CN211205123U - PCB thickness measurement device - Google Patents
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Abstract
Description
技术领域technical field
本实用新型涉及印刷电路板技术领域,具体涉及采用百分表的PCB板厚测量装置。The utility model relates to the technical field of printed circuit boards, in particular to a PCB board thickness measuring device using a dial indicator.
背景技术Background technique
现有的PCB板厚测量装置大多采用千分尺进行测量,在待测板件的体积较小的时候,操作人员能够通过千分尺直接测量待测板件的厚度,但是,如图1所示,在待测板件600体积相对较大的时候,因为千分尺500本身尺架及测微螺杆的设计问题,只能够测量到待测板件边缘25mm及以内区域的板厚,导致距板边大于25mm的区域成为测试盲区。而且,由于PCB板件在成型后可能会因为制作过程中出现的误差而无法呈现完全平面的状态,直接将PCB板件放置在测量平台或是直接手拿进行厚度测量,很容易因为PCB板件翘起而产生较大的测量误差,但是,针对性地购置专用仪器对PCB板件进行测量,成本较高,且结构复杂,操作不便。Most of the existing PCB thickness measurement devices use a micrometer for measurement. When the volume of the board to be tested is small, the operator can directly measure the thickness of the board to be tested through the micrometer. When the size of the
实用新型内容Utility model content
本实用新型的目的在于提供PCB板厚测量装置,通过设置百分表测量待测板件任意位置的厚度,结构简单、操作方便;设置限位组件,避免测量误差过大,用于解决现有技术中PCB板厚测量装置成本较高、结构复杂、操作不便的问题。The purpose of the utility model is to provide a PCB board thickness measuring device, which can measure the thickness of any position of the board to be measured by setting a dial indicator, with simple structure and convenient operation; setting a limit component to avoid excessive measurement error, which is used to solve the problem of existing In the technology, the PCB thickness measurement device has the problems of high cost, complex structure and inconvenient operation.
为实现上述目的,本实用新型采用以下技术手段加以实施:To achieve the above object, the present invention adopts the following technical means to implement:
PCB板厚测量装置,包括水平设置的操作平台,所述操作平台侧边垂直安装测量支撑架,所述测量支撑架靠近操作平台的一侧安装用于测量待测板件厚度的百分表,所述操作平台顶部架设气缸支撑架,气缸支撑架上安装气缸,气缸的活塞杆底部安装限位组件,限位组件靠近百分表的一端开设适于百分表的测量杆穿过的测量孔。The PCB thickness measurement device includes a horizontally arranged operation platform, a measurement support frame is installed vertically on the side of the operation platform, and a dial indicator for measuring the thickness of the board to be measured is installed on the side of the measurement support frame close to the operation platform. A cylinder support frame is erected on the top of the operating platform, a cylinder is installed on the cylinder support frame, a limit assembly is installed at the bottom of the piston rod of the cylinder, and one end of the limit assembly close to the dial indicator is provided with a measuring hole suitable for the measuring rod of the dial indicator to pass through. .
上述技术方案中,所述百分表的测量杆侧边安装适于所述测量孔的推动组件。In the above technical solution, a push assembly suitable for the measuring hole is installed on the side of the measuring rod of the dial indicator.
进一步的,所述气缸侧边安装导向杆,所述导向杆安装于气缸支撑架且与所述操作平台垂直,限位组件上开设适于所述导向杆的导向限位孔。Further, a guide rod is installed on the side of the cylinder, the guide rod is installed on the cylinder support frame and is perpendicular to the operation platform, and a guide limit hole suitable for the guide rod is defined on the limit component.
再进一步的,所述限位组件底部安装软质缓冲组件。Still further, a soft buffer component is installed at the bottom of the limiting component.
作为一种有效的设置方案,所述气缸经脚踏开关与气源处理组件连接。As an effective arrangement solution, the air cylinder is connected with the air source processing assembly via a foot switch.
