CN208334229U - Printed IC board detection system - Google Patents
Printed IC board detection system Download PDFInfo
- Publication number
- CN208334229U CN208334229U CN201820655718.8U CN201820655718U CN208334229U CN 208334229 U CN208334229 U CN 208334229U CN 201820655718 U CN201820655718 U CN 201820655718U CN 208334229 U CN208334229 U CN 208334229U
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- China
- Prior art keywords
- detected
- substrate
- film
- imaging device
- mark line
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of printed IC board detection systems, it includes wiring board limiting device, CCD detection device, display imaging device and film egative film, CCD detection device and display imaging device are electrically connected, the display surface of display imaging device is arranged in the fitting of film egative film, wiring board limiting device is arranged below CCD detection device, substrate to be detected is installed in wiring board limiting device, CCD detection device is used to show on the picture transfer of substrate to be detected to display imaging device；Edge wire is provided on film egative film, edge wire is overlapped with the lower edges of the picture of substrate to be detected, and upper limit mark line and lower limit mark line are arranged in parallel in edge wire.The utility model is by being attached to the display surface being shown as device for film egative film, it is compared using the upper limit mark line and lower limit mark line being arranged on film egative film with the real time picture of substrate to be detected shown on display imaging device, completes the offset to substrate to be detected and screen.
Description
Technical field
The utility model relates to a kind of printed wiring boards, more particularly, to a kind of printed IC board detection system.
Background technique
In the production process of printed wiring board, there is sporadic offset in the copper PAD and line edge of printed wiring board
It is not avoided that, after beer sheet metal forming, the substrate of offset is difficult to effectively and quickly screen out, and exists and flows into the risk of client: one,
Client generates offset when printing tin slurry, leads to component rosin joint；Two, after client posts lamp bead, because lamp bead deviates ultra-specification, dress
There are the bad phenomenons such as side leakage light after mixing display.So, it is necessary to such substrate be carried out after printed wiring sheet metal forming
It effectively screens and intercepts, and how sufficiently printed wiring board to be screened and is intercepted, be the direction for needing emphasis to be researched and developed.
Utility model content
Based on this, it is necessary in view of the deficiencies of the prior art, provide and a kind of effectively carry out offset examination to substrate to be detected
Printed IC board detection system.
A kind of printed IC board inspection that in order to solve the above technical problems, the technical scheme adopted by the utility model is:
Examining system comprising wiring board limiting device, CCD detection device, display imaging device and film egative film, the CCD detection dress
It sets and is electrically connected with display imaging device, the display surface of display imaging device is arranged in the film egative film fitting, described
Wiring board limiting device is arranged below CCD detection device, and substrate to be detected is installed in the wiring board limiting device, described
CCD detection device is used to show on the picture transfer of substrate to be detected to display imaging device；It is arranged on the film egative film
There is edge wire, shows that the lower edges of the picture of substrate to be detected are overlapped in the edge wire and display imaging device, institute
It states and is arranged in parallel with upper limit mark line and lower limit mark line in edge wire.
The wiring board limiting device is provided with horizontal baffle, the substrate patch to be detected in one of the embodiments,
The flat baffle plate setting of Heshui.
The range between the upper limit mark line and lower limit mark line is that client's permission is to be checked in one of the embodiments,
Survey the offset of substrate offset.
In conclusion the utility model printed IC board detection system is shown as picture by the way that film egative film to be attached to
The display surface of device, using the upper limit mark line and lower limit mark line and substrate to be detected being arranged on film egative film aobvious
Show that the real time picture shown on imaging device is compared, completes the offset to substrate to be detected and screen.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model printed IC board detection system；
Fig. 2 is the structural schematic diagram of the utility model film egative film.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
As depicted in figs. 1 and 2, the utility model printed IC board detection system include wiring board limiting device 10,
CCD detection device 20, display imaging device 30 and film egative film 40, the CCD detection device 20 and 30 electricity of display imaging device
Property connection, the film egative film 40 is bonded the display surface that display imaging device 30 is arranged in, the wiring board limiting device
10 are arranged below CCD detection device 20, and the wiring board limiting device 10 is provided with horizontal baffle 11, the wiring board limit
Substrate 50 to be detected is installed in device 10, the substrate 50 to be detected is bonded horizontal baffle 11 and is arranged, the wiring board limit
The horizontal baffle 11 of device 10 is for limiting substrate 50 to be detected, so that CCD detection device 20 can be treated steadily
Detection substrate 50 is shot, and the CCD detection device 20 is shown as the real time picture of substrate 50 to be detected to be transmitted to
As being shown on device 30.
