CN208333195U - A kind of board-like pulsating heat pipe of aluminium oxide ceramics - Google Patents
A kind of board-like pulsating heat pipe of aluminium oxide ceramics Download PDFInfo
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- CN208333195U CN208333195U CN201820974977.7U CN201820974977U CN208333195U CN 208333195 U CN208333195 U CN 208333195U CN 201820974977 U CN201820974977 U CN 201820974977U CN 208333195 U CN208333195 U CN 208333195U
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- heat pipe
- pulsating heat
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Abstract
The utility model provides a kind of board-like pulsating heat pipe of aluminium oxide ceramics.The board-like sealing structure that pulsating heat pipe described in the utility model is integrally formed, the pulsating heat pipe plate body inside are equipped with curved duct array, and plate body surface is equipped with implementation of port, and the implementation of port is connected with the curved duct array.The curved duct array is divided into evaporating area, adiabatic region, condensing zone from bottom to top.The utility model plank frame and its curved duct array of inside are integrally formed by molding, sintering process, Conventional plate-type pulsating heat pipe is largely avoided because cracking, the phenomenon of leakage insecure and occur are welded or bonded in top and the bottom, the utility model can be widely popularized in heat exchange and refrigeration technology field based on the above reasons.
Description
Technical field
The utility model relates to exchange heat and refrigeration technology field more particularly to a kind of board-like pulsating heat pipe of aluminium oxide ceramics.
Background technique
With the continuous development of electronics technology, integrated chip, miniaturization have become the trend of development, small size, height
The microelectronic component of power, which generates higher heat aggregation, influences the stability and safety of equipment.However it is a large amount of high as carrying
The substrate of hot-fluid semiconductor element is mostly the pcb board of low thermal conductivity, and material is glass-epoxy (FR-4), thermally conductive
Coefficient is about 0.35W/mk.Therefore the heat dissipation bottleneck of electric system mostly occurs in the ring for conducting heat to circuit board at this stage
Section, the key of circuit substrate being chosen to for heat dissipation.
Pulsating heat pipe takes full advantage of the high coefficient of heat transfer brought by gas-liquid phase transition as new and effective heat transfer technology,
The heat that electronic device generates can quickly be passed, be the effective way for solving heat dissipation problem.Production at present and research
In pulsating heat pipe be largely metal pulsating heat pipe, such as copper material pulsating heat pipe and aluminium pulsating heat pipe.Metal pulsating heat pipe
Since it does not have electrical insulation capability, the heat dissipation of circuit board cannot be used directly for, it is difficult to play the heat dissipation advantage of pulsating heat pipe.
Existing pulsating heat pipe is mostly split type structure, and mostly being welded by upper and lower plates or bonded rear can be used, and often can
There is a phenomenon where crackings, leakage, seriously affect the performance of equipment.
Utility model content
According to technical problem set forth above, and provide a kind of low in cost, good integrated molding aluminium oxide of thermal conductivity
Ceramics plate type pulsating heat pipe.The technological means that the utility model uses is as follows:
A kind of board-like pulsating heat pipe of aluminium oxide ceramics, the board-like sealing structure that the pulsating heat pipe is integrally formed are described
Curved duct array, the working medium filled with preset quality in the curved duct array, plate body table are equipped with inside pulsating heat pipe plate body
Face is equipped with implementation of port, and the implementation of port is connected with the curved duct array.
Further, the curved duct array is divided into evaporating area, adiabatic region, condensing zone from bottom to top.
Further, the shape of the cross section of the curved duct array be square, rectangle or circle.
Further, the curved duct array is the disjunct open loop type of head and the tail.
Preferably, the curved duct array is end to end closed loop.
Further, the thickness H of the curved duct array any point is respectively less than plate thickness H1。
Further, in the curved duct array, the gap of adjacent conduit is all the same.
The utility model plank frame and its curved duct array of inside are integrally formed by molding, sintering process, pole
The earth avoids traditional pulsating heat pipe because cracking, the phenomenon of leakage insecure and occur, base are welded or bonded in top and the bottom
It can be widely popularized in heat exchange and refrigeration technology field in above-mentioned reason the utility model.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is done simply to introduce, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is curved duct array schematic diagram inside the utility model embodiment pulsating heat pipe.
Fig. 2 is the utility model embodiment pulsating heat pipe main view.
Fig. 3 is the utility model embodiment pulsating heat pipe side view.
Fig. 4 is that the utility model embodiment is molded model core arrangement schematic diagram.
Fig. 5 is the utility model embodiment mould pressing process schematic diagram.
Fig. 6 is the utility model embodiment isostatic cool pressing process schematic representation.
Fig. 7 is the utility model embodiment multistep sintering process curve graph.
Fig. 8 is the utility model embodiment vacuum liquid-charging process schematic device.
In figure: 1, curved duct array;2, implementation of port;3, it is molded inner core;4, alumina ceramic powder;5, pulsating heat pipe element
Embryo;6, metal plate;7, rubber-plastics material;8, valve I;9, valve II.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
As shown in Figures 1 to 3, the board-like pulsating heat pipe of a kind of aluminium oxide ceramics, the pulsating heat pipe are integrally formed board-like
Sealing structure, the pulsating heat pipe plate body inside are equipped with curved duct array 1, and the curved duct array 1 is interior filled with default matter
The working medium of amount, plate body surface are equipped with implementation of port 2, and the implementation of port 2 is connected with the curved duct array 1.The curved duct
Array 1 is divided into evaporating area, adiabatic region, condensing zone from bottom to top.
The shape of the cross section of the curved duct array 1 is square, rectangle or circle.
The curved duct array 1 is the disjunct open loop type of head and the tail or end to end closed loop.
The thickness H of 1 any point of curved duct array is respectively less than plate thickness H1。
In the curved duct array 1, the gap of adjacent conduit is all the same.
The present embodiment also provides the preparation process of the board-like pulsating heat pipe of the utility model aluminium oxide ceramics,
Firstly, casting prepares molding inner core 3 as shown in Figure 4, specifically include: heating paraffin to fusing point is formed into paraffin
Solution is poured into the mold with required shape, and after paraffin is cooling, paraffin molding inner core is can be obtained in demoulding.
Mechanical processing method: carrying out Milling Process using CNC milling machine in paraffin plate, mills out required paraffin molding inner core
Shape.
As shown in figure 5, S1, mould pressing process: molding inner core 3 is buried in the intracorporal alumina ceramic powder 4 of mold cavity
Between, by pressurizeing jointly to alumina ceramic powder 4 and molding inner core 3, it is compressed into pulsating heat pipe biscuit 5;
As shown in fig. 6, S2, isostatic cool pressing technique: clamping pulsating heat pipe element embryo 5 by metal plate 6, pass through rubber-plastics material 7
Its integral sealing is formed into seal, the seal is placed in isostatic cool pressing instrument and carries out pressurization compacting;
As shown in fig. 7, S3, multistep sintering process:, will by pre-burning at a first temperature of default of the green body after isostatic cool pressing
Molding inner core 3 and binder decompose and exclude green body, then heat to preset sintering temperature, and with furnace after held for some time
It is cooling;
As shown in figure 8, S4, liquid-charging process: the inside curved duct array 1 in plate type pulsating heat pipe is filled with preset quality
Working medium, implementation of port 2 is sealed.The working medium can be water, acetone, alcohol, fluorinated hydrocarbon single-phase liquid or multiphase mixing
Liquid, nano-fluid.
The internal curved duct array 1 is the cavity that is formed after being evaporated, being decomposed when sintering at high temperature by molding inner core 3.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System;Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced;And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (7)
1. a kind of board-like pulsating heat pipe of aluminium oxide ceramics, which is characterized in that the board-like sealing that the pulsating heat pipe is integrally formed
Structure, the pulsating heat pipe plate body inside are equipped with curved duct array, the work filled with preset quality in the curved duct array
Matter, plate body surface are equipped with implementation of port, and the implementation of port is connected with the curved duct array.
2. the board-like pulsating heat pipe of aluminium oxide ceramics according to claim 1, which is characterized in that the curved duct array is certainly
It is divided into evaporating area on down, adiabatic region, condensing zone.
3. the board-like pulsating heat pipe of aluminium oxide ceramics according to claim 1, which is characterized in that the curved duct array
The shape of cross section is square, rectangle or circle.
4. the board-like pulsating heat pipe of aluminium oxide ceramics according to claim 1, which is characterized in that the curved duct array is
Disjunct open loop type from beginning to end.
5. the board-like pulsating heat pipe of aluminium oxide ceramics according to claim 1, which is characterized in that the curved duct array is
End to end closed loop.
6. the board-like pulsating heat pipe of aluminium oxide ceramics according to claim 1, which is characterized in that the curved duct array is appointed
The thickness H of any is respectively less than plate thickness H1。
7. according to the board-like pulsating heat pipe of aluminium oxide ceramics described in claim 1, which is characterized in that in curved duct array, conduit
Gap it is all the same.
Priority Applications (1)
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CN201820974977.7U CN208333195U (en) | 2018-06-22 | 2018-06-22 | A kind of board-like pulsating heat pipe of aluminium oxide ceramics |
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CN201820974977.7U CN208333195U (en) | 2018-06-22 | 2018-06-22 | A kind of board-like pulsating heat pipe of aluminium oxide ceramics |
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Publication Number | Publication Date |
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CN208333195U true CN208333195U (en) | 2019-01-04 |
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CN201820974977.7U Active CN208333195U (en) | 2018-06-22 | 2018-06-22 | A kind of board-like pulsating heat pipe of aluminium oxide ceramics |
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2018
- 2018-06-22 CN CN201820974977.7U patent/CN208333195U/en active Active
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