进一步的,所述气源处理组件包括第一过滤组件、气压调节组件、第二过滤组件,所述第一过滤组件进气口与外部起源连接,所述第一过滤组件出气口与所述气压调节组件进气口连接,所述气压调节组件出气口与所述第二过滤组件进气口连接,所述第二过滤组件出气口与所述脚踏开关进气口连接,所述脚踏开关出气口与所述气缸进气口连接。Further, the air source processing assembly includes a first filter assembly, an air pressure adjustment assembly, and a second filter assembly, the air inlet of the first filter assembly is connected to an external source, and the air outlet of the first filter assembly is connected to the air pressure. The air inlet of the adjustment assembly is connected, the air outlet of the air pressure adjustment assembly is connected to the air inlet of the second filter assembly, the air outlet of the second filter assembly is connected to the air inlet of the foot switch, and the foot switch The air outlet is connected to the air inlet of the cylinder.
再进一步的,还包括安装支架,所述操作平台水平安装于所述安装支架顶部,所述测量支撑架安装于所述安装支架侧边,所述气源处理组件、脚踏开关安装于安装支架底部。Still further, it also includes an installation bracket, the operation platform is horizontally installed on the top of the installation bracket, the measurement support bracket is installed on the side of the installation bracket, and the air source processing assembly and the foot switch are installed on the installation bracket. bottom.
本实用新型至少具有以下有益之处:The utility model at least has the following benefits:
操作平台水平设置,且侧边垂直安装测量支撑架,百分表与测量支撑架固定连接,且百分表的测量杆垂直于操作平台,待测板件水平放置在操作平台上,在测量板厚的过程中,通过调整待测板件与百分表的接触位置,能够测量待测板件任意位置的厚度,根据百分表的读数直接获取待测板件厚度,结构简单,且能够有效节约成本;The operation platform is set horizontally, and the measuring support frame is installed vertically on the side. The dial indicator is fixedly connected to the measurement support frame, and the measuring rod of the dial indicator is perpendicular to the operation platform. The plate to be tested is placed horizontally on the operation platform. In the process of thickening, by adjusting the contact position of the plate to be tested and the dial indicator, the thickness of the plate to be measured can be measured at any position, and the thickness of the plate to be measured can be directly obtained according to the reading of the dial indicator. The structure is simple and effective. save costs;
操作平台上架设安装气缸的气缸支撑架,并在气缸的活塞杆固定连接限位组件,通过控制气缸活塞杆控制所述限位组件下压,以压紧操作平台上的待测板件,在限位组件靠近百分表的一端开设测量孔,百分表的测量杆垂直穿过测量孔,对待测板件的厚度进行测量,防止无法呈现平直状态的待测板件在测量过程中翘起,提高测量精度,且操作方便,能有效提高测量效率。The cylinder support frame for installing the cylinder is erected on the operation platform, and the limit component is fixedly connected to the piston rod of the cylinder. A measuring hole is opened at one end of the limit component close to the dial indicator, and the measuring rod of the dial indicator vertically passes through the measuring hole to measure the thickness of the plate to be measured, so as to prevent the plate to be measured that cannot be in a straight state from warping during the measurement process It can improve the measurement accuracy, and the operation is convenient, which can effectively improve the measurement efficiency.
附图说明Description of drawings
图1是采用千分尺的PCB板厚测量装置;Figure 1 is a PCB thickness measurement device using a micrometer;
图2是本实用新型较佳实施例的结构示意图;Fig. 2 is the structural representation of the preferred embodiment of the present utility model;
图3是本实用新型较佳实施例未测量时推动组件的结构示意图;Fig. 3 is the structural schematic diagram of the push assembly when the preferred embodiment of the present invention is not measured;
图4是本实用新型较佳实施例测量时推动组件的结构示意图;4 is a schematic structural diagram of a push assembly during measurement according to a preferred embodiment of the present invention;
图中:100、操作平台;201、测量支撑架;202、百分表;2021、测量杆;2022、推动组件;301、气缸支撑架;302、气缸;3021、活塞杆;303、限位组件;3031、测量孔;3032、缓冲组件;304、气源处理组件;305、脚踏开关;400、安装支架;500、千分尺;600、待测板件。In the figure: 100, operating platform; 201, measuring support frame; 202, dial indicator; 2021, measuring rod; 2022, push assembly; 301, cylinder support frame; 302, cylinder; 3021, piston rod; 303,
具体实施方式Detailed ways
为了使本实用新型的目的、技术方案及优点更容易被理解,以下结合实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本实用新型,并不用于限定本实用新型。In order to make the purpose, technical solutions and advantages of the present utility model easier to understand, the present utility model will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.