Edge wire 41 is provided on the film egative film 40, the edge wire 41 is shot with through CCD detection device 20
The lower edges of the real time picture of substrate to be detected 50 afterwards are overlapped, and are arranged in parallel with upper limit mark line in the edge wire 41
42 and lower limit mark line 43, the range between the upper limit mark line 42 and lower limit mark line 43 is that client allows base to be detected
The offset that plate 50 deviates, to be detected to the copper PAD offset on substrate 50 to be detected, if the copper on substrate to be detected 50
PAD is between upper limit mark line 42 and lower limit mark line 43, then substrate 50 to be detected is qualified product；If on substrate 50 to be detected
Copper PAD is beyond 43 lower section of 42 top of upper limit mark line or lower limit mark line, then substrate 50 to be detected is defective products.
The utility model is when it is implemented, firstly, being placed into substrate 50 to be detected on wiring board limiting device 10 and pasting
It closes horizontal baffle 11 to be arranged, the magnifying glass multiple of CCD detection device 20 is adjusted, until substrate 50 to be detected can clearly be seen
Until the offset control datum mark of upper corresponding customer requirement, and record the amplification factor of corresponding CCD detection device 20, wherein
The offset control datum mark of customer requirement is the copper PAD construction in the present embodiment；According to the times magnification of above-mentioned CCD detection device 20
Number, to make the film egative film 40 of corresponding same amplification factor, while be arranged on film egative film 40 upper limit mark line 42 and under
Mark line 43 is limited, and film egative film 40 is installed in the display surface of display imaging device 30, to subsequent base to be detected
Plate 50 carries out detection judgement, the real time picture and upper limit mark line 42 of the substrate to be detected 50 after the shooting of CCD detection device 20
And lower limit mark line 43 is compared, and completes the offset to substrate 50 to be detected and screens.
In conclusion the utility model printed IC board detection system is shown as by the way that film egative film 40 to be attached to
As the display surface of device 30, using the upper limit mark line 42 and lower limit mark line 43 being arranged on film egative film 40 with it is to be detected
The real time picture of substrate shown on display imaging device 30 is compared, and completes the offset to substrate 50 to be detected and screens.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to the scope of the utility model.It should be pointed out that for the ordinary skill of this field
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this
The protection scope of utility model.Therefore, the protection scope of the utility model should be determined by the appended claims.
Claims (3)
1. a kind of printed IC board detection system, it is characterised in that: including wiring board limiting device, CCD detection device, show
Show that imaging device and film egative film, the CCD detection device and display imaging device are electrically connected, the film egative film fitting is set
The display surface in display imaging device is set, the wiring board limiting device is arranged below CCD detection device, the route
Substrate to be detected is installed in plate limiting device, the CCD detection device is used for the picture transfer of substrate to be detected to display
It is shown on imaging device；It is provided with edge wire on the film egative film, is shown on the edge wire and display imaging device
The lower edges of the picture of substrate to be detected are overlapped, and upper limit mark line and lower limit label are arranged in parallel in the edge wire
Line.
2. printed IC board detection system according to claim 1, it is characterised in that: the wiring board limiting device
It is provided with horizontal baffle, the substrate fitting horizontal baffle setting to be detected.
3. printed IC board detection system according to claim 1 or 2, it is characterised in that: the upper limit mark line
And the range between lower limit mark line is the offset that client allows substrate offset to be detected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820655718.8U CN208334229U (en) | 2018-05-04 | 2018-05-04 | Printed IC board detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820655718.8U CN208334229U (en) | 2018-05-04 | 2018-05-04 | Printed IC board detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208334229U true CN208334229U (en) | 2019-01-04 |
Family
ID=64776438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820655718.8U Expired - Fee Related CN208334229U (en) | 2018-05-04 | 2018-05-04 | Printed IC board detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208334229U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188747A (en) * | 2020-10-13 | 2021-01-05 | 合肥泽延微电子有限公司 | Intelligent positioning system for wiring of integrated circuit board |
-
2018
- 2018-05-04 CN CN201820655718.8U patent/CN208334229U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188747A (en) * | 2020-10-13 | 2021-01-05 | 合肥泽延微电子有限公司 | Intelligent positioning system for wiring of integrated circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |