positioning chamber and third expansion compensation mechanism compatible with chamber and mobile is along the vertical direction arranged in hydrid integrated circuit shell positioning chamber and flat pin briquetting compatible with flat pin.Compared with prior art, the utility model passes through the cooperation of third expansion compensation mechanism and flat pin briquetting, make hydrid integrated circuit shell during high-temperature heat expansion, flat pin is in horizontality always, peak excursion angle is no more than 1 °, the quality and consistency that ensure that product improve the reliability and efficiency of hydrid integrated circuit shell gold wire bonding in subsequent use.
Description
Technical field
The utility model belongs to hydrid integrated circuit shell processing technique field, is related to a kind of for containing flat pin mixing collection
At the high level degree sintering mold of circuit case.
Background technique
Hydrid integrated circuit shell it is many kinds of, all include generally metal shell, multiple be plugged on metal shell
Pin and it is arranged between pin and metal shell for the glass insulator that seals and insulate.For certain hybrid integrated electricity
Road shell, the pin installed are flat pin.This kind of hydrid integrated circuit shell when being sintered processing needs that mould will be sintered
A mold block in tool processes a groove, and for controlling the direction of flat pin, the width of the groove is the thickness of flat pin
Gap required for degree+thermal expansion, levelness is poor after this design will lead to flat pin sintering, greater than required ± 3 °；
If the quantity of flat pin is more on metal shell, the flat pin number for not reaching requirement for horizontality can be very much, lead to finished product
Rate is lower.
Utility model content
The purpose of this utility model is exactly to provide a kind of for containing flat to overcome the problems of the above-mentioned prior art
The high level degree sintering mold of pin hydrid integrated circuit shell.
The purpose of this utility model can be achieved through the following technical solutions:
It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell, the hydrid integrated circuit
Shell includes that shell, multiple glass for being plugged in the flat pin of shell one end and being arranged between flat pin and shell side by side are exhausted
Edge offers chamber on the shell, and one end of the flat pin is located in chamber, and the sintering mold includes mould
Tool pallet and the sectional die block that is arranged in die tray offer outside hydrid integrated circuit in the die tray
Shell positioning chamber, the sectional die block include that setting is in hydrid integrated circuit shell positioning chamber and adjacent with shell respectively
Two sides compatible first expansion compensation mechanism and the second expansion compensation mechanism are arranged in hydrid integrated circuit shell positioning chamber
Third expansion compensation mechanism interior and compatible with chamber and along the vertical direction mobile setting are fixed in hydrid integrated circuit shell
Position is intracavitary and compatible with flat pin flat pin briquetting.When sintering processing, hydrid integrated circuit shell is placed on mixing collection
At in circuit case positioning chamber, the first expansion compensation mechanism, the second expansion compensation mechanism respectively from outside to product sintered
Expansion or shrinkage in journey compensates, third expansion compensation mechanism on the inside of the chamber to product expansion during the sintering process or
Contraction compensates, and guarantees the concentricity of each flat pin；Flat pin briquetting is pressing against one end of flat pin down from above, makes flat draw
The flat horizontal surface of foot remains horizontal.
Further, the first expansion compensation mechanism and the second expansion compensation mechanism include being arranged in hybrid integrated
The first supporting block, the second supporting block in circuit case positioning chamber and it is arranged between the first supporting block and the second supporting block
First briquetting, first supporting block are adapted with the inner sidewall of hydrid integrated circuit shell positioning chamber, and described second
Bracer is adapted with shell.When shell expands under sintering high temperature, the second supporting block is moved to the first support Block direction, makes the
Spacing between one supporting block and the second supporting block becomes smaller；When shell, which cools down, to be shunk, under the gravity of the first briquetting, move
The second dynamic supporting block opposite direction, which moves, to be resetted, and realizes expansion compensation and synchronous.
Further, first supporting block and the second supporting block are in horizontally disposed triangular prism shape, and described
One briquetting inclines in side and the first supporting block of the first horizontally disposed cylindric and described briquetting, the second supporting block
Inclined-plane is in contact.Cooperated by the inclined surface of the side of the first briquetting and the first supporting block, the second supporting block, realizes expansion compensation
Function.
Further, the shell is equipped with extension board, is additionally provided in the hydrid integrated circuit shell positioning chamber
Extension board briquetting compatible with extension board.Extension board briquetting is pressing against extension board, while the two of extension board briquetting down from above
Side is adapted with outer side of shell wall, the second supporting block side wall respectively.
Further, the third expansion compensation mechanism includes being disposed in parallel in hydrid integrated circuit shell positioning chamber
Third supporting block, the 4th supporting block and the second briquetting being arranged between third supporting block and the 4th supporting block, it is described
Flat pin briquetting moves along the vertical direction to be arranged between the 4th supporting block and the inner sidewall of shell, one end of the flat pin
Positioned at the lower section of flat pin briquetting.When shell expands under sintering high temperature, the overall space of chamber becomes smaller, third supporting block and
4th supporting block moves toward one another；When shell, which cools down, to be shunk, under the gravity of the second briquetting, third supporting block and the 4th
Bracer counter motion resets, and realizes expansion compensation and synchronous.During the sintering process, flat pin briquetting is pressed from the top down always
One end of flat pin, avoid flat pin run-off the straight.
Further, the side of the 4th supporting block is equipped with lower convex platform compatible with the end of flat pin, described
Flat pin briquetting bottom be equipped with convex platform compatible with the end of flat pin.In sintering process, convex platform and lower convex platform
Always one end of flat pin is clipped.
Further, flat pin placing groove compatible with flat pin is offered in the die tray.Flat pin
The other end is placed on flat pin placing groove.
The top of the lower convex platform is flushed with the bottom surface of flat pin placing groove as a preferred technical solution,.Guarantee
In sintering process, flat pin is always positioned at horizontality.
The utility model is in practical application, shell is put into hydrid integrated circuit shell positioning chamber, later by first
Expansion compensation mechanism, the second expansion compensation mechanism are put into hydrid integrated circuit shell positioning chamber, and are against the adjacent two sides of shell
On face；Flat pin and glass insulator are assembled in corresponding position on the shell, and one end of flat pin is placed in flat pin and is placed
In slot；Third expansion compensation mechanism is put into chamber, is located at the other end of flat pin on lower convex platform, is put into flat pin later
Briquetting, and convex platform is made to be pressed in the end of flat pin, high temperature sintering is carried out later.
Compared with prior art, the utility model has the following characteristics that
1) cooperation for passing through third expansion compensation mechanism and flat pin briquetting keeps hydrid integrated circuit shell swollen in high warm
In swollen process, flat pin is in horizontality always, and peak excursion angle is no more than 1 °, ensure that the quality of product and consistent
Property, improve the reliability and efficiency of hydrid integrated circuit shell gold wire bonding in subsequent use；
2) the first expansion compensation mechanism, the second expansion compensation mechanism and third expansion compensation mechanism can be with the heat of shell
Swollen shrinkage and correspondingly expansion or shrinkage, guarantee the concentricity of each flat pin on shell.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of hydrid integrated circuit shell in the utility model；
Fig. 2 is the overlooking structure diagram that the sintering mold after hydrid integrated circuit shell is put into the utility model；
Fig. 3 be in Fig. 2 A-A to schematic cross-sectional view；
Fig. 4 is the partial enlargement structural representation in Fig. 3 at B；
Description of symbols in figure:
1-shell, 2-flat pins, 3-glass insulators, 4-chambers, 5-die trays, 6-flat pin briquettings, 7-
First supporting block, the 8-the second supporting block, the 9-the first briquetting, 10-extension boards, 11-extension board briquettings, the support of 12-thirds
Block, the 13-the four supporting block, the 14-the second briquetting, 15-lower convex platforms, 16-convex platforms, 17-flat pin placing grooves.
Specific embodiment
The utility model is described in detail in the following with reference to the drawings and specific embodiments.The present embodiment is with the utility model
Implemented premised on technical solution, the detailed implementation method and specific operation process are given, but the guarantor of the utility model
Shield range is not limited to the following embodiments.
Embodiment:
Hydrid integrated circuit shell as described in Figure 1 includes shell 1, multiple flat pins 2 for being plugged in 1 one end of shell side by side
And the glass insulator 3 between flat pin 2 and shell 1 is set, chamber 4, one end position of flat pin 2 are offered on shell 1
In in chamber 4.
As shown in Figure 2 and Figure 3 is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell, packet
The sectional die block for including die tray 5 and being arranged in die tray 5 offers hydrid integrated circuit in die tray 5
Shell positioning chamber, sectional die block include being arranged in hydrid integrated circuit shell positioning chamber and respectively adjacent with shell 1 two
Side compatible first expansion compensation mechanism and the second expansion compensation mechanism are arranged in hydrid integrated circuit shell positioning chamber
And third expansion compensation mechanism compatible with chamber 4 and along the vertical direction mobile setting positioned in hydrid integrated circuit shell
Flat pin briquetting 6 intracavitary and compatible with flat pin 2.
Wherein, the first expansion compensation mechanism and the second expansion compensation mechanism include that setting is fixed in hydrid integrated circuit shell
The first intracavitary supporting block 7 of position, the second supporting block 8 and the first pressure being arranged between the first supporting block 7 and the second supporting block 8
Block 9, the first supporting block 7 are adapted with the inner sidewall of hydrid integrated circuit shell positioning chamber, and the second supporting block 8 is suitable with 1 phase of shell
Match.First supporting block 7 and the second supporting block 8 are in horizontally disposed triangular prism shape, and the first briquetting 9 is in horizontally disposed cylinder
Shape, and the side of the first briquetting 9 is in contact with the inclined surface of the first supporting block 7, the second supporting block 8.Shell 1, which is equipped with, to be extended
Plate 10 is additionally provided with extension board briquetting 11 compatible with extension board 10 in hydrid integrated circuit shell positioning chamber.
Third expansion compensation mechanism include the third supporting block 12 being disposed in parallel in hydrid integrated circuit shell positioning chamber,
4th supporting block 13 and the second briquetting 14 being arranged between third supporting block 12 and the 4th supporting block 13, flat pin briquetting 6
It moves and is arranged between the 4th supporting block 13 and the inner sidewall of shell 1 along the vertical direction, one end of flat pin 2 is located at flat pin pressure
The lower section of block 6.As shown in figure 4, the side of the 4th supporting block 13 is equipped with lower convex platform 15 compatible with the end of flat pin 2, it is flat
The bottom of pin briquetting 6 is equipped with convex platform 16 compatible with the end of flat pin 2.
Flat pin placing groove 17 compatible with flat pin 2 is offered in die tray 5.
In practical application, shell 1 is put into hydrid integrated circuit shell positioning chamber, later by the first expansion compensation machine
Structure, the second expansion compensation mechanism are put into hydrid integrated circuit shell positioning chamber, and are against on the adjacent two sides of shell 1；Outside
Flat pin 2 and glass insulator 3 are assembled in corresponding position on shell 1, and one end of flat pin 2 is placed in flat pin placing groove 17
In；Third expansion compensation mechanism is put into chamber 4, is located at the other end of flat pin 2 on lower convex platform 15, is put into flat draw later
Foot press block 6, and convex platform 16 is made to be pressed in the end of flat pin 2, high temperature sintering is carried out later.
It can understand the above description of the embodiments is intended to facilitate those skilled in the art and use practical
It is novel.Person skilled in the art obviously easily can make various modifications to these embodiments, and illustrating herein
General Principle be applied in other embodiments without having to go through creative labor.Therefore, the utility model is not limited to above-mentioned
Embodiment, those skilled in the art's announcement according to the present utility model, do not depart from improvement that the utility model scope is made and
Modification should be all within the protection scope of the utility model.
Claims (7)
1. it is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell, outside the hydrid integrated circuit
Shell includes shell (1), multiple flat pins (2) for being plugged in shell (1) one end side by side and is arranged in flat pin (2) and shell
(1) glass insulator (3) between offers chamber (4) on the shell (1), and one end of the flat pin (2) is located at
In chamber (4), which is characterized in that the sintering mold includes the group of die tray (5) and setting on die tray (5)
Box-like mold block offers hydrid integrated circuit shell positioning chamber, the sectional die block in the die tray (5)
It is mended including compatible first expansion in hydrid integrated circuit shell positioning chamber and respectively two sides adjacent with shell (1) is arranged
Mechanism and the second expansion compensation mechanism are repaid, is arranged in hydrid integrated circuit shell positioning chamber and compatible the with chamber (4)
Three expansion compensation mechanisms and along the vertical direction it is mobile be arranged in hydrid integrated circuit shell positioning chamber and with flat pin (2) phase
The flat pin briquetting (6) of adaptation.
2. it is according to claim 1 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, the first expansion compensation mechanism and the second expansion compensation mechanism include being arranged outside hydrid integrated circuit
The first supporting block (7), the second supporting block (8) and setting in shell positioning chamber is in the first supporting block (7) and the second supporting block (8)
Between the first briquetting (9), first supporting block (7) is adapted with the inner sidewall of hydrid integrated circuit shell positioning chamber,
Second supporting block (8) is adapted with shell (1).
3. it is according to claim 2 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, first supporting block (7) and the second supporting block (8) they are in horizontally disposed triangular prism shape, described the
One briquetting (9) is in the side and the first supporting block (7), second of horizontally disposed cylindric and described the first briquetting (9)
The inclined surface of bracer (8) is in contact.
4. it is according to claim 2 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, the shell (1) is equipped with extension board (10), it is additionally provided in the hydrid integrated circuit shell positioning chamber
The compatible extension board briquetting (11) with extension board (10).
5. it is according to claim 1 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, the third expansion compensation mechanism includes the third being disposed in parallel in hydrid integrated circuit shell positioning chamber
Supporting block (12), the 4th supporting block (13) and the second pressure being arranged between third supporting block (12) and the 4th supporting block (13)
Block (14), the inner sidewall in the 4th supporting block (13) and shell (1) is arranged in movement to the flat pin briquetting (6) along the vertical direction
Between, one end of the flat pin (2) is located at the lower section of flat pin briquetting (6).
6. it is according to claim 5 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, the side of the 4th supporting block (13) is equipped with lower convex platform (15) compatible with the end of flat pin (2),
The bottom of the flat pin briquetting (6) is equipped with convex platform (16) compatible with the end of flat pin (2).
7. it is according to claim 6 a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell,
It is characterized in that, offering the compatible flat pin placing groove (17) with flat pin (2) in the die tray (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821482656.1U CN208706578U (en) | 2018-09-11 | 2018-09-11 | It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821482656.1U CN208706578U (en) | 2018-09-11 | 2018-09-11 | It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208706578U true CN208706578U (en) | 2019-04-05 |
Family
ID=65946993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821482656.1U Active CN208706578U (en) | 2018-09-11 | 2018-09-11 | It is a kind of for the high level degree sintering mold containing flat pin hydrid integrated circuit shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208706578U (en) |
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2018
- 2018-09-11 CN CN201821482656.1U patent/CN208706578U/en active Active
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