实施例Example
如图2-4,PCB板厚测量装置,包括水平设置的操作平台100,操作平台100侧边设置测量支撑架201,测量支撑架201垂直安装于操作平台100侧边,测量支撑架201靠近操作平台100的一侧固定安装用于测量待测板件厚度的百分表202,需要说明的是,根据实际使用环境的不同,可在测量支撑架201侧边设置支撑臂,百分表202与支撑臂固定连接,并通过支撑臂固定安装于测量支撑架,当然,支撑臂与测量支撑架、百分表与支撑臂之间安装有固定件,所述固定件可采用螺杆等固定零件。操作平台100顶部设置气缸支撑架301,气缸支撑架301呈“U”型架设于操作平台100顶部,气缸支撑架301顶部平行于操作平台100。具体的,所述气缸支撑架301两侧的支撑脚可设置成“T”型,T型支撑脚的翼缘的侧边可与操作平台100侧边对齐,T型支撑脚的翼缘设有连接位,T型支撑脚通过适于所述连接位的螺钉与操作平台100固定连接,作为本实用新型的又一实施方式,气缸支撑架可直接焊接在操作平台上。所述气缸302经脚踏开关305与气源处理组件304连接,脚踏开关305经气源处理组件304与外部气源连接,通过脚踏开关对气缸供气以控制气缸的活塞杆运动。具体的,气源处理组件包括第一过滤组件、气压调节组件、第二过滤组件,第一过滤组件进气口与外部起源连接,第一过滤组件出气口与气压调节组件进气口连接,气压调节组件出气口与第二过滤组件进气口连接,第二过滤组件出气口与脚踏开关进气口连接,脚踏开关出气口与气缸进气口连接,其中,外部起源提供压缩空气,第一过滤组件用于过滤压缩空气中的杂质,气压调节组件用于对压缩空气进行降压处理,第二过滤组件用于除去压缩空气中的水分。当然,气缸302可安装于气缸支撑架301中部,测量支撑架201可对应所述气缸302安装于操作平台100侧边中部。其中,气缸活塞杆3021的底部安装限位组件303,具体可在限位组件303挖设有适于活塞杆3021的孔位,限位组件303通过所述孔位固定安装于气缸活塞杆3021底部。其中,限位组件303靠近百分表202的一端开设有适于百分表的测量杆2021穿过的测量孔3031,所述测量孔底面平行于操作平台,测量孔3031径宽大于测量杆2021外径,测量孔3031可设置成圆形等任意适于测量杆2021通过的形状。在测量过程中,通过控制气缸活塞杆3021控制所述限位组件303下压,由限位组件303压紧待测板件后,百分表202的测量杆2021通过测量孔3031测量待测板件厚度,以减小测量误差。As shown in Figure 2-4, the PCB thickness measurement device includes a horizontally arranged
于本实用新型较佳实施例中,可选用在百分表202的测量杆2021侧边安装适于所述测量孔3031的推动组件2022,具体的,所述推动组件2022一端设有适于测量杆2021的连接位,测量杆2021经所述连接位与推动组件2022固定连接。推动组件2022的另一端与测量孔3031外边缘顶部抵接,需要说明的是,所述推动组件远离测量杆的一端与测量杆的测量头之间的高度差不小于限位组件厚度(即处于未测量状态时,推动组件与测量孔外边缘顶部抵接,测量杆的测量头较限位组件底面的位置偏低)。根据实际使用环境的不同要求,所述推动组件2022可设置成任意形状。在使用过程中,限位组件303在气缸活塞杆3021的作用下下压至操作平台上水平放置的待测板件600,推动组件无限位组件的约束,百分表的测量杆自动向下移动至待测板件时停止,此时百分表202读数为待测板件厚度。在完成记数后,通过活塞杆带动推动组件上移,以带动百分表的测量杆离开操作平台100。In the preferred embodiment of the present invention, a
为实现限位组件303能够沿着垂直于操作平台100的方向移动,可在气缸302侧边安装垂直于操作平台100的导向杆,导向杆顶部与气缸支撑架301固定连接,于本实用新型较佳实施例中,优选在气缸302远离百分表202的一侧安装导向杆,在限位组件303上开设适于所述导向杆的导向限位孔,使限位组件303在导向杆的作用下始终沿着垂直于操作平台100的方向移动。In order to realize that the
为避免所述限位组件303在操作过程中对待测板件造成损坏,可在限位组件303底部安装胶圈等软质缓冲组件3032。In order to prevent the
于本实用新型较佳实施示例中,还包括安装支架400,操作平台100底部设置有安装基座,操作平台100经安装基座水平安装于安装支架400顶部,操作平台100侧边设置固定连接位,通过螺杆等固定零件与安装支架400固定连接。操作平台100顶部设置气缸支撑架301,侧边安装测量支撑架201,测量支撑架201靠近操作平台100的一侧与百分表202固定连接。所述气源处理组件304、脚踏开关305安装于安装支架400底部,为便于操作者使用,脚踏开关305安装于远离所述测量支撑架201的一侧。In the preferred embodiment of the present invention, it also includes an
本实用新型具体工作原理为:The specific working principle of the utility model is as follows:
1.将待测板件600水平放置在操作平台100上,将待测板件需要测量厚度的位置记为测试点,将测量点移动至百分表202的测量杆2021下,踩下脚踏开关305,使气缸302的活塞杆3021向下移动,并带动活塞杆3021底部的限位组件303沿导向杆垂直向下移动,以压紧待测板件。测量杆2021自动向下移动至待测板件时停止,此时百分表202读数为待测板件厚度。1. Place the plate to be tested 600 on the
2.记数完成后,松开脚踏开关305使气缸活塞杆3021向上动作,带动活塞杆3021底部的限位组件303向上移动,限位组件303通过测量杆2021侧边的推动组件2022带动测量杆向上移动,使百分表的测量杆2021抬离待测板件,测量结束。2. After the counting is completed, release the
重复以上1-2点,可测量待测板件上任意位置的厚度。Repeat the above 1-2 points to measure the thickness of any position on the plate to be tested.
本实用新型所示的PCB板厚测量装置的校正方法为:The calibration method of the PCB thickness measuring device shown in the utility model is as follows:
按照上述操作步骤,在不放置待测板件的前提下,踩下脚踏开关305,使气缸302的活塞杆3021带动限位组件303沿导向杆向下移动,测量杆2021向下移动至操作平台时停止运动,此时转动百分表202的表盘,使指针于表盘上的零刻度线重合。再采用任一PCB标准厚度板,按上述步骤测量,使本实用新型所示PCB板厚测量装置的测量结果与标准板厚度值一致,在二者数值出现偏差的时候通过调整百分表202的表盘,使百分表202读数与PCB标准厚度板厚度值相同。重复多次测量PCB标准厚度板以及PCB标准厚度板任意位置的厚度,直至百分表202读数与标准板数值一致后,校正完成。According to the above operation steps, on the premise of not placing the plate to be measured, step on the
以上所述,仅为本实用新型较佳的具体实施方式,但本实用新型的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本实用新型揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本实用新型的保护范围之内。因此,本实用新型的保护范围应该以权利要求的保护范围为准。The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. The changes or replacements should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114370811A (en) * | 2020-10-15 | 2022-04-19 | 深圳基本半导体有限公司 | Warping degree measuring device |
| CN115854825A (en) * | 2023-02-28 | 2023-03-28 | 深圳市盈通恒翼科技有限公司 | Thickness detection device for circuit board paster |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114370811A (en) * | 2020-10-15 | 2022-04-19 | 深圳基本半导体有限公司 | Warping degree measuring device |
| CN115854825A (en) * | 2023-02-28 | 2023-03-28 | 深圳市盈通恒翼科技有限公司 | Thickness detection device for circuit board paster |
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Granted publication date: 20200807 |