CN208333717U - A kind of device for pressure measurement of die bond swing arm - Google Patents
A kind of device for pressure measurement of die bond swing arm Download PDFInfo
- Publication number
- CN208333717U CN208333717U CN201820809996.4U CN201820809996U CN208333717U CN 208333717 U CN208333717 U CN 208333717U CN 201820809996 U CN201820809996 U CN 201820809996U CN 208333717 U CN208333717 U CN 208333717U
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- micrometer
- swing arm
- elevating mechanism
- die bond
- sliding block
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Abstract
The utility model system provides a kind of device for pressure measurement of die bond swing arm, including rack, rack is equipped with fixed plate, the side of fixed plate is fixed with sliding rail, the side of sliding rail slidably connects sliding block, and micro pressure sensor is fixed on sliding block, is further fixed on mounting blocks in fixed plate, micrometer elevating mechanism is installed, the output end of micrometer elevating mechanism acts on sliding block on mounting blocks.Reliable measurement structure is arranged in the utility model, the operation of measurement die bond swing arm pressure can significantly be simplified, the working strength of operating personnel can be significantly reduced, and the cooperation of each structure is coherent reliable, reliable and stable precondition can be provided for pressure measurement, measurement accuracy is high, the reproducibility of measurement is good, and device overall structure is simple, and cost of manufacture is lower.
Description
Technical field
The utility model relates to pressure measurements, specifically disclose a kind of device for pressure measurement of die bond swing arm.
Background technique
Chip is the nuclear structure of miniature electronic part, in the manufacturing process of the electronic components such as diode, triode, is needed
Chip is fixed on frame, then carries out the operation of injection molding packaging again.
Die bond process is the die bond swing arm swing that motor driven is equipped with suction nozzle, and die bond swing arm reaches above wafer disk or frame
When, driving die bond swing arm decline feeding or feed, the dynamics of die bond swing arm lifting it is excessive or it is too small can all influence die bond effect, because
And it is typically necessary and the pressure of die bond swing arm is measured.In the prior art, the method for measuring die bond swing arm pressure is to pass through
Manual dynamometer pulls die bond swing arm, and the reading of dynamometer is just deposited when worker lifts dynamometer manually for the pressure of die bond swing arm
In the uncertain factors such as handshaking, pull-out altitude is inaccurate, measurement result can be seriously affected.
Utility model content
Based on this, it is necessary to it is directed to prior art problem, a kind of device for pressure measurement of die bond swing arm is provided, it can be significant
Simplify the measurement operation of die bond swing arm pressure, and measurement accuracy is high, the reproducibility of measurement is good.
To solve prior art problem, the utility model discloses a kind of device for pressure measurement of die bond swing arm, including rack,
Rack is equipped with fixed plate, and the side of fixed plate is fixed with sliding rail, and the side of sliding rail slidably connects sliding block, is fixed on sliding block
Micro pressure sensor is further fixed on mounting blocks in fixed plate, and micrometer elevating mechanism, micrometer lifting are equipped on mounting blocks
The output end of mechanism acts on sliding block.
Further, thick elevating mechanism, the output end and fixed plate of thick elevating mechanism are additionally provided between rack and fixed plate
It is fixedly connected.
Further, thick elevating mechanism is screw lift structure.
Further, the output end of micrometer elevating mechanism is downward, and sliding block includes that the mounting base being fixedly connected and stress are driven
Movable plate, sliding block are installed in mounting base, and the output end of micrometer elevating mechanism acts on driver under stress plate, and driver under stress plate is logical
Spring is crossed to connect with fixed plate.
Further, micrometer elevating mechanism includes fixes sleeve, and output screw, output screw are connected in fixes sleeve
One end be connected with microdrum, differential sleeve is set to outside fixes sleeve.
Further, micrometer elevating mechanism is digimatic micrometer structure.
The utility model has the following beneficial effects: the utility model discloses a kind of device for pressure measurement of die bond swing arm, setting
Reliable measurement structure, can significantly simplify the operation of measurement die bond swing arm pressure, and the work that can significantly reduce operating personnel is strong
Degree, and the cooperation of each structure is coherent reliable, can provide reliable and stable precondition for pressure measurement, measurement accuracy height,
The reproducibility of measurement is good, and device overall structure is simple, and cost of manufacture is lower.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the utility model.
