CN208336186U - A kind of chip diode structure of adhesive-spill-preventing - Google Patents
A kind of chip diode structure of adhesive-spill-preventing Download PDFInfo
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- CN208336186U CN208336186U CN201820809998.3U CN201820809998U CN208336186U CN 208336186 U CN208336186 U CN 208336186U CN 201820809998 U CN201820809998 U CN 201820809998U CN 208336186 U CN208336186 U CN 208336186U
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- conductive sheet
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Abstract
The utility model system provides a kind of chip diode structure of adhesive-spill-preventing, including the first conductive sheet and the second conductive sheet, and chip is connected between the first conductive sheet and the second conductive sheet, plastic-sealed body is fixed with outside chip；First conductive sheet successively includes the first upper mounting plate, the first bending interconnecting piece and the first lower pin, second conductive sheet successively includes the second upper mounting plate, the second bending interconnecting piece and the second lower pin, chip is between the first upper mounting plate and the second upper mounting plate, the difference in height of first lower pin bottom surface and the first bending interconnecting piece minimum point is D, and the second lower pin bottom surface and the difference in height of the second bending interconnecting piece minimum point are also D.The utility model is when being molded type chamber, it can effectively ensure that between type bottom of chamber face and the bottom surface of lower pin be not in gap, to effectively prevent fluid plastic overflow to the bottom surface of lower pin, it can effectively ensure that lower pin can be normally electrically connected with pcb board.
Description
Technical field
The utility model relates to chip diodes, specifically disclose a kind of chip diode structure of adhesive-spill-preventing.
Background technique
Diode is a kind of electronic device that can unidirectionally conduct electric current, is equipped with PN junction inside diode, the two of PN junction
End is equipped with lead terminal, if having the unilateral conductivity of electric current according to the direction of applied voltage.Most of diode is had
Current direction we be normally referred to as rectification function, diode can generate heat during rectification, especially big electricity
Stream power consumption in rectification is larger, causes the calorific value of diode also to increase, influences the performance of diode.
The production method of conventional diode is chip to be welded in nead frame, then pass through electrical fire flower process compacting conduction
Piece forms bending Z-type, and conductive sheet generally comprises upper mounting plate, bending interconnecting piece and lower pin, and drawing for chip is being welded in upper and lower mould
The pressing mold shape forming cavity of carry out up and down of foot frame obtains diode package after being molded into mold, the conductive sheet meeting after bending
Make to form gap between the bottom surface of lower pin and the bottom surface of type chamber, fluid plastic can be by the R of bending interconnecting piece in injection moulding process
Overflow causes the bottom surface of lower pin to be covered by ambroin, will affect diode and pcb board just to the bottom surface of lower pin at angle
Often connection uses.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of chip diode structure of adhesive-spill-preventing, Neng Gouyou
Effect prevents fluid plastic overflow to the bottom surface of lower pin, can effectively ensure that lower pin can be normally electrically connected with pcb board.
To solve prior art problem, the utility model discloses a kind of chip diode structure of adhesive-spill-preventing, including is in Z
The first conductive sheet and the second conductive sheet of type are connected with chip, are fixed with outside chip between the first conductive sheet and the second conductive sheet
Across the plastic-sealed body of the first conductive sheet and the second conductive sheet；
First conductive sheet successively includes the first upper mounting plate, the first bending interconnecting piece and the first lower pin, the second conductive sheet according to
Secondary includes the second upper mounting plate, the second bending interconnecting piece and the second lower pin, chip be located at the first upper mounting plate and the second upper mounting plate it
Between, the difference in height of the first lower pin bottom surface and the first bending interconnecting piece minimum point is D, and the second lower pin bottom surface connects with the second bending
The difference in height of socket part minimum point is also D.
Further, 0.02mm≤D≤0.05mm.
Further, the bottom surface of the first lower pin and the bottom surface of the second lower pin protrude from the bottom surface of plastic-sealed body.
Further, chip is fixed on the second upper mounting plate, and the bottom of the first upper mounting plate is fixed with elargol boss, chip
Top surface offsets with elargol boss and connect.
Further, it is fixedly connected between chip and elargol boss by copper particle layer.
The utility model has the following beneficial effects: the utility model discloses a kind of chip diode structure of adhesive-spill-preventing, if
The downwardly projecting minimum point in the second bending interconnecting piece in bottom surface for setting lower pin can effectively really when being molded to type chamber
It is not in gap between guarantor's type bottom of chamber face and the bottom surface of lower pin, to effectively prevent fluid plastic overflow to the bottom of lower pin
Face, the face for ultimately forming the lower pin of diode will not be attached with plastics, can effectively ensure lower pin can normally and pcb board into
Row electrical connection.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the utility model.
Fig. 2 is the schematic diagram of the section structure of the utility model A-A ' along Fig. 1.
Fig. 3 is the enlarged structure schematic diagram of the utility model B in Fig. 2.
Appended drawing reference are as follows: the lower pin 13 of the first conductive sheet 10, the first upper mounting plate 11, the first bending interconnecting piece 12, first, the
Two conductive sheets 20, the second upper mounting plate 21, the second bending interconnecting piece 22, second pin 23, chip 30, elargol boss 31, copper particle weldering
Layer 32, plastic-sealed body 40.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
Referring to figs. 1 to Fig. 3.
