CN208338187U - A kind of semiconductor refrigerating dehumidification device - Google Patents

A kind of semiconductor refrigerating dehumidification device Download PDF

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Publication number
CN208338187U
CN208338187U CN201821065398.7U CN201821065398U CN208338187U CN 208338187 U CN208338187 U CN 208338187U CN 201821065398 U CN201821065398 U CN 201821065398U CN 208338187 U CN208338187 U CN 208338187U
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China
Prior art keywords
cold end
shell
hot
cooling fin
display screen
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Active
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CN201821065398.7U
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Chinese (zh)
Inventor
杨杰
史友龙
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Nanjing Huashui Technology Co Ltd
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Nanjing Huashui Technology Co Ltd
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Priority to CN201821065398.7U priority Critical patent/CN208338187U/en
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Abstract

The utility model discloses a kind of semiconductor refrigerating dehumidification devices, including shell, display screen is installed at the top of the side outer wall of shell, the surface of display screen is equipped with film key, the lower section of display screen is equipped with the air hole through shell, the bottom interior wall of shell is fixedly connected with cold end fan, cold end fan is connected with cold end cooling fin far from the side of air hole, cold end cooling fin is connected with semiconductor chilling plate far from the side of cold end fan, and cold end cooling fin is contacted with the cold end of semiconductor chilling plate, semiconductor chilling plate is fixedly connected with hot-side heat dissipation piece far from the side of cold end cooling fin, and hot-side heat dissipation piece is contacted with the hot end of semiconductor chilling plate.The utility model can reduce water content in air, so that relative humidity and absolute humidity reduce simultaneously, hardly improve cabinet body temperature, the negative effect of temperature difference bring is not generated, it can be good at realizing the effect of air dewetting in cabinet, the automatic data that upload reduce the workload of patrol officer to patrol officer.

Description

A kind of semiconductor refrigerating dehumidification device
Technical field
The utility model relates to technical field of semiconductors more particularly to a kind of semiconductor refrigerating dehumidification devices.
Background technique
With the continuous development of computer and network technologies, the development of industrial technology is driven, more and more cabinets exist It is applied in life, there is important electricity spare parts in each cabinet, humidity height will lead to equipment premature aging, dielectric strength drop Low, terminal breakdown, material mildew and corrosion of metal structure etc..A decisive role is just played in cabinet dehumidifying.
Cabinet dehumidifying at present has following several method:
1, by installation heater, increase interior of the cabinet air themperature, reduce water-vapo(u)r saturation degree, so that it is opposite to reach reduction The purpose of humidity.
2, semiconductor refrigerating dehumidification device is installed, air is condensed into water after semiconductor refrigerating mechanism in cabinet body, then leads to Drainage pipeline is crossed to be discharged to outside cabinet body, by reducing water content in air, so that relative humidity and absolute humidity reduce simultaneously, it is several Cabinet body temperature is not improved, is not generated the negative effect of temperature difference bring, is fundamentally prevented or reduce the generation of accident, not yet It can lead to the aging of device aging and cabinet body in cabinet because of high temperature.
Utility model content
Purpose of the utility model is to solve disadvantages existing in the prior art, and a kind of semiconductor refrigerating proposed Dehumidification device.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of semiconductor refrigerating dehumidification device, including shell are equipped with display screen at the top of the side outer wall of the shell, The surface of the display screen is equipped with film key, and the lower section of the display screen is equipped with the air hole through shell, the shell Bottom interior wall is fixedly connected with cold end fan, and the cold end fan is connected with cold end cooling fin far from the side of air hole, described Cold end cooling fin is connected with semiconductor chilling plate far from the side of cold end fan, and cold end cooling fin and semiconductor chilling plate is cold End in contact, the semiconductor chilling plate are fixedly connected with hot-side heat dissipation piece, and hot-side heat dissipation piece far from the side of cold end cooling fin It being contacted with the hot end of semiconductor chilling plate, the hot-side heat dissipation piece is equipped with hot end fan far from the side of semiconductor chilling plate, The side inner wall of the shell is fixedly connected with master control borad, and the bottom shell wall of the shell offers apopore, the apopore Lower section be equipped with and be fixedly connected with drainpipe with the bottom outer wall of shell, and drainpipe is located at cold end cooling fin lower section.
Preferably, side of the shell far from master control borad be by being connected with humidity sensor, the humidity sensor Model SHT10, the display screen are charactron.
Preferably, the sheathing material uses stainless steel material, the material that the cold end cooling fin and hot-side heat dissipation piece are For aluminum alloy material, air inlet is offered at the top of the shell.
Preferably, the master control borad and semiconductor chilling plate, cold end fan, hot end fan, display screen, film key and temperature Humidity sensor is electrically connected by conducting wire, integrated GSM module on the master control borad.
Preferably, the drainpipe is in funnel shaped, and the top internal diameter of drainpipe is greater than bottom inner diameter, the drainpipe Material be rubber material.
Compared with prior art, the beneficial effects of the utility model are: the utility model is by being equipped with semiconductor system Cold, cold end fan, hot end fan, cold end cooling fin, hot-side heat dissipation piece, the structures such as drainpipe, can be dropped by these structures Water content in the gas of low latitude hardly improves cabinet body temperature, does not generate temperature difference band so that relative humidity and absolute humidity reduce simultaneously The negative effect come can be good at the effect for realizing air dewetting in cabinet, can intelligently be started according to cabinet humidity situation Equipment operation, the automatic data that upload reduce the workload of patrol officer to patrol officer.
Detailed description of the invention
Fig. 1 be the utility model proposes a kind of semiconductor refrigerating dehumidification device System Working Principle figure;
Fig. 2 be the utility model proposes a kind of semiconductor refrigerating dehumidification device systematic part figure;
Fig. 3 be the utility model proposes a kind of semiconductor refrigerating dehumidification device overall structure diagram;
Fig. 4 be the utility model proposes a kind of semiconductor refrigerating dehumidification device schematic diagram of internal structure.
In figure: 1 master control borad, 2 semiconductor chilling plates, 3 cold end fans, 4 hot end fans, 5 display screens, 6 film keys, 7 wet Spend sensor, 8 cold end cooling fins, 9 hot-side heat dissipation pieces, 10 drainpipes, 11 shells.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.
Referring to Fig.1-4, a kind of semiconductor refrigerating dehumidification device, including shell 11, the top peace of the side outer wall of shell 11 Equipped with display screen 5, the surface of display screen 5 is equipped with film key 6, and the lower section of display screen 5 is equipped with the air hole through shell 11, outside The bottom interior wall of shell 11 is fixedly connected with cold end fan 3, and cold end fan 3 is connected with cold end cooling fin 8 far from the side of air hole, Cold end cooling fin 8 is connected with semiconductor chilling plate 2, and cold end cooling fin 8 and semiconductor chilling plate far from the side of cold end fan 3 2 cold end contact, semiconductor chilling plate 2 is fixedly connected with hot-side heat dissipation piece 9 far from the side of cold end cooling fin 8, and hot end dissipates Backing 9 is contacted with the hot end of semiconductor chilling plate 2, and hot-side heat dissipation piece 9 is equipped with hot end wind far from the side of semiconductor chilling plate 2 Fan 4, the side inner wall of shell 11 are fixedly connected with master control borad 1, and the bottom shell wall of shell 11 offers apopore, under apopore Side, which is equipped with, is fixedly connected with drainpipe 10 with the bottom outer wall of shell 11, and drainpipe 10 is located at 8 lower section of cold end cooling fin.
Side of the shell 11 far from master control borad 1 is by being connected with humidity sensor 7, the model of humidity sensor 7 SHT10, display screen 5 are charactron, and 11 material of shell uses stainless steel material, the material that cold end cooling fin 8 and hot-side heat dissipation piece 9 are Matter is aluminum alloy material, and the top of shell 11 offers air inlet, master control borad 1 and semiconductor chilling plate 2, cold end fan 3, hot end Fan 4, display screen 5, film key 6 and Temperature Humidity Sensor 7 are electrically connected by conducting wire, integrated GSM module on master control borad 1, Drainpipe 10 is in funnel shaped, and the top internal diameter of drainpipe 10 is greater than bottom inner diameter, and the material of drainpipe 10 is rubber material.
In the present embodiment, firstly, air is flowed on cold end cooling fin 8 by air inlet in cabinet, due to cold end cooling fin 8 Temperature it is low, moisture condensation Cheng Shui is flowed in drainpipe 10, cold end fan 3 accelerate condensation rate, improve efficiency, hot end fan 4 Heat on hot-side heat dissipation piece 9 is discharged, so that semiconductor chilling plate 2 works normally, master control borad 1 passes through humidity sensor 7 The data of acquisition, intelligent control cold end fan 3, semiconductor chilling plate 2, hot end fan 4 run, realtime curve are being shown On screen 5, film key 6 is used to that parameter is arranged.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model Within enclosing.

Claims (5)

1. a kind of semiconductor refrigerating dehumidification device, including shell (11), which is characterized in that the side outer wall of the shell (11) Top is equipped with display screen (5), and the surface of the display screen (5) is equipped with film key (6), is set below the display screen (5) There is the air hole through shell (11), the bottom interior wall of the shell (11) is fixedly connected with cold end fan (3), the cold end wind Fan (3) is connected with cold end cooling fin (8) far from the side of air hole, and the one of the cold end cooling fin (8) separate cold end fan (3) Side is connected with semiconductor chilling plate (2), and cold end cooling fin (8) is contacted with the cold end of semiconductor chilling plate (2), the semiconductor Cooling piece (2) is fixedly connected with hot-side heat dissipation piece (9) far from the side of cold end cooling fin (8), and hot-side heat dissipation piece (9) with partly lead The hot end of body cooling piece (2) contacts, and the hot-side heat dissipation piece (9) is equipped with hot end wind far from the side of semiconductor chilling plate (2) It fans (4), the side inner wall of the shell (11) is fixedly connected with master control borad (1), and the bottom shell wall of the shell (11) offers Apopore, the lower section of the apopore is equipped with to be fixedly connected with drainpipe (10) with the bottom outer wall of shell (11), and drainpipe (10) it is located at below cold end cooling fin (8).
2. a kind of semiconductor refrigerating dehumidification device according to claim 1, which is characterized in that the shell (11) is far from main The side of control plate (1) is by being connected with humidity sensor (7), the model SHT10 of the humidity sensor (7), the display Shielding (5) is charactron.
3. a kind of semiconductor refrigerating dehumidification device according to claim 1, which is characterized in that shell (11) material is adopted With stainless steel material, the material that the cold end cooling fin (8) and hot-side heat dissipation piece (9) are is aluminum alloy material, the shell (11) air inlet is offered at the top of.
4. a kind of semiconductor refrigerating dehumidification device according to claim 1, which is characterized in that the master control borad (1) and half Conductor cooling piece (2), cold end fan (3), hot end fan (4), display screen (5), film key (6) and Temperature Humidity Sensor (7) It is electrically connected by conducting wire, integrated GSM module on the master control borad (1).
5. a kind of semiconductor refrigerating dehumidification device according to claim 1, which is characterized in that the drainpipe (10) is in leakage Bucket shape shape, and the top internal diameter of drainpipe (10) is greater than bottom inner diameter, the material of the drainpipe (10) is rubber material.
CN201821065398.7U 2018-07-06 2018-07-06 A kind of semiconductor refrigerating dehumidification device Active CN208338187U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821065398.7U CN208338187U (en) 2018-07-06 2018-07-06 A kind of semiconductor refrigerating dehumidification device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821065398.7U CN208338187U (en) 2018-07-06 2018-07-06 A kind of semiconductor refrigerating dehumidification device

Publications (1)

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CN208338187U true CN208338187U (en) 2019-01-04

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CN201821065398.7U Active CN208338187U (en) 2018-07-06 2018-07-06 A kind of semiconductor refrigerating dehumidification device

Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110486983A (en) * 2019-07-25 2019-11-22 中国科学院广州能源研究所 A kind of controllable temperature semiconductor damp-proof moisture removing apparatus
CN115518312A (en) * 2022-08-11 2022-12-27 北京机械设备研究所 Cooling device and breathing equipment based on oxygen respirator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110486983A (en) * 2019-07-25 2019-11-22 中国科学院广州能源研究所 A kind of controllable temperature semiconductor damp-proof moisture removing apparatus
CN110486983B (en) * 2019-07-25 2021-11-09 中国科学院广州能源研究所 Temperature-controllable semiconductor moisture-proof and dehumidifying device
CN115518312A (en) * 2022-08-11 2022-12-27 北京机械设备研究所 Cooling device and breathing equipment based on oxygen respirator

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