Fig. 2 is the enlarged structure schematic diagram of the utility model a in Fig. 1.
Appended drawing reference are as follows: rack 10, thick elevating mechanism 11, fixed plate 20, sliding rail 21, sliding block 22, mounting base 221, stress
Driving plate 222, micro pressure sensor 23, mounting hole 24, spring 25, micrometer elevating mechanism 30, bald sleeve 31, output spiral shell
Bar 32, microdrum 33.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
With reference to Fig. 1, Fig. 2.
The utility model embodiment discloses a kind of device for pressure measurement of die bond swing arm, including rack 10, sets in rack 10
There is fixed plate 20, the side of fixed plate 20 is fixed with sliding rail 21, and the side of sliding rail 21 slidably connects sliding block 22, pacifies on sliding block 22
Dress is fixed with micro pressure sensor 23, and micro pressure sensor 23 connects the external display with signal processing function, micro-
The reading of type pressure sensor 23 is shown by the display, and mounting blocks 24 are further fixed in fixed plate 20, are pacified on mounting blocks 24
Equipped with micrometer elevating mechanism 30, micrometer elevating mechanism 30 is the micrometer for removing ruler frame and die bond anvil, passes through above-mentioned thousand points
The output end of ruler realizes that high-precision position is adjusted, and the output end of micrometer elevating mechanism 30 acts on sliding block 22, thousand points
Measuring surface of the output end of ruler elevating mechanism 30 perpendicular to micro pressure sensor 23.
The working process of the utility model is as follows: mobile bracket 10 makes micro pressure sensor 23 be located at die bond swing arm suction nozzle
Underface；Adjusting micrometer elevating mechanism 30 goes up and down sliding block 22 in sliding rail 21, until micro pressure sensor 23 is just
Die bond swing arm suction nozzle is touched, if the reading of micrometer elevating mechanism 30 and micro pressure sensor 23 is 0, that is, regards thousand points at this time
The reading of ruler elevating mechanism 30 and micro pressure sensor 23 is 0, to facilitate subsequent adjusting, reading operation；Adjust micrometer
Elevating mechanism 30 makes micro pressure sensor 23 rise 1mm, and the reading of micro pressure sensor 23 is the pressure value of die bond swing arm.
Reliable measurement structure is arranged in the utility model, can significantly simplify the operation of measurement die bond swing arm pressure, can show
The working strength for reducing operating personnel is write, and the cooperation of each structure is coherent reliable, can provide for pressure measurement reliable and stable
Precondition, measurement accuracy is high, the reproducibility of measurement is good, and device overall structure is simple, and cost of manufacture is lower.
In the present embodiment, be additionally provided with thick elevating mechanism 11 between rack 10 and fixed plate 20, thick elevating mechanism 11 it is defeated
Outlet is fixedly connected with fixed plate 20, it is preferable that thick elevating mechanism 11 is screw lift structure.Thick elevating mechanism 11 is for making this
Utility model can adapt to the crystal solidifying apparatus of different size, and thick elevating mechanism 11 cooperates micrometer elevating mechanism 30 to use, can
Avoiding micro pressure sensor 23 is more than the range of micrometer elevating mechanism 30 at a distance from die bond swing arm suction nozzle, can be effectively improved
The universal performance of utility model device, adjusting thick elevating mechanism 11 makes micro pressure sensor 23 close to the suction of die bond swing arm
Mouth, then micro pressure sensor 23 is adjusted by micrometer elevating mechanism 30 and measures operation.
In the present embodiment, the output end of micrometer elevating mechanism 30 is downward, and sliding block 22 includes the mounting base being fixedly connected
221 and driver under stress plate 222, driver under stress plate 222 is parallel with the measuring surface of micro pressure sensor 23, and sliding block 22 is installed on
It fills on seat 221, the output end of micrometer elevating mechanism 30 acts on driver under stress plate 222, and driver under stress plate 222 passes through spring
25 connect with fixed plate 20, the axis parallel in the axle center of spring 25 and 30 output end of micrometer elevating mechanism, spring 25 by by
The effect of power drive plate 222 can reset the position of micro pressure sensor 23.Be arranged the output end of micrometer elevating mechanism 30 to
Under, i.e. the adjustable side of micrometer elevating mechanism 30 is upward, can effectively facilitate adjusting to operate, adjusting efficiency can be improved.