The utility model embodiment discloses a kind of chip diode structure of adhesive-spill-preventing, conductive including Z-shaped first
Piece 10 and with the second Z-shaped conductive sheet 20, is connected with chip 30, chip 30 between the first conductive sheet 10 and the second conductive sheet 20
It is fixed with the plastic-sealed body 40 across the first conductive sheet 10 and the second conductive sheet 20 outside；
First conductive sheet 10 successively includes the first upper mounting plate 11, first bending interconnecting piece 12 and the first lower pin 13, and second
Conductive sheet 20 successively includes the second upper mounting plate 21, second bending interconnecting piece 22 and the second lower pin 23, and chip 30 is located on first
Between platform 11 and the second upper mounting plate 21, the first lower 13 bottom surface of pin and the difference in height of the first bending 12 minimum point of interconnecting piece are D,
The downwardly projecting lowest point in the first bending interconnecting piece 12 in the bottom surface of i.e. first lower pin 13, the second lower 23 bottom surface of pin and second
The difference in height for bending 22 minimum point of interconnecting piece is also D, i.e., the bottom surface of the second lower pin 23 is downwardly projecting to bend interconnecting piece in second
22 lowest point.
The downwardly projecting minimum point in the second bending interconnecting piece in bottom surface of lower pin is arranged in the utility model, to type chamber into
When row injection molding, it can effectively ensure that between type bottom of chamber face and the bottom surface of lower pin be not in gap, to effectively prevent fluid
For plastics by overflow at the angle R of bending interconnecting piece to the bottom surface of lower pin, the face for ultimately forming the lower pin of diode will not be attached
Have plastics, can effectively ensure that lower pin can be normally electrically connected with pcb board.
In the present embodiment, due to the size of chip diode be all it is smaller, setting 0.02mm≤D≤
0.05mm, it can be ensured that the bottom surface of lower pin will not protrude from bending interconnecting piece minimum point it is excessive, to improve integrally-built
Stability, while ensuring that the part protruded can effectively stop fluid plastic, it is preferable that 0.02mm≤D≤0.03mm.
In the present embodiment, the bottom surface of the first lower pin 13 and the bottom surface of the second lower pin 23 are downwardly projecting in plastic-sealed body
40 bottom surface, it is preferable that the height of protrusion is 0.01~0.02mm.
In the present embodiment, chip 30 is fixed on the second upper mounting plate 21 by scolding tin, and the bottom of the first upper mounting plate 11 is solid
Surely there is elargol boss 31, the top surface of chip 30 offsets with elargol boss 31 to be connect, and elargol boss 31 can effectively improve diode
Whole heat dissipation effect, while can effectively improve chip 30 and the second upper mounting plate 21 is electrically connected effect.
In the present embodiment, it is fixedly connected between chip 30 and elargol boss 31 by copper particle layer 32, copper particle layer 32
It is generally doped with the soldering-tin layer of fine copper particle, the secured of connection structure between chip 30 and pin boss 31 can be effectively improved
Property, to effectively improve the integrally-built stability of diode.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (5)
1. a kind of chip diode structure of adhesive-spill-preventing, which is characterized in that including Z-shaped the first conductive sheet (10) and second
Conductive sheet (20) is connected with chip (30), the chip between first conductive sheet (10) and second conductive sheet (20)
(30) plastic-sealed body (40) across first conductive sheet (10) and second conductive sheet (20) is fixed with outside；
First conductive sheet (10) successively includes the first upper mounting plate (11), the first bending interconnecting piece (12) and the first lower pin
(13), second conductive sheet (20) successively includes the second upper mounting plate (21), the second bending interconnecting piece (22) and the second lower pin
(23), the chip (30) is drawn under described first between first upper mounting plate (11) and second upper mounting plate (21)
The difference in height of foot (13) bottom surface and described first bending interconnecting piece (12) minimum point is D, the described second lower pin (23) bottom surface with
The difference in height of described second bending interconnecting piece (22) minimum point is also D.
2. a kind of chip diode structure of adhesive-spill-preventing according to claim 1, which is characterized in that 0.02mm≤D≤
0.05mm。
3. a kind of chip diode structure of adhesive-spill-preventing according to claim 1, which is characterized in that draw under described first
The bottom surface of the bottom surface of foot (13) and second lower pin (23) protrudes from the bottom surface of the plastic-sealed body (40).
4. a kind of chip diode structure of adhesive-spill-preventing according to claim 1, which is characterized in that the chip (30)
It is fixed on second upper mounting plate (21), the bottom of first upper mounting plate (11) is fixed with elargol boss (31), the core
The top surface of piece (30) offsets with the elargol boss (31) and connect.
5. a kind of chip diode structure of adhesive-spill-preventing according to claim 4, which is characterized in that the chip (30)
It is fixedly connected between the elargol boss (31) by copper particle layer (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809998.3U CN208336186U (en) | 2018-05-28 | 2018-05-28 | A kind of chip diode structure of adhesive-spill-preventing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809998.3U CN208336186U (en) | 2018-05-28 | 2018-05-28 | A kind of chip diode structure of adhesive-spill-preventing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208336186U true CN208336186U (en) | 2019-01-04 |
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ID=64775725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820809998.3U Active CN208336186U (en) | 2018-05-28 | 2018-05-28 | A kind of chip diode structure of adhesive-spill-preventing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208336186U (en) |
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2018
- 2018-05-28 CN CN201820809998.3U patent/CN208336186U/en active Active
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