In the present embodiment, micrometer elevating mechanism 30 includes fixes sleeve 31, and fixes sleeve 31 is fixed on mounting blocks 24
In, output screw 32 is connected in fixes sleeve 31, output screw 32 is the output end of micrometer elevating mechanism 30, output screw
32 one end is connected with microdrum 33, and microdrum 33 is sheathed on outside fixes sleeve 31, and fixes sleeve 31 and microdrum 33 are equipped with
Scale can adjust the position of output screw 32 by rotating microdrum 33.
In the present embodiment, micrometer elevating mechanism 30 is digimatic micrometer structure, and digimatic micrometer is to be connected with number
The micrometer of display screen, can obtain the reading of micrometer by display screen, and precision is higher.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (6)
1. a kind of device for pressure measurement of die bond swing arm, which is characterized in that including rack (10), the rack (10) is equipped with solid
The side of fixed board (20), the fixed plate (20) is fixed with sliding rail (21), and the side of the sliding rail (21) slidably connects sliding block
(22), it is fixed with micro pressure sensor (23) on the sliding block (22), is further fixed on mounting blocks on the fixed plate (20)
(24), it is equipped with micrometer elevating mechanism (30) on the mounting blocks (24), the output end of the micrometer elevating mechanism (30)
It acts on the sliding block (22).
2. a kind of device for pressure measurement of die bond swing arm according to claim 1, which is characterized in that the rack (10) and
It is additionally provided with thick elevating mechanism (11) between the fixed plate (20), the output end of the thick elevating mechanism (11) and the fixed plate
(20) it is fixedly connected.
3. a kind of device for pressure measurement of die bond swing arm according to claim 2, which is characterized in that the thick elevating mechanism
It (11) is screw lift structure.
4. a kind of device for pressure measurement of die bond swing arm according to claim 1, which is characterized in that the micrometer lifting
The output end of mechanism (30) is downward, and the sliding block (22) includes the mounting base (221) being fixedly connected and driver under stress plate (222),
The sliding block (22) is installed on the mounting base (221), and the output end of the micrometer elevating mechanism (30) acts on described
On driver under stress plate (222), the driver under stress plate (222) is connect by spring (25) with the fixed plate (20).
5. a kind of device for pressure measurement of die bond swing arm according to claim 1, which is characterized in that the micrometer lifting
Mechanism (30) includes fixes sleeve (31), is connected with output screw (32), the output screw in the fixes sleeve (31)
(32) one end is connected with microdrum (33), and the microdrum (33) is sheathed on the fixes sleeve (31) outside.
6. a kind of device for pressure measurement of die bond swing arm according to claim 1, which is characterized in that the micrometer lifting
Mechanism (30) is digimatic micrometer structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809996.4U CN208333717U (en) | 2018-05-28 | 2018-05-28 | A kind of device for pressure measurement of die bond swing arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809996.4U CN208333717U (en) | 2018-05-28 | 2018-05-28 | A kind of device for pressure measurement of die bond swing arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208333717U true CN208333717U (en) | 2019-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820809996.4U Active CN208333717U (en) | 2018-05-28 | 2018-05-28 | A kind of device for pressure measurement of die bond swing arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208333717U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108375429A (en) * | 2018-05-28 | 2018-08-07 | 东莞市佳骏电子科技有限公司 | A kind of device for pressure measurement and measurement method of die bond swing arm |
-
2018
- 2018-05-28 CN CN201820809996.4U patent/CN208333717U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108375429A (en) * | 2018-05-28 | 2018-08-07 | 东莞市佳骏电子科技有限公司 | A kind of device for pressure measurement and measurement method of die bond swing arm |
| CN108375429B (en) * | 2018-05-28 | 2024-05-14 | 东莞市佳骏电子科技有限公司 | Pressure measurement device and method for die bonding swing arm |
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